JPH0139570B2 - - Google Patents
Info
- Publication number
- JPH0139570B2 JPH0139570B2 JP4921882A JP4921882A JPH0139570B2 JP H0139570 B2 JPH0139570 B2 JP H0139570B2 JP 4921882 A JP4921882 A JP 4921882A JP 4921882 A JP4921882 A JP 4921882A JP H0139570 B2 JPH0139570 B2 JP H0139570B2
- Authority
- JP
- Japan
- Prior art keywords
- polyene
- acid
- methacrylate
- composition
- solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000203 mixture Substances 0.000 claims description 41
- -1 benzyl dimethyl ketal compound Chemical class 0.000 claims description 28
- 229920001577 copolymer Polymers 0.000 claims description 22
- 150000004291 polyenes Chemical class 0.000 claims description 16
- 239000002253 acid Substances 0.000 claims description 14
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 claims description 13
- 230000005855 radiation Effects 0.000 claims description 12
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims description 9
- IUHFWCGCSVTMPG-UHFFFAOYSA-N [C].[C] Chemical group [C].[C] IUHFWCGCSVTMPG-UHFFFAOYSA-N 0.000 claims description 8
- FBCQUCJYYPMKRO-UHFFFAOYSA-N prop-2-enyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC=C FBCQUCJYYPMKRO-UHFFFAOYSA-N 0.000 claims description 4
- GWOLZNVIRIHJHB-UHFFFAOYSA-N 11-mercaptoundecanoic acid Chemical compound OC(=O)CCCCCCCCCCS GWOLZNVIRIHJHB-UHFFFAOYSA-N 0.000 claims description 3
- RCHALGLCCGJUAE-UHFFFAOYSA-N 4-methyl-4-(trichloromethyl)cyclohexa-2,5-dien-1-one Chemical compound ClC(Cl)(Cl)C1(C)C=CC(=O)C=C1 RCHALGLCCGJUAE-UHFFFAOYSA-N 0.000 claims description 2
- PXQLVRUNWNTZOS-UHFFFAOYSA-N sulfanyl Chemical class [SH] PXQLVRUNWNTZOS-UHFFFAOYSA-N 0.000 claims 4
- NLGDWWCZQDIASO-UHFFFAOYSA-N 2-hydroxy-1-(7-oxabicyclo[4.1.0]hepta-1,3,5-trien-2-yl)-2-phenylethanone Chemical compound OC(C(=O)c1cccc2Oc12)c1ccccc1 NLGDWWCZQDIASO-UHFFFAOYSA-N 0.000 claims 1
- 125000000217 alkyl group Chemical group 0.000 claims 1
- HDFRDWFLWVCOGP-UHFFFAOYSA-N carbonothioic O,S-acid Chemical compound OC(S)=O HDFRDWFLWVCOGP-UHFFFAOYSA-N 0.000 claims 1
- 229920001897 terpolymer Polymers 0.000 claims 1
- KYRXIBAPZPPDGD-UHFFFAOYSA-N undec-1-enyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCC=COC(=O)C(C)=C KYRXIBAPZPPDGD-UHFFFAOYSA-N 0.000 claims 1
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 39
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 36
- 238000000034 method Methods 0.000 description 26
- 239000010949 copper Substances 0.000 description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 22
- 238000000576 coating method Methods 0.000 description 22
- 229910052802 copper Inorganic materials 0.000 description 22
- 239000011248 coating agent Substances 0.000 description 21
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 20
- 238000011161 development Methods 0.000 description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 14
- 239000008262 pumice Substances 0.000 description 11
- 239000000758 substrate Substances 0.000 description 11
- 239000004743 Polypropylene Substances 0.000 description 10
- 229920001155 polypropylene Polymers 0.000 description 10
- 229910000029 sodium carbonate Inorganic materials 0.000 description 10
- 239000002904 solvent Substances 0.000 description 10
- NJRXVEJTAYWCQJ-UHFFFAOYSA-N thiomalic acid Chemical compound OC(=O)CC(S)C(O)=O NJRXVEJTAYWCQJ-UHFFFAOYSA-N 0.000 description 10
- 229920000642 polymer Polymers 0.000 description 9
- 125000003396 thiol group Chemical group [H]S* 0.000 description 9
- HTNFLUQQANUSLR-UHFFFAOYSA-N 2-octanoyloxyethyl octanoate Chemical compound CCCCCCCC(=O)OCCOC(=O)CCCCCCC HTNFLUQQANUSLR-UHFFFAOYSA-N 0.000 description 8
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 8
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 8
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 7
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 7
- 239000012964 benzotriazole Substances 0.000 description 7
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 6
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 6
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- 229920006295 polythiol Polymers 0.000 description 6
- 239000012965 benzophenone Substances 0.000 description 5
- IDGUHHHQCWSQLU-UHFFFAOYSA-N ethanol;hydrate Chemical compound O.CCO IDGUHHHQCWSQLU-UHFFFAOYSA-N 0.000 description 5
- 239000003999 initiator Substances 0.000 description 5
- 239000011877 solvent mixture Substances 0.000 description 5
- 239000000654 additive Substances 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 4
- 229910052786 argon Inorganic materials 0.000 description 4
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 4
- CWERGRDVMFNCDR-UHFFFAOYSA-N thioglycolic acid Chemical compound OC(=O)CS CWERGRDVMFNCDR-UHFFFAOYSA-N 0.000 description 4
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000005227 gel permeation chromatography Methods 0.000 description 3
