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JPH0154858B2 - - Google Patents
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JPH0154858B2 - - Google Patents

Info

Publication number
JPH0154858B2
JPH0154858B2 JP58126789A JP12678983A JPH0154858B2 JP H0154858 B2 JPH0154858 B2 JP H0154858B2 JP 58126789 A JP58126789 A JP 58126789A JP 12678983 A JP12678983 A JP 12678983A JP H0154858 B2 JPH0154858 B2 JP H0154858B2
Authority
JP
Japan
Prior art keywords
voltage
discharge
low voltage
wire
switching element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58126789A
Other languages
Japanese (ja)
Other versions
JPS6017925A (en
Inventor
Hitoshi Sakuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP58126789A priority Critical patent/JPS6017925A/en
Publication of JPS6017925A publication Critical patent/JPS6017925A/en
Publication of JPH0154858B2 publication Critical patent/JPH0154858B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/0711Apparatus therefor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/01Manufacture or treatment
    • H10W72/015Manufacture or treatment of bond wires
    • H10W72/01551Changing the shapes of bond wires
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/0711Apparatus therefor
    • H10W72/07141Means for applying energy, e.g. ovens or lasers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/075Connecting or disconnecting of bond wires
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/075Connecting or disconnecting of bond wires
    • H10W72/07511Treating the bonding area before connecting, e.g. by applying flux or cleaning

Landscapes

  • Wire Bonding (AREA)

Description

【発明の詳細な説明】 (発明の利用分野) 本発明は放電によつてワイヤの先端にボールを
形成するワイヤボンダ用ボール形成装置に関す
る。
DETAILED DESCRIPTION OF THE INVENTION (Field of Application of the Invention) The present invention relates to a ball forming device for a wire bonder that forms a ball at the tip of a wire by electric discharge.

(発明の背景) 従来、スパーク放電によりワイヤの先端にボー
ルを形成するボール形成装置として、例えば実開
昭57−80841号公報に示す方法が知られている。
この方法は、高電圧をスイツチング素子により直
接スイツチングするので、高価な高電圧電源及び
高耐電圧スイツチング素子が必要である。また高
電圧のみを印加するので、アークが安定しなく、
良好なボールが形成されないという致命的な欠点
を有する。
(Background of the Invention) Conventionally, as a ball forming apparatus for forming a ball at the tip of a wire by spark discharge, for example, a method disclosed in Japanese Utility Model Application Publication No. 57-80841 is known.
In this method, a high voltage is directly switched by a switching element, and therefore an expensive high voltage power supply and a high withstand voltage switching element are required. Also, since only high voltage is applied, the arc is unstable and
This has the fatal drawback that a good ball cannot be formed.

ところで、最近、アークを安定させて良好なボ
ールを形成するには、例えば特開昭57−40947号
公報に示すように、高電圧低電流を電極とボール
の間に与えてアークを形成し、一旦アークが形成
されると低電圧高電流を与えてボールを形成する
のが好ましいとされている。
By the way, recently, in order to stabilize the arc and form a good ball, for example, as shown in Japanese Patent Application Laid-open No. 57-40947, a high voltage and low current are applied between the electrode and the ball to form an arc. Once the arc is formed, it is preferred to apply a low voltage and high current to form a ball.

しかしながら、この方法は、電源回路が2個必
要であり、また高電圧放電スイツチング手段とし
て高電圧を直接サイリスタでスイツチングするた
め、サイリスタを動作させる回路が必要であるこ
と等により、回路が非常に複雑になる。また放電
用コンデンサとして大容量高電圧のコンデンサを
使用しなければならないので、充電時間が遅く、
ワイヤボンデイングのスピードが1ワイヤ当り
0.4〜0.6秒必要とする。また前記のように高電圧
を直接サイリスタでスイツチングするので、高電
圧の立上り及び立下りが遅く、放電時間及び放電
電流の精密な制御及び大電流出力等が困難であ
る。
However, this method requires two power supply circuits, and since the high voltage is directly switched by the thyristor as a high voltage discharge switching means, a circuit to operate the thyristor is required, making the circuit extremely complicated. become. Also, since a large-capacity, high-voltage capacitor must be used as a discharging capacitor, charging time is slow.
Wire bonding speed per wire
Requires 0.4~0.6 seconds. Furthermore, since the high voltage is directly switched by the thyristor as described above, the rise and fall of the high voltage is slow, making it difficult to precisely control the discharge time and discharge current, and to output a large current.

