JPH0155946B2 - - Google Patents
Info
- Publication number
- JPH0155946B2 JPH0155946B2 JP8954681A JP8954681A JPH0155946B2 JP H0155946 B2 JPH0155946 B2 JP H0155946B2 JP 8954681 A JP8954681 A JP 8954681A JP 8954681 A JP8954681 A JP 8954681A JP H0155946 B2 JPH0155946 B2 JP H0155946B2
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- mold
- tool
- polishing tool
- workpiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005498 polishing Methods 0.000 claims description 147
- 238000000034 method Methods 0.000 claims description 9
- 238000013459 approach Methods 0.000 claims 1
- 238000006073 displacement reaction Methods 0.000 description 13
- 238000001514 detection method Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 238000003754 machining Methods 0.000 description 3
- 230000001174 ascending effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012369 In process control Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010965 in-process control Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B13/00—Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Eyeglasses (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、非球面形状の研磨装置に係り、特に
回転軸対称の非球面プラスチツクレンズ成型金型
を研磨する非球面研磨装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an aspherical surface polishing device, and more particularly to an aspherical surface polishing device for polishing an aspherical plastic lens mold that is rotationally symmetrical.
従来、球面形状の研磨方法は、レンズ研磨機や
皿状研磨具が用いられている。一方、非球面形状
には通常のレンズ研磨機や、皿状の研磨具が適用
できず、加工物をたわませたままで加工する手
法、特殊な材質、形状の工具を用いて部分修正す
る手法およびカムによつて倣わせて研磨する手法
等が用いられている。しかし、これ等の手法はい
ずれも研磨技術者の腕に頼るところが多く、研磨
精度が数λ（ラムダ）ときびしくなると研磨時間、
費用が膨大となる欠点を有していた。さらに従来
技術では、非球面形状の成形用金型を自動的に高
精度研磨する装置がなく、効果的な非球面研磨装
置が要請されていた。
Conventionally, lens polishing machines and dish-shaped polishing tools have been used to polish spherical surfaces. On the other hand, ordinary lens polishing machines and dish-shaped polishing tools cannot be applied to aspherical shapes, and methods involve machining the workpiece while it is bent, or partial correction using tools made of special materials and shapes. Also, methods of copying and polishing with a cam, etc. are used. However, these methods often rely on the skill of the polishing engineer, and when the polishing accuracy becomes severe by several λ (lambda), the polishing time and
It had the disadvantage of being extremely expensive. Further, in the prior art, there is no apparatus for automatically polishing an aspherical mold with high precision, and an effective aspherical polishing apparatus has been required.
上記従来技術は、研磨部各点における研磨条件
の変動の点について配慮がされておらず、研磨前
の形状精度を維持できないこと、研磨傷などの研
磨欠陥を生じる問題があつた。
The above-mentioned conventional technology does not take into consideration variations in polishing conditions at each point of the polishing part, and has problems in that the shape accuracy before polishing cannot be maintained and polishing defects such as polishing scratches occur.
本発明の目的は、従来技術の欠点を解消し研磨
工具のエツジの片当たりによつて生じるスクラツ
チが入らず研磨前の形状精度を保持しながら最良
な研磨条件で自動研磨加工ができ、かつ、研磨面
にピンホールを生じさせない非球面研磨装置を提
供するにある。 The object of the present invention is to eliminate the drawbacks of the prior art, to avoid scratches caused by uneven contact of the edge of the polishing tool, to maintain the shape accuracy before polishing, and to enable automatic polishing under the best polishing conditions. To provide an aspherical surface polishing device that does not create pinholes on a polished surface.
