JPH0150566B2 - - Google Patents
Info
- Publication number
- JPH0150566B2 JPH0150566B2 JP60082647A JP8264785A JPH0150566B2 JP H0150566 B2 JPH0150566 B2 JP H0150566B2 JP 60082647 A JP60082647 A JP 60082647A JP 8264785 A JP8264785 A JP 8264785A JP H0150566 B2 JPH0150566 B2 JP H0150566B2
- Authority
- JP
- Japan
- Prior art keywords
- mold clamping
- low
- pressure mold
- force
- crosshead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
- B29C45/7653—Measuring, controlling or regulating mould clamping forces
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は射出成形機或はプレス等のトグル機構
を用いた型締装置の低圧型締制御装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a low-pressure mold clamping control device for a mold clamping device using a toggle mechanism such as an injection molding machine or a press.
まず、低圧型締制御について第２図を参照して
説明する。
First, low pressure mold clamping control will be explained with reference to FIG. 2.
金型の間に異物をかみ込んだ時、大きな型締力
で型を閉じると、金型を破損するおそれがある。
そこで、金型が完全に閉じる少し手前から型締力
を小さくし、かつ一定の値に保つ。この型締力を
小さな値に保つ制御が低圧型締制御であり、低圧
型締制御区間L1が第２図に示されている。低圧
型締制御が始まる位置から、型が完全に閉じる型
全閉位置までの距離L2は、例えば数10mmである。
このように金型が全閉となる少し前から型締力を
小さく維持することにより、金型が異物をかみこ
んだ時は金型を破損する前に可動プラテンが停止
するようにして、可動プラテンが停止したことを
検出することにより、金型を破損することなく、
異物のかみ込みを検出することができる。 If a foreign object is caught between the molds and the mold is closed with a large mold clamping force, the mold may be damaged.
Therefore, the mold clamping force is reduced slightly before the mold is completely closed and kept at a constant value. Control to keep this mold clamping force at a small value is low pressure mold clamping control, and the low pressure mold clamping control section L1 is shown in FIG. The distance L2 from the position where low-pressure mold clamping control starts to the mold fully closed position where the mold is completely closed is, for example, several tens of mm.
In this way, by keeping the mold clamping force low a little before the mold is fully closed, if the mold gets caught in a foreign object, the movable platen will stop before the mold is damaged, and the movable platen will stop moving. By detecting when the platen has stopped, the mold can be prevented from being damaged.
It is possible to detect the presence of foreign objects.
従来、トグル機構を用いた型締装置において
は、低圧型締を行なう時には、前記トグル機構の
クロスヘツドに加わる力が一定となるように、型
締駆動装置を経験的に制御していた。 Conventionally, in a mold clamping device using a toggle mechanism, when performing low-pressure mold clamping, the mold clamping drive device was empirically controlled so that the force applied to the crosshead of the toggle mechanism was constant.
〔発明が解決しようとする問題点〕
しかしながら、トグル倍率はクロスヘツドの位
置によつて変化し、可動プラテンに加わる力（即
ち、型締力）は、
型締力＝クロスヘツドに加えた力×トグル倍率
となつていた。一般に、トグル倍率は可動プラテ
ン側にクロスヘツドが押されて移動するにつれて
型全閉に近い位置（一般に低圧型締制御を行なう
区間）で急激に大となり、型締力が大きくなつて
しまう。このため、クロスヘツドに加える力を一
定に制御する方法では、低圧型締時に型締力を一
定の小さい値に維持することができないという問
題点がある。[Problem to be solved by the invention] However, the toggle magnification changes depending on the position of the crosshead, and the force applied to the movable platen (i.e., mold clamping force) is: mold clamping force = force applied to the crosshead x toggle magnification It was becoming. Generally, as the crosshead is pushed toward the movable platen and moves, the toggle magnification increases rapidly at a position close to the fully closed mold (generally in a section where low-pressure mold clamping control is performed), and the mold clamping force increases. For this reason, the method of controlling the force applied to the crosshead at a constant level has the problem that the clamping force cannot be maintained at a constant small value during low-pressure mold clamping.
また、従来、一定の低圧型締力を得るために補
助シリンダにより直接可動プラテンに力を加える
方法が用いられているが、補助シリンダ分コスト
アツプとなる。 Furthermore, conventionally, in order to obtain a constant low-pressure mold clamping force, a method has been used in which a force is applied directly to the movable platen using an auxiliary cylinder, but the cost increases due to the auxiliary cylinder.
本発明の目的は、低圧型締時に可動プラテンに
加わる力（即ち、型締力）が設定値となるよう
に、クロスヘツドに加える力を制御するようにし
た、安価な低圧型締制御装置を提供することにあ
る。
An object of the present invention is to provide an inexpensive low-pressure mold clamping control device that controls the force applied to the crosshead so that the force applied to the movable platen (i.e., mold clamping force) during low-pressure mold clamping becomes a set value. It's about doing.
