JPH0143933B2 - - Google Patents
Info
- Publication number
- JPH0143933B2 JPH0143933B2 JP56108587A JP10858781A JPH0143933B2 JP H0143933 B2 JPH0143933 B2 JP H0143933B2 JP 56108587 A JP56108587 A JP 56108587A JP 10858781 A JP10858781 A JP 10858781A JP H0143933 B2 JPH0143933 B2 JP H0143933B2
- Authority
- JP
- Japan
- Prior art keywords
- etching
- display
- film
- resist
- electrochromic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 150000001412 amines Chemical class 0.000 claims 1
- -1 ammonium ions Chemical class 0.000 claims 1
- 238000005530 etching Methods 0.000 description 17
- 238000000034 method Methods 0.000 description 14
- 239000000463 material Substances 0.000 description 8
- 206010063836 Atrioventricular septal defect Diseases 0.000 description 7
- 238000001211 electron capture detection Methods 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 238000000059 patterning Methods 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 238000003486 chemical etching Methods 0.000 description 3
- 229910000314 transition metal oxide Inorganic materials 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000005546 reactive sputtering Methods 0.000 description 1
- 238000006479 redox reaction Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- ZNOKGRXACCSDPY-UHFFFAOYSA-N tungsten trioxide Chemical compound O=[W](=O)=O ZNOKGRXACCSDPY-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/15—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on an electrochromic effect
- G02F1/153—Constructional details
- G02F1/1533—Constructional details structural features not otherwise provided for
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
本発明は、エレクトロクロミツク表示装置の製
造方法に関する。
近年、エレクトロクロミツク材料例えばWO3,
MoO3等の遷移金属酸化物の電気化学的酸化還元
反応を利用したエレクトロクロミツク表示装置
(以下ECDと称す)が開発されている。かかる
ECDの一般的な構造は、第1図aに示すように
透明基板1に酸化インジウム又は酸化スズの透明
導電膜2を形成し、その膜上にエレクトロクロミ
ツク層(以下EC層と称す)としての酸化タング
ステン(WO3)膜3を蒸着し表示電極を形成し
ている。又第1図bのように透明導電膜2の保護
のために、表示部(WO3)以外の導電膜上に絶
縁保護膜4を設けることもある。
従来、かかるECD表示極の表示部(例えば
WO3)のパターン化は、メタルマスクを用いて
蒸着時に行なうのが一般的であるが、この場合、
機械的なマスク重ね合せ誤差が大きく、かつパタ
ーン周辺部の膜厚が均一にならず表示ボケを生じ
るという欠点を有する。
故に、精度の良いパターンを必要とする場合は
エレクトロクロミツク材料を全面蒸着した後、エ
ツチング法によつてパターン化する方法がとられ
る。
遷移金属酸化物(例えばWO3,MoO3)をエツ
チングする方法としては、主にケミカル法、プラ
ズマ法、リアクテイブスパツター法がある。ケミ
カルエツチング法は他の方法に較べ量産性に富み
安価な方法であるが、従来、サイドエツチング
(第1図bの6に示す)が大きいこととエツチン
グ材料の金属残渣で基板を汚すことにより採用さ
れ難かつた。
本発明は、表示部をパターン化するケミカルエ
ツチング法において、サイドエツチングが少なく
かつ、エツチング後の金属残渣のないエツチング
材料を見い出したことにより、量産性に富んだパ
ターン化方法を利用して安価なECDを提供する
ものである。
以下、本発明の一実施例を図面を参照して説明
する。
(実施例 1)
第2図eは本発明製造方法による一例のECセ
ルの要部断面を示し、図において、1は透明基
板、2はIn2O3,SnO2などの透明導電膜、3は
WO3,MoO3などの遷移金属酸化物EC層、4は
酸化シリコン、MgF2などの絶縁性保護膜、5は
レジストである。
第2図a〜eは本発明の一例によるWO3膜
ECDを用いた場合の表示極作成工程を説明する
ための説明図である。
以下、各工程について説明する。
(a) まず、ガラス基板1にIn2O3から成る透明導
電膜2を形成し、その基板面上にWO3膜3を
約3000Å程度蒸着法により形成する。
(b) さらにスクリーンレジンレジストもしくはフ
オトエツチングレジスト等のレジスト5を表示
パターン状に作成する。レジスト5は好ましく
は後の剥離工程が簡単に行なえるポジタイプの
レジストが良い。
(c) この工程はWO3膜をパターン化するエツチ
ング工程である。エツチング材料はNH4Cl―
NH4OH混合水溶液(PH10程度)を用いて行な
う。この時のサイドエツチングは1μm程度であ
つた。エツチング終了後基板を流水洗浄する。
(d) 絶縁膜コーテイングの工程である。SiOを蒸
着法により形成する。
(e) この工程はレジストを剥離すると同時に、絶
縁性保護膜をリフトオフエツチングする工程で
ある。
以上、(a)〜(e)の工程において、WO3膜のサイ
ドエツチ(オーバーエツチ)を1μm程度に制御す
ることが可能でかつ、WO3エツチング工程にお
ける金属残渣もなく、表示メモリ性のよい表示極
が得られた。
(実施例 2)
実施例1と同様の表示極作成工程において、エ
ツチング材料を種々変えて、WO3膜のサイドエ
ツチングの程度と、金属残渣による表示メモリ性
の度合を表1に示す。
The present invention relates to a method of manufacturing an electrochromic display. In recent years, electrochromic materials such as WO3 ,
Electrochromic display devices (hereinafter referred to as ECDs) that utilize electrochemical redox reactions of transition metal oxides such as MoO 3 have been developed. It takes