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 3
- 238000003760 magnetic stirring Methods 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 239000004014 plasticizer Substances 0.000 description 3
- 150000003254 radicals Chemical class 0.000 description 3
- ZNQOETZUGRUONW-UHFFFAOYSA-N 1-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOC(C)O ZNQOETZUGRUONW-UHFFFAOYSA-N 0.000 description 2
- ILBBNQMSDGAAPF-UHFFFAOYSA-N 1-(6-hydroxy-6-methylcyclohexa-2,4-dien-1-yl)propan-1-one Chemical compound CCC(=O)C1C=CC=CC1(C)O ILBBNQMSDGAAPF-UHFFFAOYSA-N 0.000 description 2
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 description 2
- KCTZYAAHUYSVON-UHFFFAOYSA-N 4-(sulfanylmethyl)benzoic acid Chemical compound OC(=O)C1=CC=C(CS)C=C1 KCTZYAAHUYSVON-UHFFFAOYSA-N 0.000 description 2
- RUZXDTHZHJTTRO-UHFFFAOYSA-N 7-amino-4h-1,4-benzoxazin-3-one Chemical compound N1C(=O)COC2=CC(N)=CC=C21 RUZXDTHZHJTTRO-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- MZRVEZGGRBJDDB-UHFFFAOYSA-N N-Butyllithium Chemical compound [Li]CCCC MZRVEZGGRBJDDB-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 239000008199 coating composition Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N isopropyl alcohol Natural products CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 239000003504 photosensitizing agent Substances 0.000 description 2
- 229920002587 poly(1,3-butadiene) polymer Polymers 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 229920005604 random copolymer Polymers 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 150000003573 thiols Chemical class 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- OTKCEEWUXHVZQI-UHFFFAOYSA-N 1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(=O)CC1=CC=CC=C1 OTKCEEWUXHVZQI-UHFFFAOYSA-N 0.000 description 1
- DKEGCUDAFWNSSO-UHFFFAOYSA-N 1,8-dibromooctane Chemical compound BrCCCCCCCCBr DKEGCUDAFWNSSO-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- LLVWLCAZSOLOTF-UHFFFAOYSA-N 1-methyl-4-[1,4,4-tris(4-methylphenyl)buta-1,3-dienyl]benzene Chemical compound C1=CC(C)=CC=C1C(C=1C=CC(C)=CC=1)=CC=C(C=1C=CC(C)=CC=1)C1=CC=C(C)C=C1 LLVWLCAZSOLOTF-UHFFFAOYSA-N 0.000 description 1
- INPHIYULSHLAHR-UHFFFAOYSA-N 1-pentylanthracene-9,10-dione Chemical compound O=C1C2=CC=CC=C2C(=O)C2=C1C=CC=C2CCCCC INPHIYULSHLAHR-UHFFFAOYSA-N 0.000 description 1
- SKDGWNHUETZZCS-UHFFFAOYSA-N 2,3-ditert-butylphenol Chemical compound CC(C)(C)C1=CC=CC(O)=C1C(C)(C)C SKDGWNHUETZZCS-UHFFFAOYSA-N 0.000 description 1
- BHFMSDUUPGFQBD-UHFFFAOYSA-N 2-(sulfanylmethylidene)butanedioic acid Chemical compound OC(=O)CC(=CS)C(O)=O BHFMSDUUPGFQBD-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- VZMLJEYQUZKERO-UHFFFAOYSA-N 2-hydroxy-1-(2-methylphenyl)-2-phenylethanone Chemical compound CC1=CC=CC=C1C(=O)C(O)C1=CC=CC=C1 VZMLJEYQUZKERO-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- GELQHEZAIPGORC-UHFFFAOYSA-N 2-methoxy-1-(2-methylphenyl)-2-phenylethanone Chemical compound COC(C(C1=C(C=CC=C1)C)=O)C1=CC=CC=C1 GELQHEZAIPGORC-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- TZVOTYCXLFYAPY-UHFFFAOYSA-N 2-sulfanylhexadecanoic acid Chemical compound CCCCCCCCCCCCCCC(S)C(O)=O TZVOTYCXLFYAPY-UHFFFAOYSA-N 0.000 description 1
- JSGPBRQYMLFVJQ-UHFFFAOYSA-N 2-sulfanylhexanoic acid Chemical compound CCCCC(S)C(O)=O JSGPBRQYMLFVJQ-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- IKELQWCAFMIQBM-UHFFFAOYSA-N 3-[4-(sulfanylmethyl)phenyl]propanoic acid Chemical compound OC(=O)CCC1=CC=C(CS)C=C1 IKELQWCAFMIQBM-UHFFFAOYSA-N 0.000 description 1
- NEQSQCCQRRPTQA-UHFFFAOYSA-N 4-(2-ethoxyethoxy)-4-oxo-3-sulfanylbutanoic acid Chemical compound CCOCCOC(=O)C(S)CC(O)=O NEQSQCCQRRPTQA-UHFFFAOYSA-N 0.000 description 1
- AKWLSBGVYJYBAL-UHFFFAOYSA-N 4-hexoxy-4-oxo-3-sulfanylbutanoic acid Chemical compound CCCCCCOC(=O)C(S)CC(O)=O AKWLSBGVYJYBAL-UHFFFAOYSA-N 0.000 description 1
- JGRSVXLSEJAAFH-UHFFFAOYSA-N 4-methoxy-4-oxo-3-sulfanylbutanoic acid Chemical compound COC(=O)C(S)CC(O)=O JGRSVXLSEJAAFH-UHFFFAOYSA-N 0.000 description 1
- CMNQZZPAVNBESS-UHFFFAOYSA-N 6-sulfanylhexanoic acid Chemical compound OC(=O)CCCCCS CMNQZZPAVNBESS-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 239000004971 Cross linker Substances 0.000 description 1
- 108010010803 Gelatin Proteins 0.000 description 1
- 229920013646 Hycar Polymers 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- PWKSKIMOESPYIA-BYPYZUCNSA-N L-N-acetyl-Cysteine Chemical compound CC(=O)N[C@@H](CS)C(O)=O PWKSKIMOESPYIA-BYPYZUCNSA-N 0.000 description 1
- LSDPWZHWYPCBBB-UHFFFAOYSA-N Methanethiol Chemical group SC LSDPWZHWYPCBBB-UHFFFAOYSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 229960004308 acetylcysteine Drugs 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 239000008280 blood Substances 0.000 description 1
- 210000004369 blood Anatomy 0.000 description 1
