JPH0136592B2 - - Google Patents

Description

[Detailed Description of the Invention] (1) Technical Field of the Invention The present invention provides a method for testing the characteristics of electronic components such as integrated circuits (hereinafter referred to as "IC") by connecting them to an electronic component tester and determining the quality of the test results. The present invention relates to a docking mechanism for sequentially connecting component cases housing electronic components to component guide rails built into a test jig in an autohandler for an electronic component tester that automatically processes electronic components.

(2) Technology background The current situation is that ICs, especially linear ICs, have different mounting positions, shapes, dimensions, etc. of heat sinks depending on the manufacturer, and the overall shape and dimensions of the linear ICs vary. . Conventionally, when testing the characteristics of linear ICs with various shapes and dimensions, the linear ICs are automatically supplied to the measurement section, or the linear ICs are automatically placed at a predetermined location after measurement. There were almost no devices to store, and tests were performed by manually inserting and removing each device one by one into the measuring section. For this reason, there is a need for an autohandler for electronic component testers that can automatically process electronic components such as linear ICs of various shapes and dimensions as described above. There is a demand for a docking mechanism that sequentially connects the two.

(3) Purpose of the invention The present invention was made in response to the above circumstances.
In an autohandler for electronic component testers that automatically processes electronic components of various shapes and sizes, we have developed a docking mechanism that can sequentially connect component cases that house electronic components to component guide rails built into the test jig. The purpose is to provide.

(4) Structure of the Invention According to the present invention, this object includes a table provided adjacent to a control unit installed on a pedestal and inclined to one side, and a table provided in the center of the table and provided inside. A test jig that has a component guide rail along the inclination direction of the table and is replaceable, and a component case that is installed on the top of the table and stores electronic components to be tested are aligned so that they can move up and down. In an autohandler for an electronic component tester, the autohandler has a supply-side Yatoi stored therein and a receiving-side Yatoi installed at the bottom of the table and storing component cases arranged so as to be movable up and down for storing electronic components after completion of testing. , Docking guide rails are provided at the upper and lower ends of the component guide rail of the test jig into which the ends of the component cases of the supply side Yatoi and the receiving side Yatoi can be inserted, respectively, and are coaxial with the component guide rail of the test jig. A supply side docking mechanism section and a receiver, each having a presser bar arranged on a line and projecting above the supply side yatoi and the receiving side yatoi from the central portions of the upper and lower ends of the table, respectively, and protruding downward to press down the component case. A side docking mechanism is provided,
The supply side yatoi and the receiving side yatoi are interlocked by the feeding mechanism and are pitch-feeded in the lateral direction, and the respective parts cases are sequentially pushed downward by the presser bars of both the docking mechanisms to be inserted and connected to the docking guide rail. This is achieved by providing a component case docking mechanism in an autohandler for an electronic component tester characterized by the following features.

(5) Embodiments of the invention Hereinafter, embodiments of the invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a perspective view showing the entire autohandler for an electronic component tester according to the present invention. A pedestal 1 serves as a pedestal for supporting the autohandler, and a control section 2 is installed on the top surface of the pedestal 1.
This control section 2 controls the operation of the autohandler, and an operation panel 3 is provided on its upper surface.

A table 4 is provided on the side of the control section 2 and adjacent to the control section 2. The table 4 is inclined to one side and has an appropriate width and length. This table 4 is used to set up a test jig 5 and tools 13 and 18, which will be described later, so that electronic components such as ICs to be tested will flow from the supply side to the receiving side under the action of gravity, for example.
It has an inclination of about 45°.

At the longitudinal center of the table 4, a test jig 5 and a signal transfer section 6 are provided adjacent to the test jig 5. As shown in FIG. 3, this test jig 5 is provided with a component guide rail 7 inside thereof along the longitudinal direction, that is, the inclination direction, of the table 4, and the upstream part of this component guide rail 7 is It has a shutter section 8 that feeds and cuts off ICs, etc.,
In the central part, there is a measuring part 9 for testing by contacting the contact pins with the leads of ICs, etc., and further in the downstream part, there is a determining part 10 for determining the quality of the test results and sorting out good products and defective products. ing. At the upper and lower ends of the component guide rail 7, there is a docking guide rail 11 having a shape into which the end portions of component cases 14, 14 aligned and stored in a supply side yatoi 13 and a receiving side yatoi 18, which will be described later, can be inserted. ,12
are provided for each. Note that this test jig 5 is removable at a predetermined position on the table 4, and can be replaced with another test jig 5 having a component guide rail 7 according to the shape and dimensions of the IC, etc. to be tested. Can be done. The signal transfer section 6 transmits and receives signals necessary for characteristic testing between the measurement section 9 of the test jig 5 and the electronic component tester. A test result signal from the tester is sent to the control section 2, and an output signal is sent from this control section to the judgment drive section, and the judgment section 10 of the jig 5 performs judgment work.

