JPH0134510B2 - - Google Patents

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention provides a solid-state image sensor that can obtain high-resolution images using a solid-state image sensor with a limited number of pixels, and that also has excellent mechanical strength such as earthquake resistance. It relates to an imaging device.

[Technical background of the invention and its problems]

A solid-state image sensor such as a CCD has a structure in which a plurality of pixels are arranged two-dimensionally on a semiconductor substrate.
Generally, the resolution is determined by the number of pixels, so it has been difficult to achieve high resolution.

Therefore, the present inventors previously proposed in Japanese Patent Application No. 57-78328 (Japanese Unexamined Patent Publication No. 58-196773), etc., a device that achieves high resolution by using a solid-state image sensor with the limited number of pixels mentioned above. did. As shown in FIGS. 1a and 1b, which show a perspective view and a cross-sectional configuration diagram, this device has a first substrate 2 on which a solid-state image sensor 1 is mounted and fixed, and a second substrate 3, which is provided with a first substrate 2 that can vibrate freely. The solid-state image sensor 1 is attached to the center of the piezoelectric vibrator 4, and the vibration of the piezoelectric vibrator 4 spatially vibrates the solid-state image sensor 1 in the direction of arrow A. In addition, Fig. 1 a, b
Inside, 5 is a support provided on the second substrate 3 and fixedly supporting both ends of the piezoelectric vibrator 4;
Reference numeral 6 denotes a fixing member that fixes the center portion of the piezoelectric vibrator 4 to the first substrate 2; 7 a bonding lead wire that electrically connects the solid-state image sensor 1 to the wiring pattern on the first substrate 2; , and 8 are flexible lead wires that connect the wiring pattern of the first substrate 2 and the wiring pattern of the second substrate 3 to connect the solid-state image sensor 1 and its external drive circuit.

According to the device configured in this way, for example, a rectangular waveform voltage is applied to the piezoelectric vibrator 4 to cause it to vibrate in the direction of arrow A, and the solid-state image sensor 1 vibrated thereby causes the piezoelectric vibrator 4 to vibrate at each vibration position. By performing a synthesis process on the input image, the solid-state image sensor 1
It is possible to obtain an image with a higher resolution than that of the device itself.

However, in the device configured in this way, since the first substrate 2 is supported to vibrate freely with respect to the second substrate 3 via the piezoelectric vibrator 4, it is difficult for the device to be subjected to strong impact, for example. At that time, there was a problem in that the piezoelectric vibrator 4 was easily damaged due to bending exceeding its destruction amplitude. In other words, mechanical strength such as earthquake resistance is poor. Furthermore, since the above-mentioned structure is adopted, there are also problems such as an increase in the size of the device as a whole.

[Purpose of the invention]

The present invention was made in consideration of these circumstances, and its purpose is to obtain a high-resolution image using a solid-state image sensor with a limited number of pixels, and which also has excellent earthquake resistance. An object of the present invention is to provide a solid-state imaging device with a simple structure.

In other words, the present invention aims to provide a solid-state imaging device with a simple and highly practical structure that improves earthquake resistance by improving the previously proposed solid-state imaging device with higher resolution. It is something to do.

[Summary of the Invention] The present invention provides a first method in which a solid-state image sensor is mounted and fixed.
The substrate is fixed to a piezoelectric vibrator provided on a second substrate so as to be able to freely vibrate, so as to vibrate spatially, and the first substrate is fixed to a piezoelectric vibrator that is vibably provided on a second substrate, and the first substrate is vibrated in a range narrower than the breakdown amplitude of the piezoelectric vibrator. The solid-state imaging device is characterized in that a position regulating body for regulating vibration amplitude is provided on the second substrate.

〔Effect of the invention〕

Thus, according to the present invention, even if a large stress is applied to the piezoelectric vibrator that vibrably supports the first substrate (solid-state image sensor) due to an impact, etc., the bending of the piezoelectric vibrator is prevented by the position regulating body. Since the vibration amplitude can be suppressed below the destruction amplitude, problems such as destruction of the piezoelectric vibrator and failure to return to its original shape are eliminated. In other words, assuming that the earthquake resistance is sufficiently high,
It becomes possible to ensure mechanical stability. Moreover, by vibrationally moving the solid-state image sensor, it is possible to effectively obtain an image with a resolution higher than that of the number of pixels, which is extremely effective in practical use.

[Embodiments of the invention]

Embodiments of the present invention will be described below with reference to the drawings. However, the same parts as those in the apparatus shown in FIG. 1 are given the same reference numerals, and detailed explanation thereof will be omitted.

FIG. 2 is a cross-sectional configuration diagram of an apparatus showing a first embodiment of the present invention. The features of this device are:
The point is that a position regulating body 11 for regulating the vibration width of the first substrate 2 is provided on the second substrate 3. This position regulating body 11 is made of, for example, a plate-like member or a rod-like member, and comes into contact with the side of the first substrate 2 in the vibration direction to regulate the vibration width thereof. Thus, the position regulating body 11 is provided at a position where the first substrate 2 can vibrate at intervals narrower than the destructive vibration amplitude distance of the piezoelectric vibrator 3. It is needless to say that this position regulating body 11 is provided in such a way that it does not interfere with the vibration of the first substrate 2 by, for example, contacting the flexible lead wire 8 or the like.

According to the device configured in this way,
A first substrate 3 on which the solid-state image sensor 1 is mounted and fixed
is normally vibrated with a predetermined amplitude by the vibration drive of the piezoelectric vibrator 1. This makes it possible to synthesize image signals at each vibration position of the solid-state image sensor 1 and obtain a high-resolution image.