- 238000006664 bond formation reaction Methods 0.000 description 1
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 1
- 235000010354 butylated hydroxytoluene Nutrition 0.000 description 1
- 238000007707 calorimetry Methods 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 125000000490 cinnamyl group Chemical group C(C=CC1=CC=CC=C1)* 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- POSWICCRDBKBMH-UHFFFAOYSA-N dihydroisophorone Natural products CC1CC(=O)CC(C)(C)C1 POSWICCRDBKBMH-UHFFFAOYSA-N 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 150000002596 lactones Chemical class 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M methacrylate group Chemical group C(C(=C)C)(=O)[O-] CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- 229940086559 methyl benzoin Drugs 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- XJRBAMWJDBPFIM-UHFFFAOYSA-N methyl vinyl ether Chemical compound COC=C XJRBAMWJDBPFIM-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- PWQWROFQFPSDFH-UHFFFAOYSA-N pentane-1-thiol;phosphoric acid Chemical compound OP(O)(O)=O.CCCCCS PWQWROFQFPSDFH-UHFFFAOYSA-N 0.000 description 1
- LYXOWKPVTCPORE-UHFFFAOYSA-N phenyl-(4-phenylphenyl)methanone Chemical compound C=1C=C(C=2C=CC=CC=2)C=CC=1C(=O)C1=CC=CC=C1 LYXOWKPVTCPORE-UHFFFAOYSA-N 0.000 description 1
- 125000005499 phosphonyl group Chemical group 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- LPNYRYFBWFDTMA-UHFFFAOYSA-N potassium tert-butoxide Chemical compound [K+].CC(C)(C)[O-] LPNYRYFBWFDTMA-UHFFFAOYSA-N 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000000425 proton nuclear magnetic resonance spectrum Methods 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- PJANXHGTPQOBST-UHFFFAOYSA-N stilbene Chemical group C=1C=CC=CC=1C=CC1=CC=CC=C1 PJANXHGTPQOBST-UHFFFAOYSA-N 0.000 description 1
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Landscapes
- Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
- Polymerisation Methods In General (AREA)
Description
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The present invention relates to photosensitive compositions containing unsaturated polymeric mercapto acids and radical initiation systems, elements made from said compositions, and methods for photoimaging said elements. The technical background of the invention includes the following. U.S. Pat. No. 4,179,531 discloses a monoalkenyl aromatic diene copolymer resin, optically cross-linking C=
A curable composition is disclosed that includes a C-containing monomer, a polythiol, and a photoinitiator. U.S. Pat. No. 4,234,676 discloses unsaturated polymers,
A curable composition containing a monomer, a thiol, and a curing agent is disclosed. U.S. Pat. No. 4,248,960 discloses a relief-forming laminate in which the lower laminate composition is preferably a photocurable polymer composition. US Pat. No. 4,266,004 discloses a method for photoimaging certain organic sulfide-containing polymers in the presence of oxygen and a photosensitizer. UK Patent No. 1390711 and US Patent No. 3767398
Each specification describes a curable composition comprising a polymer having monoallyl ester repeating units of a methyl vinyl ether/maleic anhydride copolymer and a polythiol and containing or not containing a photocuring rate accelerator. is disclosed. US Pat. No. 3,809,633 discloses chain-extended polythioether-containing polymer compositions containing reactive unsaturated carbon-carbon functional groups and/or reactive thiol groups within the molecule. U.S. Pat. No. 3,660,088 discloses a metal etching process using a photocurable composition comprising a polyene, a polythiol, and a photocure rate accelerator. U.S. Pat. No. 3,936,530 discloses curable coating compositions comprising polyene and polythiol components based on styrene-allylic alcohol copolymers. U.S. Pat. No. 3,627,529 discloses a method of making lithographic plates from a photocurable composition of an ethylenically unsaturated polyene, a polythiol, and a photocure rate accelerator. U.S. Pat. No. 4,179,295 discloses that the organopolysiloxane contains an aliphatic unsaturated bond-containing organopolysiloxane and a mercapto-containing organopolysiloxane in the molecule, and that the organopolysiloxane is cured by ultraviolet irradiation to cause cross bond formation. A photosensitive composition is disclosed. US Pat. No. 4,130,469 discloses curable coating compositions containing a polymer containing pendant mercaptan groups and a bismaleimide crosslinker. GB 1179252 discloses the use of butadiene polymers containing carboxyl groups in the production of thermoplastic elastic compositions. U.S. Pat. No. 2,589,151 discloses a thioglycolic acid adduct of a butadiene polymer prepared in solution using a free radical initiator, and the structure of the adduct is "J.
