JPH0145630B2 - - Google Patents
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- Publication number
- JPH0145630B2 JPH0145630B2 JP2563581A JP2563581A JPH0145630B2 JP H0145630 B2 JPH0145630 B2 JP H0145630B2 JP 2563581 A JP2563581 A JP 2563581A JP 2563581 A JP2563581 A JP 2563581A JP H0145630 B2 JPH0145630 B2 JP H0145630B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- grindstone
- electrophotographic photoreceptor
- polishing
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 81
- 108091008695 photoreceptors Proteins 0.000 claims description 52
- 239000000463 material Substances 0.000 claims description 41
- 238000000034 method Methods 0.000 claims description 34
- 238000005498 polishing Methods 0.000 claims description 28
- 230000003746 surface roughness Effects 0.000 claims description 23
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 claims description 10
- 229910052711 selenium Inorganic materials 0.000 claims description 9
- 239000011669 selenium Substances 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000004064 recycling Methods 0.000 claims description 5
- 239000012776 electronic material Substances 0.000 claims 1
- 238000012545 processing Methods 0.000 description 16
- 239000007788 liquid Substances 0.000 description 9
- 238000012360 testing method Methods 0.000 description 8
- 229910003460 diamond Inorganic materials 0.000 description 7
- 239000010432 diamond Substances 0.000 description 7
- 238000007514 turning Methods 0.000 description 7
- 230000002093 peripheral effect Effects 0.000 description 6
- 238000003672 processing method Methods 0.000 description 6
- 230000004888 barrier function Effects 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000011069 regeneration method Methods 0.000 description 3
- 239000008399 tap water Substances 0.000 description 3
- 235000020679 tap water Nutrition 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000012670 alkaline solution Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012634 fragment Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 230000008929 regeneration Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910001370 Se alloy Inorganic materials 0.000 description 1
- 229910001215 Te alloy Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000003350 kerosene Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012958 reprocessing Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- 238000000870 ultraviolet spectroscopy Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03G—ELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
- G03G15/00—Apparatus for electrographic processes using a charge pattern
- G03G15/75—Details relating to xerographic drum, band or plate, e.g. replacing, testing
- G03G15/751—Details relating to xerographic drum, band or plate, e.g. replacing, testing relating to drum
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Photoreceptors In Electrophotography (AREA)
Description
本発明はセレン系電子写真感光体用基体の製造
方法に関するものである。
一般に電子写真感光体は、導電性の基体上に直
接、或いは適当なバリヤー層を介して光導電性層
を設けて構成される。この電子写真感光体用基体
としては種々の形状のものが知られているが、主
として円筒状のものが使用され、その材質として
はアルミニウム、銅、ステンレス銅又は真輸その
他のものが使用されている。
この電子写真感光体用基体は、基体材料である
管体の外周表面を、ダイヤモンドその他のバイト
を用いる旋削法、バフ研摩法、超仕上加工法、液
体ホーニング法等の方法により加工することによ
り製造されるが、その加工法は、電子写真感光体
用基体として有利に用いられるべく特定の表面状
態が得られるものであることが必要であつて、就
中、面粗度が一定の範囲内の大きさで得られなけ
ればならない。この面粗度の大きさは、基体材
料、当該基体上に形成される光導電性層の種類、
或いは当該基体と光導電性層の間にバリヤー層が
形成されるときにはその種類等によつて多少異な
るが、通常約0.3μmS〜約3.0μmSの範囲内であ
ることが望ましい。裏面の面租度が0.3μmS未満
の基体によつて構成された電子写真感光体は、繰
り返し使用すると、その光導電性層が剥離するお
それが極めて大きい。又面粗度が3.0μmSより大
きい基体によつて構成された電子写真感光体は、
電子写真プロセスの帯電工程で与えられた表面電
位の暗減衰が大きかつたり、形成される画像にア
レが生ずるようになる。
又電子写真感光体の光導電性層が疲労等によつ
て劣化した場合には、その光導電性層を除去して
当該基体上に新しい光導電性層を形成し、再び電
子写真感光体を構成するようにすれば製造コスト
を大幅に低くすることができる。しかしこれを行
なうためには古い光導電性層を除去する基体の再
生処理が必要である。この基体の再生方法として
は種々のものが知られている。例えば基体上の古
い光導電性層のみを任意の方法で除去した上で洗
浄する方法がある。この方法は、再生処理により
基体表面が変化を受けず、その表面状態が保持さ
れる点においては大きな長所を有するが、斯くし
て得られた再生基体を用いて構成された電子写真
感光体は、使用に伴つて急激に劣化し、使用寿命
が大幅に短縮されたものとなつてしまう。これ
は、劣化した光導電性層を完全に除去することが
できず、仮に光導電性層を完全に除去できたとし
ても、基体の表面を完全に清浄な状態とすること
ができないからであると考えられる。
以上のことから、古い光導電性層を除去し、更
に表面を研磨(研削)することにより、古い基体
の表面を50ミクロン以下、好ましくは10ミクロン
以下の厚さだけ研磨(研削)し、以つて新しい表
面を有する基体を得る再生方法が好ましいと言え
る。ここで研磨代(研削代)(研磨ないし研削に
より減耗する厚さ)が50ミクロンを越えると、得
られる再生基体を用いて製造される電子写真感光
体は外径が縮小して、複写機における各部の位置
調整が必要となり、場合によつては良好な画像形
成が達成されなくなる。
又基体の再生は、再生した後の基体表面の光反