(発明の目的) 本発明の目的は、簡単な回路よりなり、ワイヤ
ボンデイングのスピードが早く、かつ放電時間及
び放電電流の精密な制御が行えるワイヤボンデイ
ング用ボール形成装置を提供することにある。
(Object of the Invention) An object of the present invention is to provide a ball forming device for wire bonding which has a simple circuit, can perform wire bonding at high speed, and can precisely control discharge time and discharge current.

(発明の実施例) 以下、本発明の一実施例を第1図により説明す
る。ボール形成時には、クランパ1でワイヤ2を
クランプし、キヤピラリ3に挿通されたワイヤ2
と所定の間隙を保つようにワイヤ2の先端下方に
放電電極4が移動させられる。
(Embodiment of the Invention) An embodiment of the present invention will be described below with reference to FIG. When forming a ball, the clamper 1 clamps the wire 2 and the wire 2 inserted into the capillary 3
The discharge electrode 4 is moved below the tip of the wire 2 so as to maintain a predetermined gap.

前記ワイヤ2の先端と放電電極4間に電圧を印
加するボール形成装置は次のように構成されてい
る。低電圧E1(例えば200〜300V)を出力する低
電圧発生回路10にはコンデンサ11が接続され
ている。コンデンサ11の出力側では、一方の出
力線がトランジスタ等のスイツチング素子12、
ダイオード13及び放電電流調整用可変抵抗器1
4を介してクランパ1に接続され、他方の出力線
が放電電極4に直接接続されている。前記スイツ
チング素子12には放電時間を可変する可変抵抗
15を有するタイマ16が接続されている。
The ball forming device that applies a voltage between the tip of the wire 2 and the discharge electrode 4 is constructed as follows. A capacitor 11 is connected to a low voltage generating circuit 10 that outputs a low voltage E 1 (for example, 200 to 300 V). On the output side of the capacitor 11, one output line is connected to a switching element 12 such as a transistor,
Diode 13 and variable resistor 1 for adjusting discharge current
4 to the clamper 1, and the other output line is directly connected to the discharge electrode 4. A timer 16 having a variable resistor 15 for varying the discharge time is connected to the switching element 12.

従つて、スイツチング素子12の出力電圧E2
は低電圧E1より若干小さいがほぼ等しい低電圧
を出力する。また放電電流調整用可変抵抗器14
の出力電圧E3は前記出力電圧E2より若干小さい
電圧、例えば200〜300Vになる。この出力電圧E3
は後記するように放電維持電圧となるので、以
下、この出力電圧を放電維持用低電圧とよぶ。そ
こで、電圧E1,E2,E3間は次式の関係になる。
Therefore, the output voltage E 2 of the switching element 12
outputs a low voltage that is slightly smaller but approximately equal to the low voltage E1 . Also, a variable resistor 14 for adjusting discharge current
The output voltage E3 is a voltage slightly smaller than the output voltage E2 , for example, 200 to 300V. This output voltage E 3
Since this becomes a discharge sustaining voltage as described later, this output voltage will be referred to as a discharge sustaining low voltage hereinafter. Therefore, the relationship between the voltages E 1 , E 2 , and E 3 is as shown in the following equation.

E1≒E2≧E3 …(1) また前記スイツチング素子12の出力線とコン
デンサ11の他方の出力線には変圧器17の入力
線が接続されており、この変圧器17で例えば
600〜1800Vの出力電圧E4に昇圧される。変圧器
17の出力線側では、一方の出力線がダイオード
18を介して前記放電電流調整用可変抵抗器14
の出力線に接続され、他方の出力線が前記放電電
極4の入力線に接続されている。ここで、前記ダ
イオード13,18は出力電圧E2とE4の相互干
渉を阻止するために設けられている。前記出力電
圧E4に前記放電維持用低電圧E3を加えた電圧E5
は後記するように放電開始電圧となるので、以下
この電圧E5を放電開始用高電圧とよぶ。そこで、
電圧E2,E4,E5間は次式の関係になる。
E 1 ≒E 2 ≧E 3 (1) Furthermore, the input line of a transformer 17 is connected to the output line of the switching element 12 and the other output line of the capacitor 11, and this transformer 17
Boosted to an output voltage E4 of 600-1800V. On the output line side of the transformer 17, one output line is connected to the discharge current adjusting variable resistor 14 via a diode 18.
The other output line is connected to the input line of the discharge electrode 4. Here, the diodes 13 and 18 are provided to prevent mutual interference between the output voltages E2 and E4 . Voltage E 5 which is the sum of the output voltage E 4 and the discharge sustaining low voltage E 3
Since E is the discharge starting voltage as described later, this voltage E5 will be referred to as the discharge starting high voltage hereinafter. Therefore,
The relationship between voltages E 2 , E 4 , and E 5 is as shown in the following equation.