Am.Chem.Soc.â Vol. 70, pp. 1804-1808 (1948)
It is further discussed inside. Ind.Eng.Chem., Vol. 45, pp. 2090-2093 (1953) describes the modification of polybutadiene by the addition of polar group-containing thiols, such as mercaptoacetic acid, to produce polymers with improved oil resistance. Disclosed. Research Disclosure, Vol. 143, p. 24 (1976) discloses the use of unsaturated polymeric mercapto acid derivatives as components in liquid electrographic developers. The present invention comprises the following components: (i) about 10 to 90% of the total weight of components (i), (ii) and (iii);
(ii) components (i), (ii) and (iii) having a number average molecular weight of from about 1,000 to 1,000,000 and containing from about 20 to 1,800 milliequivalents of reactive unsaturated carbon-carbon groups per 100 g; ) Approximately 1 to 70% of the total weight of
of reactive mercapto acid, and (iii) from about 0.001 to the total weight of components (i), (ii) and (iii).
50
% actinic radiation to initiate the addition of mercapto acid to a polyene. The present invention also relates to a photosensitive element comprising a substrate coated with a layer of a photosensitive composition having a thickness in the range of about 0.1 ÎŒm to 7600 ÎŒm or more. Preferred photosensitive elements are used in photoresists and proofing systems. The substrate can be any natural or synthetic support, preferably in the form of a flexible or rigid film or sheet. The present invention also provides an image-containing transparent body with
It also relates to a photoimaging method comprising imagewise exposing a photosensitive element to actinic radiation containing a wavelength of 5000 Ã
and processing the image. A "reactive" unsaturated carbon-carbon group refers to a thioether bond that reacts with the thiol group of a mercapto acid in the presence of a photosensitizer under actinic radiation.
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A random copolymer was produced by the following method. All glassware for this polymerization was oven dried at 150°C for 4 hours before use. The apparatus was assembled hot and purged with argon until cooled. The reaction was carried out under positive pressure of argon.
Tetrahydrofuran (THF) was freshly distilled from benzophenone/sodium under nitrogen. Freshly distilled cinnamyl methacrylate (bp79 ~
80°/0.005mm, 5.06g, 25mmol), n-butyl methacrylate (16.00g, 112mmol) and methyl methacrylate (11.26g, 112mmol)
mixed and passed through neutral alumina, and
Degassed with argon for 15 minutes. THF (300 ml) and diphenylethylene (redistilled, bp 90°/1 mm, 0.44 g, 2.5 mmol)
I prepared it. The solution was cooled to 0° and n-
Butyl lithium (1.7 ml, 2.5 mmol in 1.6 M hexane) was added. The blood red solution was cooled to -78° and the monomer mixture (25.9 g, 0.2 mol) was added at such a rate (10 minutes) that the temperature did not exceed -70°. After 15 minutes, acetic acid (0.2 ml, 3 mmol) was added.
The warmed solution was then poured into water (2). The particulate solid copolymer was isolated and dried in a vacuum desiccator overnight to yield cinnamyl methacrylate copolymer (25.8 g, 100%) as a fine white powder. The 90MHZ 1 H NMR spectrum is above all 4.5 (broad, dJ about 6, OC H 2 =
CHC 6 H 5 ), 3.8 (broad, t, J approx. 6, OC H
2 CH 2 CH 2 CH 3 ) and 3.5(s,OCH 3 ) bands in a ratio of 3:15:21, which represents 9% cinnamyl, 47% butyl, and 44% methyl in the copolymer. Corresponds to the composition of methacrylate. Gel permeation chromatography (GPC): o 9700, w 10000.
T g (DSC) 54° by scanning differential calorimetry. [Method B] A (40:40:20) random copolymer of methyl methacrylate/butyl methacrylate/allyl methacrylate was produced by the following method. All glassware and reagents were prepared as in Method A. Allyl methacrylate (15.14 g, 0.12 mol), butyl methacrylate (34.13 g, 0.24 mol) and methyl methacrylate (24.03 g, 0.24 mol) were mixed, passed through alumina (10 g) and degassed with argon. A 500 ml flask set up as in Method A was charged with THF (300 ml) and potassium tert-butoxide (5.61 g, 0.05 mole). The monomer mixture (61.1 g, 0.5 mol) was added dropwise over 23 minutes. During this period, the temperature rose from 25° to 53°,
Then it decreased to 25°. Acetic acid (4 ml, 70 mmol) was added and the reaction mixture was poured into water (4) in a blender. The isolated copolymer was dried in a vacuum desiccator to yield allyl methacrylate copolymer (59 g, 97%) as a fine white powder. MMR analysis shows that the copolymer composition is 2.1% allyl, 44% butyl, and 35%
It was shown to be methyl methacrylate.
GPC: o 6000, w 10000. Other unsaturated copolymers made by Method A and Method B are shown in Table 1, where
MMA is methyl methacrylate and BMA is n-butyl methacrylate.