本発明は、以上の目的を達成するため、研磨荷
重を一定に保持すると共に、加工物の研磨面の法
線と研磨工具の軸方向を一致させ、かつ研磨工具
が加工物の中心に行くに従つて、加工物の回転数
と研磨工具と加工物の相対的な送り速度を速くす
るようにし、さらに、研磨工具を間欠的に上昇さ
せながら研磨するようにしたことを特徴とする。
In order to achieve the above objects, the present invention maintains the polishing load constant, aligns the normal to the polishing surface of the workpiece with the axial direction of the polishing tool, and moves the polishing tool toward the center of the workpiece. Therefore, the present invention is characterized in that the rotational speed of the workpiece and the relative feed rate between the polishing tool and the workpiece are increased, and furthermore, the polishing is performed while the polishing tool is intermittently raised.
〔作用〕
研磨面にかかる研磨荷重は定圧倣い制御により
一定に制御すると共に加工物の姿勢は、研磨工具
に揺動を与えて、研磨面と研磨工具の接触状態を
インプロセス制御し、常に研磨面の法線を研磨工
具の軸方向に一致させる。更に加工物の回転数と
研磨工具と加工物との相対的な送り速度は、送り
テーブル上に設けた複数個のドツクからの位置検
出指令に基づくシーケンス制御ないしNC装置に
より制御するようにしたため、研削または切削加
工で得られた加工精度をくずすことなく、しかも
スクラツチを生じることなく加工物表面を研磨す
ることができる。[Operation] The polishing load applied to the polishing surface is controlled to be constant by constant pressure tracing control, and the posture of the workpiece is controlled by in-process control of the contact state between the polishing surface and the polishing tool by giving swing to the polishing tool, so that polishing is always maintained. Align the normal of the surface with the axial direction of the polishing tool. Furthermore, the rotational speed of the workpiece and the relative feed speed between the polishing tool and the workpiece are controlled by sequence control or an NC device based on position detection commands from multiple docks provided on the feed table. The surface of the workpiece can be polished without impairing the machining accuracy obtained by grinding or cutting, and without causing scratches.
また、定圧倣い制御装置により、研磨工具を間
欠的に上昇させることにより研磨面にピンホール
を生じさせることなく研磨できる。 Furthermore, by intermittently raising the polishing tool using the constant pressure profiling control device, polishing can be performed without creating pinholes on the polishing surface.
以下、本発明の実施例を図に基づいて説明す
る。
Embodiments of the present invention will be described below based on the drawings.
第１図は、本発明の全体構成を示す。研磨機本
体、油圧タンク、操作盤から成つている。研磨機
本体に関しては、研磨ヘツド１、この下端にとり
つけた研磨工具２、金型３を載置するテーブル１
８、金型回転用の直流モータ６、及び金型を傾斜
させるための直流モータ４、及びこれらをＹ方向
に移動させるテーブル７から成つている。 FIG. 1 shows the overall configuration of the present invention. It consists of the polishing machine itself, a hydraulic tank, and an operation panel. The main body of the polishing machine includes a polishing head 1, a polishing tool 2 attached to its lower end, and a table 1 on which a mold 3 is placed.
8, a DC motor 6 for rotating the mold, a DC motor 4 for tilting the mold, and a table 7 for moving these in the Y direction.
操作盤４７に関しては、金型回転数とテーブル
送り速度制御装置９、金型の姿勢制御装置１０、
定圧倣い制御装置１５から成つている。なお、油
圧タンク２７は別置きに設置されている。 Regarding the operation panel 47, a mold rotation speed and table feed speed control device 9, a mold attitude control device 10,
It consists of a constant pressure profiling control device 15. Note that the hydraulic tank 27 is installed separately.
