JPH0153520B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a loading device for semiconductor devices.

Conventionally, mounting of a semiconductor device on a general semiconductor device mounting jig has been carried out manually by an operator. However, manual work has disadvantages in that the work is uneven, the number of work to be processed is small, and the work efficiency for mounting semiconductor devices is poor.

An object of the present invention is to provide an apparatus that automatically mounts semiconductor devices and increases the number of processing operations.

Next, one embodiment of the present invention will be described using the drawings.

In FIG. 1, a fixing plate 6 serving as a support mechanism is installed in a horizontal position, and a semiconductor device mounting jig 4 is installed on the plate 6. Said plate 6
A plurality of air blowing holes 5, 5... are provided on the upper surface of the jig 4 to blow air onto the lower surface of the jig 4 to slightly float the jig 4, and at the same time, the jig 4 is evacuated.
A plurality of suction holes 5, 5, . In the embodiment, an example is shown in which the air blowing hole 5 also serves as a suction hole, but the air blowing hole and the suction hole may be provided separately. Further, on the upper surface of the illustrated jig 4, a plurality of support plates 4a, 4a, . A plurality of mounting portions 4b, 4b, . . . , which hold the semiconductor device 1 in a state in which the leads 1a of the semiconductor device 1 straddle the support plate 4a, are provided by making cuts in a length range corresponding to the width of the semiconductor device 1.

Furthermore, a positioning mechanism 3 is installed above the jig 4 so as to be able to move up and down, for positioning the jig floating by air pressure by moving it back and forth and left and right. The mechanism 3 is a jig 4
Movement feed is applied in the horizontal direction sequentially at intervals of the mounting portions 4b. The positioning mechanism 3
The front and rear blocks 3a sandwich the mounting portion 4b of the jig 4 to adjust the front and rear positional deviation of the mounting portion 4b, and the front and rear blocks 3a fit into the mounting portion 4b of the jig 4 and expand to the left and right to adjust the left and right positions of the mounting portion 4b. It consists of left and right blocks 3b for adjusting the positional deviation of the block.

Furthermore, the semiconductor device 1 is moved up and down toward the storage section S of the semiconductor device 1 fed by a feeding device (not shown), and then reciprocated between the storage section S and the empty mounting section 4 of the jig 4, and A suction hand 2 is installed as a mounting mechanism that moves up and down toward the mounting portion 4 of the tool 4 and sequentially mounts the semiconductor devices 1 on the jig 4.

Next, the operation of the present invention will be explained. When the operating sequence of the apparatus is started, air is blown up from the air blowing hole 5 of the fixed plate 6 toward the lower surface of the jig 4, as shown in FIG. 2a, and the jig 4 is slightly floated by the air pressure. By floating the jig 4, the frictional force between the plate 6 and the jig 4 is significantly reduced, and the jig 4 can be easily moved.

When the jig 4 floats up, the positioning mechanism 3 descends as shown in FIG. 2b, and the left and right blocks 3 are reduced.
b and 3b fit into the mounting part 4b of the jig, and the left and right blocks 3b and 3b expand left and right, so the jig 4 is moved left and right following the movement of the blocks 3b and 3b, and the jig 4 is moved left and right following the movement of the blocks 3b and 3b. The tool 4 is positioned with the left and right displacement adjusted. After the left and right positioning is performed, the jig 4 is moved back and forth by the front and rear blocks 3a to adjust the front and rear positional deviation of the jig 4 and perform positioning.

When the positioning of the jig 4 in the front, back, left and right directions is completed, the supply of air to the air blowing hole 5 is stopped as shown in FIG. The tool 4 is vacuum-adsorbed onto the fixed plate 6. Fix the jig 4 on the plate 6
When the positioning mechanism 3 is fixed at , the positioning mechanism 3 separates from the jig 4, rises, and horizontally moves above the mounting section 4b on which the semiconductor device 1 is to be mounted next, in preparation for the next positioning operation.

Next, as shown in FIG. 2d, the suction hand 2 that has suctioned the semiconductor device 1 rises, then moves horizontally toward the empty mounting section 4b of the jig 4, and moves to the empty space where the semiconductor device 1 is to be mounted. The robot descends toward the mounting section 4b of the vehicle. Then, the suction hand 2 places the semiconductor device 1 on the mounting portion 4 of the jig 4 with the lead 1a straddling the support plate 4a.
b and mount it on jig 4. After loading, the suction hand 2 separates the semiconductor device 1, rises again, and then horizontally moves to the storage area S of the semiconductor device 1.
The team returned to Japan and prepared for the next stage of mounting semiconductor devices.

By repeating the above sequence, the semiconductor devices 1 are mounted on the jig 4 one after another. When semiconductor devices are mounted on all mounting parts of the jig,
A new empty jig 4 is set on the plate 6, and the above operation sequence is performed.

As explained above, in the present invention, the operations of positioning a jig and mounting a semiconductor device on the jig are performed mechanically, which not only eliminates uneven work, but also enables the automation of semiconductor device mounting. This has the effect of speeding up the mounting work, improving processing efficiency, and reducing manufacturing costs as a result.

[Brief explanation of drawings]

FIG. 1 is a schematic diagram showing one embodiment of the present invention, and FIG.
Figures a, b, c, and d are operation sequence diagrams. 1... Semiconductor device, 2... Suction hand (mounting mechanism), 3... Positioning mechanism, 4... Jig, 5...
Air blowing hole, 5... Adsorption hole, 6... Fixed plate (support mechanism).

Claims (1)

[Claims] 1. A support mechanism having a common or independent air blowing hole for blowing air to a semiconductor device mounting jig supported on its upper surface to levitate it, and a suction hole for vacuum suctioning the jig, and the levitated jig. 1. A loading device comprising: a positioning mechanism that positions the jig by moving it back and forth and left and right; and a mounting mechanism that sequentially mounts semiconductor devices on the positioned jig.