JPH0141261B2 - - Google Patents
Info
- Publication number
- JPH0141261B2 JPH0141261B2 JP56038957A JP3895781A JPH0141261B2 JP H0141261 B2 JPH0141261 B2 JP H0141261B2 JP 56038957 A JP56038957 A JP 56038957A JP 3895781 A JP3895781 A JP 3895781A JP H0141261 B2 JPH0141261 B2 JP H0141261B2
- Authority
- JP
- Japan
- Prior art keywords
- groove
- layer
- substrate
- flat
- growth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/223—Buried stripe structure
- H01S5/2232—Buried stripe structure with inner confining structure between the active layer and the lower electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/1003—Waveguide having a modified shape along the axis, e.g. branched, curved, tapered, voids
- H01S5/1014—Tapered waveguide, e.g. spotsize converter
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/1053—Comprising an active region having a varying composition or cross-section in a specific direction
- H01S5/1064—Comprising an active region having a varying composition or cross-section in a specific direction varying width along the optical axis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/223—Buried stripe structure
- H01S5/2232—Buried stripe structure with inner confining structure between the active layer and the lower electrode
- H01S5/2234—Buried stripe structure with inner confining structure between the active layer and the lower electrode having a structured substrate surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/50—Amplifier structures not provided for in groups H01S5/02 - H01S5/30
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Geometry (AREA)
- Semiconductor Lasers (AREA)
Description
【発明の詳細な説明】 本発明は半導体装置に関するものである。[Detailed description of the invention] The present invention relates to a semiconductor device.
従来、溝を付けた基板上に結晶層を成長させ、
半導体素子を作製する方法は広く行なわれてい
る。その一例として半導体レーザーを第1図に示
す。一定の幅の溝1′を付けたn型GaAs基板1
上に第1層n型Ga1-xAlxAsクラツド層2、第2
層ノンドープGa1-yAlyAs活性層3、第3層p型
Ga1-xAlxAsクラツド層4、第4層n型GaAs電流
制限層5を連続成長し、結晶表面よりストライプ
状に溝部直上で亜鉛拡散を形成6し、p側オーミ
ツク電極7を設ける。又、基板側にn側オーミツ
ク電極8を形成して完成する。この構造をとるこ
とにより、溝部上の活性層3で発振し、溝部と平
坦部の間で活性層3内に有効屈折率差を設け導波
機構を付けることができ、発振した光は溝部上に
とじ込められ、発振横モードの安定化を行なつて
いる。 Traditionally, a crystal layer is grown on a grooved substrate,
Methods for manufacturing semiconductor devices are widely used. As an example, a semiconductor laser is shown in FIG. N-type GaAs substrate 1 with a groove 1' of a constant width
On top is a first n-type Ga 1-x Al x As cladding layer 2, a second
Layer non-doped Ga 1-y Al y As active layer 3, third layer p-type
A Ga 1-x Al x As cladding layer 4 and a fourth n-type GaAs current limiting layer 5 are successively grown, zinc diffusion is formed 6 directly above the groove in a stripe form from the crystal surface, and a p-side ohmic electrode 7 is provided. Further, an n-side ohmic electrode 8 is formed on the substrate side to complete the process. By adopting this structure, it is possible to oscillate in the active layer 3 above the groove, create an effective refractive index difference in the active layer 3 between the groove and the flat part, and provide a waveguide mechanism, so that the oscillated light can be transmitted above the groove. This stabilizes the transverse mode of oscillation.
ところで、上記溝は一定の巾を有しており、溝
幅の変化した基板上に構成された半導体素子につ
いては皆無に等しい現状である。 Incidentally, the groove has a constant width, and the current situation is that there are almost no semiconductor devices constructed on a substrate with a varying groove width.
本発明は同一溝内で溝幅の変化した形状を有す
る溝を付けた基板上に結晶成長を行なつて得られ
る新しい形状の結晶層を利用した半導体素子を提
供するものである。 The present invention provides a semiconductor element that utilizes a crystal layer with a new shape obtained by growing crystals on a substrate with grooves having different groove widths within the same groove.