第１図において、研磨ヘツド１は油圧シリンダ
１４により上下（Ｚ軸方向）に移動しうると共
に、定圧倣い制御装置１５により加工物である金
型３の研磨面に常に一定の荷重を付加するように
されている。変位検出器１３は研磨ヘツド１に設
置され研磨ヘツド１の下端に取りつけられた研磨
工具２のＺ軸方向の位置変化を検出するものであ
る。研磨工具２は金型３の判径方向に沿つて（第
１図では矢印に示したＹ方向）移動する位置に位
置決めされている。金型３は金型載置テーブル１
８に載置され、直流モータ６により回転される。
金型載置テーブル１８はサポート５により支持さ
れ、サポート５に配置される直流モータ４によつ
て金型３の姿勢が調整される。またサポート５は
研磨機のテーブル７上に固着されている。ホトセ
ンサ８は研磨工具２と金型３との位置関係を検出
するものである。 In FIG. 1, the polishing head 1 can be moved up and down (in the Z-axis direction) by a hydraulic cylinder 14, and is controlled by a constant pressure profiling control device 15 to always apply a constant load to the polishing surface of a mold 3, which is a workpiece. is being used. The displacement detector 13 is installed in the polishing head 1 and detects a change in the position of the polishing tool 2 attached to the lower end of the polishing head 1 in the Z-axis direction. The polishing tool 2 is positioned at a position where it can move along the radial direction of the mold 3 (in the Y direction indicated by the arrow in FIG. 1). Mold 3 is mold mounting table 1
8 and is rotated by a DC motor 6.
The mold mounting table 18 is supported by a support 5, and the attitude of the mold 3 is adjusted by a DC motor 4 disposed on the support 5. The support 5 is also fixed on the table 7 of the polishing machine. The photosensor 8 detects the positional relationship between the polishing tool 2 and the mold 3.
このために、テーブル７の側面には複数個のド
ツク３９が設けてある。これにより、金型３と研
磨工具２の相対的位置をホトセンサ８で検出でき
るようにしてある。このホトセンサ８からの検出
信号は金型回転数およびテーブル送り速度制御装
置９に送られこれ等の制御を行なう。金型３の姿
勢制御装置１０は直流モータ４等に係合し、金型
３の姿勢を制御する。工具揺動用モータ１１は研
磨工具２に前後方向に低速、小振巾の直線往複運
動を与える。 For this purpose, a plurality of dots 39 are provided on the side surface of the table 7. This allows the photosensor 8 to detect the relative position of the mold 3 and polishing tool 2. A detection signal from the photosensor 8 is sent to a mold rotation speed and table feed speed control device 9 to control these devices. A posture control device 10 for the mold 3 engages with a DC motor 4 and the like to control the posture of the mold 3. The tool swing motor 11 gives the polishing tool 2 a linear reciprocating motion at a low speed and a small amplitude in the front-rear direction.
なお、研磨ヘツド１の内部には研磨工具２を駆
動するための工具駆動用モータを有する。さら
に、研磨工具２を一定振幅でＹ方向に揺動できる
ようなガイドを内部に有している。リミツトスイ
ツチ１６および１７は研磨ヘツド１に設置され、
これは研磨面の傾き方向を判別するのに用いられ
る。 Incidentally, the polishing head 1 includes a tool driving motor for driving the polishing tool 2 inside. Furthermore, a guide is provided inside which allows the polishing tool 2 to be oscillated in the Y direction with a constant amplitude. Limit switches 16 and 17 are installed in the polishing head 1,
This is used to determine the direction of inclination of the polished surface.
次に、主要部の構成を説明する。まず、研磨面
にかかる研磨荷重を一定に保つための方法を述べ
る。 Next, the configuration of the main parts will be explained. First, a method for keeping the polishing load applied to the polished surface constant will be described.
第２図は定圧倣い制御装置１５の構成を示す。
研磨工具２に微小変位が与えられるとこの変位に
対応して研磨ヘツド１の上部に設けられた変位検
出軸４０が動く。この変位を変位検出器１３によ
つて検出しこの検出信号が増幅器３０に送られ、
サーボ回路２９、サーボバブル２８を動作させ、
油圧シリンダ１４により研磨ヘツド１を上方或い
は下方に移動させ一定荷重で研磨面に押し当てる
よう制御する。これによつて金型３は常に一定の
研磨荷重によつて研磨されることになる。なお第
２図で２７は油圧タンクである。 FIG. 2 shows the configuration of the constant pressure profiling control device 15.