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çŽãããŠãããTable: Example 1 A 20% solids coating solution of a photosensitive composition was prepared by mixing the following ingredients. Copolymer M 1.00g Mercaptosuccinic acid 0.150g Ethylene glycol dicaprylate plasticizer
0.100g Benzophenone radical generator 0.072g 4-Methyl-2,6-ditertiary-butylphenol inhibitor 0.010g Methylene chloride/methanol (95/5) solvent
This solution was coated onto a freshly pumice polished blank copper laminate using a 5.328 g 8 mil (200 ÎŒm) doctor knife. The coated laminate was dried in air at room temperature to yield a clear, smooth, non-tacky film approximately 25 ÎŒm thick. This coated laminate was placed in a glass vacuum frame (Nuark Co., Ltd.) at a pressure of approximately 250 mmHg with an exposure source Model B-100A/X made by Ultraviolet Products Co., which includes a 100W lamp (Sylvania Flat Lamp, H-44-JM-100). Imagewise exposure was carried out for 8 minutes in a medium (product). The lamp was operated at a distance of 7 inches (17.8 cm) from the board without an infrared filter.
The process transparency was held in close contact with the plate during exposure. After exposure, the plate was developed at room temperature by immersing it in a solution of 0.5% sodium hydroxide in water/isopropyl alcohol (approximately 1/1) and gently rubbing the surface with a soft brush. The film dissolved quickly in the exposed areas of the plate. When the image was completely developed on the copper surface of the laminate, development was stopped by washing with water. When the exposure time was increased to 12 minutes, a clean, sharp image was drawn on the copper surface that corresponded exactly to the transparent image of the process transparency. In this experiment, development was carried out at 35°C using a 0.8% sodium carbonate solution in an approximately 4.5/1 water/2-(2-butoxyethoxy)ethanol solvent mixture. Example 2 The coating solution prepared as described in Example 1 was coated onto a freshly pumice polished blank copper laminate using a 5 mil (125 Όm) doctor knife. The coated board was allowed to dry and a portion of the board was exposed through a process transparency as described above. After exposure,
The plates were developed in a 0.8% sodium carbonate solution in water/2-(2-butoxyethoxyethanol (9:1)) with magnetic stirring at 30-35° for various times. The results were It is summarized in Table 2.
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ã®çµæã¯è¡šïŒã«èŠçŽãããŠããã[Table] Image The remaining parts of the coated board were exposed under glass at atmospheric pressure in a vacuum frame for 12 minutes. The image was fully developed with a development time of 4 minutes. The rest of the coated board is placed in the air.
Exposure was made for 12 minutes. A fully developed image was obtained with a development time of 2 minutes. That is, oxygen does not have a significant adverse effect on the photographic speed of this photosensitive composition. The developed plate was baked in a draft oven for 30 minutes at 106°. It was then etched in a standard ferric chloride etching bath for 20-30 minutes at room temperature. The exposed image pattern was sharply etched to the backing of the laminate without affecting the unexposed photoresist or the underlying copper. Example 3 A coating solution of a photosensitive composition was prepared as follows. Copolymer M 1.00g Mercaptosuccinic acid 0.150g Ethylene glycol dicaprylate 0.143g Benzyl dimethyl ketal 0.027g 4-Methyl-2,6-ditertiary butylphenol 0.002g Benzotriazole 0.003g Methylene chloride/methanol (90/ 10) Solvent
This solution was coated onto a freshly pumice polished blank copper laminate using a 5.300 g 5 mil (125 ÎŒm) doctor knife. The coated board was allowed to dry and a portion of the board was exposed through a process transparency as described in Example 1.
After exposure, the plate was stirred with a magnetic stirrer at 30°-35° for various times in water/2
Developed in a 0.8% sodium carbonate solution in (2-butoxyethoxyethanol) (9:1). The results are summarized in Table 3.
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ãããã®çµæã¯æ¬¡ã®è¡šïŒã«èŠçŽãããŠããã[Table] Bright Image Example 4 A coating solution of a photosensitive composition was prepared as follows. Copolymer F 1.00g Mercaptosuccinic acid 0.100g Ethylene glycol dicaprylate 0.166g Benzyl methyl ketal 0.054g 4-Methyl-2,6-ditertiary butylphenol 0.002g Benzotriazole 0.003g Methylene chloride/methanol (90/ 10) Solvent
This solution was coated onto a freshly pumice polished blank copper laminate using a 5.300 g 5 mil (125 ÎŒm) doctor knife. This dry film is clear and slightly tacky, and approximately
It had a thickness of 25 ÎŒm. A clear 25 ÎŒm polypropylene cover sheet was applied to this coating to prevent it from sticking to the process transparency during exposure. using a rubber squeegee
This cover sheet was smoothed over the coating. This was then coated after exposure and removed without damage. A sample of the coated plate was imagewise exposed through this cover sheet as described in Example 1. After exposure, this plate
Water/while stirring with a magnetic stirrer at 32â
2-(2-butoxyethoxy)ethanol (9/
Developed in 0.8% sodium carbonate solution in 1). The results are summarized in Table 4 below.
