JPH0139205B2 - - Google Patents
Info
- Publication number
- JPH0139205B2 JPH0139205B2 JP55104147A JP10414780A JPH0139205B2 JP H0139205 B2 JPH0139205 B2 JP H0139205B2 JP 55104147 A JP55104147 A JP 55104147A JP 10414780 A JP10414780 A JP 10414780A JP H0139205 B2 JPH0139205 B2 JP H0139205B2
- Authority
- JP
- Japan
- Prior art keywords
- molecular beam
- chamber
- small
- beam source
- molecular
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/22—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using physical deposition, e.g. vacuum deposition or sputtering
Landscapes
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Description
【発明の詳細な説明】
本発明は分子結晶成長において、安定した再現
性のよい均一な分子線を得るための分子線源の改
良に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement in a molecular beam source for obtaining a stable and uniform molecular beam with good reproducibility in molecular crystal growth.
超高真空に保たれたエピタキシヤル成長室内に
半導体基板を設置し、前記エピタキシヤル成長室
に連結した小部屋に該基板上に形成すべき薄膜の
ソースとなる材料を収容したカーボンあるいはパ
イロリテイツク・ボロン・ナイトライド(PBN)
よりなるオーブンセルを配置し、前記半導体基板
およびオーブンセルを加熱することでソース材料
の蒸発した分子線を基板上に照射する。そして基
板上に所望の組成を有する薄膜を形成する分子線
エピタキシヤル成長方法はすでに周知である。 A semiconductor substrate is placed in an epitaxial growth chamber kept in an ultra-high vacuum, and a small chamber connected to the epitaxial growth chamber contains carbon or pyrolitic boron containing a material that will become the source of a thin film to be formed on the substrate.・Night Ride (PBN)
An oven cell consisting of the following is disposed, and by heating the semiconductor substrate and the oven cell, the substrate is irradiated with a molecular beam in which the source material has been evaporated. A molecular beam epitaxial growth method for forming a thin film having a desired composition on a substrate is already well known.
このような分子線エピタキシヤル法を実施する
ための分子線エピタキシヤル成長装置において、
前記分子線形成用材料を充填した分子線源セルと
前記分子線源セルを加熱するヒーターとからなる
分子線源の従来の構造を第1図に断面図にて示
す。 In a molecular beam epitaxial growth apparatus for carrying out such a molecular beam epitaxial method,
A conventional structure of a molecular beam source comprising a molecular beam source cell filled with the molecular beam forming material and a heater for heating the molecular beam source cell is shown in cross-sectional view in FIG.
図示するように従来構造の分子線源は円筒形の
カーボンあるいはPBN治具をくり抜いた形の小
室1を有する分子線源用セル2とタングステンあ
るいはタンタルよりなるヒーター3とからなり上
記小室内へ分子線の材料となる例えばガリウム
(Ga)等の金属4を充填したのち前記分子線源用
セルをエピタキシヤル成長すべき半導体基板を設
置したエピタキシヤル成長室と連なる小部屋に設
置して、前記エピタキシヤル成長室および分子線
源セルを設置した小部屋を超高真空に排気したの
ち前記半導体基板および、分子線源セルの周囲の
ヒーター3を加熱して分子線源セルの噴出孔5よ
り蒸発したCaの分子線を基板上に照射していた。 As shown in the figure, the conventional molecular beam source consists of a molecular beam source cell 2 having a small chamber 1 formed by hollowing out a cylindrical carbon or PBN jig, and a heater 3 made of tungsten or tantalum. After filling a metal 4, such as gallium (Ga), which is a material for the wire, the molecular beam source cell is placed in a small room connected to an epitaxial growth chamber in which a semiconductor substrate to be epitaxially grown is installed. After the growth chamber and the small room in which the molecular beam source cell was installed were evacuated to an ultra-high vacuum, the semiconductor substrate and the heater 3 around the molecular beam source cell were heated to cause evaporation from the ejection hole 5 of the molecular beam source cell. A Ca molecular beam was irradiated onto the substrate.