When a minute displacement is applied to the polishing tool 2, a displacement detection shaft 40 provided at the top of the polishing head 1 moves in response to this displacement. This displacement is detected by the displacement detector 13, and this detection signal is sent to the amplifier 30,
Operate the servo circuit 29 and servo bubble 28,
The polishing head 1 is controlled to be moved upward or downward by the hydraulic cylinder 14 and pressed against the polishing surface with a constant load. As a result, the mold 3 is always polished with a constant polishing load. In addition, 27 in FIG. 2 is a hydraulic tank.
次に、金型の傾き状態と、金型の姿勢制御の方
法を示す。 Next, the inclination state of the mold and the method of controlling the posture of the mold will be explained.
第３図はテーブル７を前後方向（Ｙ方向）に送
つたときの金型３の傾き状態を示す。第３図ａは
回転方向１９に、第３図ｂは回転方向２０に金型
３がそれぞれ姿勢制御装置１０により制御された
状態を示す。いずれの場合にも金型３の研磨面の
法線が研磨工具２の軸方向に一致するように制御
されている。なお、第３図ａと第３図ｂの中間位
置においても同様に金型３の研磨面の法線が研磨
工具２の軸方向に一致するように制御される。ま
た、第３図ｃは金型３の姿勢を制御しない場合を
示し、研磨工具２のエツジの片当たりに金型の表
面にスクラツチが入る。 FIG. 3 shows the state of inclination of the mold 3 when the table 7 is sent in the front-rear direction (Y direction). FIG. 3a shows a state in which the mold 3 is controlled in the rotational direction 19, and FIG. 3b shows a state in which the mold 3 is controlled in the rotational direction 20 by the attitude control device 10. In either case, the normal to the polishing surface of the mold 3 is controlled to coincide with the axial direction of the polishing tool 2. In addition, at the intermediate position between FIG. 3a and FIG. 3b, control is similarly performed so that the normal line of the polishing surface of the mold 3 coincides with the axial direction of the polishing tool 2. Further, FIG. 3c shows a case where the attitude of the mold 3 is not controlled, and the surface of the mold is scratched when the edge of the polishing tool 2 touches one side.
この金型の姿勢を制御する手法は次のとうりで
ある。第４図は研磨ヘツド１を側面から見たもの
である。 The method for controlling the posture of the mold is as follows. FIG. 4 shows the polishing head 1 viewed from the side.
本図において、研磨ヘツド１の外側フレーム４
６に工具２を一定振巾δで、前後方向に揺動させ
るための駆動用モータ１１がとりつけてある。こ
のモータとクランク４７によつて、工具２、研磨
ヘツド１内部の点線で示した工具駆動用モータ４
８や、変位検出軸４０、スプリング４９、変位検
出器１３、ドツク４４，４５をとりつけたプレー
ト４３が一定振巾で揺動する。研磨ヘツド１の外
側フレームには、ドツク４４，４５に対応して、
リミツトスイツチ１６，１７が設置してある。 In this figure, the outer frame 4 of the polishing head 1
A driving motor 11 is attached to 6 for swinging the tool 2 back and forth with a constant amplitude δ. This motor and crank 47 drive the tool 2 and the tool drive motor 4 shown by the dotted line inside the polishing head 1.
8, a displacement detection shaft 40, a spring 49, a displacement detector 13, and a plate 43 to which docks 44 and 45 are attached, swing at a constant amplitude. On the outer frame of the polishing head 1, corresponding to the dots 44 and 45,
Limit switches 16 and 17 are installed.