E5>E4>E2 …(2) 従つて、(1)(2)式より各電圧E1〜E5の関係は次
のようになる。
E 5 >E 4 >E 2 (2) Therefore, from equations (1) and (2), the relationships among the voltages E 1 to E 5 are as follows.

E5>E4>E1≒E2>E3 …(3) 次に作用について説明する。低電圧発生回路1
0によりコンデンサ11に低電圧が印加される。
低電圧発生回路10の低電圧E1をタイマ16で
制御し、スイツチング素子12を駆動する。この
スイツチング素子12の出力電圧E2は放電電流
調整用可変抵抗器14を介して放電維持低電圧
E3となる。またスイツチング素子12の出力電
圧E2の一部は変圧器17で高電圧E4に昇圧され
る。前記出力電圧E3及びE4は同時に放電開始用
高電圧E5=E3+E4としてワイヤ2と放電電極4
間に印加される。この放電開始用高電圧E5によ
り放電が開始されると、変圧器17の垂下特性に
よりコンデンサ11からの低電圧E1による電圧、
即ち放電維持用低電圧E3がワイヤ2と放電電極
4間に印加され、タイマ16で設定された時間だ
け放電が続く。この時の電圧波形及び電流波形を
第2図に示す。この場合、放電が行われなかつた
時は点線のような波形になる。
E 5 >E 4 >E 1 ≒E 2 >E 3 ...(3) Next, the effect will be explained. Low voltage generation circuit 1
0, a low voltage is applied to the capacitor 11.
The low voltage E 1 of the low voltage generating circuit 10 is controlled by a timer 16 to drive the switching element 12 . The output voltage E2 of this switching element 12 is set to a discharge sustaining low voltage via a discharge current adjusting variable resistor 14.
It becomes E 3 . Further, a part of the output voltage E 2 of the switching element 12 is boosted to a high voltage E 4 by the transformer 17. The output voltages E 3 and E 4 are simultaneously applied to the wire 2 and the discharge electrode 4 as a high voltage for starting discharge E 5 =E 3 +E 4 .
applied in between. When the discharge is started by this discharge starting high voltage E5 , the voltage due to the low voltage E1 from the capacitor 11 due to the drooping characteristics of the transformer 17,
That is, the discharge sustaining low voltage E 3 is applied between the wire 2 and the discharge electrode 4, and the discharge continues for the time set by the timer 16. The voltage and current waveforms at this time are shown in FIG. In this case, when no discharge occurs, the waveform becomes a dotted line.

このように、低電圧発生回路10の低電圧E1
(正確にはE2)を昇圧器17で昇圧させて高電圧
を発生させ、この高電圧により放電が開始される
と昇圧器17の垂下特性により自動的に低電圧が
印加されるので、回路が非常に簡単になる。また
電源として低電圧発生回路10を使用するので、
コンデンサ11は低電圧用で大容量のものを用い
ることができ、充電時間が早くなる。その結果、
ワイヤボンデイングのスピードが1ワイヤ当り
0.1〜0.3秒となり、生産性が約2倍に向上する。
また低電圧発生回路10の低電圧E1をスイツチ
ング素子12でスイツチングするので、スイツチ
ング素子12は高耐電圧用である必要がない。従
つて、スイツチング素子12として大電流用ダー
リントントランジスタ等が使用でき、立上り及び
立下りが早く、放電時間及び放電電流が精密に制
御できる。
In this way, the low voltage E 1 of the low voltage generation circuit 10
(E 2 to be exact) is boosted by the booster 17 to generate a high voltage, and when discharge is started by this high voltage, a low voltage is automatically applied due to the drooping characteristics of the booster 17, so the circuit becomes very easy. Also, since the low voltage generation circuit 10 is used as a power source,
As the capacitor 11, a capacitor 11 for low voltage and large capacity can be used, and the charging time becomes faster. the result,
Wire bonding speed per wire
It takes 0.1 to 0.3 seconds, approximately doubling productivity.
Furthermore, since the low voltage E1 of the low voltage generating circuit 10 is switched by the switching element 12, the switching element 12 does not need to be for high withstand voltage. Therefore, a large current Darlington transistor or the like can be used as the switching element 12, and the rise and fall are quick, and the discharge time and discharge current can be precisely controlled.

