JPH0154710B2 - - Google Patents

Description

[Detailed description of the invention]

<Industrial Application Fields> In the publishing and printing industry, covers of books and magazines,
Logograms are used as illustrations, gifts, novelties, and to prevent counterfeiting of securities, credit cards, and ID cards. Additionally, holograms are used in the field of advertising and displays due to their iridescent decorative properties and unexpected three-dimensional effect. The present invention relates to the hologram, and more particularly to a hologram transfer foil for the purpose of molding a surface relief type hologram by embossing molding technology and transferring the hologram to an object to be transferred. <Prior art> A conventional method for replicating and mounting a hologram is to use a stamper on which a surface relief hologram is formed on a resin layer coated on a base material.
Embossing is performed to form a surface relief hologram on the resin, the surface is vapor-deposited with aluminum, heat-sensitive adhesive is applied, and the hologram is transferred to the object using a hot stamp. It was used. This method reproduces holograms mechanically rather than optically, making it suitable for mass production at low cost.Since this method uses a transfer method different from the sticker format, it can be mounted in a way where the thickness of the hologram is hardly felt. Ru. <Problems to be solved by the invention> With hologram transfer foil, the hologram is embossed in the first step, and then transferred using a hot stamp in the second step. At first glance, seemingly contradictory performances are required, such as adhesion with resin and releasability during transfer. Conventional transfer foils can be embossed, but they have problems such as extremely poor transferability, and good releasability during transfer, but the resin tends to peel off from the base material during embossing. Further, even among transfer foils that can be used for emboss transfer, there are some that have raised resin heat resistance, resulting in poor moldability of holograms and resulting in dark reproduced images. Since hot stamping is performed, there is a limit to the thickness of the base material, and a thin base material of about 20 to 30 μm must be used, which tends to cause press unevenness during embossing molding, resulting in a decrease in quality in appearance. Furthermore, there were other problems such as whitening of the resin during aluminum vapor deposition for use as a reflection hologram and weak adhesion between the aluminum and the resin. Another problem was that the resin was damaged by the heat-sensitive adhesive used for hot stamping. Furthermore, there were problems such as the resin being altered by the heat during hot stamping, blisters occurring during transfer, and many burrs. <Means for Solving the Problems> The present invention has been achieved as a result of various studies in view of the above circumstances. That is, in the present invention, a hologram is formed on the surface of a resin layer provided on one side of a base film by heating and pressurizing with a surface relief type hologram stamper, and then a metal reflective layer and a heat-sensitive adhesive layer are sequentially applied by vapor deposition. In the stacked transfer foil, the resin composition consists of a two-layer composition from the base film side, a release varnish layer and a hologram-forming resin layer, and the hologram-forming resin layer contains at least 3 to 15% by weight of a copolymer component. Contains a vinyl acetate component and a compound having an acid value of 1 to 6% by weight, and has a degree of polymerization of 400 to 400.
It has been found that by using a vinyl chloride resin having a molecular weight of 800, a hologram transfer foil with excellent moldability and transferability during embossing can be obtained. Hereinafter, the present invention will be explained in detail using the drawings.
FIGS. 1 to 3 clearly illustrate the state in which the hologram transfer foil according to the present invention is embossed with a surface relief type stamper. That is, in FIG. 1, 1 represents a base film, 2 represents a release varnish layer, 3 represents a hologram forming resin layer, and 1 to 3 are the basic components of the hologram transfer foil of the present invention. Reference numeral 4 indicates a surface relief type hologram stamper, which is fixed to the press upper surface plate 5. The upper surface plate of the press has a built-in heating mechanism necessary for embossing. Reference numeral 6 indicates a press lower platen, which is heated and pressurized for a certain period of time by the press plates 5 and 6, so that the relief pattern of the hologram stamper is embossed on the hologram forming layer. FIG. 2 shows the basic part of the hologram transfer foil after being embossed in this manner, and the resin layer 7 shows the state after a hologram has been embossed on the hologram forming resin layer 3. Furthermore, FIG. 3 is a conceptual cross-sectional view showing the overall image of the hologram transfer foil of the present invention, where 8 shows the vapor deposited metal reflective layer applied on the resin layer 7 after the hologram has been embossed, and 9 shows the vapor deposited metal reflective layer. layer 8
