JPH0141243B2 - - Google Patents

Description

[Detailed Description of the Invention] (a) Technical Field of the Invention The present invention relates to a method for manufacturing electronic components mounted on printed boards etc. by face bonding, particularly aluminum solid electrolytic capacitors and tantalum solid electrolytic capacitors. The present invention relates to a method of soldering a metal layer for external connection to the electrode pad surface of an electronic component and covering the outer peripheral surface of the electronic component except for this metal layer with an insulating resin.

(b) Background of the technology This type of manufacturing method involves forming a solder layer all over the board, placing a chip-type electronic component element on the solder layer, and connecting the anode pad surface and cathode pad surface with the solder layer. Then, each pad surface is fixed to the solder layer by heating and melting the solder layer. Then, in this fixed state, insulating resin is coated on the outer surface of the electronic component element except the fixed part by molding, and finally, There was a method of heating and melting the solder layer to separate the electronic component element from the substrate, thereby forming a solder layer on the pad surface and completing an electronic component in which the parts other than the pad surface were coated with resin.

However, when completing a large number of electronic components at once using this method, alignment is required when placing the electronic components on the board due to the relationship with the mold, and this alignment is technically and operationally difficult. It was troublesome and hot.

Therefore, the present applicant began implementing the "Method for Manufacturing Electronic Components" (Japanese Patent Publication No. 1983-35020), which was filed on March 4, 1972 and published on August 14, 1981.

(c) Prior art and problems The above-announced "method for manufacturing electronic components" is a method that facilitates the positioning of a large number of electronic component elements on a board. After arranging multiple sets of corresponding recesses on the board and placing solder chips in each recess, the board is adjusted so that the anode pad and cathode pad of each electronic component element are seated on each pair of solder chips. A group of electronic component elements on the front surface is placed. Next, the solder chips are temporarily heated and melted to solder and fix the board and electronic component elements, and in this state, each electronic component element is covered with an insulating resin exterior by mold-in molding, and then the solder chips are This is a method of reheating and separating the packaged electronic component element group from the board.

However, a common drawback of electronic components completed using the traditional methods explained in the background of these methods and techniques is that the surfaces of the layers deposited on the anode and cathode pads are uneven, and the electronic components There have been cases where it has been necessary to smooth out the unevenness before mounting the component on a printed board or the like.

(d) Object of the invention An object of the invention is to provide a method for manufacturing electronic components that improves the above-mentioned problems.

(e) Structure of the Invention The above object is to produce a chip in which a metal layer and a solder layer that can be soldered to the recesses of a board having a plurality of pairs of recesses arranged on the surface thereof are laminated with the solder layer on top of the chip. placing the elements on the surface of the substrate so that the solderable anode pad surface and cathode pad surface of each electronic component element are respectively seated on each pair of chips; The solder layer is temporarily heated and melted to fuse the chip to the element, and then each element is covered with an electrically insulating resin exterior body by mold-in molding, and the group of exterior elements to which the chip is fused is formed. This is achieved by a method of manufacturing an electronic component, which is characterized by separating the substrate from the substrate.

(f) Examples of the invention Examples of the method of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view showing an electronic component element such as an aluminum solid electrolytic capacitor element and a chip according to the present invention, FIG. 2 is a plan view of a substrate according to an embodiment of the present invention, and FIG. FIG. 4 is a cross-sectional view of the element covered with an exterior using the substrate, and FIG. 5 is a perspective view of a completed capacitor in which the element is coated with an exterior.

In FIG. 1, 11 is an anode wire extending from the main body of the capacitor element 10, and a solderable metal piece 12 is welded to the tip of the anode wire, and the lower surface of this metal piece 12 in the drawing provides an anode pad surface 12a. The main body of the element 10 is coated with a solder layer 13, and the lower surface of the solder layer 13 in the drawing provides a cathode pad surface 13a.

In FIGS. 2 and 3, the board 20 is composed of a metal base 21 having a flat surface and a plate 22 with holes fixed thereon, and the base 21 and the plate 22 with holes are solderable. It is better to use a metal with poor solderability or a surface treatment with poor solderability. Moreover, the substrate 20 consists of a base 21 and a plate with holes 22.
It does not need to be a layered structure and may be formed as a single piece from the beginning.

