JPH0148648B2 - - Google Patents

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a composite circuit element and a method for manufacturing the same. It's about things.

[Technical Background of the Invention] Conventional composite circuit elements used to form circuits such as this type of resistor network have element films such as resistive films formed in parallel on the front surface of a ceramic substrate, and connected to both ends of each resistive film. The structure is such that a conductive wire is soldered to the electrode coating, and the entire structure is covered with an insulating coating.

[Problems with background technology]

In conventional composite circuit elements, circuit elements such as resistors were formed on the front surface of the board by printing in parallel, making it impossible to form multiple circuit elements in high density, and the moisture resistance was low. Furthermore, when multiple circuit elements are different, for example, when forming resistive coatings with different resistance values, it is not necessary to change the printing plate multiple times and eliminate printing of the coating, which increases the number of manufacturing steps and makes the work complicated. , it has the disadvantage of being expensive.

[Purpose of the invention]

The present invention has been made in view of the above-mentioned drawbacks, and it is possible to form each circuit element part with high density, improve moisture resistance, and form a composite circuit with good workability in which different types of circuit element parts can be obtained at low cost. It provides an element.

[Summary of the invention]

The present invention embeds and fixes a plurality of circuit element pieces each having an electrode part in a synthetic resin molded body, and forms a wiring path connected to the exposed electrode part of the circuit element part of each circuit element piece on the end face of the molded body. It is made by connecting conductor wires to the terminal.

In addition, the present invention involves embedding and molding a plurality of substrates having a plurality of circuit element parts and electrode parts connected to the circuit element parts in a synthetic resin in parallel, cutting the molded synthetic resin, and cutting the molded body. Wiring paths connected to exposed electrode portions of circuit element pieces formed by cutting each substrate are formed on the end faces, and conductive wires are connected thereto.

[Embodiments of the invention]

The configuration of an embodiment of the present invention will be explained with reference to FIGS. 7 and 8.

1 is a synthetic resin molded body in which a plurality of circuit element pieces 2 are integrally embedded and fixed. The circuit element pieces 2 are embedded and fixed in parallel so that the element forming surfaces 3 are parallel to each other, and the side edges of each circuit element piece 2 are exposed at the end surface of the molded body 1. The electrode portions connected to the element forming surface 3 of each circuit element piece 2 are also exposed at the end surface of the molded body 1. Further, the electrode portions of the circuit element pieces 2 exposed on the end faces of the molded body 1 are connected to wiring paths 5 formed on the end faces of the molded body 1, and conductive wires 6 are connected to the wiring paths 5 of each circuit element piece 2, respectively. There is. The molded body 1 to which the conductive wire 6 is connected is coated with an insulating coating 7.

Next, a method for manufacturing this composite circuit element will be explained with reference to FIGS. 1 to 8.

As shown in FIG. 1, circuit element portions 11 such as resistive coatings are formed on the circuit element forming surface 3 of the ceramic circuit element substrate 10 in the form of an elongated plate at intervals in the longitudinal direction by appropriate means such as printing. This circuit element section 1
Both ends of the electrode 1 are connected to electrode portions 12 formed in advance on the circuit element forming surface 3 along both longitudinal edges at intervals by an appropriate means such as vapor deposition. Next, the circuit element portion 11 is trimmed to perform adjustments such as resistance adjustment. Next, the electrode portion 1 of the circuit element portion 11 is continuously applied to both edges of the substrate 10 along the longitudinal direction.
The electrode portion 13 connected to the electrode portion 2 is formed by vapor deposition or the like.

Next, as shown in FIG. 2, a plurality of substrates 10 are arranged in parallel with their circuit element forming surfaces 3 parallel to each other. These substrates 10 may be arranged side by side with a predetermined interval between them using spacers (not shown) or may be placed side by side in direct contact with each other. If the circuit element portions 11 are formed on both sides of the substrate 10, they may be arranged side by side with a predetermined interval between them. Set up The circuit element portions 11 of each of the substrates 10 arranged in parallel are selected from the same or different types depending on the type of composite circuit element and arranged in parallel.

Next, as shown in FIG. 3, the substrates 10 arranged in parallel are embedded and molded with synthetic resin, and each substrate 10 is integrated with the synthetic resin molded body 1.

Next, as shown in FIG.
At the same time, the edges of each circuit element piece 2 formed by cutting the substrate 10 are exposed on the end face of the cut synthetic resin molded body 1 as shown in FIG. 5. , the electrode portion 13 is also exposed at the end surface.

Next, as shown in FIG. 6, a wiring path 5 is formed on the exposed end surface of each circuit element piece 2 of the synthetic resin molded body 1 by an appropriate method such as printing or etching. The sections 13 are connected according to the type of composite circuit element.

