JPH0136992B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a hybrid integrated circuit in which a thin film pattern is formed on a ceramic substrate and active and passive circuit components are mounted on a part of the circuit pattern, and in particular, This invention relates to improvements in connection methods for connecting external lead leads to circuit boards.

With the miniaturization of various electronic components, hybrid integrated circuits are becoming smaller and more dense, and the connection between the alumina ceramic board for mounting components and the mounted components, and the connection between external lead wires and the board are required to ensure reliability and quality. It has become even more important in terms of

Generally, elements such as resistors, capacitors, conductors, cross-under parts, and patterns are deposited on an alumina ceramic substrate used as a hybrid integrated circuit by vapor deposition, sputtering, etc., and then a large number of patterns are formed using photolithography. Next, we check the electrical characteristics of the pattern and cut it out into individual hybrid integrated circuit boards, and after mounting the patterned components, we adjust the functions and check the characteristics of the hybrid integrated circuit and then separate it into individual circuits. However, in these methods, when performing various electrical checks before singulation, a needle (probe) is used for each pattern in order to provide electrical conditions to each pattern. need to be brought into contact.

As patterns in hybrid integrated circuits become smaller and more dense, check needles are coming into contact with required locations in the circuit in a scattered manner. In particular, when adjusting resistors, capacitors, etc. to desired values (hereinafter referred to as trimming) while using a probe, methods such as laser light, electric discharge, and ultrasonic waves are used as adjustment means. However, trimming using laser light has recently been adopted as a common method, and if the stylus is scattered, the laser light may hit the stylus and trimming cannot be performed.

In order to avoid this, a method is used in which the needles are gathered near the external lead pattern land portion of the hybrid integrated circuit. In terms of ease of attaching the stylus, it is advantageous to gather the stylus near the external pull-out pattern land, but on the other hand, it means providing as many stylus patterns as the number of stylus, and as a result, the board size increases. What I said will happen. However, in the direction of miniaturization of hybrid integrated circuit boards, it is difficult to increase the board size, and the only way to avoid increasing the board size is to reduce the stylus pattern and external lead-out pattern. .

On the other hand, the external lead wire is connected via solder on the external lead pattern land, and the connection strength between the lead wire and the land is required to fulfill the role of electrical input/output with the outside of the hybrid integrated circuit. Ru. Therefore, when the external lead pattern land is reduced in size, the soldering area of the external lead wire becomes smaller, and as a result, the strength of the lead connection part decreases, causing a problem in connection reliability.

An object of the present invention is to provide a patterned land for a stylus around the board to facilitate checking the electrical characteristics of the board, while increasing the size of a conventional board by providing a patterned land for a stylus around the board; An object of the present invention is to provide a method for manufacturing a hybrid integrated circuit in which reduction in external lead lead connection strength is avoided.

The method for manufacturing a hybrid integrated circuit according to the present invention includes a method of manufacturing a hybrid integrated circuit by applying a stylus to a stylus pattern land of an external lead-out pattern land and a stylus pattern land provided adjacent to the periphery of a ceramic substrate, and then detecting electrical characteristics of the ceramic substrate. The method includes a step of performing a check, and a step of cutting off the stylus pattern land using a laser beam, and using the separated pattern land and the lead-out pattern land in common to connect an external lead-out lead.

Next, the present invention will be explained with reference to the drawings.

FIGS. 1a and 1b are plan views for explaining the method of connecting external lead leads in the conventional hybrid integrated circuit manufacturing method. First, as shown in FIG. There are provided an external lead pattern land 2 having a sufficiently large area to secure the wiring pattern, and a stylus pattern land 3 for checking the electrical characteristics of the board 1 on which a circuit pattern is formed. Then, after checking the electrical characteristics of the board 1 by placing the stylus on the stylus pattern land 3, as shown in FIG. . In this type of conventional external lead connection, the stylus pattern lands are formed on the periphery of the circuit board, so the board area is smaller than when the stylus pattern lands are scattered at required positions within the circuit. It tends to get bigger. However, if the area of the external lead pattern land 2 is reduced in order to reduce the area, the connection strength of the external lead lead 4 becomes insufficient.

FIGS. 2a and 2b are plan views for explaining the process of connecting external leads to a hybrid integrated circuit board according to an embodiment of the method of the present invention. First, an alumina ceramic substrate 11 on which a circuit pattern is formed
An external drawer pattern land 12 having an area half that of a conventional external drawer pattern land is formed around the periphery of the stylus pattern land 12, and a stylus pattern land 13 of approximately the same size is provided adjacent to this. In the state shown in FIG. 2a, after checking the electrical characteristics of the ceramic substrate 11 by placing the stylus on the stylus pattern land 13, as shown in FIG. The cut-off stylus pattern land 13 and the external lead pattern land 12 are collectively put together and connected to the external lead lead 4 by soldering.

In this way, in the method of the present invention, the external lead-out pattern land drawn out around the ceramic substrate is made smaller, and the reduced size is compensated for by the stylus pattern land that is separated and made independent. The increase in substrate area caused by gathering the components around the substrate is no longer necessary. In this way, after checking the electrical characteristics by making the stylus easier with the stylus pattern land around the board, the stylus pattern land is separated and merged with the adjacent external lead pattern land. In order to connect the external lead to the external lead pattern land, the external lead is connected with conventional strength. In other words, the present invention provides a highly practical and great effect in that the ease of stylus operation can be achieved without increasing the substrate area.

[Brief explanation of drawings]

1A and 1B are plan views for explaining the process of connecting external leads to a ceramic substrate according to a conventional manufacturing method, and FIGS. 2A and 2B are plan views of a hybrid integrated circuit ceramic according to an embodiment of the present invention. FIG. 3 is a plan view for explaining a process of connecting external leads to a substrate. 1, 11... Ceramic substrate, 2, 12... External drawer pattern land, 3, 13... Stylus pattern land, 4... External drawer lead.

Claims (1)

[Claims] 1 Form a circuit pattern on a ceramic substrate,
In this method of manufacturing a hybrid integrated circuit including mounting a circuit component on a part of the circuit pattern, a wide external lead-out pattern land and a wide stylus are provided adjacent to the periphery of the ceramic substrate. A step of placing a stylus on a stylus pattern land among the pattern lands and checking the electrical characteristics of the board; After this checking step, the stylus pattern land is separated by a laser beam, and the separated stylus pattern land is A method for manufacturing a hybrid integrated circuit, comprising the step of connecting an external lead lead in common with the external lead pattern land.