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ã€ã³ã°æº¶æ¶²ã補é ããã[Table] Sharp image This coated board showed excellent resolution. Comparable results were obtained when the coated plates were baked in a draft oven at 70° C. for 30 minutes and then exposed to light. Samples of the coated plates were also exposed through the cover sheet in a vacuum frame at atmospheric pressure. The exposure/development times required to obtain a fully developed sharp image were similar to those required for plates exposed in vacuum. Examples 5-9 5.0g in each solution as shown in Table 5
Coating solutions of five photosensitive compositions were prepared using different unsaturated copolymers and varying amounts of mercaptosuccinic acid and ethylene glycol dicaprylate.
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nn ããã©ãŒã®ã±ãã³[Table] Each coating solution contains 0.270 g of benzyl dimethyl ketal, 0.010 g of 4-methyl-2,6-
It contained ditert-butylphenol, 0.015g benzotriazole, and 26.66g 90/10 methylene chloride/methanol solvent. The solutions of Examples 5 and 9 were clear, but those of Examples 6, 7, and 8 were slightly hazy. They have been aged before use. This solution was coated onto a freshly pumice polished blank copper laminate using a 7 mil (180 Όm) doctor knife and the board was allowed to dry. A polypropylene coversheet was applied to this coating and a sample of the plate was exposed imagewise through the coversheet as described in Example 1. After exposure, the plate was developed in a 0.8% sodium carbonate solution in water/2-(2-butoxyethoxy)ethanol (9/1) at 32° C. with magnetic stirring. Sharp, fully developed images were obtained under the exposure and development conditions summarized in Table 6. Table 6 Example Exposure Time (min) Development Time 5 1.0 1.5 6 6.0 8.0 7 2.0 4.3 8 1.0 2.5 9 1.0 2.5 The developed film of Example 9 was very soft and it gradually ran into the developed area on standing. Example 10 A coating solution of a photosensitive composition was prepared as follows. Copolymer L 1.00g Mercaptosuccinic acid 0.134g Ethylene glycol dicaprylate 0.140g Benzyl dimethyl ketal 0.054g 4-Methyl-2,6-ditertiary butylphenol 0.002g Benzotriazole 0.003g Methylene chloride/methanol (90/ 10) Solvent
5.332 g The amount of mercaptosuccinic acid used corresponded to about 0.56 moles per mole of carbon-carbon double bonds in the copolymer. This solution was coated onto a freshly pumice polished blank copper laminate using an 8 mil (200 Όm) doctor knife and the board was allowed to dry. A polypropylene coversheet was applied to this coating and a sample of the plate was exposed imagewise through the coversheet as described in Example 1. After exposure, the plate was developed in a 0.8% sodium carbonate solution in water/2-(2-butoxyethoxy)ethanol (9/1) at 32° C. with magnetic stirring. Sharp, fully developed images with exposure times of 0.5 to 2 minutes and 2.5
Obtained with a development time of ~5 minutes. The unexposed and undeveloped areas were non-tacky and were not visibly affected by the developer solution. The sample plate, imagewise exposed for 1 minute and developed for 2.5 minutes, was allowed to dry at room temperature for 2 hours and then reexposed through a polypropylene cover sheet without a process transparency. This blanket exposure allowed the non-image areas to easily peel off the plate after 2.5 minutes in the developer solution. In contrast, the photosensitive composition of this non-imaging plate did not peel off even after 30 minutes in the developer solution under the same conditions. This experiment shows that the unexposed portions of the photosensitive composition can be removed (or further imaged) by additional exposure after primary development. A second sample plate, imagewise exposed for 1 minute and developed for 2.5 minutes, was baked at 110° C. in a circulating air oven. It was then immersed in a ferric chloride etching bath at room temperature. After 20 minutes, the copper had been etched away in the imaged portion of the plate without lifting or undercutting the unexposed portions of the resist.
Etching resistance is etching at 50â (8 minutes)
It wasn't something I was satisfied with. Example 11 A coating solution of a photosensitive composition was prepared as follows. Styrene/butadiene (28/72) linear ABA block copolymer (lactone 1102) 7.2g Mercaptosuccinic acid 1.5g Oleic acid 1.2g Benzyl dimethyl ketal 0.48g 4-Methyl-2,6-ditertiary butylphenol 0.02 g Benzotriazole 0.022g Methylene chloride/methanol (95.4/4.6)
Solvent 65g This solution was coated onto a freshly pumice polished blank copper laminate to produce a slightly sticky film with an odor after drying. Apply a polypropylene cover sheet to this coating,
The cover sheet was then exposed imagewise for 1 to 6 minutes as described in Example 1. After exposure, the plate was stirred with a magnetic stirrer at 32°C in a 0.8% sodium carbonate solution in water/2-(2-butoxyethoxy)ethanol (9/1) at 1.5%.
Developed. For all exposures tested, an image was drawn on the plate that corresponded to the transparent portion of the process transparency.