しかし前記したような形状の分子線源セルで
は、セル内で溶融したCaが突沸等によつて多数
個分子の粒となつて噴出孔5より飛び出し基板迄
飛来して基板に付着する。そしてこのような粒が
基板に付着すると付着した部分のみ結晶が異常成
長しこのような異常成長した部分を多数有する結
晶基板からIC等を製造した場合歩留が低下する
といつた問題点を生じる。 However, in the molecular beam source cell having the above-mentioned shape, Ca melted within the cell becomes a large number of molecular particles due to bumping, etc., which fly out from the ejection hole 5 and fly to the substrate, where they adhere to the substrate. When such grains adhere to a substrate, crystals grow abnormally only in the adhered portions, resulting in problems such as a decrease in yield when ICs and the like are manufactured from a crystal substrate having many such abnormally grown portions.
本発明は上記した欠点を除去し、分子線源セル
から噴出する分子線が突沸等の現象によつて多数
個分子の粒となつて噴出しないようにし、均一な
単分子の分子線として安定に取り出せるようにし
た分子線源を提供することを目的とするものであ
る。 The present invention eliminates the above-mentioned drawbacks, prevents the molecular beam ejected from the molecular beam source cell from ejecting as multiple molecular particles due to phenomena such as bumping, and stabilizes the molecular beam as a uniform single molecule. The purpose is to provide a molecular beam source that can be extracted.
かかる目的を達成するため、本発明では分子線
形成材料より蒸発した分子線を通過させる小孔が
設けられた隔壁と、該隔壁によつて仕切られた複
数の小室と、該小室ごとに別個に設けられ該小室
を加熱するヒータとを有する分子線結晶成長用分
子線源を構成し、該ヒータの加熱温度を調節する
ことで、該複数の小室を各々異なる温度に加熱
し、該分子線中の分子の大きさを均一化して該分
子線を分子線エピタキシヤル成長室に放出するこ
とを特徴とするものである。 In order to achieve such an object, the present invention includes a partition wall provided with a small hole through which the molecular beam evaporated from the molecular beam forming material passes, a plurality of small chambers partitioned by the partition wall, and a separate partition for each small chamber. A molecular beam source for molecular beam crystal growth includes a heater provided for heating the small chambers, and by adjusting the heating temperature of the heater, each of the plurality of small chambers is heated to a different temperature. This method is characterized in that the molecular size of the molecules is made uniform and the molecular beams are emitted into a molecular beam epitaxial growth chamber.
つまり、本発明の分子線源セルにおいては従来
の分子線源セルの内部を多数の小室に分割し、第
1の室で分子線源の材料を溶融しガス状の分子線
源とし前記第1の室に連なる第2の室で分子線を
再加熱し、更に順次分子線を隣接する小室に移動
させて再加熱して各小室毎に分子線の強度を変化
させることで分子線を形成する分子の大きさを均
一にするようにしたものである。 That is, in the molecular beam source cell of the present invention, the interior of the conventional molecular beam source cell is divided into a number of small chambers, and the molecular beam source material is melted in the first chamber to form a gaseous molecular beam source. The molecular beam is reheated in a second chamber connected to the chamber, and then the molecular beam is sequentially moved to adjacent chambers and reheated, changing the intensity of the molecular beam in each chamber to form a molecular beam. The size of the molecules is made uniform.
以下図面を用いて本発明の一実施例につき詳細
に説明する。 An embodiment of the present invention will be described in detail below with reference to the drawings.
第2図は本発明に係る分子線源の断面図であ
る。図示するように分子線源を構成する分子線源
セル11は高純度のグラフアイトで形成されてお
り前記円筒形のグラフアイトをくり抜いた形の分
子線源セルの内部は第1の小室12、第2の小室
13、第3の小室14にそれぞれ分割されてい
る。各小室はカーボンの隔壁15,16によつて
区分され前記隔壁には隣接せる小室間を連結し形
成された分子線を噴出するための小孔17,18
が設けられている。また第3小室14から基板へ
分子線の照射を行うための噴出孔19が設けられ
ている。また前記各々の小室を別個に加熱するた
めのタンタルよりなるヒーター群20,21,2
2がそれぞ設けられている。このような分子線源
セルの第1の小室12内へ分子線源材料となる
Ga23を充填したのちエピタキシヤル成長室と
連なる小部屋に前記分子線源セルを設置したの
ち、前記エピタキシヤル成長室および小室を超高
真空に排気する。その後前記第1の小室を加熱す
るヒーター20の温度を1500〜1600℃、第2の小
室を加熱するヒーター21の温度を1600℃、第3
の小室を加熱するヒーター22の温度を1000℃に
それぞれ温度調節してヒータの温度を昇温させ
る。 FIG. 2 is a sectional view of a molecular beam source according to the present invention. As shown in the figure, a molecular beam source cell 11 constituting the molecular beam source is made of high-purity graphite. It is divided into a second small chamber 13 and a third small chamber 14, respectively. Each chamber is divided by carbon partition walls 15 and 16, and the partition walls have small holes 17 and 18 for connecting adjacent chambers and ejecting the formed molecular beam.