2 shows a heat-sensitive adhesive layer provided on top of the heat-sensitive adhesive layer. As the base film 1 described in the present invention, heat-resistant polyester film, polypropylene film, polycarbonate film, cellophane, etc. can be used, and those having a thickness of about 10 to 100 μm are preferable. Among them, polyester film gives the best results in terms of heat resistance, physical strength, smoothness, and little stickiness. The release varnish layer 2 described in the present invention is provided to more effectively transfer the hologram-forming resin layer 3 to the transfer target, and is essential for increasing production efficiency. Acrylic resins, chlorinated rubber resins, and resins that can be used in combination with these resins include nitrocellulose, acetylcellulose,
Acetate butyrate, polystyrene, vinyl chloride, salt-vinyl acetate resin, etc. can be used. Furthermore, thermosetting resins such as melamine resins, alkyd resins, epoxy resins, urea resins, and acrylic resins can be used alone or in combination, and silicone resins, paraffin waxes, reactive fluororesins, etc. can also be used. is also possible. As a resin suitable for the hologram forming resin layer 3 described in the present invention, extremely good results can be obtained by using a certain type of vinyl chloride resin. That is, the hologram-forming resin layer contains at least 3 to 15% by weight of a vinyl acetate component and a compound having an acid value of 1 to 6% by weight as copolymerization components, and the degree of polymerization is in the range of 400 to 800. By using vinyl chloride resin, it has good embossing moldability, is less likely to cause uneven pressing, and a bright reproduced image can be obtained.In addition, it has good adhesion to the base material during embossing molding.
It was discovered that the adhesion to the metal reflective layer was good and the peelability when transferring to a transfer object was extremely good. Among them, by using maleic acid as a compound having an acid value, particularly good results can be obtained in adhesion to a metal reflective layer such as aluminum. The method for coating such a hologram-forming resin layer is to apply resin in the form of paint using a method such as roll coating or blade coating, and then dry it.
A film thickness of 0.5 to 5 μm may be formed. The thus obtained hologram-forming resin layer adheres appropriately to the base film coated with the release varnish layer, has excellent moldability when heated and pressurized during embossing molding, and has a surface coated with nickel and gold. It does not adhere to stampers plated with chrome, etc., and also exhibits good adhesion to metal reflective layers, and the film cuts well. Furthermore, it enables reliable transfer without peeling defects, uneven transfer, burrs, or blisters of the metal reflective layer during hot stamping, and eliminates cracks, whitening, and other problems caused by shrinkage caused by the heat during the vapor deposition process and hot stamping. There is no visible deterioration in quality, such as destruction of the hologram pattern. In the embossing process, the relief hologram pattern of the hologram forming resin layer 3 and the stamper 4 are superimposed using a press machine (upper surface plate 5 and lower surface plate 6), and heated and pressurized at a temperature of 90°C to 150°C. After that,
By cooling, a hologram pattern is formed on the surface of the resin layer 3. The metal reflective layer 8 described in the present invention, that is, the metal vapor deposition layer, is preferably a metal with a high surface reflectance, and specifically, aluminum, gold, silver, copper, etc., and alloys containing these metals can be used. It can be provided by commonly known methods such as vacuum evaporation, sputtering, and ion plating. The appropriate thickness is in the range of 100 Å to 10,000 Å. The heat-sensitive adhesive layer 9 described in the present invention is made of polyester resin, acrylic resin, vinyl chloride resin, polyamide resin, polyvinyl acetate, rubber resin, ethylene-vinyl acetate copolymer resin, vinyl chloride-vinyl acetate copolymer resin, etc. A plastic resin can be used, and any resin is selected taking into account its adhesion to the metal reflective layer and the material to be transferred, and the resin is varnished with an appropriate solvent and then applied to the gravure coating method, roll coating method, or blade coating method. The film is formed by coating using a known method such as a coating method, and the film thickness is preferably 1 μm to 20 μm. FIG. 4 clearly shows the state in which the hologram transfer foil obtained in this way is transferred to an arbitrary transfer material 10 such as paper, a vinyl chloride sheet, a polyester sheet, etc. That is, the coated surface of the heat-sensitive adhesive layer 9 is aligned with the transfer target 10, and the base film 1 is
After applying heat and pressure (hot stamping) from the side to adhere the heat-sensitive adhesive layer 9 to the transfer target 10, the base film 1 is peeled off to complete the transfer. When peeling the base film 1 here,
The following two cases are possible depending on the type of resin used for the release varnish layer 2. In other words, as shown in FIG. 4A, the release varnish layer is peeled off while remaining adhered to the base film side during peeling, and as shown in FIG.