研磨ヘツド１で、直流モータ１１により、研磨
工具２に揺動振巾δを与えながら研磨すると、第
５図に示すような信号が得られる。金型３の研磨
面の法線と研磨工具２の軸方向が一致しない状態
では、研磨工具２の揺動に同期して、変位検出器
１３には第５図ａの検出電圧波形３１で示すよう
に研磨面の傾き角に比例した振巾の電圧波形が得
られる。ここで変位検出軸４０が上昇する、すな
わち研磨工具２が押し上げられようとすると検出
電圧が＋となるように設定されている。また、こ
の検出電圧は押し上げられる量が多い程、高い電
圧を示す。第５図ａは縦軸に検出電圧Ｅ（ボル
ト）、横軸には研磨時間ｔをとつたものである。
このような状態に対し姿勢制御装置１０の設定電
圧３２に示すごとく研磨面の法線と研磨工具２の
軸方向がほぼ一致する０ボルト付近に設定し、こ
の設定電圧３２内に検出電圧３１がおさまるまで
直流モータ４を回転し、金型の姿勢を制御する。
３３は制御後の電圧波形を示している。なお研磨
面の傾き方向は、研磨ヘツド１上に配置した研磨
工具の揺動に伴つて作動するリミツトスイツチ１
６および１７によるON−OFF信号と変位検出器
１３からの検出電圧波形との位相関係から判別さ
れる。 When the polishing head 1 polishes the polishing tool 2 while applying a swing amplitude δ to the polishing tool 2, a signal as shown in FIG. 5 is obtained. When the normal to the polishing surface of the mold 3 and the axial direction of the polishing tool 2 do not match, the displacement detector 13 detects a voltage waveform 31 shown in FIG. 5a in synchronization with the swinging of the polishing tool 2. Thus, a voltage waveform with an amplitude proportional to the inclination angle of the polished surface is obtained. Here, when the displacement detection shaft 40 is raised, that is, when the polishing tool 2 is about to be pushed up, the detection voltage is set to be positive. Moreover, the larger the amount of this detected voltage is pushed up, the higher the voltage is. In FIG. 5a, the vertical axis represents the detected voltage E (volts), and the horizontal axis represents the polishing time t.
In such a situation, as shown in the set voltage 32 of the posture control device 10, the normal to the polishing surface and the axial direction of the polishing tool 2 are approximately coincident, which is around 0 volts, and the detected voltage 31 is within this set voltage 32. The DC motor 4 is rotated until the position of the mold is controlled.
33 shows the voltage waveform after control. Note that the direction of inclination of the polishing surface is determined by a limit switch 1 that operates as the polishing tool placed on the polishing head 1 swings.
This is determined based on the phase relationship between the ON-OFF signals from 6 and 17 and the detected voltage waveform from the displacement detector 13.
第５図では、電圧波形３１のとき、左のリミツ
トスイツチ１７をたたいたとき（ONの時）検出
電圧が＋となつているからこの場合の研磨面の傾
きは左側が高いことになる。 In FIG. 5, when the voltage waveform 31 is detected, the detected voltage is + when the left limit switch 17 is hit (ON), so the slope of the polishing surface in this case is higher on the left side.
第６図は姿勢制御装置のブロツク図を示す。変
位検出器１３からの検出信号は比較器３６に入
り、リミツトスイツチ１６および１７からの信号
と共に傾き方向判別回路３７に入り方向判別を
し、研磨面の傾き角制御回路３８により直流モー
タ４を駆動し金型の姿勢を制御する。 FIG. 6 shows a block diagram of the attitude control device. The detection signal from the displacement detector 13 enters the comparator 36, and together with the signals from the limit switches 16 and 17, enters the inclination direction determination circuit 37 to determine the direction, and the DC motor 4 is driven by the polishing surface inclination angle control circuit 38. Controls the posture of the mold.
次に、金型表面各点の研磨量を一定とするため
の制御方法を示す。研磨量を一定とするには、研
磨工具が接触している位置での金型の回転速度
と、研磨工具の相対移動間隔を同じにすることに
より達成される。 Next, a control method for keeping the polishing amount constant at each point on the mold surface will be described. A constant polishing amount is achieved by making the rotational speed of the die at the position where the polishing tool is in contact the same as the relative movement interval of the polishing tool.