単結晶半導体基板9上にたとえば第2図aのよ
うにテーパー状に幅の変化した溝9′を設ける。
その基板表面に液相エピタキシヤル法により結晶
成長を行なう。なお、以下に示す第2図b,c,
dにおいてA,BはそれぞれA,B方向から見た
図を示す。ところでこのように溝を有する基板の
上に結晶成長を行う場合、一般に、成長開始時の
溶液の過飽和度を小さくすれば、基板9の平坦部
における成長速度よりも溝9′のコーナー部のそ
れの方が大きくなり、溝部9′が成長結晶層10
で埋まる傾向をを示す。(第2図b)、すなわち溝
部9′が図のごとく幅の変化したものであつても、
全体が平坦な成長層10を形成できる。一方、過
飽和度を大きくすれば、基板平坦部の成長速度が
増加し、溝部を埋めるためには第2図cのごとく
平坦部の成長層10′を厚くしなければならない
という関係がある。すなわち、このことは成長層
を薄くすれば、溝のコーナー部とそれ以外の平坦
部(溝内の平坦部、溝外の平坦部)の厚さを変え
ることができることを意味する。 A groove 9' having a tapered width varying in width is provided on a single crystal semiconductor substrate 9, for example as shown in FIG. 2a.
Crystal growth is performed on the surface of the substrate by a liquid phase epitaxial method. In addition, Fig. 2 b, c, shown below
In d, A and B show views seen from directions A and B, respectively. By the way, when crystal growth is performed on a substrate having grooves in this way, generally speaking, if the degree of supersaturation of the solution at the start of growth is made small, the growth rate at the corners of the grooves 9' will be faster than that at the flat areas of the substrate 9. becomes larger, and the groove 9' becomes the grown crystal layer 10.
indicates a tendency to be filled with (Fig. 2b), that is, even if the groove 9' has a changed width as shown in the figure,
A growth layer 10 that is flat as a whole can be formed. On the other hand, if the degree of supersaturation is increased, the growth rate of the flat part of the substrate increases, and in order to fill the groove part, the growth layer 10' in the flat part must be made thicker, as shown in FIG. 2c. In other words, this means that by making the growth layer thinner, the thickness of the corner portion of the groove and the other flat portions (the flat portion inside the groove and the flat portion outside the groove) can be changed.
また、溝9′の深さ、幅等によつても、平坦部
と溝9′のコーナー部上での成長層の厚さを変え
ることができる。 Furthermore, the thickness of the grown layer on the flat portion and the corner portions of the groove 9' can be changed by changing the depth, width, etc. of the groove 9'.
このような特徴を利用することにより、第2図
dに示すような形状の結晶層10″を得ることが
できる。すなわち、第2図dの構造は、溝9′の
巾の狭いXY側では成長層10″は平坦で、巾の
広いX′Y′側で溝9′のコーナー部では厚く、溝
9′内の平坦部および溝9′外の平坦部では薄い成
長層10″を形成したものである。 By utilizing such characteristics, it is possible to obtain a crystal layer 10'' having a shape as shown in FIG. 2d. That is, the structure shown in FIG. The growth layer 10'' was flat, thick at the corners of the groove 9' on the wide X'Y' side, and thin at the flat parts inside the groove 9' and the flat parts outside the groove 9'. It is something.
この新しい形成をもつた基板上への結晶成長と
それを利用して作製できる本発明の実施例の半導
体素子について具体的に以下に説明する。以下に
GaAsを基板としてGaAs,Ga1-xAlxAsの結晶成
長を行ない、半導体素子としてここでは簡単な光
導波路について示す。 The crystal growth on the substrate having this new formation and the semiconductor element of the embodiment of the present invention that can be manufactured using the crystal growth will be specifically described below. less than
A simple optical waveguide is shown here as a semiconductor device by growing crystals of GaAs and Ga 1-x Al x As using GaAs as a substrate.
n型GaAs結晶基板9(100)面上に第2図a
に示すように幅の変化している溝9′を形成する。
溝9′のエツジの片方は<011>方向にとり、他方
はそれに対して30゜かたむける。溝9′の深さは
1.5μmである。この基板9上に液相エピタキシヤ
ル法によりたとえばn型のCa0.65Al0.35As11、ノ
ンドープのGaAs12を連続成長する。 Figure 2a is placed on the n-type GaAs crystal substrate 9 (100) plane.