(発明の効果) 以上の説明から明らかな如く、本発明によれ
ば、回路が簡単になり、ワイヤボンデイングのス
ピードが早く、かつ放電時間及び放電電流の精密
な制御が行える。
(Effects of the Invention) As is clear from the above description, according to the present invention, the circuit can be simplified, the speed of wire bonding can be increased, and the discharge time and discharge current can be precisely controlled.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の一実施例を示す回路図、第2
図は放電波形を示し、aは電圧波形図、bは電流
波形図である。 2……ワイヤ、4……放電電極、10……低電
圧発生回路、12……スイツチング素子、17…
…変圧器、E1,E2……低電圧、E3……放電維持
用電圧、E4……高電圧、E5……放電開始用電圧。
Figure 1 is a circuit diagram showing one embodiment of the present invention, Figure 2 is a circuit diagram showing an embodiment of the present invention.
The figure shows discharge waveforms, where a is a voltage waveform diagram and b is a current waveform diagram. 2...Wire, 4...Discharge electrode, 10...Low voltage generation circuit, 12...Switching element, 17...
...Transformer, E 1 , E 2 ... Low voltage, E 3 ... Voltage for maintaining discharge, E 4 ... High voltage, E 5 ... Voltage for starting discharge.

Claims (1)

【特許請求の範囲】[Claims] 1 ワイヤと放電電極間に電圧を印加してワイヤ
の先端にボールを形成するワイヤボンダ用ボール
形成装置において、低電圧発生回路と、この低電
圧発生回路の低電圧をスイツチングするスイツチ
ング素子と、このスイツチング素子の出力電圧を
昇圧して高電圧を出力する変圧器とを備え、前記
スイツチング素子の出力電圧及び前記変圧器の出
力電圧を同時に放電開始用高電圧として前記ワイ
ヤと前記放電電極間に印加するように構成してな
り、前記放電開始用高電圧による放電開始後、前
記変圧器の垂下特性により前記スイツチング素子
の出力電圧が放電維持低電圧として前記ワイヤと
前記放電電極間に印加されることを特徴とするワ
イヤボンダ用ボール形成装置。
1. A ball forming device for a wire bonder that applies a voltage between a wire and a discharge electrode to form a ball at the tip of the wire, which includes a low voltage generation circuit, a switching element that switches the low voltage of the low voltage generation circuit, and a switching element that switches the low voltage of the low voltage generation circuit. and a transformer that boosts the output voltage of the element to output a high voltage, and simultaneously applies the output voltage of the switching element and the output voltage of the transformer as a high voltage for starting discharge between the wire and the discharge electrode. After the discharge is started by the discharge starting high voltage, the output voltage of the switching element is applied as a discharge sustaining low voltage between the wire and the discharge electrode due to the drooping characteristic of the transformer. Characteristic ball forming device for wire bonder.
JP58126789A 1983-07-11 1983-07-11 Ball forming device for wire bonder Granted JPS6017925A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58126789A JPS6017925A (en) 1983-07-11 1983-07-11 Ball forming device for wire bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58126789A JPS6017925A (en) 1983-07-11 1983-07-11 Ball forming device for wire bonder

Publications (2)

Publication Number Publication Date
JPS6017925A JPS6017925A (en) 1985-01-29
JPH0154858B2 true JPH0154858B2 (en) 1989-11-21

Family

ID=14943975

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58126789A Granted JPS6017925A (en) 1983-07-11 1983-07-11 Ball forming device for wire bonder

Country Status (1)

Country Link
JP (1) JPS6017925A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6076537B1 (en) * 2015-05-03 2017-02-08 株式会社カイジョー Ball bonder for wire bonder

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62127651A (en) * 1985-11-28 1987-06-09 Sanshin Ind Co Ltd Foreign matter detector for lubricating device for engine

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6076537B1 (en) * 2015-05-03 2017-02-08 株式会社カイジョー Ball bonder for wire bonder

Also Published As

Publication number Publication date
JPS6017925A (en) 1985-01-29

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