第７図は金型回転数２３およびテーブル送り速
度２４と金型３の加工位置との関係を示す。すな
わち、金型３の外端部２５においては金型回転数
２３とテーブル送り速度２４とは両者とも低い
が、金型３の中心部２６に行くに従つて増大させ
るように設定してある。さらに詳述すると第８図
に示すごとく研磨工具２の金型３に対する相対的
な移動速度２２を金型３のどの位置においても一
定とするように金型回転数を金型の回転中心部に
向うに従つて増加させると共に、相対的な工具移
動軌跡２１の間隔Ｓと常に一定にするためテーブ
ル７の送り速度を金型の回転中心部に向うに従つ
て速くするように制御されている。この制御は前
記したごとく、金型３の直径に対応して設置した
複数個のドツク３９のＡ、Ｂ、…Ｉに対応して得
られるホトセンサ８からの信号をもとに金型回転
数およびテーブル送り速度制御装置９によつて行
なわれる。 FIG. 7 shows the relationship between the mold rotation speed 23, the table feed rate 24, and the machining position of the mold 3. That is, at the outer end 25 of the mold 3, the mold rotation speed 23 and the table feed speed 24 are both low, but are set to increase toward the center 26 of the mold 3. More specifically, as shown in FIG. 8, the mold rotation speed is adjusted to the center of rotation of the mold so that the relative moving speed 22 of the polishing tool 2 to the mold 3 is constant at any position on the mold 3. The feed speed of the table 7 is controlled to increase toward the center of rotation of the mold in order to always increase the feed speed toward the center of rotation of the mold and to keep it constant with the distance S of the relative tool movement locus 21. As mentioned above, this control is performed based on the signals from the photosensor 8 obtained in correspondence to the A, B, ... I of the plurality of docks 39 installed corresponding to the diameter of the mold 3, to control the mold rotation speed and the like. This is done by the table feed speed control device 9.
次に研磨工具の間欠的な上昇動作について説明
する。第９図ａおよび第９図ｂに示すごとく研磨
工具２が工具上昇のON−OFF信号３４，３５に
よつて上下に一定間かくで上下動する。この動作
により研磨工具の底面に研磨液が間欠的に補給さ
れ、工具面の焼付けを防止でき、結果として研磨
面に微妙な穴（いわゆるピンホール）が発生する
ことを防止する。 Next, the intermittent raising operation of the polishing tool will be explained. As shown in FIGS. 9a and 9b, the polishing tool 2 is moved up and down at fixed intervals in response to ON-OFF signals 34 and 35 for raising the tool. This operation replenishes the polishing liquid intermittently to the bottom of the polishing tool, preventing the tool surface from being seize and, as a result, preventing the formation of minute holes (so-called pinholes) on the polishing surface.
第１０図は研磨工具の間欠的な上昇動作を行な
う全体構成を示す。制御回路４１は一定周期の上
昇指令を出す回路で、この指令信号はサーボ回路
２９に入力され油圧シリンダ１４により研磨工具
に上昇動作を与える。 FIG. 10 shows the overall configuration for performing intermittent lifting operations of the polishing tool. The control circuit 41 is a circuit that issues an ascending command at a constant period. This command signal is input to the servo circuit 29, and the hydraulic cylinder 14 causes the polishing tool to perform an ascending motion.
制御回路４１は、油圧サーボ回路２９へ一定周
期で電圧を印加するものである。電圧Ｅ（Ｖ）を
時間t1（sec）だけサーボ回路２９へ入れると、油
圧サーボバルブ２８のスプールのバランスがくず
れるため、研磨ヘツド１と共に研磨工具２は上昇
し、第９図ｂの左側のようになる。時間t1が経過
後印加電圧がＯ（Ｖ）になると、油圧サーボバル
ブのスプールはバランスがとれるため、研磨工具
２は、t2（sec）間金型表面に接触し、第９図ｂの
右側のようになる。なお、スイツチ４２は、研磨
工具２が上昇する時間t1（sec）だけ、研磨工具２
の変化によつて得られる検出信号を姿勢制御装置
１０に入力しないためのスイツチである。 The control circuit 41 applies voltage to the hydraulic servo circuit 29 at regular intervals. When the voltage E (V) is applied to the servo circuit 29 for a time t 1 (sec), the spool of the hydraulic servo valve 28 becomes unbalanced, and the polishing tool 2 rises together with the polishing head 1, causing the polishing tool 2 to rise as shown on the left in FIG. It becomes like this. When the applied voltage becomes O (V) after time t 1 has elapsed, the spool of the hydraulic servo valve is balanced, so the polishing tool 2 comes into contact with the mold surface for t 2 (sec), as shown in Fig. 9b. It will look like the one on the right. Note that the switch 42 causes the polishing tool 2 to rise only for the time t 1 (sec) during which the polishing tool 2 rises.