本発明の低圧型締制御装置は、型締駆動装置の
駆動力をトグル機構のクロスヘツドに伝え、該ク
ロスヘツドに伝えられた力を、前記トグル機構を
介して、可動プラテンに伝えることにより、一対
の金型の型締を行なう型締装置における、低圧型
締を制御する低圧型締制御装置において、前記ク
ロスヘツド及び前記可動プラテンのうちの少くと
も一方の位置を検出する位置検出装置と、低圧型
締区間を設定するための低圧型締区間設定器と、
所定の低圧型締力を設定するための低圧型締力設
定器と、前記位置検出装置、前記低圧型締区間設
定器、前記低圧型締力設定器、及び前記型締駆動
装置に接続され、前記位置検出装置からの位置デ
ータ信号によつて示される位置に対応したトグル
倍率で、前記低圧型締力設定器に設定された所定
の低圧型締力を除算し、除算結果を前記低圧型締
区間設定器に設定された低圧型締区間、前記型締
駆動装置へ駆動制御信号として与える演算制御装
置とを有することを特徴とする。 The low-pressure mold clamping control device of the present invention transmits the driving force of the mold clamping drive device to the crosshead of the toggle mechanism, and transmits the force transmitted to the crosshead to the movable platen via the toggle mechanism. A low-pressure mold clamping control device for controlling low-pressure mold clamping in a mold clamping device for clamping a mold includes a position detection device for detecting the position of at least one of the crosshead and the movable platen, and a low-pressure mold clamping device. A low-pressure mold clamping interval setting device for setting the interval,
a low-pressure mold clamping force setter for setting a predetermined low-pressure mold clamping force; connected to the position detection device, the low-pressure mold clamping section setter, the low-pressure mold clamping force setter, and the mold clamping drive device; A predetermined low pressure mold clamping force set in the low pressure mold clamping force setter is divided by a toggle magnification corresponding to the position indicated by the position data signal from the position detection device, and the division result is applied to the low pressure mold clamping force. The present invention is characterized by comprising a low-pressure mold clamping section set in a section setting device, and an arithmetic control device that supplies a drive control signal to the mold clamping drive device.
次に本発明の実施例について図面を参照して説
明する。
Next, embodiments of the present invention will be described with reference to the drawings.
第１図を参照すると、本発明の一実施例による
低圧型締制御装置は、射出成形機の型締装置にお
ける低圧型締を制御するものである。射出成形機
の型締装置は、型締駆動装置１の駆動力を、動力
伝達装置２を介して、トグル機構３のクロスヘツ
ド４に伝え、クロスヘツド４に伝えられた力を、
トグル機構３を介して、可動プラテン５に伝える
ことにより、一対の金型６の型締を行なう。７は
固定プラテンである。 Referring to FIG. 1, a low-pressure mold clamping control device according to an embodiment of the present invention controls low-pressure mold clamping in a mold clamping device of an injection molding machine. The mold clamping device of the injection molding machine transmits the driving force of the mold clamping drive device 1 to the crosshead 4 of the toggle mechanism 3 via the power transmission device 2, and transmits the force transmitted to the crosshead 4 to the crosshead 4.
By transmitting the signal to the movable platen 5 via the toggle mechanism 3, the pair of molds 6 are clamped. 7 is a fixed platen.
本実施例による低圧型締制御装置は、クロスヘ
ツド４の位置を検出する位置検出装置８を有して
いる。位置検出装置８はクロスヘツド４の位置を
示すクロスヘツド位置データ信号９を射出成形機
演算制御装置１０に伝える。演算制御装置１０に
は、低圧型締区間を設定するための低圧型締区間
設定器１１と、所定の低圧型締力を設定するため
の低圧型締力設定器１２とが接続されている。演
算制御装置１０は、低圧型締区間設定器１１から
の低圧型締区間設定信号１３と、低圧型締力設定
器１２からの低圧型締力設定信号１４と、位置検
出装置８からのクロスヘツド位置データ信号９と
を基に、駆動制御信号１５を作成し、型締駆動装
置１に与える。 The low-pressure mold clamping control device according to this embodiment has a position detection device 8 for detecting the position of the crosshead 4. The position detection device 8 transmits a crosshead position data signal 9 indicating the position of the crosshead 4 to the injection molding machine arithmetic and control unit 10. The arithmetic and control device 10 is connected to a low-pressure mold clamping section setting device 11 for setting a low-pressure mold clamping section and a low-pressure mold clamping force setting device 12 for setting a predetermined low-pressure mold clamping force. The arithmetic and control device 10 receives a low pressure mold clamping section setting signal 13 from the low pressure mold clamping section setting device 11, a low pressure mold clamping force setting signal 14 from the low pressure mold clamping force setting device 12, and a crosshead position signal from the position detecting device 8. A drive control signal 15 is created based on the data signal 9 and is applied to the mold clamping drive device 1.
