JPH0142832B2 - - Google Patents
Info
- Publication number
- JPH0142832B2 JPH0142832B2 JP58014213A JP1421383A JPH0142832B2 JP H0142832 B2 JPH0142832 B2 JP H0142832B2 JP 58014213 A JP58014213 A JP 58014213A JP 1421383 A JP1421383 A JP 1421383A JP H0142832 B2 JPH0142832 B2 JP H0142832B2
- Authority
- JP
- Japan
- Prior art keywords
- heating element
- substrate
- bead
- layer
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
Landscapes
- Electronic Switches (AREA)
Description
【発明の詳細な説明】
発明の技術分野
本発明は、基板上に制御回路用の半導体素子を
取付けたサーマルヘツドに関するものである。DETAILED DESCRIPTION OF THE INVENTION Technical Field of the Invention The present invention relates to a thermal head in which a semiconductor element for a control circuit is mounted on a substrate.
技術的背景およびその問題点
従来、機器の小型化のために制御回路部を発熱
体部付近に実装して高密度化をはかつているもの
が存する。すなわち、第１図に示すように平板状
の絶縁基板１に発熱体層２、導体層３、発熱体部
４、耐摩耗層５を形成し、制御回路用の半導体素
子６を絶縁基板１上に取付けてボンデングワイヤ
ー７により接続している。また、裏面には放熱板
８が一体的に接合されている。Technical Background and Problems Conventionally, in order to miniaturize devices, there are devices in which a control circuit section is mounted near a heating element section to increase density. That is, as shown in FIG. 1, a heating element layer 2, a conductor layer 3, a heating element part 4, and a wear-resistant layer 5 are formed on a flat insulating substrate 1, and a semiconductor element 6 for a control circuit is placed on the insulating substrate 1. It is attached to and connected by bonding wire 7. Furthermore, a heat sink 8 is integrally joined to the back surface.
このような構造においては、放熱板が絶縁基板
１の裏側に位置し、その絶縁基板１が熱伝導性の
低いものであるため放熱性が良くないと云う問題
がある。また、半導体素子は発熱体部の存する側
に突出しており、感熱紙等が接触し易く、これに
より、電気的接続等に悪影響を与えるおそれがあ
り、この周辺にスペース的な余裕をもたせなけれ
ばならない。 In such a structure, the heat dissipation plate is located on the back side of the insulating substrate 1, and since the insulating substrate 1 has low thermal conductivity, there is a problem that heat dissipation is not good. In addition, the semiconductor element protrudes to the side where the heating element is located, making it easy for thermal paper etc. to come into contact with it, which may have a negative effect on electrical connections, etc. Therefore, it is necessary to provide sufficient space around this area. It won't happen.
発明の目的
本発明は、放熱性がよく、発熱体の熱効率が高
く、また、半導体素子を実装してもその電気的接
続やスペース的になんら問題がなく、しかも、そ
の形成加工が容易なサーマルヘツドを得ることを
目的とするものである。Purpose of the Invention The present invention provides a thermal method that has good heat dissipation, high thermal efficiency of the heating element, no problems in terms of electrical connection or space even when semiconductor elements are mounted, and is easy to form and process. The purpose is to obtain a head.
発明の概要
本発明は、金属板の表面の絶縁ガラス層を形成
した基板を用いたので、その基板自体がきわめて
熱伝導性がよく、これにより、放熱性は良好にな
り、また、基板に設けられた凹部内に半導体素子
を設けたので、半導体素子が突出することなく、
それを設けなかつたものと同様に処理することが
でき、プラテンもその直径の大きなものを使用す
ることができ、さらに、発熱体はビードの突出面
側に設けられているため、熱効率が高く、これに
より、発熱体部への印加電圧を低くすることがで
きて長い寿命を得ることができ、しかも、一枚の
金属基板で一体的に形成することができるため、
その形成加工が容易であるように構成したもので
ある。Summary of the Invention The present invention uses a substrate with an insulating glass layer formed on the surface of a metal plate, so the substrate itself has extremely good thermal conductivity, which improves heat dissipation. Since the semiconductor element is provided in the recessed part, the semiconductor element does not protrude.