Next, as shown in FIG. 7, conductive wires 6 are connected to the wiring path 5 by soldering or the like, and the conductive wires 6 are arranged in parallel and protruding in the same direction.

Next, as shown in FIG. 8, the surface of the molding 1 is coated with an insulating coating 7 made of synthetic resin or the like, thereby completing a composite circuit element 8.

When the aforementioned synthetic resin molded body 1 and the substrate 10 are cut (FIG. 5), the end surface of the molded body 1 with the edge of the substrate 10 exposed is removed by etching or other means to remove the side edges of the substrate 10. It is also possible to ensure the connection between the electrode portion 13 and the wiring path 5 by exposing it as shown in the figure.

Further, as shown in FIG. 10, a plurality of circuit element pieces 2
The circuit element piece group 9 is not limited to one circuit element piece group 9 arranged in parallel, but a plurality of circuit element piece groups 9 may be integrally embedded and fixed in the molded body 1. Moreover, the circuit element portions 11 can be provided with higher density by using both sides of the circuit element piece 2 as the circuit element forming surfaces 3.

Furthermore, the circuit element piece 2 can be applied not only to resistors but also to ceramic capacitors as shown in FIG.
In this configuration, the elongated ceramic capacitor substrate 10
Electrode portions 13 are formed continuously on both longitudinal edges of the circuit element forming surface 3 of A, and as shown in the above embodiment, the substrates 10A are embedded and fixed in parallel in the molded body 1 and cut to form a composite. As a circuit element.

Further, as shown in FIG. 12, the present invention can also be applied to a chip-shaped coil, in which the coil substrate 10B is similarly embedded and fixed in the molded body 1 and cut to form a composite circuit element.

Note that the circuit element pieces 2 to be embedded and fixed in parallel in the molded body 1 are not limited to the same type of resistors, capacitors, or coils, but may be arranged in parallel in combination with resistors, capacitors, or coils that suit the composite circuit as appropriate , capacitor capacity, coil capacity, etc. can be selected as appropriate.

〔Effect of the invention〕

According to the present invention, since a plurality of circuit element pieces are embedded and fixed in a synthetic resin molded body, the circuit elements can be arranged in parallel at high density, and the moisture resistance of each circuit element part is improved.
It is easy to manufacture and can be obtained at low cost.

In addition, by embedding and molding a board on which multiple circuit elements are formed in parallel using synthetic resin, and cutting the synthetic resin to form circuit element pieces by cutting each board, different resistance values and different circuit elements can be created. A composite circuit element with a combination of can be easily obtained.

[Brief explanation of drawings]

Fig. 1 is a front view of a substrate forming a circuit element piece of the present invention, Fig. 2 is a perspective view showing the same substrates arranged side by side, and Fig. 3 is a state in which a plurality of substrates are integrated with a synthetic resin molded body. FIG. 4 is a perspective view showing the same as the above in a cut state, FIG. 5 is a perspective view showing the same as the cut piece, FIG. 8 is a front view of the same completed state, FIG. 9 is a side view of a cut molded body showing another embodiment, and FIG. 10 is a complex circuit showing another embodiment. Perspective view of element, 11th
The figure is a front view of a board with a capacitor as a circuit element, and FIG. 12 is a front view of a board with a coil as a circuit element. 1...Synthetic resin molded body, 2...Circuit element piece, 3
...Circuit element forming surface, 5... Wiring path, 6... Conductor, 11... Circuit element portion, 13... Electrode portion.

Claims (1)

[Scope of Claims] 1. A circuit element piece having a circuit element forming surface and an electrode portion connected to the circuit element portion of the circuit element forming surface and having the circuit element forming surfaces arranged parallel to each other, and the plurality of circuit elements. It consists of a synthetic resin molded body in which the pieces are embedded and fixed together and the electrode parts at the edges of each circuit element piece are exposed, and a wiring path connected to the electrode part is formed on the end surface of this molded body where the electrode part is exposed. A composite circuit element characterized by connecting conductive wires. 2 Form circuit element parts at predetermined intervals on the circuit element forming surface of the substrate, and form electrode parts connected to each of the circuit element parts, and arrange the plurality of substrates so that the circuit element forming surfaces are parallel to each other. Then, the plurality of parallel substrates are integrally embedded in synthetic resin, and the synthetic resin molded body in which the plurality of substrates are embedded and fixed is cut between each circuit element part in a direction perpendicular to each substrate. A wiring path is formed on the end surface of the molded body to connect the exposed electrode portions of the edges of the plurality of circuit element pieces formed by cutting each substrate, and a conductive wire is connected thereto. A method for manufacturing a composite circuit element.