JPH0132655B2 - - Google Patents
Info
- Publication number
- JPH0132655B2 JPH0132655B2 JP402782A JP402782A JPH0132655B2 JP H0132655 B2 JPH0132655 B2 JP H0132655B2 JP 402782 A JP402782 A JP 402782A JP 402782 A JP402782 A JP 402782A JP H0132655 B2 JPH0132655 B2 JP H0132655B2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- tool
- lead
- bonding
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/015—Manufacture or treatment of bond wires
- H10W72/01551—Changing the shapes of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07521—Aligning
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07531—Techniques
- H10W72/07532—Compression bonding, e.g. thermocompression bonding
- H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
Description
【発明の詳細な説明】
本発明は半導体のワイヤボンデイング方法に関
する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a semiconductor wire bonding method.
周知の如く、半導体部品の組立においては、ペ
レツトのパツトとリードフレームのリードポスト
との間をワイヤで接続する。このワイヤ接続はワ
イヤが挿通されたツールによつてワイヤをパツト
又はリードポストに押付け、熱圧着法又は超音波
法或いは超音波併用熱圧着法によつてボンデイン
グされる。 As is well known, in assembling semiconductor components, parts of a pellet and lead posts of a lead frame are connected by wires. This wire connection is made by pressing the wire against the patch or lead post using a tool through which the wire is inserted, and bonding is performed by a thermocompression bonding method, an ultrasonic method, or a thermocompression bonding method combined with ultrasonic waves.
前記ワイヤは金線又はアルミニウム線等よりな
り、またパツトには一般にアルミニウム金属膜が
形成されているので、パツトへのワイヤの接続は
上記方法で容易に行われる。しかしながら、リー
ドポスト（リードフレーム）はコバール、アロイ
等の金属材よりなるので、上記方法で金線等のワ
イヤを接続するのは容易でない。このためリード
フレームにはワイヤとの接続を良くするために金
メツキ又は銀メツキを施している。ところで、貴
金属である金、銀は非常に高価であるので、半導
体部品が非常にコスト高になるという問題があつ
た。 Since the wire is made of gold wire or aluminum wire, and the pad is generally coated with an aluminum metal film, the wire can be easily connected to the pad by the method described above. However, since the lead post (lead frame) is made of a metal material such as Kovar or alloy, it is not easy to connect wires such as gold wires using the above method. For this reason, the lead frame is plated with gold or silver to improve the connection with the wire. By the way, since gold and silver, which are precious metals, are very expensive, there has been a problem in that the cost of semiconductor components is very high.
そこで、本発明はリードフレームに特別に表面
処理を行わなくても良好なワイヤボンデイングが
行えるワイヤボンデイング方法を提供することを
目的とする。 SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a wire bonding method that allows good wire bonding without special surface treatment of a lead frame.
以下、本発明を図示の一実施例により説明す
る。まず、ツール１の下端より延在したワイヤ２
の端部に水素又は電気トーチ（図示せず）によつ
てボールが形成される。次にツール１が下降して
ペレツト３のパツトにワイヤ２を押付け、熱圧着
又は超音波或いは超音波併用熱圧着等によつてワ
イヤ２がペレツト３のパツトにボンデイングされ
る。次にツール１が上昇及び水平移動してリード
フレーム４のリードポスト４ａの上方に位置し、
続いてツール１が下降して前記と同様にリードポ
スト４ａにワイヤ２を押付けてボンデイングす
る。次にツール１がわずかに上昇し、図示しない
クランパーによつてワイヤ２が引張られ、リード
ポスト４ａの根元より切断される。 Hereinafter, the present invention will be explained with reference to an illustrated embodiment. First, wire 2 extending from the lower end of tool 1
A ball is formed at the end by a hydrogen or electric torch (not shown). Next, the tool 1 is lowered to press the wire 2 against the part of the pellet 3, and the wire 2 is bonded to the part of the pellet 3 by thermocompression bonding, ultrasonic waves, thermocompression bonding with ultrasonic waves, or the like. Next, the tool 1 rises and moves horizontally to be located above the lead post 4a of the lead frame 4,
Subsequently, the tool 1 is lowered to press the wire 2 against the lead post 4a for bonding in the same manner as described above. Next, the tool 1 is slightly raised, and the wire 2 is pulled by a clamper (not shown) and is cut from the base of the lead post 4a.