The material in the exposed areas swelled in the developer, but it had insufficient solubility to be washed away to the plate. Other coated plate samples were first baked in an air oven at 70°C for 15 minutes and then exposed for 6 minutes. Upon immediate removal of the cover sheet, the photosensitive composition in the unexposed areas was lifted from the plate along with the cover sheet and film in the exposed areas remaining on the plate. Thus, it can be seen that the compositions and elements of the present invention, which are normally used to give positive working images by solvent washing of the exposed areas, can also be used in the described peel-apart development process to give negative working images. . Example 12 A coating solution of a photosensitive composition was prepared as follows. Hiker 1072-CG [milled (20x) on a cold mill to improve solubility] 10.0 g Mercaptosuccinic acid 1.42 g Ethylene glycol dicaprylate 1.32 g Benzyl dimethyl ketal 0.54 g 4-Methyl-2,6-di Tertiary butylphenol 0.02g Benzotriazole 0.03g Methylene chloride/methanol (90/10) solvent
106.64g "Hycar" 1072-CG (product of BF Gutdrich) is a high molecular weight (average Mooney viscosity = 4.5, o approx. 31000) carboxylated butadiene/acrylonitrile copolymer [approx. 27% acrylonitrile content, carboxyl content approx. 3.38%, rubber
The value is 0.075 based on the equivalent weight per 100 parts (EPHR) standard. This solution was coated onto a freshly pumice polished blank copper laminate to produce a dull film after drying. A polypropylene coversheet was applied to the coating and imagewise exposed through the coversheet as described in Example 1 for 1-10 minutes. After exposure, the plate was stirred at 32° with a magnetic stirrer and mixed with water/2-(2-
butoxyethoxy) in ethanol (9/1)
Developed in 0.8% sodium carbonate solution. An image corresponding to the transparent portion of the process transparency was drawn on the board for all times tested. Due to poor adhesion, the unexposed portions of this composition were lifted from the plate after 1 minute in the developer solution. Example 13 1.0 g Copolymer B, 0.1 g mercaptosuccinic acid, 0.075 g benzyl methyl ketal, 0.1 g ethylene glycol dicaprylate and 50Ό
A solution was prepared by adding the additive solution to 4.3 ml of methylene chloride/methanol (9:1) solvent mixture. The additive solution consisted of 3 mg of benzotriazole, 2 mg of 4-methyl-2,6-di-tert-butylphenol, and 2 mg of CI Solvent Red Dy #109 dissolved in a methylene chloride/methanol solvent mixture. Ta. The resulting clear solution was coated onto a pumice polished copper substrate using an 8 mil (200 ÎŒm) doctor knife. The coated panels were allowed to dry at room temperature overnight. Place a polypropylene cover sheet on this panel and pass it through a â2 step wedge process transparency in a vacuum printing frame (Nuark product) at a distance of 38 cm.
A radiation dose of 100 units per cm 2 and 580 mg associated with the radiation from a metal halide lamp covering the 3600-4500 Ã
spectral range on the exposed surface of the transparency.
was exposed for a time corresponding to an integrated light intensity of . Remove the cover sheet and expose the panel to 2588ml
of water, 27 g of sodium carbonate and 300 g of 2-
Developed in a solution made from (2-butoxyethoxy)ethanol. A magnetic stirrer was used for stirring. After 2 minutes at 35°, development of the exposed portion of the panel up to step 7 (32 mj/cm 2 ) was completed down to the copper surface. The parts of the coating that were exposed to less radiation remained intact. Example 14 A mixture of 1.0 g of Copolymer C, 200 mg of 4-mercaptomethylbenzoic acid, 100 mg of benzyl dimethyl ketal, 75 mg of ethylene glycol dicaprylate and 50 Ό of the additive solution of Example 13 was mixed in methylene chloride/methanol (9 /1) Solvent mixture
It was dissolved in 4.3ml. 8 mil (200ÎŒm) of this solution
The coating was applied onto a pumice polished copper substrate using a doctor knife. Place a polypropylene cover sheet over this panel and pass it through the â2 step wedge process transparency in the vacuum printing frame of Example 13.
It was exposed to a radiation dose of 100 units. The cover sheet was removed and the exposed panel was developed in the developer solution of Example 13 at 35° for 4 minutes. Development up to step 4 (132 mj/cm 2 ) was completed up to the copper surface. The exposed copper was etched from the plate in a ferric chloride bath at room temperature. The etched plate was then re-exposed to an additional 290 mj/cm 2 of radiation through a process transparency. The re-exposed plate was then developed as described for 4 minutes. Development of the second exposed area was completed to the copper surface. This example shows that this photosensitive element has add-on capability. The reason is that the unexposed composition is still functional after the development and etching steps. Examples 15-54 These Examples were performed using the method described in Example 13. In each case the solution is 1.0 of the stated copolymer
g, mercapto acid, photoinitiator, stated amount of ethylene glycol diacrylate plasticizer and 50Ό additive package in 4.3ml methylene chloride/
Prepared by addition to methanol (9/1) solvent mixture. The resulting solution was coated onto a substrate using a doctor knife to produce the stated initial coating thickness. The substrates used were pumice polished copper (Cu) or oriented polyester film or polypropylene film (Film). If film is used,
The coating was transferred to the copper substrate by lamination before exposure. The dried coating was exposed to radiation as described for a time corresponding to the number of units required to give the stated integrated light intensity (mj/cm 2 ). The exposed coatings were developed at 35° for the indicated times. The resolution of the images obtained in most examples was measured in Όm. The developed image was inspected and the development type was recorded as follows. C Even the copper substrate was removed during development. Most of the S image has been removed. An R relief image was obtained, but it was not removed to the copper surface. V A visible image was obtained, but no relief was obtained. A summary of these examples is included in Tables 7 and 8. In Table 7, mercapto acids and radical generating initiators are referred to by the following symbols: Mercaptoic acid a 6-Mercaptocaproic acid b Mercaptosuccinic acid c Mercaptoitaconic acid d 2-Mercaptocaproic acid e 4-Mercaptomethylbenzoic acid f 4-Mercaptomethyldihydrocinnamic acid g Mercaptosuccinic acid monomethyl ester h Mercaptosuccinic acid monon- Hexyl ester i Mercaptosuccinic acid mono-2-ethoxyethyl ester j N-acetyl cysteine k 11-mercaptoundecanoic acid initiator aa benzyl dimethyl ketal bb benzoin methyl ether cc 2-(o-chlorophenyl)-4,5-diphenylimidazolyl dimer dd methylbenzoin methyl ether ee methylbenzoin ff benzophenone gg pentylanthraquinone hh benzophenone/Michler's ketone (4/
1) ii Benzoin ethyl ether jj Desoxybenzoin kk Benzophenone/Michler's ketone (1/
1) ll 4-Phenylbenzophenone mm Benzoin isobutyl ether nn Michler's ketone
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ïŒâã·ã¯ããããµãžãšãã³ïŒTMCHïŒEXAMPLE 55 Preparation of positive-working litho film The following two solutions were prepared. A Carbon black 20g Methylene chloride 120g B Copolymer K 1g 11-mercaptoundecanoic acid 0.20g Benzyl dimethyl ketal 0.20g Methylene chloride/methanol (90/10) solvent
Pressurize solution A through a 4.3 g 10 ÎŒm Millipore filter and filter the solution to 4 mil (100 ÎŒm).