It is conceivable that the film may peel off while remaining adhered to the side. Specifically, when a resin with good adhesion to the base film, such as thermoplastic acrylic resin or chlorinated rubber-based polyester film, is used as the resin in the release varnish layer, the former release state shown in A is shown, and the heat When used alone or in combination with hardening melamine resins, alkyd resins, epoxy resins, urea resins, silicone resins, paraffin waxes, etc.
When using reactive fluororesin, the adhesion to the base film such as polyester film is low, and it easily peels off from the base film when peeled.
The peeling state of the latter is shown in (b). In either case, as described above, the release varnish layer 2 is provided to more effectively transfer the hologram-forming resin layer 3 to the transfer target 10, and the amount of application thereof may be small; In particular, in the case of a structure in which the peeling varnish layer remains on the hologram forming resin layer as shown in (B), the hologram is adversely affected.
A large amount is not preferable. As described above, by using the hologram transfer foil described in the present invention, it was possible to solve the problems that conventional hologram transfer foils had. The present invention will be explained in more detail below using examples. <Example> (Example 1) A varnish with the following composition (a) was applied to the surface of a 25 μm thick polyester film using a roll coater, and a peelable resin layer of approximately 0.5 μm was provided, and the following Apply a resin layer of approximately 1 μm using varnish of composition (b),
After curing at 60℃ for 72 hours, the resin layer and the hologram forming surface of the stamper are placed on top of each other using a press machine, and embossing is performed on the resin surface at 130℃ under heating and pressure conditions of 40Kg/ ^cm2. A hologram was formed. Next, aluminum was vapor-deposited to a thickness of about 500 Å on the surface of the resin layer, and a varnish having the following composition (c) was applied using a roll coater to form a heat-sensitive adhesive layer of about 3 μm to obtain a hologram transfer foil. (a) Varnish {methyl methacrylate polyol T.
G.105℃, molecular weight 300× ¹³ )...9.0% by weight Cellulose acetate butyrate (butyl group 37
%, TG130℃) …1.0 Toluene …35.0 Methyl ethyl ketone …35.0 Isobutyl acetate …20.0 (b) Varnish {vinyl chloride vinyl acetate/maleic acid copolymer (average degree of polymerization 600) …150 Weight% (Contains 10% by weight of vinyl acetate and 2% by weight of maleic acid as copolymerization components) Toluene...35.0 Methyl ethyl ketone...35.0 Isobutyl acetate...15.0 100.0 (c) Varnish {salt vinyl acetate resin ( Vinyl chloride/vinyl acetate = 86/
14, Average degree of polymerization 600-700) ...15% by weight Acrylic resin (TG 80℃, molecular weight 150×10 ³ )
……10 〃 MEK ……38 〃Toluene ……37 〃｝ 100.0 〃 Next, transfer the obtained transfer foil to 157 g/ ^m2 art paper.
When the hologram is transferred by hot pressing at 120°C for 0.5 seconds, a transfer product that faithfully reproduces the hologram is obtained without defects such as whitening, cracks, and blisters. Further, in embossing the resin layer, there was no problem of adhesion to the stamper, and the processability was excellent. (Example 2 and Comparative Examples 1 to 5) A varnish having the following composition (d) was applied to the surface of a 25 μm thick polyester film using a roll coater, and a release resin layer of about 0.5 μm was provided, and then A resin layer of approximately 1.5 μm was applied using the various types of vinyl chloride/vinyl acetate copolymer resin shown in (e) below, and after curing under the same conditions at 60°C for 72 hours, it was placed in a press. The resin layer and the hologram forming surface of the stamper were overlapped and embossing was performed at 130℃.
A hologram was formed on the resin surface under heating and pressure conditions of 40 kg/cm ² . Next, as in Example 1, aluminum was vapor-deposited to a thickness of about 500 Å on the surface of the resin layer, and a varnish with the following composition (f) was applied using a roll coater to form a heat-sensitive adhesive layer of about 3 μm, and various holograms were transferred. Got the foil. Next, the thus obtained transfer foil was heat-pressed onto 157 g/m ² art paper at 120° C. for 0.5 seconds to compare transfer suitability. As a result, as shown in the results column, when using a vinyl chloride resin in which the copolymerization ratio (wt%) of the vinyl acetate component was outside the range of 3 to 15 wt% and the degree of polymerization was outside the range of 400 to 800, Both have embossability, transferability,
Unsatisfactory results were obtained in terms of image reproducibility, etc. Furthermore, when 1 to 6% by weight of a compound having an acid value such as maleic acid was not included as a copolymerization component, the adhesion between the aluminum vapor deposited layer and the hologram forming layer was poor, resulting in unsatisfactory results. (d) Varnish (release varnish) {Adekaprene CR-20 (chlorinated rubber resin manufactured by Asahi Denka Co., Ltd.) ...30% by weight MEK/toluene = 1/1 ...7.0 〃｝ 100.0 〃 (e) Varnish ~ (hologram pattern) Forming resin layer) {Vinyl chloride resin* ...20% by weight Toluene ...35 〃 Methyl ethyl ketone ...35 〃 Acetate isobutyl ketone ...10 〃}

