JPH0153492B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement in a method of connecting an enameled wire used in a coil or the like of a ballast for a discharge lamp and a lead wire to be connected to the enameled wire.

Conventionally, when connecting an enameled wire used in the coil of a discharge lamp ballast to a lead wire, the enamel coating on the tip of the enameled wire is chemically or mechanically peeled off and then crimped to the lead wire with a connecting terminal. A method of connecting or soldering has been adopted, or, if the enamel coating is not peeled off, a method of connecting to the lead wire using a special connection terminal with a blade that bites into the enamel wire has been adopted. However, the former method has the disadvantage that the enamel coating of the enameled wire must be peeled off one by one, making it difficult to perform the wire connection work efficiently. Furthermore, in the latter method, not only is it necessary to appropriately select the connecting terminal and the crimping force according to the wire diameter, but there is also a restriction on the number of wires to be connected. Furthermore, both methods are unsuitable for automating wiring connections due to the above-mentioned drawbacks.

The present invention has been made in view of the above-mentioned points, and provides a connection method that allows an enamelled wire to be easily and reliably connected to a lead wire without peeling off the enamel coating, and is also suitable for automation of the connection. The purpose is to provide the following.

Figure 1 shows the connection between the coil outlet wire and the lead wire in a ballast for a discharge lamp. 1 is the ballast core, 2 is a coil bobbin with an enameled wire wound around the ballast core. fitted coil,
3a and 3b are lead wires of the coil, 4a and 4b are lead wires, and 5a and 5b are connection terminals connecting the lead wires and the lead wires. In the present invention, the enameled wire constituting the lead wire as described above and the lead wire to be connected thereto are connected by the following method. First, as shown in FIG. 2a, the tip of the enameled wire 3 whose enamel coating has not been peeled off and the tip of the lead wire 4 are bundled in the same direction to form a cylindrical shape made of a material with good solderability. Insert into the bundling terminal 5 of. Next, as shown in FIG. 2b, a part of the binding terminal 5 is compressed and deformed, and the enameled wire 3 is
and crimp the lead wire 4. Next, as shown in FIG. 2c, the binding terminal 5 is cut at the crimped portion to align the ends of the enameled wire and the lead wire, and to expose the conductive portion of each wire. And finally the second
As shown in FIG. d, solder 6 is applied to the cut portion of the binding terminal 5 to complete the wiring work. FIG. 3 shows an enlarged view of the connecting portion between the enamelled wire and the lead wire connected by such a method. In the figure, 3 is an enameled wire, 7 is an enamel coating, 4 is a lead wire, 5 is a binding terminal, and 6 is solder applied to the cut portion. According to this structure, the enameled wire 3 and the lead wire 4 are electrically connected reliably by the solder 6 applied to the tip. As shown in the figure, when the crimp portion of the binding terminal 5 is cut diagonally, the exposed area of the conductive portions of the enameled wire 3 and the lead wire 4 increases, so that a more reliable electrical connection can be obtained. Furthermore, applying solder to the cut portion of the bundling terminal can be easily performed by immersing the cut portion in a solder bath or the like.

According to the wire connection method of the present invention, there is no need to peel off the enamel coating of the enameled wire one by one, so the wire connection work becomes extremely simple. The bundling terminal used may be one that can bundle an appropriate number of wires at once, so even if the diameters and numbers of wires to be connected differ, the terminals can be shared. Since a special connection terminal with a blade is not used, there is no need to adjust the crimping force according to the wire diameter or number of wires. Since the terminals to be connected are aligned by cutting a part of the bundling terminal, there is no need to align the tips of each wire beforehand when connecting the wires, and the setting work is easy. Soldering of the cut portion of the bundling terminal can be easily done by immersing the same portion in a solder bath, making it suitable for automation of wiring work. Further, according to the present invention, it is possible to obtain extremely reliable electrical connection.

[Brief explanation of drawings]

Fig. 1 is a perspective view of a connection section between a coil outlet wire and a lead wire of a ballast for a discharge lamp, Fig. 2 a to d are side views for explaining the operation of the wiring connection method according to the present invention, and Fig. 3 FIG. 2 is a longitudinal sectional side view of a wired portion connected by the method according to the present invention. In Figures 2 and 3, 3
...enamel wire, 4...lead wire, 5...bundling terminal, 6...solder.

Claims (1)

[Scope of Claims] 1. A bundle made of a material with good solderability, in which an appropriate number of enamelled wire tips whose enamel coating is not peeled and the tip portions of lead wires to be connected to the wires are bundled from the same direction. A wire connection method characterized in that after crimping and fixing with a lead wire, the bundling terminal is cut at the crimp portion, and electrical continuity between the enamelled wire and the lead wire is obtained by applying solder to the cut portion. . 2. The wire connection method according to claim 1, characterized in that when cutting the crimped portion of the bundling terminal, the cut is made at an angle.