A groove 9' having a varying width is formed as shown in FIG.
One of the edges of the groove 9' is oriented in the <011> direction, and the other is oriented at 30° with respect to it. The depth of groove 9' is
It is 1.5 μm. For example, n-type Ca 0.65 Al 0.35 As 11 and non-doped GaAs 12 are successively grown on this substrate 9 by a liquid phase epitaxial method.
成長開始時の過飽和度を6℃と大きくし、成長
開始温度750℃、冷却速度0.5℃/分で成長する
と、第3図に示すように、平坦部の成長速度が大
きくなり、溝9′が埋めつくされず、第1層n型
GaAlAsよりなる21の表面が平坦にならない。
このため、GaAsよりなる第2層22は溝幅の狭
い方で平坦で、溝幅の広い方でななめになつた形
状が得られる。第1層21の平坦部21′での膜
厚は0.5μm、溝幅の広い側の溝コーナー部の段差
の部分21″で約1μmであり、第2層22は平坦
部22′で0.5μm、段差部の傾斜した部分22″で
0.6μmと平坦部22″より厚く成長できる。 When the degree of supersaturation at the start of growth is increased to 6°C, the growth starting temperature is 750°C, and the cooling rate is 0.5°C/min, the growth rate in the flat part becomes faster and the groove 9' is formed as shown in Figure 3. The first layer is n-type.
The surface of 21 made of GaAlAs is not flat.
Therefore, the second layer 22 made of GaAs has a flat shape on the narrow side of the groove and a slanted shape on the wide side of the groove. The film thickness of the first layer 21 at the flat part 21' is 0.5 μm, about 1 μm at the stepped portion 21'' of the wide groove corner, and the thickness of the second layer 22 is 0.5 μm at the flat part 22'. , at the sloped part 22'' of the step.
It can grow thicker than the flat part 22'' at 0.6 μm.
したがつて、第2層GaAs22の傾斜した部分
22″はその両側より厚くなつているので、その
部分に光を閉じ込めることができ、光導波路が形
成できる。 Therefore, since the inclined portion 22'' of the second layer GaAs 22 is thicker than both sides thereof, light can be confined in that portion and an optical waveguide can be formed.
第3図に示した構造において、幅の狭いXY側
では層22は横方向に屈折率分布が形成され、
点々を施した部分に光が伝搬する。そして、幅の
広いX′Y′側では21″の部分が厚く21′の部分
が薄いため21″の実効屈折率が高く、光はXY
側に対応したX′側の22″の部分に閉じ込められ
る。すなわち、第3図に示すごとく、入射された
光l4は層22を進行していくにつれて光は横方向
に広がらず、傾斜部分22″に閉じ込められここ
から放出される。この第3図に示した導波路構造
を用いると、入射光と出射光の偏波面を変化させ
ることができ、使用状態が多様化されレーザー素
子との一体化、光ICの集積化等に好都合である。 In the structure shown in FIG. 3, the layer 22 has a refractive index distribution in the lateral direction on the narrow XY side.
Light propagates to the dotted area. On the wide X'Y' side, the 21" part is thick and the 21' part is thin, so the effective refractive index of 21" is high, and the light is
In other words, as shown in FIG. 3, as the incident light l 4 travels through the layer 22, it does not spread laterally and is confined in the slanted portion. 22″ and is released from there. By using the waveguide structure shown in Figure 3, it is possible to change the plane of polarization of the incident light and the output light, which allows for diversification of usage conditions and is convenient for integration with laser elements, integration of optical ICs, etc. It is.
このように、第3図に示した光導波路は溝9′
の幅の狭いところと広いところとでねじれている
ため、成長層に平行に偏向した光を入射させる
と、もとの入射光に対し、偏向方向が変化した光
が得られる特長を有している。 In this way, the optical waveguide shown in FIG.
Because it is twisted in the narrow and wide areas, it has the characteristic that when parallel polarized light is incident on the growth layer, light with a different polarization direction compared to the original incident light is obtained. There is.