射率が再生前の基体表面の反射率と一致している
ように実施されることが望ましい。反射率が一致
していれば、研磨法、(研削法)が同じである限
り、同一の研磨(研削)状態が得られていること
になり、従つて性能の一定した電子写真感光体を
提供することができるからである。又電子写真感
光体の周面に転写紙等が捲き付く事故が生じたこ
とを検知するために、或いは常に一定した複写画
像濃度を得るために基体により反射された光の強
度を基準とし、これと捲き付き事故を起こしてい
る転写紙等によつて反射された光の強度、或いは
感光体上で現像された基準濃度の原稿による画像
によつて反射された光の強度を比較して信号を発
する検知装置を電子写真複写機に設置することが
好ましいことであり、この検知装置を有効に利用
する上で、再生基体が再生前のものと同一の光反
射率を有することが望ましいからである。
電子写真感光体用基体としては以上のほか、真
円度の高い円柱状表面を有し、又うねりや傷のな
い表面を有するものが好ましいことは当然であ
る。
以上のように、電子写真感光体用基体の製造方
法としての基体材料の加工方法には種々の要請が
存在するが、従来、これらの全てを満足する加工
方法は知られていない。
例えば、加工方法としてダイヤモンドその他の
バイトによる旋削法を利用した場合には、研削代
が約100ミクロンにもなる。又バフ研磨法によれ
ば平滑な鏡面状の基体を得ることはできるが、周
期的なうねりが表面に形成される。このうねり
は、当該基体を用いて構成される電子写真感光体
の画像形成性能に悪影響を及ぼすものである。
又超仕上加工法によれば、表面粗度を約0.3μm
S〜約3.0μmSの範囲の大きさとすることは容易
であるが、基体の再生のためにこの超仕上加工法
を利用すると、再生基体の表面の処々にスクラツ
チ状の傷が生じ、この傷は、当該基体で構成され
る電子写真感光体を用いた画像形成において画像
欠陥を招くようになる。又この超仕上加工法によ
つて得られる基体の反射率は、同一加工条件でも
大幅に変動することが認められる。このような傷
が生ずるのは、砥石が基体材料表面に面接触して
加工が行なわれるため、剥離した光導電性層の破
片が砥石、基体材料両者間に介入するからであ
る。更に液体ホーニング法によれば、得られる基
体の表面粗度を0.3μmS〜3.0μmSの範囲内の大
きさとすることは困難である。
このように、従来より知られている加工方法を
含む電子写真感光体用基体の製造方法において
は、種々の避けることのできない欠点がある。
本発明の他の目的は、既に電子写真感光体の構
成に供された基体を材料として、全く新しい基体
材料を用いた場合と同等の優れた特性を有する電
子写真感光体用基体を容易に製造することのでき
る方法を提供するにある。
以上の目的は、「特許請求の範囲に記載した方
法」によつて達成される。
以下図面によつて本発明の方法について説明す
る。
第1図に示す具体例においては、円筒状又は円
柱状の基体材料1をその中心軸Xを例えば水平と
してその周りに回転せしめ、この基体材料1の外
周表面に、前記中心軸Xと直交する平面と0゜〜
45゜の種々の角度をもつ回転軸Yの周りに回転す
る砥石2の端面を接触せしめ、更に前記砥石2を
中心軸Xの方向に走行せしめ、これにより前記基
体材料1の表面を研磨して電子写真感光体用基体
を製造する。
以上においては、前記砥石の回転軸Yは必ずし
も前記中心軸Xと交わる必要はなく、第2図に示
すように回転軸Yが前記中心軸Xと外れる状態で
あつてもよい。
図示の装置において、砥石2は、略々その中央
部における例えば水平な支点3において支持体4
により枢支された揺動自在なバー5の一端に設け
られ、このバー5はその他端に例えば固定された
重錘6及び必要に応じて当該バー5の長さ方向に
移動可能な圧接力調整用重錘7が存在し、前記重
錘6の重量の大きさ及び調整用重錘7の位置を調
整することにより、前記砥石2の基体材料1に対
する圧接力を調整することができる。又砥石2の
中心軸Xの方向の走行は、例えば前記支点3を有
する支持体4をレール等の走行路上に配置するこ
とによつて達成することができる。そして前記砥
石2は、例えば重錘6を兼ねるモーター等により
駆動される。
第1図、第2図は本発明方法を実施する装置を
概略的に示しているが、砥石による基体材料の研
磨状況を第3図、第4図にもとづいて説明する。
第3図、第4図は第1図、第2図々示の装置の
紙面に垂直で砥石の回転軸に平行な平面への部分
拡大投影図である。
基体材料1の中心軸Xと直交する平面と砥石2
の回転軸Yとのなす角θは第3図の例では0゜にな
るように設定してある。この場合、研磨力及び研
磨方向が異なる砥石の種々の部分で研磨が行なわ
れるため被研磨面は種々の研磨作用を受け、結果
として一様に研磨されたうねりがない適度な面粗
度の基体表面が得られる。第2図に示すように、
軸Xと軸Yとが外れるように設定することによつ
て、基体材料表面に種々の異なつた研磨力を作用
させれば、得られる効果は特に顕著である。
第4図には、前記θが45゜となるように砥石2
を設定した例を示す。このような研磨方法では、
軸Yを中心にして、その投影図上での両側におい
て砥石にかかる力の不均衡がなく、したがつてこ
のような不均衡によつて生ずる砥石の振動がなく
安定した作動が得られる。
このように、第4図に示すように砥石を配置す
ること即ち、砥石の回転軸を投影図上で傾けて設
定することは、研磨作業中の砥石の安定性を得る
うえで好適であつて前記したθは最大45゜に至る
種々の値を取りうる。
斯かる研磨装置としては、例えば特公昭51−
46315号公報に記載されたものがあり、その代表
的な具体例としては、三興機械株式会社製の「円
筒研削鏡面仕上機」を挙げることができる。
又本発明において使用される砥石としては、研
磨用砥石として一般に使用される砥石を使用する
ことができる。その具体例としては、日本特殊研
砥株式会社製の「PVA砥石」や「FBB砥石」等
を挙げることができる。
以上の通りであるから、主として円筒状又は円
柱状の基体材料の表面を高い寸法精度で研磨する
ことができ、得られる基体の表面の面粗度は、砥
石2の種類、砥石2の基体材料に対する圧接力の
大きさによつて最小0.05μmSまで制御すること
が可能であり、電子写真感光体用基体の面粗度と
して好適な、0.3μmS〜3.0μmSの範囲内の大き
さの面粗度を有する表面を具えた基体を容易に又
確実に製造することができる。又、得られる基体
の光反射率のバラツキはほとんど全く認められ
ず、研磨条件を同一とする限り、常に一定の反射
率の表面を得ることができる。又常に真円の円柱
状表面を有し、うねりのない基体が得られる。
又、本発明は基体材料として既に電子写真感光
体の構成に供せられた基体を使用するものであ
り、元の基体と実質上同一の面粗度、及び反射率
を有する同等の表面状態を得ることができ、うね
り或いはスクラツチ等の不都合は何ら生ずること
がない。これは、砥石と基体材料との接触が線接
触であるため、光導電性層の破片等が両者間に介
入することがないことによると考えられる。
更に本発明においては、研磨代を10ミクロン以
下に抑えることが容易であり、基体の再生処理を
行なつても、得られる基体の、従つてその基体を
用いて構成される電子写真感光体の外径は、ほと
んど変化せず、従つて再生した基体を用いた電子
写真感光体を装着した場合にも電子写真複写機に
於いて、各部の位置調整が不要であり、かつ又基
体の多数回の再生使用によつて、当該電子写真感
光体のコストを大幅に低下することができる。
又本発明方法によつて得られる電子写真感光体
用基体を用いて得られる電子写真感光体は、濃度
ムラやアレ等のない良好な画像を与え得るもので
あり、しかも繰り返し使用した場合にも光導電性
層の基体からの剥離等の故障がなくて耐久性が大
きいものとなる。これらは本発明によつて再生さ
れた基体による電子写真感光体についても、全く
同様である。
尚本発明による基体上に形成される光導電性層
としては非晶質セレンないし非晶質セレン系合金
より成る光導電性層が使用できる。これら光導電
性層と基体の間には必要に応じてバリヤー層を設
けることができ、例えば、金属酸化物、各種無機
化合物、各種有機化合物等より成る一般に知られ
ているバリヤー層を形成することができる。
以下本発明の実施例について説明するが、これ
らにより本発明の実施の態様が限定されるもので
はない。
参考例 1
外周表面をバイトによる旋削法で加工して得ら
れた外径120.007mm、長さ340.00mm、表面粗度3.0μ
mSのアルミニウム管体を基体材料とし、下記の
条件で表面加工を行なつた。
加工装置:円筒研削鏡面仕上機「SM−1A−
1500」(三興機械社製)
砥 石:「FBB−CC 2000」(外径200mm、厚
み50mm、取付用中心穴径50mm、日本
特殊研砥社製)
砥石の回転数:600r.p.m.
砥石の送り速度:0.7m/分
砥石の圧接力:35Kg
基体中心軸に直交する平面と砥石回転軸のなす
角度(以下θと表わす):0゜
基体材料の回転周速度:160m/分
研磨回数:往復1回
研磨液:水道水
得られた加工済管体は、表面粗度が0.3μmSの
均一な面粗度を有し、外径が120.004mmであり、
又波長930nmの光の反射率が37%のものであつ
た。
この加工済管体を弱アルカリ性溶液で洗浄した
後水洗、乾燥し、これを基体としてその表面にセ
レン−テルル合金(テルル10.0重量%含有)を通
常の方法により真空蒸着せしめて厚さ70ミクロン
のセレン系光導電性層を形成し、以つて電子写真
感光体を得た。得られた当該感光体は、通常の電
子写真感光体としての性能を十分に有するもので
あり、これにより形成される画像は良好なもので
あつた。
又当該感光体を電子写真複写機「U−BixV」
(小西六写真工業社製)に装着して耐久試験を行