is provided. Further, an ejection hole 19 is provided for irradiating the substrate with a molecular beam from the third small chamber 14. Also, heater groups 20, 21, 2 made of tantalum for heating each of the small chambers separately.
2 are provided respectively. The molecular beam source material is introduced into the first chamber 12 of such a molecular beam source cell.
After filling with Ga23, the molecular beam source cell is installed in a small chamber connected to the epitaxial growth chamber, and then the epitaxial growth chamber and the small chamber are evacuated to ultra-high vacuum. After that, the temperature of the heater 20 that heats the first small chamber is set to 1500 to 1600°C, the temperature of the heater 21 that heats the second small chamber is set to 1600°C, and the temperature of the heater 21 that heats the second small chamber is set to 1600°C.
The temperatures of the heaters 22 that heat the small chambers are adjusted to 1000° C. to raise the temperature of the heaters.
このようにすると容積約20c.c.の第1の小室で加
熱されたGaは該室内で5〜6Torrの蒸気圧をも
つた蒸気となり、この蒸気が第1の小室と第2の
小室を連結し第1の小室よりはるかに小さい断面
積を有する小孔17を通じて第2の小室13内へ
噴射されるようになる。この第2の小室に移つた
蒸気は第2の小室を加熱するヒーター21によつ
て約1600℃に再加熱され、10-1TorrのGaの蒸気
となる。このGa蒸気は更に第2の小室13と第
3の小室14とを連結する小孔18を通じて第3
の小室14内へ移動し、更にヒーター22によつ
て約1000℃に加熱されて5〜6×10-3〜5〜6×
10-2TorrのGaの蒸気となる。そして噴出孔19
より基板上に分子線としてとび出す。 In this way, the Ga heated in the first chamber with a volume of about 20 c.c. becomes steam with a vapor pressure of 5 to 6 Torr, and this steam connects the first chamber and the second chamber. The liquid is then injected into the second chamber 13 through a small hole 17 having a much smaller cross-sectional area than the first chamber. The steam transferred to this second chamber is reheated to about 1600° C. by the heater 21 that heats the second chamber, and becomes Ga vapor at 10 −1 Torr. This Ga vapor further passes through the small hole 18 connecting the second small chamber 13 and the third small chamber 14 to the third small chamber 14.
It is further heated to about 1000°C by the heater 22 and heated to 5 to 6×10 -3 to 5 to 6×
It becomes Ga vapor at 10 -2 Torr. and spout 19
The molecular beams are projected onto the substrate as molecular beams.
このようにすれば第1の小室で溶融したGaか
ら直接飛び出した分子線は、第2以降の小室で分
子線源セルの壁面と衝突し再び加熱される。この
時の壁面からの熱エネルギーによつて多数個の分
子は崩壊され、単一分子となり、最終段の噴出口
19より大きさのそろつた均一な分子線となつて
とり出されるようになる。 In this way, the molecular beam directly ejected from the molten Ga in the first small chamber collides with the wall surface of the molecular beam source cell in the second and subsequent small chambers and is heated again. At this time, a large number of molecules are disintegrated by the thermal energy from the wall surface and become a single molecule, which is then extracted as a uniform molecular beam of uniform size from the ejection port 19 at the final stage.