It can be processed in the same way as one without it, a platen with a larger diameter can be used, and the heating element is provided on the protruding surface side of the bead, so thermal efficiency is high. As a result, the voltage applied to the heating element can be lowered, resulting in a longer lifespan.Furthermore, it can be formed integrally with a single metal substrate.
The structure is such that it can be easily formed and processed.
発明の実施例
本発明の一実施例を第２図に基いて説明する。
まず、金属板９が設けられ、この金属板９には幅
方向に長いビード１０が形成されているとともに
他方には前記ビード１０と反対方向へ突出して凹
部１１が円形に形成されている。そして、前記ビ
ード１０と前記凹部１１とが形成された面に絶縁
ガラス層１２が形成されて基板１３が構成され
る。この絶縁ガラス層１２は厚膜印刷法、デイツ
プ法、スピンナ法等によつて形成されるものであ
る。このような絶縁ガラス層１２の表面には前記
凹部１１の表面を除いて発熱体層１４と導体層１
５とが順次積層され、とくに前記ビード１０の部
においては導体層１５の一部が切欠されて発熱体
部１６が形成され、この表面には耐摩耗層１７が
積層形成されている。Embodiment of the Invention An embodiment of the present invention will be described with reference to FIG.
First, a metal plate 9 is provided, and a bead 10 that is long in the width direction is formed on the metal plate 9, and a circular recess 11 is formed on the other side of the metal plate 9 so as to protrude in a direction opposite to the bead 10. Then, an insulating glass layer 12 is formed on the surface where the beads 10 and the recesses 11 are formed, thereby forming a substrate 13. This insulating glass layer 12 is formed by a thick film printing method, a dip method, a spinner method, or the like. A heating element layer 14 and a conductor layer 1 are formed on the surface of such an insulating glass layer 12 except for the surface of the recess 11.
Particularly at the bead 10, a part of the conductor layer 15 is cut out to form a heating element part 16, and a wear-resistant layer 17 is laminated on the surface of this part.
また、前記凹部１１内における前記絶縁ガラス
層１０の表面には制御回路用の半導体素子１８が
固定され、ボンデングワイヤー１９によつてその
凹部１１内において前記導体層１５に接続されて
いる。そして、前記凹部１１には保護用のキヤツ
プ２０により覆われている。 Further, a semiconductor element 18 for a control circuit is fixed to the surface of the insulating glass layer 10 in the recess 11 and connected to the conductor layer 15 in the recess 11 by a bonding wire 19 . The recess 11 is covered with a protective cap 20.
このような構成において、発熱体部１６は基板
１３の基面より突出した状態となつているため、
印字時に感熱紙の接触面積が小さく、これによ
り、発熱体部１６での熱の拡散が少なくて熱交率
がきわめて高い。そのため、発熱体部１６への印
加電圧を低減しうるため、寿命が長くなる。 In such a configuration, since the heating element portion 16 is in a state of protruding from the base surface of the substrate 13,
During printing, the contact area of the thermal paper is small, and as a result, there is little heat diffusion in the heating element section 16, and the heat exchange rate is extremely high. Therefore, the voltage applied to the heating element section 16 can be reduced, resulting in a longer lifespan.
また、半導体素子１８はその接続用のボンデン
グワイヤー１９とともに凹部１１内に埋設される
ので、この部分が突出することがなく、感熱紙に
接触することがなく、また、電気的接触状態が安
定しており、故障等が発生しない。 In addition, since the semiconductor element 18 is buried in the recess 11 together with the bonding wire 19 for connection thereof, this part does not protrude and come into contact with the thermal paper, and the electrical contact state is stable. and no breakdowns will occur.