On the upper part of the table 4, there is a supply side Yatoi 13.
is provided. This supply-side yatoi 13 is for supplying ICs to be tested to the test jig 5, and as shown in FIG. Component cases 14 containing ICs and the like to be used are arranged and stored. The component case 14 is formed into an elongated cylindrical shape, such as a rectangular cross section, depending on the shape and dimensions of the IC etc. to be stored, and is provided on the inner bottom surface of the supply side yatoi 13, as shown in FIG. The floating springs 15, 15 are arranged on the upper surface side of the Yatoi 13 from above, and the floating springs 15, 15 are stored with pressing members 16, 16 at both ends slightly pressing the floating springs 15, 15. Therefore, the component case 14 can be moved up and down by the elastic action of the floating springs 15, 15 while it is housed in the Yatoi 13. Then, the supply side yatoi 13 is fed in pitches in the directions of arrows A and B by a feeding mechanism consisting of a drive motor, a ball screw, etc. provided in the hole 17 of the table 4 shown in FIG. ing.

At the bottom of the table 4, there is a receiving side yatoi 18.
is provided. This receiving side Yatoi 18 is sent out from the test jig 5 after the test is completed.
As shown in FIGS. 1 and 2, a component case 14 similar to the above-described component case 14 is used to store ICs, etc. after the test is completed along the longitudinal direction of the table 4, that is, the inclination direction, as shown in FIGS. are stored in order. And this receiving side Yatoi 18,
A feeding mechanism similar to that described above provided in the hole 19 of the table 4 shown in FIG. 1 feeds the paper in pitches in the directions of arrows A and B.

From the center of the upper and lower ends of the table 4, as shown in FIG. A supply-side docking mechanism section 20 and a receiving-side docking mechanism section 21 extend parallel to the table 4 along the longitudinal direction above the parts cases 14, 14 of the supply-side Yatoi 13 and the receiving-side Yatoi 18. . As shown in FIGS. 3 and 4, a presser bar 22 is provided on the lower surface side of both the docking mechanism sections 20 and 21 and projects downward therefrom to press the upper surface of the component cases 14 and 14. There is.
This presser bar 22 is projected downward by, for example, operating a lever 23 shown in FIG. 4 by operating an air cylinder 25 provided in both docking mechanisms 20, 21. In addition, in FIGS. 2 to 4, the reference numeral 24 indicates the component case 14.
These are end plates provided on both Yatoi 13 and 18 so as to cover the openings at both ends when the Yatoi 13 and 18 move up and down.

Next, the operation of the component case docking mechanism in the autohandler for electronic component testers according to the present invention will be explained. First, as a preparatory stage for testing, the component cases 14 containing ICs and the like to be tested are lined up and stored on the upper surface of the supply side yatoi 13. On the other hand, empty component cases 14 having the same shape and dimensions as the supply side component cases 14 are arranged and stored on the upper surface of the receiving side yatoi 18. In this state, the supply side Yatoi 13 and the receiving side Yatoi 18
is fully retreated in the direction of arrow B as shown in FIG. Next, a test jig 5 containing a component guide rail 7 having a shape and dimensions according to the shape and dimensions of the IC, etc. to be tested, which is stored in the component case 14 stored in the supply side yatoi 13, is installed. Set it at a predetermined position in the center of the table 4. At this time, the terminals of the performance board (printed board) of the test jig 5 are inserted into the connector of the signal transfer section 6. When the preparations are completed in this manner, the operation button 26 on the operation panel 3 of the control section 2 is operated to start. First, hole 1
The feeding mechanism 13 and the receiving side yatoi 18 are interlocked by the feeding mechanism provided in the parts 7 and 19, and the first
In the figure, it is pitch fed in the direction of arrow A. In this way, when the first component cases 14 and 14 of the respective Yatoi 13 and 18 have stopped directly below the supply side docking mechanism section 20 and the receiving side docking mechanism section 21, respectively, as shown in FIG. A presser bar 22 provided on the lower surface side of the docking mechanism parts 20, 21 is projected downward by a lever 23 which is rotated in the direction of the arrow shown in FIG. 4 by the operation of an air cylinder 25. As a result, the upper surfaces of the component cases 14, 14 are pressed by the presser bar 22, and the parts cases 14, 14 are pushed down against the floating springs 15 provided on the inner bottom surfaces of the respective Yatoi 13, 18, and the fourth
As shown in the figure, its ends are inserted into docking guide rails 11 and 12 provided at the upper and lower ends of the component guide rail 7 of the test jig 5 and connected thereto. Once this is done, the IC to be tested is selected from the component case 14 of the supply side Yatoi 13.
The parts are fed into the guide rail 7 in the test jig 5 by the action of gravity, and the shutter part, measurement part,
The test is performed through a predetermined process of the determining section.

