JPH0147032B2 - - Google Patents

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a pattern structure of a printed board.

As ICs are mounted on printed circuit boards at high density, and with the advent of digitalization, in order to strengthen and stabilize power supply and ground patterns, these patterns are formed with thick line patterns or multi-layered. I'm dealing with it.

On the other hand, like other devices, these printed boards are required to be low in cost, and consideration must be given to providing a pattern structure that allows for easy mounting of bypass capacitors.

[Conventional technology]

An example of a conventional printed board of this type has a pattern structure as shown in Figure 2, where a is a cross-sectional view of the printed board, b is a plan view of the power layer, and c is a plan view of the ground layer. be.

In Fig. 2, the printed board is a four-layer printed board, and the signal layer 1 is on the surface on which the IC is mounted.
A signal layer 2 is formed on the back surface to be soldered, and a power layer 3 and a ground layer 4 are provided on the inner layer.

As shown in FIG. 2b, the power supply layer 3 is composed of a large number of power supply patterns 6 parallel to the IC terminal rows and a large number of power supply patterns 5 perpendicular to the IC terminal rows formed in a lattice shape. .

At the rectangular IC mounting position 9 shown by the chain line, there are a power supply through hole 10 into which a power terminal is inserted and a grounding through hole 11 into which a ground terminal is inserted.
Signal through-holes 12 are arranged in two rows with .

The power supply through hole 10, the grounding through hole 11, and the signal through hole 12 are provided at the center of each grid formed by the power supply pattern 5 and the power supply pattern 6.
A power supply pattern 5 and a power supply pattern 6 form the four sides of the grid by a cross-shaped connecting pattern.
It is connected to the.

The ground layer 4 is formed in the same grid shape as the power supply layer 3, as shown in FIG. is configured.
At the rectangular IC mounting position 9 shown by the chain line, a power supply through-hole 10 into which a power terminal is inserted and a grounding through-hole 11 into which a ground terminal is inserted are diagonally arranged at the same position as the power supply layer 3. As the end of 2
Signal through holes 12 are arranged in parallel in the rows.
Of these through-holes, only the grounding through-hole 11 is connected to the grounding pattern 7 and the grounding pattern 8 forming the four sides of the grid by a cross-shaped connection pattern.

These power supply patterns and earth patterns are both formed from photomasks obtained by automatic drafting machines, and the pattern width is limited to 1 mm.

Conventionally, in this way, the power supply layer 3 and the ground layer 4 were provided on conductor layers separate from the signal layer, and their power supply patterns and ground patterns were formed in a grid shape to stabilize the ground and power supply. ing.

Although not shown, there is also a minibus made of a metal plate mounted on the IC mounting surface of the printed circuit board as a measure to strengthen the conventional grounding and power supply.

[Problem that the invention seeks to solve]

However, the conventional pattern structure described above is expensive because it uses a multilayer printed board, and digital printed boards have a pattern width of 1 mm or less, so there is a risk of failure due to unstable grounding and power supply. There is.

Furthermore, the minibus method has the problem that not only the structure of the minibus is complicated and expensive, but also that the printed board becomes large, at least in the mounting area of the minibus.

[Means for solving problems]

The above problem is that one side of a double-sided printed board on which ICs are installed side by side has a signal line pattern perpendicular to the terminal rows of the ICs, and a pair of wide opposing wire patterns at each mounting interval of the ICs. A ground pattern and a power supply pattern are formed, and a through hole for one bypass capacitor is connected to the power supply pattern in a plane pattern between a pair of the ground pattern and the power supply pattern, parallel to the terminal row of the IC. A through hole for the other bypass capacitor connected to the surface pattern is provided facing the other side, and on the other side, there is a thick width between the signal line pattern and the terminal row of the IO so as to be parallel to the terminal row of the IC. A pair of ground patterns and a power supply pattern facing each other are formed,
The grounding through hole and the one bypass capacitor through hole are connected by a rectangular ground pattern, and the power supply through hole and the other bypass capacitor through hole are connected by a rectangular power pattern. This is solved by the pattern structure according to the invention.

[Effect]

According to the above means of the present invention, the wide power supply pattern and the ground pattern formed on one side and the other side of the printed board are formed in a lattice shape, and the IC is located at the intersection of the power supply pattern. There is a power supply through hole into which the power supply terminal is inserted, a grounding through hole into which the IC's ground terminal is inserted at the intersection of the ground patterns, and a bypass capacitor through hole at each intersection. It is provided.

Therefore, it is possible to directly supply power and ground to the power terminal and ground terminal of each IC from both sides of the printed board, thereby strengthening the power and grounding.

Further, it is possible to mount a bypass capacitor by appropriately selecting a bypass capacitor through hole, and a stable power supply and ground can be supplied.

