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JPH0152890B2 - - Google Patents
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JPH0152890B2 - - Google Patents

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Publication number
JPH0152890B2
JPH0152890B2 JP28199885A JP28199885A JPH0152890B2 JP H0152890 B2 JPH0152890 B2 JP H0152890B2 JP 28199885 A JP28199885 A JP 28199885A JP 28199885 A JP28199885 A JP 28199885A JP H0152890 B2 JPH0152890 B2 JP H0152890B2
Authority
JP
Japan
Prior art keywords
molecular beam
shutter
beam source
epitaxial growth
ejection port
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP28199885A
Other languages
Japanese (ja)
Other versions
JPS62141716A (en
Inventor
Akihiro Shibatomi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Institute of Advanced Industrial Science and Technology AIST
Original Assignee
Agency of Industrial Science and Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agency of Industrial Science and Technology filed Critical Agency of Industrial Science and Technology
Priority to JP28199885A priority Critical patent/JPS62141716A/en
Publication of JPS62141716A publication Critical patent/JPS62141716A/en
Publication of JPH0152890B2 publication Critical patent/JPH0152890B2/ja
Granted legal-status Critical Current

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  • Crystals, And After-Treatments Of Crystals (AREA)
  • Junction Field-Effect Transistors (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)

Description

【発明の詳細な説明】 〔概要〕 分子線源から放射された熱線が再び分子線源に
反射して、跳ね返つてこないような形状のシヤツ
ターを分子線源セルの噴出口前部に設け、分子線
源のビーム強度がシヤツターの開閉で変動しない
ようにした分子線エピタキシヤル成長装置である 〔産業上の利用分野〕 本発明は分子線エピタキシヤル成長装置に係
り、特に分子線源を蓄えたセル(容器)の噴出口
前部に設けたシヤツターに関する。
[Detailed Description of the Invention] [Summary] A shutter shaped so that the heat rays emitted from the molecular beam source is reflected back to the molecular beam source and does not bounce back is provided in front of the ejection port of the molecular beam source cell, This invention relates to a molecular beam epitaxial growth apparatus in which the beam intensity of a molecular beam source does not fluctuate due to opening and closing of the shutter. It relates to a shutter provided in front of the spout of a cell (container).

周知のように、半導体装置を製造する際、結晶
基板に沿つて半導体膜をエピタキシヤル成長する
エピタキシー法が使用されており、これは半導体
製造の最もベーシツクな技術である。
As is well known, when manufacturing semiconductor devices, an epitaxy method is used in which a semiconductor film is epitaxially grown along a crystal substrate, and this is the most basic technology for semiconductor manufacturing.

このようなエピタキシー法において、最近、分
子線エピタキシー(MBE)法が知られており、
この分子線エピタキー法は超高真空下
(10-11Torr以下)で蒸着する方法で、清浄な結
晶基板面が維持できるために、低温度でのエピタ
キシヤル成長が可能で、且つ、膜厚や不純物分布
を数10Å程度の単原子レベルで精密な制御ができ
るという特徴のあるものである。
Among such epitaxy methods, molecular beam epitaxy (MBE) has recently become known.
This molecular beam epitaxy method is a method of vapor deposition under ultra-high vacuum (below 10 -11 Torr), and since a clean crystal substrate surface can be maintained, epitaxial growth can be performed at low temperatures, and film thickness and It is characterized by the ability to precisely control impurity distribution at the single atomic level of several tens of angstroms.

更に、MBE法の大きな特徴は、各種元素ある
いは化合物元素のヘテロ接合やグレーデツドヘテ
ロ接合も容易に得られるという点で、GaAsなど
の化合物半導体のエピタキシヤル成長に広く利用
されつつある。
Furthermore, a major feature of the MBE method is that heterojunctions and graded heterojunctions of various elements or compound elements can be easily obtained, and it is becoming widely used for the epitaxial growth of compound semiconductors such as GaAs.