このようにすれば従来の分子線源セルからGa
分子が多数集まつて突沸して基板上にGa分子の
粒子の塊りとなつて付着することによる異常な結
晶成長がおこることなく、均一な薄膜が基板上に
再現性良く形成されるようになる。 In this way, Ga
A uniform thin film can be formed on the substrate with good reproducibility without abnormal crystal growth caused by a large number of molecules gathering and bumping and adhering to the substrate as clusters of Ga molecule particles. Become.
また以上の実施例においては分子線源セルを3
つの小室に分割したがこの分割する数は多い程均
一な分子線が得られる。 In addition, in the above embodiment, three molecular beam source cells are used.
Although it is divided into two small chambers, the more the number of chambers is divided, the more uniform the molecular beam can be obtained.
また以上の実施例においては分子線形成用材料
としてGaを用いて説明したが、その他Al、In等
の分子線結晶成長用材ならいずれでも適用可能と
なる。 Further, in the above embodiments, Ga was used as the molecular beam forming material, but any other material for molecular beam crystal growth such as Al, In, etc. can be used.
第1図は従来の分子線源セルの構造を示す断面
図で、第2図は本発明の分子線源セルの一実施例
の構造を示す断面図である。
図において1は小室、2は分子線源用セル、3
はヒーター、4はGa金属、5は噴出孔、11は
分子線源セル、12は第1の小室、13は第2の
小室、14は第3の小室、15,16は隔壁、1
7,18は小孔、19は噴出孔、20,21,2
2はヒーター群、23はGa金属。
FIG. 1 is a sectional view showing the structure of a conventional molecular beam source cell, and FIG. 2 is a sectional view showing the structure of an embodiment of the molecular beam source cell of the present invention. In the figure, 1 is a small chamber, 2 is a molecular beam source cell, and 3 is a small chamber.
1 is a heater, 4 is a Ga metal, 5 is an ejection hole, 11 is a molecular beam source cell, 12 is a first small chamber, 13 is a second small chamber, 14 is a third small chamber, 15 and 16 are partition walls, 1
7, 18 are small holes, 19 is an ejection hole, 20, 21, 2
2 is a heater group, 23 is a Ga metal.
Claims (1)
せる小孔が設けられた隔壁と、該隔壁によつて仕
切られた複数の小室と、該小室ごとに別個に設け
られ該小室を加熱するヒータとを有する分子線結
晶成長用分子線源を構成し、 該ヒータの加熱温度を調節することで、該複数
の小室を各々異なる温度に加熱し、該分子線中の
分子の大きさを均一化して該分子線を分子線エピ
タキシヤル成長室に放出することを特徴とする分
子線エピタキシヤル成長方法。[Scope of Claims] 1. A partition wall provided with small holes through which molecular beams evaporated from a molecular beam forming material pass, a plurality of small chambers partitioned by the partition walls, and A molecular beam source for molecular beam crystal growth has a heater for heating the small chambers, and by adjusting the heating temperature of the heater, each of the plurality of small chambers is heated to a different temperature, and the molecules in the molecular beam are heated. A molecular beam epitaxial growth method characterized by emitting the molecular beam into a molecular beam epitaxial growth chamber with a uniform size.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10414780A JPS5730321A (en) | 1980-07-29 | 1980-07-29 | Molecular beam source for molecular beam epitaxy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10414780A JPS5730321A (en) | 1980-07-29 | 1980-07-29 | Molecular beam source for molecular beam epitaxy |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5730321A JPS5730321A (en) | 1982-02-18 |
| JPH0139205B2 true JPH0139205B2 (en) | 1989-08-18 |
Family
ID=14372964
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10414780A Granted JPS5730321A (en) | 1980-07-29 | 1980-07-29 | Molecular beam source for molecular beam epitaxy |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5730321A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2572099B1 (en) * | 1984-10-24 | 1987-03-20 | Comp Generale Electricite | THERMAL CRACKING MOLECULAR JET GENERATOR FOR THE MANUFACTURE OF SEMICONDUCTORS BY EPITAXIAL DEPOSITION |
| JPH01278493A (en) * | 1988-04-28 | 1989-11-08 | Nec Corp | Molecular beam generating device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS568186Y2 (en) * | 1976-04-20 | 1981-02-23 |
-
1980
- 1980-07-29 JP JP10414780A patent/JPS5730321A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5730321A (en) | 1982-02-18 |
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