なつたところ、6万回の使用後においても、光導
電性層の剥離等の故障は全く認められなかつた。
実施例 1
参考例1の耐久試験を完了した感光体の光導電
性層を除去するために、特開昭50−87651号明細
書の実施例7に記載された方法を適用した。しか
しながら、基体の端部の光導電性層は、数回当該
方法を繰り返し適用しても除去されず、残存し
た。そこで、上述と同じ研磨処理を行ない、残存
する光導電性層を完全に除去した。
ここに得られた再生基体は、新しい基体材料か
ら得られた加工済管体と実質上同一であり、表面
粗度は0.3μmS、外径は120.002mm、光反射率は
37%であつた。
この再生基体を使用して参考例1と同じ方法で
セレン系光導電性層を形成して得られた電子写真
感光体は、新しい基体材料から得られた加工済管
体を用いて構成した電子写真感光体と同等の性能
を有し、耐久性能も十分満足できるものであつ
た。
尚管体外径の測定は、「E−DC−M760−3B型
三次元デジタル座標測定機」(東京精密社製)に
より、表面粗度の測定は、「E−ST−S03A型表
面粗さ計」(東京精密社製)により、又反射率の
測定は、「EPS−3T型紫外可視分光光度計」(日
立製作所製)により行なつた。
参考例 2
参考例1における加工条件のうちθを30″とし
て以外参考例1と同じ条件で、同様のアルミニウ
ム管体を基体材料として加工を行なつた。
得られた加工済管体は、表面粗度が0.3μmSの
均一な面粗度を有し、外径が120.003mmであり、
又波長930nmの光の反射率が35%のものであつ
た。
この加工済管体を使用して、参考例1と同じ方
法で電子写真感光体を得た。得られた感光体は、
通常の電子写真感光体としての性能を十分に有す
るものであり、これにより形成される画像は良好
なものであつた。
又当該感光体において参考例1と同じ方法で耐
久試験を行なつたところ、6万回の使用後におい
ても、光導電性層の剥離等の故障は全く認められ
なかつた。
実施例 2
参考例2の耐久試験を完了した感光体の光導電
性層を実施例1と同じ方法で除去した。
ここに得られた再生基体は、新しい基体材料か
ら得られた加工済管体と実質上同一であり、表面
粗度は0.3μmS、外径は120.001mm光反射率は34
%であつた。
この再生基体を使用して前述と同じ方法でセレ
ン系光導電性層を形成して得られた電子写真感光
体は、新しい基体材料から得られた加工済管体を
用いて構成した電子写真感光体と同等の性能を有
し、耐久性能も十分満足できるものであつた。
比較例
参考例1におけると同様のアルミニウム管体を
4本基体材料として用い、これらについて、(1)ダ
イヤモンドバイトによる旋削加工、(2)バフ研磨加
工、(3)超仕上加工、(4)液体ホーニング加工によ
り、夫々下記条件で表面加工を行なつた。
(1) ダイヤモンドバイトによる旋削加工条件
加工装置:超精密旋盤「L−3001型」(豊田工
機社製)
バイ ト:「ミラクルダイヤモンドバイト」(東
京ダイヤモンド工具製作所社製)
基体材料の回転周速度:942m/分
基体材料の送り速度:471m/分
旋削回数:1回
旋削液 :灯油
(2) バフ研磨加工条件
加工装置:「LPT−35C型」(ワシノ機械社製)
バフ研磨機「1VM型」(轟製作所社
製)
バ フ:「トバコパツカード1 H36」(東京
バフ社製)
バフ研磨剤:「トリポリK−2000」(光陽社製)
バフ周速度:2000m/分
基体材料の回転周速度:75m/分
基体材料の送り速度:68m/分
研磨回数:1回
(3) 超仕上加工条件
加工装置:旋盤「LPT−35 C型」(ワシノ機
械社製)超仕上装置「T−SE140
型」(東洋工業社製)
砥 石:「FBB−CC 1000」(日本特殊研砥
社製)
砥石の振動数:1500c/分
砥石の圧接力:0.6Kg/cm2
基体材料の回転周速度:150m/分
砥石の送り速度:500mm/分
研磨回数:1回
研磨 液:水道水
(4) 液体ホーニング加工条件
加工装置:「F−5型」(不二精機製造所社製)
研磨 剤:珪石粉末「#2000」
加工 液:水道水(研磨剤/加工液=4:1
(重量))
空気 圧:3.0Kg/cm2
ノズルと基体材料との距離:80mm
吹付角度:60度
ノズル口径:直径8.3mm
以上に加工により得られた4本の加工済管体に
ついて、表面粗度、外径、波長930nmの光の反射
率の測定を行なつた。又参考例1と同様にして、
各加工済管体を弱アルカリ性溶液で洗浄し、水洗
及び乾燥し、これらを基体として参考例1と同様
にしてセレン系電子写真感光体を4本作り、その
各々について画像形成性能試験及び耐久試験を行
なつた。
更に耐久試験の完了した4本の感光体を、実施
例1と同じ方法により光導電性層を一次的に除去
した後、最初の加工済管体を得たと同じ加工法に
よつて残存する光導電性層を除去して、再生基体
を得た。そしてこれら再生基体の表面粗度、外
径、波長930nmの光の反射率の測定を行なつた。
その後これらを基体として同様にしてセレン系電
子写真感光体を作り、画像形成性能試験及び耐久
試験を行なつた。
以上の各測定及び試験の結果は、参考例1、参
考例2、実施例1及び実施例2におけるものと共
に下表に示す通りである。この表から明らかなよ
うに、ダイヤモンドバイトによる研削法、バフ研
磨法、超仕上加工法、液体ホーニング法には各々
重大な欠点があるが、本発明方法によれば優れた
感光体を与える基体を製造することができる。
The present invention relates to a method for manufacturing a selenium-based electrophotographic photoreceptor substrate. Generally, an electrophotographic photoreceptor is constructed by providing a photoconductive layer directly on a conductive substrate or via a suitable barrier layer. Various shapes are known as the substrate for electrophotographic photoreceptors, but cylindrical ones are mainly used, and the material used is aluminum, copper, stainless steel, copper, or other materials. There is. This substrate for electrophotographic photoreceptors is manufactured by processing the outer circumferential surface of the tube, which is the substrate material, by methods such as turning using a diamond or other cutting tool, buffing, super finishing, and liquid honing. However, the processing method must be able to obtain a specific surface condition so that it can be advantageously used as a substrate for electrophotographic photoreceptors, and in particular, the surface roughness must be within a certain range. Must be obtained in size. The magnitude of this surface roughness depends on the substrate material, the type of photoconductive layer formed on the substrate,
Alternatively, when a barrier layer is formed between the substrate and the photoconductive layer, it is preferably within the range of about 0.3 μmS to about 3.0 μmS, although it varies somewhat depending on the type of barrier layer. When an electrophotographic photosensitive member constructed of a substrate having a surface roughness of less than 0.3 μmS on the back surface is used repeatedly, there is a very high possibility that the photoconductive layer will peel off. Furthermore, an electrophotographic photoreceptor composed of a substrate having a surface roughness of more than 3.0 μmS is