このように利点の多いMBE法ではあるが、蒸
発する分子線源は常時、一定条件の下に制御され
ていなければ、高精度なエピタキシヤル成長層の
形成は難しくなる。
Although the MBE method has many advantages, it is difficult to form epitaxial growth layers with high precision unless the evaporating molecular beam source is constantly controlled under certain conditions.

〔従来の技術〕[Conventional technology]

第2図は分子線エピタキシヤル成長装置の要部
概要を示しており、1は超高真空処理容器、2は
被成長基板、3は分子線源セル、4は冷却隔壁
(液体窒素シユラウド)、5はシヤツター、6はク
ライオポンプ、7は真空排気口である。
Fig. 2 shows an outline of the main parts of the molecular beam epitaxial growth apparatus. 1 is an ultra-high vacuum processing chamber, 2 is a growth substrate, 3 is a molecular beam source cell, 4 is a cooling partition (liquid nitrogen shroud), 5 is a shutter, 6 is a cryopump, and 7 is a vacuum exhaust port.

このような成長装置を用いて、被成長基板2に
分子線エピタキシヤル成長を行なう場合、所望の
分子線源を蓄えたセル3の上のシヤツター5を開
けて、加熱ヒータで溶融させた分子線源を蒸発
(噴出)させ、被成長基板上にエピタキシヤル成
長させる。図において、一つの被成長基板2に対
して多数のセルが設けられているが、それは例え
ば、GaAs基板に対して種々の組成接合を次々に
積み上げるためで、それはシヤツターの開閉によ
つて切り換えられる。
When performing molecular beam epitaxial growth on the growth target substrate 2 using such a growth apparatus, the shutter 5 above the cell 3 storing the desired molecular beam source is opened, and the molecular beam melted by the heater is released. The source is evaporated (spouted) and epitaxially grown on the substrate to be grown. In the figure, a large number of cells are provided for one growth substrate 2, but this is because, for example, junctions of various compositions are stacked one after another on a GaAs substrate, and these cells are switched by opening and closing the shutter. .

このような分子線エピタキシヤル成長装置のう
ち、分子線源セル3とシヤツター5の部分の概要
断面図を第3図に示しており、セル3は31は円
錐形るつぼ31、ヒータ32、溶融した分子線源
(分子線材料)33、温度センサ34から構成さ
れ、図中のその他の部材は第2図と同じく、4は
液体窒素シユラウド(冷却隔壁)、5はシヤツタ
ー、51はシヤツター操作棒である。同図はシヤ
ツターで噴出口を遮蔽した状態を示しているが、
このシヤツター5を開けると、分子線が液面より
蒸発して、真正面の被成長基板面に飛着し、エピ
タキシヤル成長が行なわれる。
FIG. 3 shows a schematic cross-sectional view of the molecular beam source cell 3 and shutter 5 in such a molecular beam epitaxial growth apparatus. It consists of a molecular beam source (molecular beam material) 33 and a temperature sensor 34, and the other members in the figure are the same as in Figure 2, 4 is a liquid nitrogen shroud (cooling partition), 5 is a shutter, and 51 is a shutter operating rod. be. The figure shows the state where the ejection port is shielded by the shutter,
When the shutter 5 is opened, the molecular beam evaporates from the liquid surface and lands on the surface of the substrate to be grown, directly in front of it, and epitaxial growth is performed.

この分子線源を蓄えたセルの大きさは、例え
ば、円錐形るつぼ31が口径20mm、長さ100mm程
度の容器で、焼結窒化硼素(PBN)で作成され
ており、ヒータ32はタンタル線などが用いられ
ている。また、シヤツター5はタンタル(Ta)、
タングステン(W)、モリブデン(Mo)などの
耐熱金属で作成され、図には凹形状のシヤツター
を示しているが、平板形のシヤツターも用いられ
ている。
The size of the cell storing this molecular beam source is, for example, a conical crucible 31 with a diameter of 20 mm and a length of about 100 mm, made of sintered boron nitride (PBN), and a heater 32 made of tantalum wire or the like. is used. In addition, shutter 5 is made of tantalum (Ta),
It is made of heat-resistant metals such as tungsten (W) and molybdenum (Mo), and although a concave shutter is shown in the figure, flat plate shutters are also used.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