In addition, since it is a double-sided printed board, the cost is lower than that of a multilayer printed board or a minibus.

〔Example〕

The gist of the present invention will be specifically explained below with reference to illustrated examples. Note that the same reference numerals indicate the same objects throughout the figures.

FIG. 1 shows one embodiment of the present invention, in which a is a plan view of a main part and b is a detailed plan view of an intersection.

On the IC mounting side of the double-sided printed board, there is a signal line pattern 2 shown by solid lines perpendicular to the IC terminal rows.
7 and a thick width (for example, 5 mm) every 9 intervals of IC mounting position.
A pair of ground patterns 21 and power supply patterns 22 facing each other are formed.

In addition, on the other soldered surface of the printed circuit board, there is a signal line pattern 37 shown by dotted lines parallel to the IC terminal rows, and a pair of ground patterns 31 facing each other with a wide width between the IC terminal rows. A power supply pattern 32 is formed.

At the intersection of the power pattern 22 and the power pattern 32, the power pattern 22 is provided with a comb-shaped protrusion 25 having a surface pattern and protruding squarely in the direction of the opposing ground pattern 21. On the other hand, a comb-shaped recess 24 serving as a relief is provided in the ground pattern 21 in correspondence with the comb-shaped protrusion 25 .

A ground pattern 21 is provided at one corner of the comb-shaped recess 24.
A through hole 34 for a bypass capacitor is provided in one corner of the comb-shaped convex portion 25.
4, a bypass capacitor through hole 36 is provided which is surface-connected to the power supply pattern 22.

On the other hand, on the surface to be soldered, there is a rectangular ground pattern 33 that connects the ground through hole 11 and the bypass capacitor through hole 34.
is formed.

On the other hand, a rectangular ground pattern 35 is formed which connects the power supply through hole 10 and the bypass capacitor through hole 36 in a plane.

Since the present invention is configured as described above, power can be supplied to the power supply terminal of each IC from the wide power supply pattern 22 and the power supply pattern 32, respectively, through the power supply through hole 10. Can be done.

On the other hand, the ground terminal of each IC is connected to the grounding pattern 21 and the grounding pattern 31 through the grounding through hole 11, respectively.
Grounded and reinforced with power and grounding.

In addition, it is possible to mount a bypass capacitor in the pair of bypass capacitor through holes 34 by appropriately selecting the bypass capacitor through hole 36, and it is possible to supply stable power and ground.

Since it is a double-sided printed board, it is of course low cost, but furthermore, the ground pattern and power supply pattern are wide, and the patterns connected to these are rectangular surface patterns. Therefore, in forming a pattern on a photomask, it is possible to employ manual means with higher efficiency than an automatic drafting machine, and cost reduction can be further promoted.

〔Effect of the invention〕

As explained above, the present invention has extremely excellent practical effects, such as being able to use a double-sided printed board, being low cost, and strengthening and stabilizing the supply of power and ground.

[Brief explanation of drawings]

FIG. 1 shows one embodiment of the present invention, in which a is a plan view of a main part, b is a detailed plan view of an intersection, and FIG. 2 is a conventional pattern structure. a is a cross-sectional view of the printed board, b
is a plan view of the power supply layer, and c is a plan view of the earth layer. In the figure, 1 and 2 are signal layers, 3 is a power layer, and 4
is the ground layer, 5, 6, 22, 32 are the power supply pattern, 7, 8, 21, 31 are the ground pattern, 9 is the
IC mounting position, 10 is through hole for power supply, 11
is a grounding through hole, 12 is a signal through hole, 27, 37 is a signal line pattern, 33, 35
indicates a rectangular ground pattern, and 34 and 36 indicate through holes for bypass capacitors, respectively.

Claims (1)

[Claims] 1. On one side of the double-sided printed board on which the ICs are installed, there is a signal line pattern perpendicular to the terminal rows of the ICs, and a pair of ground patterns and power supply lines facing each other with wide widths at each mounting interval of the ICs. A through hole for a bypass capacitor is formed parallel to the terminal row of the IC, and a through hole for a bypass capacitor is connected to the ground pattern in a plane pattern between the pair of the ground pattern and the power supply pattern, and a plane pattern is formed in the power supply pattern. The through hole for the other connected bypass capacitor is provided facing the other side, and the other side is provided with the corresponding through hole.
The signal line pattern is parallel to the IC terminal row,
A pair of wide and opposing ground patterns and a power supply pattern are formed between the terminal rows of the IC, and the grounding through hole and the one bypass capacitor through hole are connected by a rectangular ground pattern. A pattern structure of a printed board, characterized in that the through-hole for the bypass capacitor and the other through-hole for the bypass capacitor are connected by a rectangular power supply pattern.