The general structure of an ECD is to form a transparent conductive film 2 of indium oxide or tin oxide on a transparent substrate 1, as shown in FIG. A tungsten oxide (WO 3 ) film 3 is deposited to form a display electrode. Further, as shown in FIG. 1B, in order to protect the transparent conductive film 2, an insulating protective film 4 may be provided on the conductive film other than the display area (WO 3 ). Conventionally, the display part of such an ECD display pole (e.g.
Patterning of WO 3 ) is generally done during vapor deposition using a metal mask, but in this case,
It has the disadvantage that the mechanical mask overlay error is large, and the film thickness around the pattern is not uniform, resulting in display blur. Therefore, when a highly accurate pattern is required, a method is used in which an electrochromic material is deposited on the entire surface and then patterned by etching. Methods for etching transition metal oxides (eg, WO 3 , MoO 3 ) mainly include chemical methods, plasma methods, and reactive sputtering methods. Chemical etching is a method that is easier to mass produce and is cheaper than other methods, but it has traditionally been difficult to use due to the large side etching (shown at 6 in Figure 1b) and the fact that the substrate is contaminated with metal residue from the etching material. It was difficult. The present invention has discovered an etching material that causes less side etching and no metal residue after etching in a chemical etching method for patterning a display area. It provides ECD. Hereinafter, one embodiment of the present invention will be described with reference to the drawings. (Example 1) Figure 2e shows a cross section of essential parts of an example of an EC cell manufactured by the manufacturing method of the present invention. In the figure, 1 is a transparent substrate, 2 is a transparent conductive film such as In 2 O 3 or SnO 2 , 3 is teeth
A transition metal oxide EC layer such as WO 3 or MoO 3 , 4 an insulating protective film such as silicon oxide or MgF 2 , and 5 a resist. Figures 2a to 2e are WO 3 membranes according to an example of the present invention.
FIG. 3 is an explanatory diagram for explaining a display electrode creation process when using ECD. Each step will be explained below. (a) First, a transparent conductive film 2 made of In 2 O 3 is formed on a glass substrate 1, and a WO 3 film 3 of about 3000 Å is formed on the substrate surface by a vapor deposition method. (b) Furthermore, a resist 5 such as a screen resin resist or a photo-etching resist is created in the shape of a display pattern. Preferably, the resist 5 is a positive type resist that can be easily subjected to a subsequent peeling process. (c) This step is an etching step to pattern the WO 3 film. Etching material is NH 4 Cl―
This is done using a mixed aqueous solution of NH 4 OH (about PH10). The side etching at this time was about 1 μm. After etching, the substrate is washed with running water. (d) Insulating film coating process. Form SiO by a vapor deposition method. (e) This step is a step in which the resist is removed and the insulating protective film is lift-off etched at the same time. In the above steps (a) to (e), it is possible to control the side etching (overetch) of the WO 3 film to about 1 μm, there is no metal residue in the WO 3 etching process, and the display has good display memory properties. The pole was obtained. (Example 2) Table 1 shows the degree of side etching of the WO 3 film and the degree of display memory due to metal residue by changing the etching material in the same display electrode manufacturing process as in Example 1.