発明の効果
本発明は、上述のように基板は金属板の表面に
絶縁ガラス層を形成したものであるため、その基
板自体の熱伝導性が高く、これにより、放熱性を
高めることができ、また、基板に形成された凹部
内に制御回路用の半導体素子を取付けたので、半
導体素子が基板表面より突出することがなく、こ
れにより、半導体素子を取付けていない平板状の
ものと同様に扱うことができ、電気的接続も充分
に保護され、そのため、プラテンも直径の大きな
ものを使用することができ、さらに、発熱体はビ
ードの突出面側に設けられているため、熱効率が
高く、これにより、発熱体部への印加電圧を低く
することができて長い寿命を得ることができ、し
かも、一枚の金属基板で一体的に形成することが
できるため、その形成加工が容易である等の効果
を有する。Effects of the Invention In the present invention, as described above, since the substrate is formed by forming an insulating glass layer on the surface of a metal plate, the substrate itself has high thermal conductivity, and this can improve heat dissipation. In addition, since the semiconductor element for the control circuit is mounted in the recess formed in the substrate, the semiconductor element does not protrude from the surface of the substrate, and as a result, it can be handled in the same way as a flat plate without a semiconductor element attached. The electrical connections are well protected, and a platen with a large diameter can therefore be used.Furthermore, the heating element is placed on the protruding surface of the bead, resulting in high thermal efficiency. As a result, the voltage applied to the heating element can be lowered, resulting in a longer lifespan.Furthermore, since it can be formed integrally with a single metal substrate, it is easy to form and process. It has the effect of
第１図は従来の一例を示す縦断側面図、第２図
は本発明の一実施例を示す縦断側面図である。
９……金属板、１１……凹部、１２……絶縁ガ
ラス層、１３……基板、１４……発熱体層、１５
……導体層、１６……発熱体部、１８……半導体
素子。
FIG. 1 is a longitudinal side view showing an example of the conventional technology, and FIG. 2 is a longitudinal side view showing an embodiment of the present invention. 9...Metal plate, 11...Recess, 12...Insulating glass layer, 13...Substrate, 14...Heating element layer, 15
...Conductor layer, 16...Heating element portion, 18...Semiconductor element.
Claims (1)
チングすることにより発熱体部を形成するように
したサーマルヘツドにおいて、幅方向に長いビー
ドとこのビードの突出方向と逆方向に突出するこ
とにより形成された凹部とを有する金属板の表面
に絶縁ガラス層を形成した基板を設け、この基板
の前記ビードの突出面側に発熱体部を形成すると
ともに前記凹部内に制御回路用の半導体素子を取
付けたことを特徴とするサーマルヘツド。1. In a thermal head in which the heating element is formed by laminating and etching a heating element layer and a conductor layer on a substrate, there is a bead that is long in the width direction and protrudes in a direction opposite to the direction in which this bead projects. A substrate is provided with an insulating glass layer formed on the surface of a metal plate having a concave portion formed by the method, and a heating element is formed on the side of the protruding surface of the bead of the substrate, and a semiconductor element for a control circuit is placed in the concave portion. A thermal head characterized by having a.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58014213A JPS59140078A (en) | 1983-01-31 | 1983-01-31 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58014213A JPS59140078A (en) | 1983-01-31 | 1983-01-31 | Thermal head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59140078A JPS59140078A (en) | 1984-08-11 |
| JPH0142832B2 true JPH0142832B2 (en) | 1989-09-14 |
Family
ID=11854811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58014213A Granted JPS59140078A (en) | 1983-01-31 | 1983-01-31 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59140078A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60248367A (en) * | 1984-05-25 | 1985-12-09 | Canon Inc | Thermal head |
| JPS61167572A (en) * | 1985-01-19 | 1986-07-29 | Fuji Xerox Co Ltd | Thermal head |
| JPS61169262A (en) * | 1985-01-24 | 1986-07-30 | Toshiba Corp | Thermal head and its preparation |
| JPS62227657A (en) * | 1986-03-28 | 1987-10-06 | Matsushita Electric Ind Co Ltd | Thermal head |
| JP5859259B2 (en) * | 2011-09-27 | 2016-02-10 | 東芝ホクト電子株式会社 | Thermal print head |
-
1983
- 1983-01-31 JP JP58014213A patent/JPS59140078A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59140078A (en) | 1984-08-11 |
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