The dark attenuation of the surface potential applied in the charging step of the electrophotographic process becomes large, and the formed image becomes uneven. In addition, if the photoconductive layer of the electrophotographic photoreceptor has deteriorated due to fatigue, etc., the photoconductive layer is removed, a new photoconductive layer is formed on the substrate, and the electrophotographic photoreceptor is reused. If configured, manufacturing costs can be significantly reduced. However, this requires a reprocessing of the substrate to remove the old photoconductive layer. Various methods are known for recycling this substrate. For example, there is a method in which only the old photoconductive layer on the substrate is removed by an arbitrary method and then cleaned. This method has a great advantage in that the surface of the substrate is not changed by the recycling treatment and its surface condition is maintained, but the electrophotographic photoreceptor constructed using the recycled substrate obtained in this way , it deteriorates rapidly with use, resulting in a significantly shortened service life. This is because the deteriorated photoconductive layer cannot be completely removed, and even if the photoconductive layer can be completely removed, the surface of the substrate cannot be left completely clean. it is conceivable that. Therefore, by removing the old photoconductive layer and further polishing (grinding) the surface, the surface of the old substrate can be polished (ground) to a thickness of 50 microns or less, preferably 10 microns or less, and A regeneration method that yields a substrate with a new surface is preferred. If the polishing allowance (thickness reduced by polishing or grinding) exceeds 50 microns, the outer diameter of the electrophotographic photoreceptor manufactured using the obtained recycled substrate will decrease, and Position adjustment of each part is required, and in some cases, good image formation may not be achieved. Further, it is desirable that the substrate be regenerated so that the light reflectance of the surface of the substrate after the regeneration matches the reflectance of the surface of the substrate before the regeneration. If the reflectances match, then as long as the polishing method (grinding method) is the same, the same polishing (grinding) state has been obtained, thus providing an electrophotographic photoreceptor with consistent performance. This is because it can be done. In addition, in order to detect an accident in which transfer paper, etc. gets wrapped around the circumferential surface of an electrophotographic photoreceptor, or to obtain a constant copy image density, the intensity of light reflected by the substrate is used as a reference. A signal is generated by comparing the intensity of the light reflected by the transfer paper, etc. that causes the wrapping accident, or the intensity of the light reflected by the image of the standard density original developed on the photoreceptor. This is because it is preferable to install a detection device that emits light in an electrophotographic copying machine, and in order to effectively utilize this detection device, it is desirable that the recycled substrate has the same light reflectance as the one before recycling. . In addition to the above-mentioned substrates for electrophotographic photoreceptors, it is of course preferable to use substrates that have a cylindrical surface with high roundness and a surface that is free from waviness and scratches. As described above, there are various demands on the processing method of a substrate material as a method of manufacturing a substrate for an electrophotographic photoreceptor, but no processing method that satisfies all of these is known so far. For example, if a turning method using a diamond or other tool is used as a processing method, the grinding allowance will be approximately 100 microns. Furthermore, although a smooth mirror-like substrate can be obtained by the buffing method, periodic undulations are formed on the surface. This waviness has an adverse effect on the image forming performance of an electrophotographic photoreceptor constructed using the substrate. Also, according to the super finishing method, the surface roughness can be reduced to approximately 0.3 μm.
It is easy to obtain a size in the range of S to approximately 3.0 μmS, but when this superfinishing method is used to regenerate the substrate, scratch-like scratches occur here and there on the surface of the regenerated substrate, and these scratches This results in image defects in image formation using an electrophotographic photoreceptor made of the substrate. Furthermore, it is recognized that the reflectance of the substrate obtained by this superfinishing method varies considerably even under the same processing conditions. Such scratches occur because processing is performed with the grinding wheel in surface contact with the surface of the substrate material, and fragments of the peeled off photoconductive layer become interposed between the grinding wheel and the substrate material. Furthermore, according to the liquid honing method, it is difficult to make the surface roughness of the obtained substrate within the range of 0.3 μmS to 3.0 μmS. As described above, methods for manufacturing substrates for electrophotographic photoreceptors, including conventionally known processing methods, have various unavoidable drawbacks. Another object of the present invention is to easily produce a substrate for an electrophotographic photoreceptor that has excellent properties equivalent to those obtained when a completely new substrate material is used, using a substrate that has already been used in the construction of an electrophotographic photoreceptor. This is to provide a method that can be used. The above objects are achieved by the "method described in the claims." The method of the present invention will be explained below with reference to the drawings. In the specific example shown in FIG. 1, a cylindrical or cylindrical base material 1 is rotated around its central axis Plane and 0°~
The end surfaces of the grindstone 2 rotating around the rotation axis Y having various angles of 45 degrees are brought into contact with each other, and the grindstone 2 is further moved in the direction of the central axis X, thereby polishing the surface of the base material 1. A substrate for an electrophotographic photoreceptor is manufactured. In the above description, the rotation axis Y of the grindstone does not necessarily need to intersect with the center axis X, and the rotation axis Y may deviate from the center axis X as shown in FIG. In the illustrated device, the grinding wheel 2 is mounted on a support 4 at an e.g. horizontal fulcrum 3 approximately in its center.
A swingable bar 5 is provided at one end of the swingable bar 5, and the other end of the bar 5 is provided with a weight 6 fixed, for example, and a pressure contact force adjustment movable in the length direction of the bar 5 as necessary. A working weight 7 is present, and by adjusting the weight of the weight 6 and the position of the adjusting weight 7, the pressing force of the grindstone 2 against the base material 1 can be adjusted. Further, the movement of the grindstone 2 in the direction of the central axis X can be achieved, for example, by arranging the support 4 having the fulcrum 3 on a running path such as a rail. The grindstone 2 is driven by, for example, a motor that also serves as a weight 6. Although FIGS. 1 and 2 schematically show an apparatus for carrying out the method of the present invention, the state of polishing a substrate material with a grindstone will be explained based on FIGS. 3 and 4. 3 and 4 are partially enlarged projection views of the apparatus shown in FIGS. 1 and 2 on a plane perpendicular to the plane of paper and parallel to the axis of rotation of the grindstone. A plane orthogonal to the central axis X of the base material 1 and the grindstone 2
The angle θ formed by the rotation axis Y is set to be 0° in the example shown in FIG. In this case, since polishing is performed on various parts of the grindstone with different polishing forces and polishing directions, the surface to be polished is subjected to various polishing actions, resulting in a uniformly polished substrate with no undulations and a moderate surface roughness. A surface is obtained. As shown in Figure 2,
The effect obtained is particularly remarkable if the axes X and Y are set so as to deviate from each other so that various different polishing forces are applied to the surface of the base material. In Fig. 4, the grinding wheel 2 is set so that θ is 45°.
An example of setting is shown below. In this polishing method,
There is no imbalance in the forces applied to the grinding wheel on both sides of the projection of the axis Y, and therefore stable operation is achieved without vibration of the grinding wheel caused by such imbalance. In this way, arranging the grindstone as shown in Fig. 4, that is, setting the rotation axis of the grindstone at an angle on the projection diagram, is suitable for obtaining stability of the grindstone during polishing work. The aforementioned θ can take various values up to 45°. As such a polishing device, for example, the
There is one described in Publication No. 46315, and a typical example thereof is "Cylindrical grinding mirror finishing machine" manufactured by Sanko Kikai Co., Ltd. Further, as the whetstone used in the present invention, a whetstone generally used as a polishing whetstone can be used. Specific examples include "PVA whetstone" and "FBB whetstone" manufactured by Nippon Tokushu Kento Co., Ltd. As described above, the surface of a mainly cylindrical or cylindrical base material can be polished with high dimensional accuracy, and the surface roughness of the obtained base material depends on the type of grindstone 2 and the base material of the grindstone 2. The surface roughness can be controlled down to a minimum of 0.05 μmS depending on the magnitude of the pressure contact force, and the surface roughness is within the range of 0.3 μmS to 3.0 μmS, which is suitable as the surface roughness of the substrate for an electrophotographic photoreceptor. It is possible to easily and reliably produce a substrate having a surface having the following properties. Moreover, almost no variation in the light reflectance of the resulting substrate is observed, and as long as the polishing conditions are kept the same, a surface with a constant reflectance can always be obtained. Moreover, a substrate always having a perfectly circular cylindrical surface and no waviness can be obtained. Furthermore, the present invention uses a substrate that has already been used in the construction of an electrophotographic photoreceptor as a substrate material, and has an equivalent surface condition with substantially the same surface roughness and reflectance as the original substrate. It can be obtained without causing any problems such as waviness or scratches. This is thought to be because the contact between the grinding wheel and the base material is a line contact, so that fragments of the photoconductive layer and the like do not intervene between the two. Furthermore, in the present invention, it is easy to suppress the polishing stock to 10 microns or less, and even if the substrate is recycled, the resulting substrate, and therefore the electrophotographic photoreceptor constructed using the substrate, will be The outer diameter hardly changes, so even when an electrophotographic photoreceptor using a recycled substrate is installed, there is no need to adjust the position of each part in the electrophotographic copying machine, and the substrate can be moved multiple times. By recycling and using the electrophotographic photoreceptor, the cost of the electrophotographic photoreceptor can be significantly reduced. Further, the electrophotographic photoreceptor obtained using the substrate for electrophotographic photoreceptor obtained by the method of the present invention can provide good images without density unevenness or blemishes, and even when used repeatedly. There is no failure such as peeling of the photoconductive layer from the substrate, and the durability is high. The same applies to the electrophotographic photoreceptor using the substrate recycled according to the present invention. As the photoconductive layer formed on the substrate according to the present invention, a photoconductive layer made of amorphous selenium or an amorphous selenium alloy can be used. A barrier layer can be provided between these photoconductive layers and the substrate as necessary, for example, a generally known barrier layer made of metal oxides, various inorganic compounds, various organic compounds, etc. can be formed. Can be done. Examples of the present invention will be described below, but the embodiments of the present invention are not limited to these. Reference example 1 Outer diameter 120.007mm, length 340.00mm, surface roughness 3.0μ obtained by machining the outer peripheral surface using a turning method using a cutting tool.
A mS aluminum tube was used as the base material, and the surface was processed under the following conditions. Processing equipment: Cylindrical grinding mirror finishing machine "SM-1A-"
1500" (manufactured by Sanko Kikai Co., Ltd.) Whetstone: "FBB-CC 2000" (outer diameter 200 mm, thickness 50 mm, center hole diameter for mounting 50 mm, made by Nippon Tokushu Kento Co., Ltd.) Grinding wheel rotation speed: 600 r.pm Feed speed: 0.7m/min Grinding wheel pressure: 35Kg Angle between the plane perpendicular to the center axis of the base and the axis of rotation of the whetstone (hereinafter referred to as θ): 0° Rotational peripheral speed of base material: 160m/min Number of times of polishing: back and forth 1 time Polishing liquid: Tap water The obtained processed pipe has a uniform surface roughness of 0.3 μmS, and an outer diameter of 120.004 mm.
In addition, the reflectance of light at a wavelength of 930 nm was 37%. This processed tubular body was washed with a weak alkaline solution, then washed with water and dried. Using this as a base, a selenium-tellurium alloy (containing 10.0% by weight of tellurium) was vacuum-deposited on the surface by a conventional method to a thickness of 70 microns. A selenium-based photoconductive layer was formed to obtain an electrophotographic photoreceptor. The resulting photoreceptor had sufficient performance as a normal electrophotographic photoreceptor, and the images formed thereby were good. In addition, the photoconductor was used in the electrophotographic copying machine "U-BixV".
(manufactured by Konishiroku Photo Industry Co., Ltd.) and a durability test was conducted, and no failures such as peeling of the photoconductive layer were observed even after 60,000 uses. Example 1 In order to remove the photoconductive layer of the photoreceptor that had completed the durability test of Reference Example 1, the method described in Example 7 of JP-A-50-87651 was applied. However, the photoconductive layer at the edge of the substrate was not removed and remained even after several repeated applications of the method. Therefore, the same polishing treatment as described above was performed to completely remove the remaining photoconductive layer. The recycled substrate obtained here is virtually the same as the processed tube obtained from the new substrate material, with a surface roughness of 0.3 μmS, an outer diameter of 120.002 mm, and a light reflectance.
It was 37%. An electrophotographic photoreceptor obtained by forming a selenium-based photoconductive layer using this recycled substrate in the same manner as in Reference Example 1 is an electrophotographic photoreceptor constructed using a processed tube obtained from a new substrate material. It had performance equivalent to that of a photographic photoreceptor, and its durability was also sufficiently satisfactory. The outer diameter of the tube was measured using the "E-DC-M760-3B three-dimensional digital coordinate measuring machine" (manufactured by Tokyo Seimitsu Co., Ltd.), and the surface roughness was measured using the "E-ST-S03A surface roughness meter". '' (manufactured by Tokyo Seimitsu Co., Ltd.), and the reflectance was measured using an ``EPS-3T ultraviolet-visible spectrophotometer'' (manufactured by Hitachi, Ltd.). Reference Example 2 Processing was carried out using the same aluminum tube as the base material under the same conditions as Reference Example 1 except that θ was changed to 30'' among the processing conditions in Reference Example 1. The obtained processed tube had a surface It has a uniform surface roughness of 0.3μmS and an outer diameter of 120.003mm.
In addition, the reflectance of light with a wavelength of 930 nm was 35%. Using this processed tube, an electrophotographic photoreceptor was obtained in the same manner as in Reference Example 1. The obtained photoreceptor is
It had sufficient performance as a normal electrophotographic photoreceptor, and the images formed thereby were good. Further, when the photoreceptor was subjected to a durability test in the same manner as in Reference Example 1, no failures such as peeling of the photoconductive layer were observed even after 60,000 uses. Example 2 The photoconductive layer of the photoreceptor that had undergone the durability test of Reference Example 2 was removed in the same manner as in Example 1. The recycled substrate obtained here is virtually identical to the processed tube obtained from the new substrate material, with a surface roughness of 0.3 μmS, an outer diameter of 120.001 mm, and a light reflectance of 34.
It was %. An electrophotographic photoreceptor obtained by forming a selenium-based photoconductive layer using this recycled substrate in the same manner as described above is an electrophotographic photoreceptor constructed using a processed tube obtained from a new substrate material. It had the same performance as the body, and its durability was also sufficiently satisfactory. Comparative Example Four aluminum tubes similar to those in Reference Example 1 were used as the base material, and these were subjected to (1) turning with a diamond tool, (2) buffing, (3) superfinishing, and (4) liquid Surface processing was performed by honing under the following conditions. (1) Turning conditions using a diamond cutting tool Machining equipment: Ultra-precision lathe "L-3001" (manufactured by Toyota Machinery Machinery Co., Ltd.) Bit: "Miracle Diamond Tooling Tool" (manufactured by Tokyo Diamond Tool Manufacturing Co., Ltd.) Rotational peripheral speed of base material : 942 m/min Feeding speed of base material: 471 m/min Number of turnings: 1 Turning fluid: Kerosene (2) Buffing processing conditions Processing equipment: "LPT-35C type" (manufactured by Washino Kikai Co., Ltd.)
Buffing machine “1VM type” (manufactured by Todoroki Seisakusho Co., Ltd.) Buffing: “Tobakopatsu Card 1 H36” (manufactured by Tokyo Buff Co., Ltd.) Buffing agent: “Tripoli K-2000” (manufactured by Koyosha Co., Ltd.) Buffing peripheral speed: 2000 m/min Rotational peripheral speed of base material: 75 m/min Feeding speed of base material: 68 m/min Number of polishing times: 1 time (3) Super finishing processing conditions Processing equipment: Lathe "LPT-35 C type" (manufactured by Wasino Kikai Co., Ltd.) Super finishing Equipment “T-SE140
"Mold" (manufactured by Toyo Kogyo Co., Ltd.) Grinding wheel: "FBB-CC 1000" (manufactured by Nippon Tokushu Kento Co., Ltd.) Grinding wheel vibration frequency: 1500c/min Grinding wheel pressure: 0.6 Kg/cm 2 Rotational peripheral speed of base material: 150m/min Grindstone feed speed: 500mm/min Number of polishing times: 1 time Polishing liquid: Tap water (4) Liquid honing processing conditions Processing equipment: "F-5 type" (manufactured by Fuji Seiki Seisakusho Co., Ltd.) Polishing agent: Silica stone Powder "#2000" Processing liquid: Tap water (abrasive/processing liquid = 4:1
(Weight)) Air pressure: 3.0Kg/cm Distance between two nozzles and base material: 80mm Spraying angle: 60 degrees Nozzle diameter: Surface roughness of the four processed pipes obtained by processing to a diameter of 8.3mm or more The degree, outer diameter, and reflectance of light at a wavelength of 930 nm were measured. Also, in the same manner as Reference Example 1,
Each processed tube was washed with a weak alkaline solution, washed with water, and dried. Using these as a base, four selenium-based electrophotographic photoreceptors were made in the same manner as in Reference Example 1, and image forming performance tests and durability tests were conducted on each of them. I did this. Furthermore, after the photoconductive layer was temporarily removed from the four photoreceptors for which the durability test had been completed using the same method as in Example 1, the remaining light was removed using the same processing method used to obtain the first processed tube. The conductive layer was removed to obtain a recycled substrate. Then, the surface roughness, outer diameter, and reflectance of light at a wavelength of 930 nm of these recycled substrates were measured.
Thereafter, selenium-based electrophotographic photoreceptors were prepared in the same manner using these as substrates, and image forming performance tests and durability tests were conducted. The results of each of the above measurements and tests are as shown in the table below, together with those in Reference Example 1, Reference Example 2, Example 1, and Example 2. As is clear from this table, the grinding method using a diamond bite, the buffing method, the super finishing method, and the liquid honing method each have serious drawbacks, but the method of the present invention can produce a substrate that provides an excellent photoreceptor. can be manufactured.