In this way, ICs, etc. are tested one after another, and the number of tested ICs is counted by a counter. When all the ICs, etc. stored in the first supply-side component case 14 have been tested, each IC, etc. is tested one after another. Presser bar 22 of the docking mechanism parts 20 and 21
However, due to the reverse rotation of the lever 23 due to the opposite operation of the air cylinder 25, the parts cases 1 of the respective Yatoi 13 and 18 are lifted up.
4 and 14 are lifted up by the elastic force of the floating spring 15, and their ends pass upward from the respective docking guide rails 11 and 12, and the connection is released. Next, both the gears 13 and 18 are pitch-fed in the direction of arrow A by the feeding mechanism, and the next component cases 14 and 14 are stopped directly below the respective docking mechanisms 20 and 21. Thereafter, by repeating the same operation as above, the parts cases 14, 14 of the supply side yatoi 13 and the receiving side yatoi 18 are automatically pushed down one after another, inserted into and connected to the docking guide rails 11, 12, and so on. or cancel it. In this way, all the ICs and the like housed in the component cases 14 on the supply side are automatically tested.

(6) Effects of the Invention Since the present invention is configured as described above, a large number of component cases 14 arranged and stored in the supply side yatoi 13 and the receiving side yatoi 18 are transferred to the supply side docking mechanism section 20 and the receiving side docking mechanism section 21. The test jig 5 can be inserted and connected to the docking guide rails 11 and 12 provided at the upper and lower ends of the component guide rail 7 of the test jig 5 by sequentially pushing it down using the presser bar 22 of the test jig 5. In addition, since the component cases 14, 14 on the supply side and the receiving side are directly connected to both ends of the component guide rail 7 of the test jig 5, the length of the component guide rail 7 and the components connected above and below the component guide rail 7 are fixed. Testing of electronic components can be performed within the range of the lengths of the cases 14, 14, and the overall shape of the autohandler can be reduced in size.

[Brief explanation of drawings]

Fig. 1 is a perspective view showing the entire autohandler for electronic component tester according to the present invention, Fig. 2 is a perspective view showing the supply side yatoi (or receiving side yatoi), and Figs. 3 and 4 are according to the invention. FIG. 1 is a sectional view taken along the line A--A showing the operating state of the component case docking mechanism, FIG. 3 shows the state before connection, and FIG. 4 shows the state after connection. 1... Frame, 2... Control unit, 4... Table,
5... Test jig, 7... Parts guide rail, 1
1, 12... Dotting guide rail, 13...
Supply side Yatoi, 14... Parts case, 15... Floating spring, 18... Receiving side Yatoi, 20
... Supply side docking mechanism section, 21 ... Receiving side docking mechanism section, 22 ... Presser bar, 23 ... Lever, 25 ... Air cylinder.

Claims (1)

[Claims] 1. A table that is installed adjacent to a control unit installed on a pedestal and tilted to one side, and a component guide rail that is installed in the center of this table and runs along the direction of inclination of the table, and is replaceable. A test jig, which is installed on the upper part of the table, and a supply side yatoi, in which component cases containing electronic components to be tested are arranged and stored in a vertically movable manner, are installed on the lower part of the table. In an autohandler for an electronic component tester, which has a receiving side tray in which component cases for storing electronic components after a test are arranged and stored so as to be movable up and down, the upper and lower ends of the component guide rail of the test jig are respectively mounted. A docking guide rail into which the ends of the parts cases of the supply side Yatoi and the receiving side Yatoi can be inserted is provided, and the docking guide rails are arranged on the same axis as the component guide rail of the test jig and are inserted from the center of the upper and lower ends of the table, respectively. A supply side docking mechanism section and a reception side docking mechanism section are provided above the supply side Yatoi and the receiving side Yatoi, each having a presser bar extending parallel to the table and protruding downward to press down the component case. The side yatoi and the receiving side yatoi are interlocked by a feeding mechanism to feed in pitch in the lateral direction, and each component case is sequentially pushed downward by the presser bar of both docking mechanism sections to be inserted and connected to the docking guide rail. A component case docking mechanism in an autohandler for an electronic component tester, characterized by: