JPH0140115B2 - - Google Patents

Description

[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to a partial plating device, particularly a partial plating device suitable for partially plating a target portion to be plated, which has a pair of left and right opposite fork-like tips of the plating object. Regarding.

<Prior art> Conventionally, a plated object 1 as shown in FIG.
Connector terminal 2 as a “fork-shaped tip” of
When applying partial plating to the plating target part [described later], various techniques have been adopted.

This connector terminal 2 is formed in a plurality of comb-like shapes at predetermined intervals on a continuous band-shaped portion 3, and the plating target portion 4 of this connector terminal 2 is separated from the end portion 5 by a predetermined gap. This refers to the side surfaces of the convex portions 6 that are formed to face each other on the left and right sides.

A conventional technique for partially plating the part 4 to be plated is a dipping device that immerses the entire end part 5 including the convex part 6 in a plating tank, and specifies the part to be coated with the plating solution by controlling the liquid level. , or a spray plating device that covers parts that do not require plating with a mask and sprays plating liquid onto the exposed parts [JP-A-126784-1984, JP-A-161084-1984, and JP-A No. 161084. 1955-83180] is generally known as a partial plating device.

<Problems to be Solved by the Invention> However, in such a conventional partial plating device, in the immersion plating device, the circumference of the end portion 5 of the connector terminal 2 is uniformly plated, and compared to the part to be plated 4. As a result, the peripheral part of the part to be plated 4 is plated thickly, making it difficult to clearly define the plating area, and therefore, when performing precious metal plating, more precious metal is consumed than necessary.

On the other hand, in spray plating equipment that uses a mask,
Generally, as the plating target part 4 becomes smaller,
Also, as the shape of the plating target part 4 becomes more complex,
It became difficult to completely maintain the mask state during mask processing and plating, and as with the above, precious metals were consumed more than necessary.

Therefore, there has been a desire for a partial plating device that can perform desired partial plating with less precious metal consumption.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a partial plating device that can reduce precious metal consumption by performing partial plating with high precision and efficiency.

<Means for Solving the Problems> The structure of the present invention for achieving the above object will be explained using FIGS. 1 to 3 corresponding to the embodiment.

The partial plating device 10 according to the present invention has a path line of the plating target portion 4 of the plating object 1 [indicated by the arrow in the figure].
PL] and is interposed between the pair of left and right plating target parts 4, the plating liquid supply body 11 is provided with a substantially mountain-shaped top part 15 having guide surfaces 14 on the left and right sides, and has an upper end 16 or an upper end of the top part 15. An opening 17 for plating liquid oozing is provided nearby, and this opening 17
A plating liquid supply passage 18 is formed inside the passage 18 and an anode 19 is disposed inside this passage 18. Then, a "delivery section" 23 for the plating liquid is formed in the area corresponding to the pass line, and the required partial plating is performed.

<Operation> The present invention uses the above-mentioned means to move the "plating object" 1 to be plated between the left and right pair of plating target parts 4 along the path line [PL] of the plating target part. With the liquid supply body 11 interposed, the plating liquid 13 passes through the passage 18 of the plating liquid supply body 11 and touches the energized anode 19 therein, and the plating liquid 13 passes through the passage 18 of the plating liquid supply body 11 and contacts the energized anode 19 therein, and the plating liquid 13 passes through the passage 18 of the plating liquid supply body 11 and contacts the energized anode 19 therein. A "delivery section" for the plating liquid 13 that oozes out from the opening 17 and wets the left and right guide surfaces 14, and constantly supplies an appropriate amount of fresh plating liquid 13 to the portion of the guide surface 14 corresponding to the pass line [PL]. Further, this "delivery section" 23 is designed to be able to respond to changes in the size and shape of the part to be plated 4 by controlling the supply amount of the plating liquid 13.

The plating target part 4 comes into contact with or comes close to the guide surface 14 of the plating liquid supply body 11, so that the plating liquid 13 that wets the guide surface 14 is evenly distributed to the entire plating target part 4. .

A high current density is obtained by the anode 19 disposed inside the passage 18 of the supply body 11, and the desired plating can be applied to the part to be plated 4 with high precision and efficiency.

<Example> An example of the present invention will be described below with reference to FIGS. 1 to 3.

Incidentally, the same reference numerals are used for parts common to the conventional one, and redundant explanation will be omitted.

First, the plating liquid supply body 11 in this partial plating apparatus 10 is disposed in the plating processing tank 12 and mainly receives the supply of the plating liquid 13 to form a delivery section 23 for the plating liquid 13.

The plating liquid supply body 11 is made of an insulating material, and has a substantially mountain-shaped top portion 15 having a guide surface 14 that slopes downward from side to side. An opening 17 is provided for the plating liquid supply body 1.
A plating liquid supply passage 18 communicating with the opening 17 is formed through the inside of the plate 1, and an anode 19 is provided upright within the passage 18.