演算制御装置１０は、詳しくは以下の動作を行
なう。即ち、演算制御装置１０は、クロスヘツド
位置データ信号９により示される位置におけるト
グル倍率を演算する。又は、演算制御装置１０
は、低圧型締制御を行なう区間におけるクロスヘ
ツド位置とトグル倍率との対応表が格納されたメ
モリを有し、そのメモリの対応表を参照すること
により、クロスヘツド位置データ信号９に対応し
たトグル倍率を得る。そして、演算制御装置１０
は、
低圧型締力設定器１２に設定された型締力
×１／トグル倍率＝クロスヘツドに加える力
…(1)
の演算を行ない、演算結果を低圧型締区間設定器
１１に設定された区間の間、型締駆動装置１へ駆
動制御信号１５として伝える。 The arithmetic and control device 10 performs the following operations in detail. That is, the arithmetic and control unit 10 calculates the toggle magnification at the position indicated by the crosshead position data signal 9. Or the arithmetic and control device 10
has a memory that stores a correspondence table between the crosshead position and toggle magnification in the section where low-pressure mold clamping control is performed, and by referring to the correspondence table in the memory, the toggle magnification corresponding to the crosshead position data signal 9 can be determined. obtain. Then, the arithmetic control device 10
The mold clamping force set in the low pressure mold clamping force setter 12 x 1/toggle magnification = force applied to the crosshead...(1) is calculated, and the calculation result is applied to the range set in the low pressure mold clamping range setter 11. During this time, it is transmitted to the mold clamping drive device 1 as a drive control signal 15.
型締駆動装置１は駆動制御信号１５により指令
された力をクロスヘツド４に伝える。クロスヘツ
ド４からトグル機構３を介して可動プラテン５に
力が伝わるとき、可動プラテン５に伝わる力は、
クロスヘツドに加えた力にトグル倍率を乗じた値
になるので、可動プラテン５に伝わる力Ｆは、
Ｆ＝クロスヘツドに加える力×トグル倍率 …(2)
である。(2)式に(1)式を代入すると、
Ｆ＝低圧型締力設定器１２に設定された型締力
×１／トグル倍率×トグル倍率
＝低圧型締力設定器１２に設定された型締力
…(3)
となり、低圧型締力設定器１２に設定された所定
の低圧型締力が可動プラテン５に、低圧型締区間
設定器１２に設定された低圧型締区間の間、伝え
られる。 The clamping drive 1 transmits a force commanded by a drive control signal 15 to the crosshead 4. When a force is transmitted from the crosshead 4 to the movable platen 5 via the toggle mechanism 3, the force transmitted to the movable platen 5 is:
Since the value is the force applied to the crosshead multiplied by the toggle magnification, the force F transmitted to the movable platen 5 is F=force applied to the crosshead x toggle magnification (2). Substituting equation (1) into equation (2), F = mold clamping force set in low pressure mold clamping force setting device 12 × 1/toggle magnification × toggle magnification = mold set in low pressure mold clamping force setting device 12 Clamping force
...(3), and the predetermined low-pressure mold clamping force set in the low-pressure mold clamping force setting device 12 is transmitted to the movable platen 5 during the low-pressure mold clamping section set in the low-pressure mold clamping period setting device 12.
以上に本発明の実施例を説明したが、本発明は
該実施例に設計変更を施したものをも含むことは
もちろんである。例えば、位置検出装置８で、ク
ロスヘツド４の位置を検出する代りに可動プラテ
ン５の位置を検出するようにしてもよい。可動プ
ラテン５の位置を検出することによつても、クロ
スヘツド４の位置を検出する場合と同様に、その
時点のトグル倍率を得ることができるからであ
る。 Although the embodiments of the present invention have been described above, it goes without saying that the present invention also includes modifications to the embodiments. For example, the position detection device 8 may detect the position of the movable platen 5 instead of detecting the position of the crosshead 4. This is because by detecting the position of the movable platen 5, the toggle magnification at that point in time can be obtained, as in the case of detecting the position of the crosshead 4.
以上説明したように、本発明によれば、低圧型
締区間の間に、可動プラテンに発生する型締力が
設定値に維持されるように、クロスヘツドに加え
る力を制御するようにした低圧型締制御装置が得
られると共に、従来のように一定の低圧型締力を
得るための補助シリンダを設ける必要はなく精度
の高い低圧型締制御装置を安価に実現できる。
As explained above, according to the present invention, the force applied to the crosshead is controlled so that the mold clamping force generated on the movable platen is maintained at a set value during the low pressure mold clamping section. In addition to obtaining a clamping control device, there is no need to provide an auxiliary cylinder for obtaining a constant low-pressure mold clamping force as in the conventional method, and a highly accurate low-pressure mold clamping control device can be realized at low cost.
