JPH0133930B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a solid electrolytic capacitor, in particular, a metal having a valve action is used as an anode body, a chemical conversion film of this metal is used as a dielectric body, and a solid electrolyte layer is formed on the dielectric body. The present invention further relates to a method for assembling a solid electrolytic capacitor element formed with a conductive layer and a counter electrode layer into a chip-type capacitor.

Chip-type solid electrolytic capacitors have the characteristic of being small and providing large capacitance compared to other capacitors. The demand for electrolytic capacitors is large, and there is a strong desire for mass production.

However, among various types of capacitors, chip-type solid electrolytic capacitors, which have advantages in terms of small size and large capacity, still have problems in mass production due to their special structure and manufacturing method.

The manufacturing method of a chip-type solid electrolytic capacitor includes a chemical conversion treatment in which a dielectric film is formed by anodic oxidation on a metal anode body having a valve action, a solid electrolyte formation treatment in which a solid electrolyte such as manganese dioxide is formed on the dielectric film, and Furthermore, the manufacturing process of the solid electrolytic capacitor element, which includes forming a conductive layer such as graphite and forming a counter electrode for connection with an external electrode, and packaging the solid electrolytic capacitor element to form a chip-type solid electrolytic capacitor product. It can be divided into assembly process. In the manufacturing process for solid electrolytic capacitor elements, which is the first half of the manufacturing process for chip-type solid electrolytic capacitors, generally a long metal anode body with valve action is connected to the anode lead wire implanted in the anode body. Mass production is possible by connecting multiple anode bodies to a metal plate and processing multiple anode bodies at once. On the other hand, regarding the assembly process, as shown in Figure 1, in a solid electrolytic capacitor of the type in which an anode lead wire is attached to the solid electrolytic capacitor element 1 and molded with insulating resin, each solid electrolytic capacitor element 1 is A mold is required, and as shown in FIG. 2, the element 1 is placed in a can 21, a cap 22 is provided on the anode lead wire 2, and a resin 3
In a can-type chip-type solid electrolytic capacitor injected with a metal can, it is necessary to attach a metal can 21 to each solid electrolytic capacitor element, and in either case, the assembly process involves assembling multiple pieces at once. This process is extremely complicated compared to the manufacturing method for chip-type solid electrolytic capacitors.

The present invention eliminates the complexity of the conventional chip-type solid electrolytic capacitor assembly process as described above, and provides a method that can manufacture a plurality of chip-type solid electrolytic capacitors at once.

That is, in the present invention, a metal having a valve action is used as an anode body, a chemical conversion film of this metal is used as a dielectric body, a solid electrolyte is formed on this dielectric body, a conductive layer and a counter electrode layer are further formed, and an exterior In a method for manufacturing a chip-type solid electrolytic capacitor, a cathode lead wire piece is connected to an anode body on which a counter electrode layer has been formed, that is, a solid electrolytic capacitor element body, with the cathode lead wire piece protruding in the opposite direction to the direction in which the anode lead wire is drawn out. However, by welding the anode lead wire to a metal plate that can be welded to the anode lead wire implanted in the anode body, such that the direction in which the anode lead wire is pulled out and the surface of the metal plate are approximately perpendicular, After connecting multiple anode bodies two-dimensionally, the anode body is molded with resin leaving the terminal end of the cathode lead piece, cut into individual pieces including the capacitor element, and then the molded resin surface of the cathode lead piece is molded. It is characterized by bending along the

Hereinafter, an example in which the method of the present invention is applied to manufacturing a tantalum solid electrolytic capacitor will be described with reference to the drawings.

FIG. 3 shows a tantalum solid electrolytic capacitor element 1 that has been subjected to chemical conversion treatment, solid electrolyte formation treatment, conductive layer formation treatment, and counter electrode formation treatment, and a cathode lead piece 4 with a thickness of 50 μm being soldered to the anode lead wire. Anode lead wire 2 implanted in the tantalum solid electrolyte element after being connected in the opposite direction to the drawing direction of
are welded to a nickel plate 5 with a thickness of 0.3 mm so that the direction of the anode lead wire and the surface of the metal plate are almost perpendicular, and a plurality of tantalum solid electrolytic capacitor elements 1 are two-dimensionally attached to the nickel plate. FIG. 3 is a diagram showing a connected state. The cathode lead wire 4 and the surface of the nickel plate 5 opposite to the surface welded to the anode lead wire 2 are each provided with 10 μm solder plating 8. FIG. 4 is a front view of the nickel plate 5 in FIG. 3 viewed from a horizontal plane. In FIG. 4, the entire tantalum solid electrolytic capacitor element 1 is molded with an insulating resin such as epoxy resin, leaving only the terminal end of the cathode lead piece 4 up to the part indicated by the broken line b. After that, the cathode lead piece is bent along the surface of the molded resin. The solder layer is formed up to the portion indicated by the dashed line 7. After the above steps, the capacitor is cut into pieces by slicing to obtain chip-type tantalum solid electrolytic capacitors as shown in FIGS. 5 and 6.

As described above, according to the manufacturing method of the present invention, in the assembly process of packaging solid electrolytic capacitor elements into a product, there is no need for the complicated process of processing each solid electrolytic capacitor element one by one as in the conventional method. Multiple solid electrolytic capacitor elements arranged two-dimensionally can be molded together with resin.
This is extremely advantageous for mass production.

[Brief explanation of drawings]

1 and 2 are cross-sectional views of structural examples of conventional chip-type solid electrolytic capacitors, respectively. 3 to 6 are diagrams for explaining the manufacturing method of the chip type solid electrolytic capacitor of the present invention, in which FIG. 3 is a perspective view, FIG. 4 is a front view, FIG. 5 is a sectional view, and FIG.
The figure is a perspective view. 1... Tantalum solid electrolytic capacitor element, 2...
... Anode lead wire, 3 ... Insulating resin, 4 ... Cathode lead piece, 5 ... Nickel plate.

Claims (1)

[Claims] 1 Chemical conversion treatment,
After conducting the conductive layer forming process and the counter electrode forming process, a cathode lead piece is connected to the anode body in a direction opposite to the direction in which the anode lead wire is drawn out in a state that it protrudes from the anode body, and then the anode body Welding the anode lead wires of the plurality of anode bodies to a metal plate that can be welded to the anode lead wires implanted in the anode body so that the direction in which the anode lead wires are pulled out and the surface of the metal plate are substantially perpendicular to each other. Therefore, after two-dimensionally connecting the plurality of anode bodies to the metal plate, the metal plate is integrally molded with resin, leaving the terminal end of the cathode lead piece, and then the individual solid electrolyte A method for manufacturing a solid electrolytic capacitor, which is characterized by cutting it out as a capacitor.