【表】
表1において明らかなようにアルカリ性有機化
合物水溶液(No.5〜No.10)をエツチング材料に用
いてWO3のエツチングを行なつた場合、従来の
アルカリ金属塩基を用いた場合(No.1〜No.4)に
較べて、サイドエツチングを1μm以下に制御する
ことができ、かつ金属残渣による基板の汚れもな
く表示メモリ性の良い表示極が得られることが判
明した。
又、EC材料として、MoO3を利用した場合の
表示極のパターン化にも同様な効果が認められ
た。
以上説明したように本発明は、表示極のパター
ン化をケミカルエツチング法で精度よく行なえる
ようにしたことにより、表示品位の問題もなく、
量産性に富んだ安価なECDを提供するものであ
る。[Table] As is clear from Table 1, when WO 3 was etched using an alkaline organic compound aqueous solution (No. 5 to No. 10) as an etching material, when a conventional alkali metal base was used (No. 1 to No. 4), it was found that side etching could be controlled to 1 μm or less, and a display electrode with good display memory properties could be obtained without contaminating the substrate with metal residue. A similar effect was also observed in the patterning of the display electrode when MoO 3 was used as the EC material. As explained above, the present invention enables patterning of display electrodes to be performed with high precision using chemical etching, thereby eliminating problems with display quality.
This provides an inexpensive ECD that is highly mass-producible.
第1図a,bは従来のECセルの要部断面図、
第2図a〜eは本発明のECDに係るECセルの作
成工程の説明図である。
1…透明基板、2…透明導電膜、3…EC層、
4…絶縁性保護膜、5…レジスト。
Figures 1a and 1b are cross-sectional views of the main parts of a conventional EC cell.
FIGS. 2a to 2e are explanatory diagrams of the manufacturing process of an EC cell according to the ECD of the present invention. 1...Transparent substrate, 2...Transparent conductive film, 3...EC layer,
4... Insulating protective film, 5... Resist.
Claims (1)
クロミツク層を設け、該エレクトロクロミツク層
をアンモニウムイオンもしくはアミンを含有する
溶液により選択的にエツチングして残されたエレ
クトロクロミツク層を表示極とすることを特徴と
するエレクトロクロミツク表示装置の製造方法。1. An electrochromic layer is provided on a transparent conductive film provided on a transparent substrate, and the electrochromic layer is selectively etched with a solution containing ammonium ions or amines, and the remaining electrochromic layer is used as a display electrode. A method of manufacturing an electrochromic display device, characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56108587A JPS5810722A (en) | 1981-07-10 | 1981-07-10 | Method of manufacturing electrochromic display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56108587A JPS5810722A (en) | 1981-07-10 | 1981-07-10 | Method of manufacturing electrochromic display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5810722A JPS5810722A (en) | 1983-01-21 |
| JPH0143933B2 true JPH0143933B2 (en) | 1989-09-25 |
Family
ID=14488582
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56108587A Granted JPS5810722A (en) | 1981-07-10 | 1981-07-10 | Method of manufacturing electrochromic display device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5810722A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62272208A (en) * | 1986-05-20 | 1987-11-26 | Fujikura Ltd | Fusion splicing device for constant polarization optical fiber |
| US5149350A (en) * | 1986-05-20 | 1992-09-22 | Fujikura Ltd. | Apparatus for fusion-splicing a pair of polarization maintaining optical fibers |
| EP0246636B1 (en) * | 1986-05-20 | 1993-03-03 | Fujikura Ltd. | Apparatus for fusion-splicing a pair of polarization maintaining optical fibers |
-
1981
- 1981-07-10 JP JP56108587A patent/JPS5810722A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5810722A (en) | 1983-01-21 |
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