[Table] (f) Varnish (thermal adhesive layer) {Salt vinyl acetate resin (vinyl chloride/vinyl acetate = 86/
14, Average degree of polymerization 600-700) ...15% by weight Acrylic resin (TG 80℃, molecular weight 150×10 ³ )
……10 〃 MEK ……38 〃Toluene ……37 〃｝ 100.0 〃

[Table] (Note) ○ indicates good quality, × indicates poor quality, and ◎ indicates overall good quality.
<Effects of the Invention> The hologram transfer foil according to the present invention is provided with a release layer and as a resin layer 3 which is a hologram forming layer,
By using a vinyl chloride resin containing as a copolymerization component at least 3 to 15% by weight of a vinyl acetate component and 1 to 6% by weight of an oxidized compound and having a degree of polymerization in the range of 400 to 800, the surface It has become possible to produce high-yield relief holograms using the emboss molding method as transfer foil, and improved moldability has resulted in brighter reproduced images, as well as improved metal deposition characteristics and transferability with hot stamping. From this, the present invention is effective in improving the quality, processability, and economic efficiency of hologram transfer foils, and is effective in improving the quality, processability, and economic efficiency of hologram transfer foils, and can be used for books, book covers, illustrations, gifts,
It can be said that the present invention is industrially effective, as it facilitates the use of hologram transfer foil in novelty packages and the like, and prevents counterfeiting.

[Brief explanation of drawings]

The drawings show embodiments of the present invention.
Fig. 3 is an explanatory cross-sectional diagram showing a state in which the hologram transfer foil is embossed with a surface relief type stamper, and Fig. 4 is an explanatory diagram in a cross-sectional view showing a state in which the hologram transfer foil is peeled off by a release varnish layer. . 1... Base film, 2... Peeling layer, 3... Hologram forming resin layer, 4... Surface relief type hologram stamper, 5... Upper surface plate of press machine, 6... Lower surface plate of press machine, 7... Resin after hologram embossing Layer, 8... Metal reflective layer, 9... Heat-sensitive adhesive layer, 10...
Transferee.

Claims (1)

[Claims] 1. On the surface of the resin layer provided on one side of the base film,
Heating and
In a transfer foil in which a hologram is formed by pressure, and then a metal reflective layer by vapor deposition and a heat-sensitive adhesive layer are stacked one after another, the resin layer structure consists of two layers: a release varnish layer and a hologram-forming resin layer from the base film side. The hologram-forming resin layer contains a vinyl acetate component of at least 3 to 15% by weight and a compound having an acid value of 1 to 6% by weight as copolymerization components, and has a degree of polymerization of 400 to 800. A hologram transfer foil characterized by being made of vinyl chloride resin. 2. The hologram transfer foil according to claim 1, wherein the compound having an acid value is maleic acid. 3. The hologram transfer foil according to claims 1 and 2, wherein the resin used for the release varnish layer is one of a thermoplastic acrylic resin and a chlorinated rubber resin, and a mixture thereof. 4. The hologram transfer foil according to claims 1 and 2, wherein the resin used for the release varnish layer is a thermosetting resin. 5. Claims 1, 2, 3, and 3, characterized in that the base film is a polyester film.
The hologram transfer foil according to item 4.