以上の例は、溝幅がテーパー状に変化している
半導体基板を用いたGaAs,Ga1-xAlxAs系の具体
例を示したが、これに限らず、幅が段階状に変化
しているものでもよく、また他の材料を用いても
基板よりも屈折率の大きい結晶を表面が平坦にな
るように成長すれば溝幅の変化した光導波路が形
成できる。また、以上は光デバイスについて示し
たが、それ以外のデバイス作製においても広く利
用できる。 The above examples show specific examples of GaAs and Ga 1-x Al x As based semiconductor substrates in which the groove width changes in a tapered manner; however, the present invention is not limited to this. Alternatively, even if other materials are used, an optical waveguide with a varying groove width can be formed by growing a crystal with a higher refractive index than the substrate so that the surface is flat. Further, although the above description has been made regarding optical devices, it can be widely used in manufacturing other devices as well.
以上のように、本発明はすぐれた特性を有する
半導体素子の実現に大きく寄与するものであり、
光素子等の利用にすぐれた効果をもたらすもので
ある。 As described above, the present invention greatly contributes to the realization of semiconductor devices with excellent characteristics.
This brings about excellent effects in the use of optical devices and the like.
第1図は溝を付けた基板上に構成された従来の
半導体レーザーの断面図、第2図aは溝幅の変化
した溝を有する本発明に用いる基板の一例の斜視
図、第2図b〜dは上記基板に成長を行なつた断
面図でA,Bは第2図aのA,B方向からの断面
図、第3図は上記基板上に2つの結晶層を成長し
た断面図でA,Bは同A,B方向の断面図であ
る。
9……n型GaAs基板、10,10′,10″…
…ノンドープGaAs層、21……n型Ga1-xAlxAs
層、22……ノンドープGaAs層。
FIG. 1 is a cross-sectional view of a conventional semiconductor laser constructed on a substrate with grooves, FIG. 2a is a perspective view of an example of a substrate used in the present invention having grooves with varying groove widths, and FIG. 2b -d are cross-sectional views of the crystals grown on the above substrate, A and B are cross-sectional views taken from directions A and B of Fig. 2a, and Fig. 3 is a cross-sectional view of two crystal layers grown on the substrate. A and B are cross-sectional views in the same A and B directions. 9...n-type GaAs substrate, 10, 10', 10''...
...Non-doped GaAs layer, 21...n-type Ga 1-x Al x As
Layer 22...non-doped GaAs layer.
Claims (1)
称に、かつ、テーパー状に変化している溝が形成
され、前記半導体基板上光導波層となるに結晶層
が形成され、前記結晶層は前記溝の幅の広い側に
おいて溝のコーナー部で前記基板側に湾曲してい
ることを特徴とする半導体装置。1. A groove whose groove width is asymmetrical with respect to the groove direction and tapered is formed on the surface of a semiconductor substrate, a crystal layer is formed as an optical waveguide layer on the semiconductor substrate, and the crystal layer is A semiconductor device characterized in that a wide side of the groove is curved toward the substrate at a corner portion of the groove.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56038957A JPS57153488A (en) | 1981-03-17 | 1981-03-17 | Semiconductor device |
| US06/357,086 US4520485A (en) | 1981-03-17 | 1982-03-11 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56038957A JPS57153488A (en) | 1981-03-17 | 1981-03-17 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57153488A JPS57153488A (en) | 1982-09-22 |
| JPH0141261B2 true JPH0141261B2 (en) | 1989-09-04 |
Family
ID=12539659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56038957A Granted JPS57153488A (en) | 1981-03-17 | 1981-03-17 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57153488A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3276917D1 (en) * | 1982-12-27 | 1987-09-10 | Ibm | Light waveguide with a submicron aperture, method for manufacturing the waveguide and application of the waveguide in an optical memory |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2205728C3 (en) * | 1972-02-08 | 1979-01-04 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Optical component consisting of a multilayer semiconductor body |
| JPS55150288A (en) * | 1979-05-10 | 1980-11-22 | Sony Corp | Semiconductor laser |
-
1981
- 1981-03-17 JP JP56038957A patent/JPS57153488A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57153488A (en) | 1982-09-22 |
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