m) 5 mils (125 ÎŒm) using a doctor knife
was coated on a gelatin-coated oriented polyester film substrate. This coated film was dried. It had a transparency of 5.70. Solution B was coated onto the solution A coated substrate using the same doctor knife. This coated film was passed through a â2 step wedge and a silver negative with a transparency of 0.4%.
Exposures were made to a radiation dose of 67 units in 13 vacuum printing frames. The exposed film was developed using a 0.8% sodium carbonate solution in water/2-(2-butoxyethoxy)ethanol (9/1) in a spray developer for 2 minutes at 35°. The last step washed away corresponds to an energy of 0.13 mj/cm 2 on the film surface. Examples 56-62 These examples were performed using the methods described in Examples 13 and 15-54. No further plasticizer was used. A coating thickness of 200 Όm was used in each example. Oriented polyester or polypropylene film substrates were used. A summary of these examples is included in Tables 9 and 10. In Table 9, mercapto acids and radical-forming initiators not listed in the previous examples are referred to by the following symbols: Mercaptoic acid l 5-mercaptopentane phosphate m 2-mercaptohexadecanoic acid initiator oo 4-methyl-4-trichloromethyl-2,
5-Cyclohexadienone (TMCH)
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ç©ã[Scope of Claims] 1st component, i.e. approximately 10 to 90% of the total weight of components (i), (ii) and (iii)
a polyene having a number average molecular weight of about 1,000 to 1,000,000 and containing about 20 to 1,800 milliequivalents of reactive unsaturated carbon-carbon groups per 100 g; about 1% to 70% by weight of the reactive mercapto acid, and about 0.001% to 50% by weight of the total weight of components (i), (ii) and (iii).
% of a radiation-sensitive radical-generating system that can be activated by actinic radiation to initiate the addition of mercapto acid to a polyene. 2. The composition according to claim 1, wherein the polyene contains at least one group selected from the formulas -CH=CH- and -CH= CH2 . 3. The composition of claim 2 containing such a group in the alkyl portion of the substituted alkyl methacrylate copolymer. 4. A composition according to claim 3, wherein the polyene is selected from copolymers of methyl methacrylate and allyl methacrylate or undecenyl methacrylate and terpolymers of methyl methacrylate, butyl methacrylate and allyl methacrylate. 5. The composition of claim 1, wherein the polyene has a molecular weight of about 5,000 to 100,000 and there are about 50 to 1,000 milliequivalents of reactive unsaturated carbon-carbon groups per 100 grams of polyene. 6. The composition according to claim 1, wherein the mercapto acid is a mercaptocarboxylic acid. 7. The composition of claim 1, wherein the radical generating system includes benzoin ether. 8. Claim 1, wherein the mercapto acid is 11-mercaptoundecanoic acid and the radical generating system is a benzyl dimethyl ketal compound.
Compositions as described in Section. 9. The composition of claim 1, wherein the radical generating system comprises 4-methyl-4-trichloromethyl-2,5-cyclohexadienone.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US27141181A | 1981-03-30 | 1981-03-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57176035A JPS57176035A (en) | 1982-10-29 |
| JPH0139570B2 true JPH0139570B2 (en) | 1989-08-22 |
Family
ID=23035431
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4921882A Granted JPS57176035A (en) | 1981-03-30 | 1982-03-29 | Photosensitive composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57176035A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06144486A (en) * | 1991-04-16 | 1994-05-24 | Shinko Seisakusho Co Ltd | Apparatus for automatic delivery of load |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6281404A (en) * | 1985-10-07 | 1987-04-14 | Mitsubishi Rayon Co Ltd | Photopolymerizable composition |
-
1982
- 1982-03-29 JP JP4921882A patent/JPS57176035A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06144486A (en) * | 1991-04-16 | 1994-05-24 | Shinko Seisakusho Co Ltd | Apparatus for automatic delivery of load |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57176035A (en) | 1982-10-29 |
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