ところで、第3図に図示したセル3とシヤツタ
ー5の図は、シヤツターで噴出口を遮蔽した状態
にあるが、この状態で分子線源33は、例えば、
約1200℃に加熱されて溶融し、一定温度に制御さ
れている。このシヤツターで噴出口を遮蔽した状
態では、分子線源より出た熱線(熱輻射線)がシ
ヤツター5により反射されてるつぼ31内の分子
線源33へ跳ね返されており、かくして、るつぼ
の温度が安定に制御された状態にある。図中の矢
印点線は熱輻射線を示している。
By the way, in the diagram of the cell 3 and the shutter 5 shown in FIG. 3, the ejection port is shielded by the shutter, but in this state, the molecular beam source 33, for example,
It is heated to about 1,200℃ to melt it and is controlled at a constant temperature. When the jet nozzle is shielded by this shutter, the heat rays (thermal radiation) emitted from the molecular beam source are reflected by the shutter 5 and are reflected back to the molecular beam source 33 in the crucible 31, thus reducing the temperature of the crucible. It is in a stable and controlled state. Dotted arrow lines in the figure indicate thermal radiation lines.

このような安定状態でシヤツター5を開ける
と、今までシヤツターでるつぼ31内の分子線源
33へ反射されていた熱輻射線が急に外部に放出
され、その結果、分子線源33の表面温度が急激
に低下して、分子線のビーム強度が弱くなる。即
ち、シヤツターの遮蔽時は、熱輻射線によつて熱
が戻されて、低いエネルギーで制御されていた
が、シヤツターが開くと、輻射熱エネルギーが逸
散するため、温度センサを含む制御系が追随でき
ずに、分子線源33の表面温度が急に低下するこ
とになる。
When the shutter 5 is opened in such a stable state, the thermal radiation that was previously reflected by the shutter to the molecular beam source 33 in the crucible 31 is suddenly emitted to the outside, and as a result, the surface temperature of the molecular beam source 33 increases. decreases rapidly, and the beam intensity of the molecular beam becomes weaker. In other words, when the shutter is shielded, heat is returned by thermal radiation and controlled with low energy, but when the shutter opens, the radiant heat energy dissipates, so the control system including the temperature sensor has to follow suit. As a result, the surface temperature of the molecular beam source 33 suddenly decreases.

そうして、ある時定数(るつぼの熱容量やヒー
タの容量などに依存した時定数)によつて徐々に
設定温度に回復してくる。しかし、この現象は極
て重要な問題で、その温度変化が成長膜の組成比
や膜厚の変動をひき起こす結果になる。
Then, the temperature gradually returns to the set temperature with a certain time constant (a time constant that depends on the heat capacity of the crucible, the capacity of the heater, etc.). However, this phenomenon is an extremely important problem, as temperature changes cause variations in the composition ratio and film thickness of the grown film.

更に、これを、HEMT用の単一ヘテロ接合結
晶構造の成長法を具体例として説明すると、第4
図はGaAs結晶の断面図で、半絶縁性GaAs基板
21の上にGaAs層22、AlGaAs層23、GaAs
層24を順次に成長させた構造である。この構造
で、GaAs層22とAlGaAs層23とのヘテロ接
合界面に両層の電子親和力の差からGaAs層22
に電子層(点線で示す)が生じて、これが高速動
作に寄与する。この電子層は結晶層の垂直方向に
は動けず、平行方向に自由に動くことができるた
め二次元電子ガス層と呼ばれているが、電子のチ
ヤンネル幅は精々80〜120Å程度で、ヘテロ接合
界面はこの程度に狭く制御されなければならな
い。
Furthermore, to explain this using the growth method of a single heterojunction crystal structure for HEMT as a specific example, the fourth
The figure is a cross-sectional view of a GaAs crystal. On a semi-insulating GaAs substrate 21, a GaAs layer 22, an AlGaAs layer 23, a GaAs
This is a structure in which layers 24 are grown sequentially. In this structure, the GaAs layer 22 is placed at the heterojunction interface between the GaAs layer 22 and the AlGaAs layer 23 due to the difference in electron affinity between the two layers.
An electronic layer (indicated by a dotted line) is formed in the wafer, which contributes to high-speed operation. This electron layer is called a two-dimensional electron gas layer because it cannot move in the vertical direction of the crystal layer but can move freely in the parallel direction, but the electron channel width is at most about 80 to 120 Å, and the heterojunction The interface must be controlled to this extent.

さて、従来のシヤツター5を用いて、この結晶
成長をおこなつた場合、GaAs層22から
AlGaAs層23へ切り換える時、アルミニウム
(Al)の分子線源セルのシヤツターを開けて、ア
ルミニウムを蒸発させる。一方、ガリウム(Ga)
および砒素(As)の分子線源はGaAs層22の成
長に引続いて、シヤツターは開いたままにしてお
く、このAl分子線源セルのシヤツターを開けた
時点で、Al分子線源の温度は1390℃から1370℃
に20℃程度の低下を来たし、その結果、Al分子
線源のビーム強度が急激に下がる。
Now, when this crystal growth is performed using the conventional shutter 5, from the GaAs layer 22
When switching to the AlGaAs layer 23, the shutter of the aluminum (Al) molecular beam source cell is opened to evaporate the aluminum. On the other hand, gallium (Ga)
The shutter of the arsenic (As) molecular beam source is kept open following the growth of the GaAs layer 22. At the time the shutter of this Al molecular beam source cell is opened, the temperature of the Al molecular beam source is 1390℃ to 1370℃
As a result, the beam intensity of the Al molecular beam source drops sharply.

例えば、AlxGa xAs結晶の組成比x値を0.3に
設定していた状態が、x=0.26まで低下する。そ
して、約5分程度経過した後、定常状態に戻る
が、その間に成長膜厚は1000Å程度成長し、その
成長層はx値が0.26から0.3まで変化している。
一方、上記したGaAs結晶のAlGaAs層23の膜
厚は精々300〜500Å程度であるから、組成比xが
定常状態に戻るまでにAlGaAs層23は成長が終
わり、従つて、AlGaAs層23は所定の混晶比を
得ることができない。
For example, the state in which the composition ratio x value of the AlxGaxAs crystal was set to 0.3 is reduced to x=0.26. Then, after about 5 minutes have passed, the steady state is returned, but during that time the thickness of the grown layer has grown to about 1000 Å, and the x value of the grown layer has changed from 0.26 to 0.3.
On the other hand, since the thickness of the AlGaAs layer 23 of the GaAs crystal described above is approximately 300 to 500 Å at most, the growth of the AlGaAs layer 23 will be completed before the composition ratio x returns to a steady state, and therefore the AlGaAs layer 23 will have a predetermined thickness. Unable to obtain mixed crystal ratio.

このような組成比の変動は動作特性に大きな悪
影響を与えるもので、本発明はこの変動をなくす
る分子線エピタキシヤル成長装置を提案するもの
である。
Such fluctuations in the composition ratio have a large adverse effect on the operating characteristics, and the present invention proposes a molecular beam epitaxial growth apparatus that eliminates these fluctuations.

〔問題点を解決するための手段〕[Means for solving problems]

その目的は、分子線源から放射された熱線を再
び該分子線源に反射しないような熱線放射曲面を
もち、且つ、熱線放出口を有する形状からなるシ
ヤツター、例えば、曲つたホーン状を有し、且
つ、先端に開口があるシヤツターを設けて分子線
エピタキシヤル成長装置によつて解決される。
The purpose of this is to provide a shutter with a heat radiation curved surface that does not reflect the heat rays emitted from the molecular beam source back to the molecular beam source, and a heat ray emission opening, such as a curved horn shape. This problem can be solved by using a molecular beam epitaxial growth apparatus equipped with a shutter having an opening at its tip.

〔作用〕[Effect]

即ち、本発明は分子線源から放射された熱線が
再び分子線源に戻らないようなシヤツターを分子
線源セルの噴出口前部に設けるもので、そうする
と、シヤツターの開閉による分子線源の温度変動
がなくなり、分子線源のビーム強度を一定化し易
くなる。
That is, in the present invention, a shutter is provided in front of the ejection port of the molecular beam source cell to prevent the heat rays emitted from the molecular beam source from returning to the molecular beam source, so that the temperature of the molecular beam source is reduced by opening and closing the shutter. Fluctuations are eliminated, making it easier to keep the beam intensity of the molecular beam source constant.

〔実施例〕〔Example〕

以下、図面を参照して実施例によつて詳細に説
明する。
Hereinafter, embodiments will be described in detail with reference to the drawings.

第1図は本発明にかかる分子線エピタキシヤル
成長装置の分子線源セルとシヤツターの部分断面
図を示しており、15が本発明にかかるシヤツタ
ーの形状例である。その他の部材は第3図と同一
部材に同一記号が付けてある。図のように、本例
のシヤツターは下方に曲がつたホーン(Horn:
角)形状で、先端に開口部を有する。
FIG. 1 shows a partial sectional view of a molecular beam source cell and a shutter of a molecular beam epitaxial growth apparatus according to the present invention, and numeral 15 is an example of the shape of the shutter according to the present invention. Other members are the same as those in FIG. 3 and are given the same symbols. As shown in the diagram, the shutter in this example has a downwardly curved horn (Horn:
It is angular) in shape and has an opening at the tip.

このような形状にすれば、熱輻射線(点線で示
す)が分子線源33に反射されて跳ね返ることな
く、シヤツター内で反射しながらホーン先端に至
り、先端の開口から放出される。且つ、このよう
な形状のシヤツターで遮蔽されていると、この開
口からの噴射ビームが真正面の被成長基板に当た
ることはなく、噴出物があるとそれは開口より下
方に落下する。
With this shape, the thermal radiation (indicated by the dotted line) is not reflected by the molecular beam source 33 and bounces back, but reaches the tip of the horn while being reflected within the shutter, and is emitted from the opening at the tip. Moreover, if the shutter is shielded with such a shape, the ejected beam from this aperture will not hit the growth substrate directly in front of it, and if there is ejected material, it will fall below the aperture.

このようなシヤツターを設ければ、分子線源セ
ルをシヤツター15で遮蔽した状態にしても、分
子線源33へ熱輻射線は反射されず、また、シヤ
ツターを除いた開放状態では熱輻射線は反射され
ないから、シヤツターの開閉に無関係に分子線源
33の加熱温度が一定化される。
If such a shutter is provided, even if the molecular beam source cell is shielded by the shutter 15, thermal radiation will not be reflected to the molecular beam source 33, and in an open state except for the shutter, thermal radiation will not be reflected. Since it is not reflected, the heating temperature of the molecular beam source 33 is kept constant regardless of whether the shutter is opened or closed.

従つて、シヤツターの開閉による分子線源の温
度差は無視できる程度に小さくなり、ビーム強度
の安定化、率いては、成長結晶の組成比や膜厚の
変動を低減して、成長結晶の高品質化を図ること
ができ、上記したHEMT用のGaAs結晶の品質も
著しく改善される。
Therefore, the temperature difference in the molecular beam source due to opening and closing of the shutter becomes negligible, which stabilizes the beam intensity, reduces fluctuations in the composition ratio and film thickness of the growing crystal, and increases the height of the grown crystal. Quality can be improved, and the quality of the GaAs crystal for HEMT described above is also significantly improved.

〔発明の効果〕〔Effect of the invention〕

以上の説明から明らかなように、本発明にかか
るシヤツターを用いた分子線エピタキシヤル成長
装置によれば、成長結晶の品質が顕著に向上し
て、半導体装置を高性能化することができる。
As is clear from the above description, according to the molecular beam epitaxial growth apparatus using the shutter according to the present invention, the quality of the grown crystal is significantly improved, and the performance of the semiconductor device can be improved.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明にかかる分子線エピタキシヤル
成長装置の分子線源セルとシヤツターの部分断面
図、第2図は分子線エピタキシヤル成長装置の全
体概要図、第3図は従来の分子線源セルとシヤツ
ターの部分断面図、第4図は問題点を説明するた
めのGaAs結晶の断面図である。 図において、1は超高真空処理容器、2は被成
長基板、3は分子線源セル、4は冷却隔壁、5,
15はシヤツター、6はクライオポンプ、7は真
空排気口、31は円錐形るつぼ、32はヒータ、
33は分子線源、34は温度センサ、51はシヤ
ツター操作棒、を示している。
Figure 1 is a partial sectional view of the molecular beam source cell and shutter of the molecular beam epitaxial growth apparatus according to the present invention, Figure 2 is an overall schematic diagram of the molecular beam epitaxial growth apparatus, and Figure 3 is a conventional molecular beam source. FIG. 4 is a partial cross-sectional view of the cell and shutter, and is a cross-sectional view of a GaAs crystal to explain the problem. In the figure, 1 is an ultra-high vacuum processing container, 2 is a growth substrate, 3 is a molecular beam source cell, 4 is a cooling partition, 5,
15 is a shutter, 6 is a cryopump, 7 is a vacuum exhaust port, 31 is a conical crucible, 32 is a heater,
33 is a molecular beam source, 34 is a temperature sensor, and 51 is a shutter operating rod.

Claims (1)

【特許請求の範囲】[Claims] 1 斜め方向に向けて噴出口より熱線を噴出する
分子線源セルと、該噴出口前部に設けられたシヤ
ツターとを備え、該シヤツターは該噴出口側に向
けて広い開口径となるホーン状内面を有し、該内
面は分子線源から放射された熱線を再び該分子線
源に反射しないような熱線放射曲面からなり、且
つ、該噴出口から離れた側に下方に向けてなる熱
線放出用開口を有していることを特徴とする分子
線エピタキシヤル成長装置。
1. Equipped with a molecular beam source cell that ejects hot rays from the ejection port in an oblique direction, and a shutter provided in front of the ejection port, and the shutter has a horn shape with a wide opening diameter toward the ejection port. A heat ray emitting device having an inner surface, the inner surface being a heat ray radiation curved surface that does not reflect the heat rays emitted from the molecular beam source back to the molecular beam source, and directed downward on the side away from the jet nozzle. 1. A molecular beam epitaxial growth apparatus characterized by having an aperture for use.
JP28199885A 1985-12-17 1985-12-17 Molecular beam epitaxial growth device Granted JPS62141716A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP28199885A JPS62141716A (en) 1985-12-17 1985-12-17 Molecular beam epitaxial growth device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28199885A JPS62141716A (en) 1985-12-17 1985-12-17 Molecular beam epitaxial growth device

Publications (2)

Publication Number Publication Date
JPS62141716A JPS62141716A (en) 1987-06-25
JPH0152890B2 true JPH0152890B2 (en) 1989-11-10

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP28199885A Granted JPS62141716A (en) 1985-12-17 1985-12-17 Molecular beam epitaxial growth device

Country Status (1)

Country Link
JP (1) JPS62141716A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0527501Y2 (en) * 1988-03-30 1993-07-13
US5656091A (en) * 1995-11-02 1997-08-12 Vacuum Plating Technology Corporation Electric arc vapor deposition apparatus and method

Also Published As

Publication number Publication date
JPS62141716A (en) 1987-06-25

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