On the other hand, when an impact is applied to the device, the first substrate 2 vibrates due to the stress. is regulated. As a result, the vibration amplitude transmitted to the piezoelectric vibrator 4 is suppressed to be narrower than its destructive vibration amplitude, thereby preventing the piezoelectric vibrator 4 from being destroyed. Therefore, it is possible to make this structure excellent in earthquake resistance. Further, this device has a simple structure in which the position regulating body 11 is provided to suppress the vibration amplitude of the solid-state image sensor 1, the first substrate 2, and the piezoelectric vibrator 4, and has a very high practical advantage.

FIG. 3 shows a second embodiment of the invention. This embodiment differs from the previous embodiment in that it has a structure in which a piece 12a is provided as a position regulating body 12 to also regulate the vertical vibration width of the first substrate 2. That is, the position regulating body 12
has a shape in which two pieces 12a are protruded from a member that regulates the horizontal vibration amplitude of the first substrate 2 with a predetermined gap between them, and the first substrate is placed between the gaps between these pieces 12a. It is designed to position the sides of 2.

Thus, with such a configuration, in addition to the effects of the device of the previous embodiment, the vibration width of the first substrate 2 in the vertical direction can be suppressed, thereby further increasing its earthquake resistance. becomes possible.

Further, FIG. 4 is a cross-sectional configuration diagram of an apparatus according to a third embodiment of the present invention. This embodiment device has a second substrate 3
Utilizing the fact that there is a space between the first substrate 2 supported via the piezoelectric vibrator 4 and the second substrate 3 above, the solid-state image sensor is mounted on the second substrate 3. 1 drive circuit and signal processing circuit as circuit element 1
3. Similarly to each of the embodiments described above, the position regulating body 14 for regulating the amplitude of vibration of the first substrate 2 is an electrostatic shield plate, which is provided so as to surround the solid-state image sensor 1.

In this way, the vibration amplitude of the first substrate 2 can be effectively regulated, and the solid-state image sensor 1 can be effectively electrostatically shielded from the circuit element 13.
It becomes possible to fully utilize its functions. Moreover, since the space on the second substrate 3 is effectively utilized to incorporate the circuit elements 13 such as the signal processing circuit, the overall device can be effectively made compact. Therefore, its practical advantages are enormous. Note that the electrostatic shield plate may be formed independently.

Further, FIG. 5 shows a fourth embodiment of the present invention, and the feature of this device is that a pair of electrodes 1 is provided at the opposing portion of the position regulating body 15 and the first substrate 2.
6a and 16b are arranged to form a capacitor. The capacitance of this capacitor is
The distance between the electrodes 16a and 16b changes due to vibration. However, the structure is such that the change in capacitance value of the lever is detected and utilized for controlling the vibration drive of the piezoelectric vibrator 3.

With such a configuration, not only can the vibration amplitude of the first substrate 2 be regulated by contacting the position regulating body 15, but also the vibration amplitude of the first substrate 2 can be regulated from the change in the capacitance value of the capacitor. By controlling the vibration drive of the piezoelectric vibrator 3 according to this detected amount, it is possible to limit the vibration amplitude. Therefore, even if the vibration width of the piezoelectric vibrator 3 changes over time due to its ambient temperature, operating time, etc., it is possible to control the vibration width to be constant. By controlling the vibration width to be constant in this manner, it is possible to obtain effects such as being able to prevent changes in resolution. In other words, after electrically regulating the vibration amplitude of the first substrate 2 from changes in the capacitance of the capacitor, large vibrations due to sudden stress are controlled by the position regulating body 15 and the first substrate 2.
This can be prevented by contact with the Therefore, it is possible to expect effects greater than those of the above-mentioned embodiments.

Note that the present invention is not limited only to the above embodiments. For example, the shape of the position regulating body may be an inverted L shape, and the number thereof can be increased as appropriate depending on the size of the first substrate 2, the vibration direction, etc. Also, the side of the first substrate 2 is
It is also possible to bend it into a letter shape and regulate the vibration width by this bent portion and the side edges of the second substrate 3. Further, in the embodiment, one piezoelectric vibrator is used to vibrate the first substrate, but it goes without saying that a plurality of piezoelectric vibrators may be provided in parallel. In short, the present invention can be implemented with various modifications without departing from the gist thereof.

[Brief explanation of drawings]

Figures 1a and 5 are perspective views and cross-sectional configuration diagrams showing the device previously proposed by the present inventors, and Figures 2 to 5.
The figures are cross-sectional configuration diagrams showing different embodiment devices of the present invention. 1... Solid-state image sensor, 2... First substrate, 3... Second
4... Piezoelectric vibrator, 5... Support, 6... Fixing member, 7... Bonding lead wire, 8... Flexible lead wire, 11, 12, 14, 15... Position regulating body, 13... Circuit element, 16a, 16b...electrodes.

Claims (1)

[Claims] 1. A first substrate on which a solid-state image sensor is mounted and fixed;
a piezoelectric vibrator that supports the first substrate and spatially vibrates the solid-state imaging device integrally with the first substrate; the first substrate provided on the second substrate;
a position regulating body that regulates the vibration width of the substrate within a range narrower than the breakdown amplitude of the piezoelectric vibrator. 2. The solid-state imaging device according to claim 1, wherein the position regulating body is in contact with the side of the first substrate to regulate its vibration amplitude. 3. The position regulating body serves as one electrode plate that constitutes a capacitor between the position regulating body and the side of the first substrate, and the capacitor detects the vibration of the first substrate through a change in its capacitance and generates a piezoelectric vibrator. 2. The solid-state imaging device according to claim 1, wherein the solid-state imaging device is used as an element of a circuit that controls the vibration amplitude of the first substrate by feedback controlling a drive voltage.