第１図は本発明の一実施例による低圧型締制御
装置のブロツク図、第２図は低圧型締制御を説明
するための図である。
１は型締駆動装置、３はトグル機構、４はクロ
スヘツド、５は可動プラテン、６は金型、８は位
置検出装置、１０は射出成形機演算制御装置、１
１は低圧型締区間設定器、１２は低圧型締力設定
器。
FIG. 1 is a block diagram of a low-pressure mold clamping control device according to an embodiment of the present invention, and FIG. 2 is a diagram for explaining low-pressure mold clamping control. 1 is a mold clamping drive device, 3 is a toggle mechanism, 4 is a crosshead, 5 is a movable platen, 6 is a mold, 8 is a position detection device, 10 is an injection molding machine arithmetic control device, 1
1 is a low-pressure mold clamping interval setting device, and 12 is a low-pressure mold clamping force setting device.
Claims (1)
ヘツドに伝え、該クロスヘツドに伝えられた力
を、前記トグル機構を介して、可動プラテンに伝
えることにより、一対の金型の型締を行なう型締
装置における、低圧型締を制御する低圧型締制御
装置において、前記クロスヘツド及び前記可動プ
ラテンのうちの少くとも一方の位置を検出する位
置検出装置と、低圧型締区間を設定するための低
圧型締区間設定器と、所定の低圧型締力を設定す
るための低圧型締力設定器と、前記位置検出装
置、前記低圧型締区間設定器、前記低圧型締力設
定器、及び前記型締駆動装置に接続され、前記位
置検出装置からの位置データ信号によつて示され
る位置に対応したトグル倍率で、前記低圧型締力
設定器に設定された所定の低圧型締力を除算し、
除算結果を前記低圧型締区間設定器に設定された
低圧型締区間の間、前記型締駆動装置へ駆動制御
信号として与える演算制御装置とを有することを
特徴とする低圧型締制御装置。1 A mold clamping device that clamps a pair of molds by transmitting the driving force of a mold clamping drive device to a crosshead of a toggle mechanism and transmitting the force transmitted to the crosshead to the movable platen via the toggle mechanism. A low-pressure mold clamping control device for controlling low-pressure mold clamping in the apparatus includes a position detection device for detecting the position of at least one of the crosshead and the movable platen, and a low-pressure mold clamping device for setting a low-pressure mold clamping section. a section setting device, a low pressure mold clamping force setting device for setting a predetermined low pressure mold clamping force, the position detection device, the low pressure mold clamping section setting device, the low pressure mold clamping force setting device, and the mold clamping drive. dividing the predetermined low pressure mold clamping force set in the low pressure mold clamping force setting device by a toggle magnification connected to the device and corresponding to the position indicated by the position data signal from the position detection device;
A low-pressure mold clamping control device comprising: an arithmetic control device that supplies the division result as a drive control signal to the mold clamping drive device during the low-pressure mold clamping period set in the low-pressure mold clamping period setting device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8264785A JPS61241118A (en) | 1985-04-19 | 1985-04-19 | Low pressure mold clamping controlling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8264785A JPS61241118A (en) | 1985-04-19 | 1985-04-19 | Low pressure mold clamping controlling device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61241118A JPS61241118A (en) | 1986-10-27 |
| JPH0150566B2 true JPH0150566B2 (en) | 1989-10-30 |
Family
ID=13780220
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8264785A Granted JPS61241118A (en) | 1985-04-19 | 1985-04-19 | Low pressure mold clamping controlling device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61241118A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63116820A (en) * | 1986-11-06 | 1988-05-21 | Japan Steel Works Ltd:The | Method and apparatus for controlling mold clamping of injection molding machine |
| US5176923A (en) * | 1989-07-24 | 1993-01-05 | Ito Kogyo Kabushiki Kaisha | Mold-pressing apparatus incorporating electric servo motor and linking mechanism |
| JP2008229897A (en) * | 2007-03-16 | 2008-10-02 | Konica Minolta Opto Inc | Injection molding method and injection molding machine |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2629182C2 (en) * | 1976-06-29 | 1978-08-10 | Bergwerksverband Gmbh, 4300 Essen | Method for charging a gasification reactor |
| JPS5857304A (en) * | 1981-09-30 | 1983-04-05 | Shinto Paint Co Ltd | Industrial germicide composition |
| JPS58107259A (en) * | 1981-12-18 | 1983-06-25 | Toyo Kikai Kinzoku Kk | Low-pressure die clamping method in molding machine having toggle type die clamping mechanism |
-
1985
- 1985-04-19 JP JP8264785A patent/JPS61241118A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61241118A (en) | 1986-10-27 |
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