さて、本発明においては、ツール１が下降して
リードポスト４ａにワイヤ２を押付けてボンデイ
ングする時に電源回路５を通電させ、ツール１と
リードフレーム４を載置するリードフレーム載置
台６との間に電流を流す。このようにワイヤ２と
リードポスト４ａとのボンデイング部に電流を流
しながらボンデイングするので、リードフレーム
に金メツキ等を施さなくても従来の熱圧着又は超
音波或いは超音波併用熱圧着でワイヤ２はリード
ポスト４ａに容易にボンデイングができる。 Now, in the present invention, when the tool 1 descends and presses the wire 2 against the lead post 4a for bonding, the power supply circuit 5 is energized to connect the tool 1 and the lead frame mounting base 6 on which the lead frame 4 is mounted. A current is passed through. Since bonding is performed while applying current to the bonding portion between the wire 2 and the lead post 4a, the wire 2 can be bonded by conventional thermocompression bonding, ultrasonic waves, or ultrasonic thermocompression bonding without applying gold plating or the like to the lead frame. Bonding can be easily performed on the lead post 4a.
なお、ツール１の材質としては、耐熱性の導電
材、例えばタングステン等を用いる。また電源回
路５を通電させるタイミング信号は、例えば特開
昭56−8832号公報に示すようにツール（正確には
ツール先端のワイヤ）がリードポストに接触した
時に発する信号を用いる。 Note that the tool 1 is made of a heat-resistant conductive material such as tungsten. Further, as the timing signal for energizing the power supply circuit 5, a signal emitted when the tool (more precisely, the wire at the tip of the tool) comes into contact with the lead post is used, as shown in, for example, Japanese Patent Laid-Open No. 56-8832.
以上の説明から明らかな如く、本発明になるワ
イヤボンデイング方法によれば、リードフレーム
に金メツキ等の特殊な表面処理をしなくてもワイ
ヤボンデイングができるので、大幅なコストダウ
ンが図れる。 As is clear from the above description, according to the wire bonding method of the present invention, wire bonding can be performed without special surface treatment such as gold plating on the lead frame, so that a significant cost reduction can be achieved.
図は本発明になるワイヤボンデイング方法の一
実施例を示す正面説明図である。
１……ツール、２……ワイヤ、３……ペレツ
ト、４……リードフレーム、４ａ……リードポス
ト、５……電源回路、６……リードフレーム載置
台。
The figure is a front explanatory view showing an embodiment of the wire bonding method according to the present invention. 1... Tool, 2... Wire, 3... Pellet, 4... Lead frame, 4a... Lead post, 5... Power supply circuit, 6... Lead frame mounting table.
Claims (1)
ポストとの間をツールに挿通されたワイヤで接続
するワイヤボンデイング方法において、前記リー
ドポストにワイヤをボンデイングする時に前記ツ
ールとリードフレーム載置台との間に電流を流し
てワイヤをリードポストに溶接することを特徴と
するワイヤボンデイング方法。1. In a wire bonding method in which a part of a pellet and a lead post of a lead frame are connected by a wire inserted through a tool, an electric current is applied between the tool and the lead frame mounting table when bonding the wire to the lead post. A wire bonding method characterized by welding a wire to a lead post by flowing it.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57004027A JPS58122742A (en) | 1982-01-16 | 1982-01-16 | Wire bonding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57004027A JPS58122742A (en) | 1982-01-16 | 1982-01-16 | Wire bonding method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58122742A JPS58122742A (en) | 1983-07-21 |
| JPH0132655B2 true JPH0132655B2 (en) | 1989-07-10 |
Family
ID=11573474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57004027A Granted JPS58122742A (en) | 1982-01-16 | 1982-01-16 | Wire bonding method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58122742A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112055889A (en) | 2019-04-09 | 2020-12-08 | 株式会社海上 | Method for bonding insulated covered wire, connection structure, method for peeling insulated covered wire, and bonding device |
-
1982
- 1982-01-16 JP JP57004027A patent/JPS58122742A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58122742A (en) | 1983-07-21 |
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