【表】【table】
【表】
尚表中「〇」は良好であることを表わし、面状
態について「A」はうねり、「B」はアレ、「C」
はスクラツチ傷により不良であることを画像につ
いて「D」は濃度ムラ、「E」はアレ、「F」はス
クラツチ傷による欠陥であることを、又耐久性に
ついて「G」は光導電性層剥離により不良である
ことを表わす。
尚本発明方法によれば既述のように適度の面粗
度を持つた電子写真感光体用基体が得られるが、
その表面の研磨模様は、
砥石の回転方向、速度
基体材料の回転方向、速度
オフセツト(砥石の回転軸と基体材料の回転
軸とのずれ)の方向及び大きさ
砥石の回転軸の基体材料の中心軸と直交する
面に対する角度
砥石の移動方向、移動速度、移動回数等の要
因により、基体材料表面を周繞する種々の傾斜
の平行な縞状模様、網目模様等種々のものがで
きる。[Table] In the table, "〇" indicates good condition, and regarding the surface condition, "A" is wavy, "B" is uneven, and "C"
For images, "D" indicates uneven density, "E" indicates defects, "F" indicates defects due to scratches, and for durability, "G" indicates peeling of the photoconductive layer. This indicates that the product is defective. According to the method of the present invention, a substrate for an electrophotographic photoreceptor having an appropriate surface roughness can be obtained as described above.
The polishing pattern on its surface is determined by: The rotational direction and speed of the whetstone The rotational direction and speed of the base material The direction and size of the offset (the deviation between the rotational axis of the whetstone and the rotational axis of the base material) The center of the base material of the whetstone's rotational axis Angle with respect to the plane perpendicular to the axis Depending on factors such as the direction of movement of the grindstone, the speed of movement, and the number of times of movement, various patterns such as parallel striped patterns and mesh patterns with various slopes can be formed around the surface of the base material.
第1図は本発明電子写真感光体用基体の製造方
法において用いられる研磨装置の具体例要部の説
明図、第2図はその変形例の説明図であり、第3
図及び第4図は、第1図、第2図の装置の紙面に
垂直で、砥石の回転軸に平行な、平面への部分拡
大投影図である。
1……基体材料、2……砥石、4……支持体、
5……バー、6……重錘、7……調整用重錘。
FIG. 1 is an explanatory diagram of the main parts of a specific example of a polishing apparatus used in the method for manufacturing an electrophotographic photoreceptor substrate of the present invention, FIG. 2 is an explanatory diagram of a modification thereof, and FIG.
Figures 1 and 4 are partially enlarged projections of the apparatus of Figures 1 and 2 onto a plane perpendicular to the plane of the paper and parallel to the axis of rotation of the grindstone. 1...Base material, 2...Whetstone, 4...Support,
5... Bar, 6... Weight, 7... Adjustment weight.
Claims (1)
料を円柱の中心軸の周りに回転させつつ、円柱状
表面に砥石を圧接させて、前記表面を研磨するセ
レン系電子写真感光体用基体を再生する製造方法
において、 前記砥石を回転砥石となし、この回転軸と前記
基体材料の中心軸に直交する平面のなす角度θが
0゜≦θ≦45゜になるように前記砥石を配置すると
ともに、 前記砥石は揺動自在の支持部材により支持され
ており、 前記砥石の回転面のうち、その回転軸と非平行
な回転面で前記表面を研磨するようにし、 前記砥石を前記基体材料の軸方向に走行せしめ
ることにより、前記表面を0.3μmS〜3.0μmSの
面粗度に研磨して再生することを特徴とするセレ
ン系電子写真感光体用基体の製造方法。[Claims] 1. Selenium-based electrophotography in which a base material for an electrophotographic photoreceptor having a cylindrical surface is rotated around the central axis of the cylinder and a grindstone is brought into pressure contact with the cylindrical surface to polish the surface. In a manufacturing method for recycling a substrate for a photoconductor, the grindstone is a rotating grindstone, and the angle θ between the rotating axis and a plane perpendicular to the central axis of the substrate material is
The grindstone is arranged so that 0°≦θ≦45°, and the grindstone is supported by a swingable support member, and among the rotation surfaces of the grindstone, a rotation surface that is non-parallel to the rotation axis thereof A selenium-based electronic material characterized in that the surface is polished and regenerated to a surface roughness of 0.3 μmS to 3.0 μmS by polishing the surface with a grinding wheel and running the grindstone in the axial direction of the base material. A method for manufacturing a substrate for a photographic photoreceptor.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2563581A JPS57139746A (en) | 1981-02-23 | 1981-02-23 | Manufacture of substrate for electrophotographic receptor |
| GB8112389A GB2077154B (en) | 1980-04-24 | 1981-04-21 | A method of polishing a peripheral surface of a cylindrical drum for electrophotography |
| DE19813116249 DE3116249A1 (en) | 1980-04-24 | 1981-04-23 | METHOD FOR POLISHING A SURFACE SURFACE OF A CYLINDRICAL DRUM FOR ELECTROPHOTOGRAPHY |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2563581A JPS57139746A (en) | 1981-02-23 | 1981-02-23 | Manufacture of substrate for electrophotographic receptor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57139746A JPS57139746A (en) | 1982-08-28 |
| JPH0145630B2 true JPH0145630B2 (en) | 1989-10-04 |
Family
ID=12171310
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2563581A Granted JPS57139746A (en) | 1980-04-24 | 1981-02-23 | Manufacture of substrate for electrophotographic receptor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57139746A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5995538A (en) * | 1982-11-24 | 1984-06-01 | Olympus Optical Co Ltd | Photosensitive body for electrophotography |
| JPH01170949A (en) * | 1987-12-25 | 1989-07-06 | Fuji Electric Co Ltd | Production of electrophotographic sensitive body |
| JP2682105B2 (en) * | 1988-04-25 | 1997-11-26 | 富士電機株式会社 | Reproducing method of electrophotographic photoreceptor |
| KR950013415B1 (en) * | 1990-10-23 | 1995-11-08 | 가부시키가이샤 도시바 | Electrophotographic photosensitive member |
| JP3854171B2 (en) | 2001-03-22 | 2006-12-06 | 株式会社リコー | Photoconductor recycling apparatus and photoconductor recycling method |
-
1981
- 1981-02-23 JP JP2563581A patent/JPS57139746A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57139746A (en) | 1982-08-28 |
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