A pair of recesses A and B are provided on the surface of the substrate 20.
There are many sets of recesses A and B.
is provided by a combination of the surface of the base 21 and the through holes a and b of the perforated plate 22. However, if the substrate is an integral piece, it is necessary to provide recesses A and B in its surface.

In the substrate 20 configured in this way, each one
In the pair of recesses A and B, chips 15A and 15B shown in FIG. Cut metal layers 16A and 16
Chips 15A and 15B each having a solder layer 17A or 17B with a thickness of 10 μm, for example, are fitted onto the plating surface of B so that the solder layers 17A and 17B face upward. Note that the chips 15A and 15B are mass-produced by cutting a large metal plate with a solder layer coated over the entire upper surface into a large number of pieces having predetermined dimensions.

Next, the element 10 shown in FIG.
Place it on top of B so that it is in contact with it. Such operations are performed for each of a predetermined number of elements 10.

Next, the substrate 20, chips 15A, 15B, and element 10 are temporarily heated (for example, at 245° C. for 10 seconds).
to temporarily melt the solder layers 17A, 17B, thereby bonding the element 10 and the chip 15A,
15B. At this time, even if the solder layers 17A and 17B, which have a suitable amount of thickness such as 10 μm, melt, they do not flow out due to their surface tension, so that the molten solder flows between the holes A and B and the chips 15A and 15B. It will not be possible to fill up all the space.

Furthermore, the substrate 20 is set in a mold-in mold, and insulating resin is injected into the mold and cured. As shown in FIG. Covering resin exterior 30
is formed.

Then, when the substrate 20 is removed from the mold-in mold, the cathode pad 1 of the device 10 is removed as shown in FIG.
The completed capacitor 100 is easily removed from the substrate 20 so that the metal layers 16A, 16B of the chips 15A, 15B fixed to the anode pad 12a and the anode pad 12a, respectively, are exposed. and metal layer 16
The exposed planes A and 16B serve as butt surfaces for mounting the capacitor 100 on a printed board or the like.

(g) Effects of the invention As explained above, according to the method of the present invention, there is no need to flatten the pad of a completed electronic component after completion, so the conventional flattening process is unnecessary and mounting on a printed board etc. The effect of making it easier is significant.

It should be noted that the method of the present invention is not only advantageous when applied to the solid electrolytic capacitor of the above embodiment, but also advantageous when applied to the manufacture of other face-bondable electronic components.

[Brief explanation of drawings]

Fig. 1 is a perspective view showing a solid electrolytic capacitor element and chip used in an embodiment of the present invention, Fig. 2 is a plan view of a board related to the embodiment, and Fig. 3 is a perspective view taken along the line - in Fig. 2. A sectional view, FIG. 4 is a sectional view in which the element is coated with an exterior using the substrate,
FIG. 5 is a perspective view showing a completed capacitor in which the element is covered with an exterior. In the figure, 10 is an aluminum solid electrolytic capacitor element, 12 is a solderable metal piece, 1
2a is the anode pad surface of the element 10, 13 is the solder layer, 13a is the cathode pad surface of the element 10, 15A,
15B is a chip, 16A and 16B are solderable metal layers (metal plates), 17A and 17B are solder layers, 20 is a substrate, 21 is a base, 22 is a plate with holes,
A and B are recesses of the substrate 20, 30 is a resin exterior, and 10
0 indicates an aluminum solid electrolytic capacitor.

Claims (1)

[Claims] 1 Place a chip on which a solderable metal layer and a solder layer are laminated in the recesses of a board having multiple pairs of recesses arranged on its surface, with the solder layer facing upward, and The group of elements is placed on the surface of the substrate so that the solderable anode pad surface and cathode pad surface of each electronic component element are respectively seated on the pair of chips, and the solder layer is temporarily heated. After the chips are melted and fused to the elements, each element is covered with an exterior body made of electrically insulating resin by mold-in molding, and the exterior elements to which the chips are fused are separated from the substrate. Characteristic manufacturing method for electronic components.