This anode 19 is in the shape of a thin round rod (line), and is placed as close as possible to the part to be plated 4 so as to obtain a high current density.

Further, 20 is a pump, 21 is a pipe, and 24 is a plating liquid management tank, which pumps the plating liquid 13, recovers it, and circulates it.

Next, the usage status will be explained.

The connector terminal 2 to be plated is made into a cathode by means not shown and moved, and the plating liquid supply body 11 is applied along the path line [arrow PL in the figure] of the pair of left and right plating target parts 4 and between the plating target parts 4. In the interposed state, the plating liquid 13 pumped by the pump 20 oozes out onto the guide surfaces 14 on both the left and right sides of the top portion 15 through the passage 18 and the opening 17 while touching the energized anode 19 . The plating liquid 13 wets the guide surface 14, forms a plating liquid layer 22 in the form of a thin film on the guide surface 14, and slowly flows down.
A plating solution "delivery section" 23 capable of constantly supplying an appropriate amount of fresh plating solution 13 is formed at a portion corresponding to the pass line (PL) with the plating target part 4.

Furthermore, by controlling the amount of the plating liquid 13 to be supplied, the state of the plating liquid layer 22 can be changed and the "delivery part" 2 can respond to changes in the size and shape of the part to be plated 4.
3.

The part 4 to be plated of the connector terminal 2 is moved in contact with or in close proximity to the guide surface 14, while the plating liquid 13 is uniformly applied to the entire part 4 from the plating liquid layer 22 on the guide surface 14. handed over to.

At this time, a high current density is obtained from the anode 19, and the desired plating can be applied to the part to be plated 4 with high precision and efficiency.

In this embodiment, an opening 17 for seeping out the plating liquid 13 is provided at the upper end 16 of the top portion 15, and the guide surface 14 is linearly inclined downward. Not limited to,
For example, the opening 17 may be formed in the side part (near the upper end) of the upper end 16 of the top part 15, and the guide surface 14 may also be curved downward in a convex or concave manner corresponding to the part to be plated 4. It may also be formed into a shape.

<Effects> Since the partial plating device according to the present invention has the contents as described above, many effects can be expected, and the main ones are listed below.

(b) A plating liquid delivery part is formed by wetting the guide surface of the plating liquid supply body corresponding to the pass line of the part to be plated, and since an appropriate amount of fresh plating liquid is always supplied there, it is possible to guide The plating liquid is delivered only to the part to be plated that corresponds to the surface, and other parts are not plated.
In addition, since the amount of plating liquid matched to the plating liquid layer on the guide surface is simply delivered, plating is not applied to a thickness greater than necessary, and therefore no more precious metal is used than necessary. The amount of precious metal used is significantly reduced compared to the conventional technology, in which the plating process is performed with the plating liquid adhering to the plating target area, including the pair of left and right side parts of the tip, which is intended to be plated only on the side parts, and even the vicinity thereof. (b) By controlling the amount of plating liquid supplied onto the guide surface, it is possible to easily deal with changes in the size and location of the part to be plated, and Furthermore, (c) the inclination angle and size of the top of the plating liquid supply body,
An additional effect is that by changing the shape, it can be applied to plated objects of various shapes and sizes.

[Brief explanation of drawings]

FIG. 1 is an overall perspective sectional view showing the operating state of the partial plating device according to the present invention, FIG. 2 is a sectional view seen from the direction of the arrow in FIG. 1, and FIG. 3 is a plating liquid supply body. FIG. 4 is a partially enlarged sectional view showing the top portion, and FIG. 4 is a schematic perspective enlarged explanatory view of a plating object in a conventional example. DESCRIPTION OF SYMBOLS 1... Plating object, 2... Connector terminal (fork-shaped tip part), 3... Continuous band-shaped part, 4... Plating target part, 10... Partial plating device, 11... Plating liquid supply body, 14... Guide surface, 15...Top part,
16... Upper end, 17... Opening, 18... Passage, 1
9...anode, 23...delivery section.

Claims (1)

[Scope of Claims] 1. For a plating object having a pair of left and right opposite plating target parts on a plurality of fork-like tip parts formed from a continuous band-shaped part, a plating target part along the path line of the plating target part and both the left and right pair of plating target parts A partial plating device in which a plating liquid supply body is disposed interposed between parts to be plated, and electroplating is applied to each part of the plating object that moves in contact with or in close proximity to the plating liquid supply body. The plating liquid supply body has a substantially mountain-shaped top having guide surfaces on the left and right sides, has an opening for plating liquid seeping out at or near the upper end of the top, and has a plating liquid supply communicating with the opening. a passageway is formed therein, an anode is disposed within the passageway, the guide surface is wetted with the plating liquid exuded from the opening, and a delivery part for the plating liquid is formed at a portion corresponding to the pass line. Partial plating device.