This is a switch for not inputting a detection signal obtained by a change in the attitude control device 10 to the attitude control device 10.
したがつて、金型の姿勢を制御する時間はt2
（sec）の間である。 Therefore, the time to control the mold attitude is t 2
(sec).
以上の構成によつて、研磨工具軸方向と金型の
研磨面の法線方向は常に一致させることができ、
また研磨荷重も常に形状に沿つて一定に保持さ
れ、かつ、相対的な工具移動軌跡が等間隔で研磨
面上の各点における研磨工具の移動速度も一定で
あるため最良の状態で研磨することができる。か
つ、これ等の動作はすべて自動的に制御されるた
め自動研磨が実施可能となる。
With the above configuration, the axial direction of the polishing tool and the normal direction of the polishing surface of the mold can always be matched.
In addition, the polishing load is always kept constant along the shape, and the relative tool movement trajectory is at equal intervals, and the speed of movement of the polishing tool at each point on the polishing surface is constant, so polishing can be performed in the best condition. Can be done. Moreover, since all these operations are automatically controlled, automatic polishing becomes possible.
以上の説明によつても明らかのごとく、本発明
によれば、加工物の研磨面の法線方向を研磨工具
の軸方向に一致させることにより研磨工具のエツ
ジの片当たりによつて生じるスクラツチが発生す
ることなく、また、研磨荷重が一定となり、か
つ、研磨位置に対応した加工物の回転速度および
研磨工具の送り速度を与えることにより最良の条
件で研磨することができ、研磨前の形状精度をそ
こなうことなく高品質の研磨を行うことができ
る。さらに間欠的な研磨工具の上昇動作により研
磨面にピンホールを発生させない効果を上げるこ
とができる。 As is clear from the above description, according to the present invention, by aligning the normal direction of the polished surface of the workpiece with the axial direction of the polishing tool, scratches caused by uneven contact of the edge of the polishing tool can be avoided. In addition, by keeping the polishing load constant and providing the rotation speed of the workpiece and the feed rate of the polishing tool that correspond to the polishing position, polishing can be performed under the best conditions, and the shape accuracy before polishing can be improved. High-quality polishing can be performed without damaging the surface. Furthermore, the intermittent lifting movement of the polishing tool can improve the effect of preventing pinholes from occurring on the polishing surface.
第１図は本発明に係る研磨方法を実施するため
の装置の一例を示す全体構成図、第２図は定圧倣
い制御の構成を示す構成図、第３図は金型の姿勢
制御を説明するための説明図、第４図は研磨ヘツ
ドの詳細を示す側面図、第５図は金型の姿勢制御
信号を説明するための説明図、第６図は金型の姿
勢制御の制御ブロツク図、第７図は研磨工具の位
置と金型回転数及びテーブル送り速度との関係を
示す図、第８図は工具移動軌跡を示す説明図、第
９図は間欠的な研磨工具の上昇動作を説明するた
めの説明図、第１０図は間欠的な研磨工具の上昇
動作制御のための構成を示す構成図である。
１……研磨ヘツド、２……研磨工具、３……金
型、４，６……直流モータ、５……サポート、７
……テーブル、８……ホトセンサ、９……金型回
転数、テーブル送り送度制御装置、１０……姿勢
制御装置、１１……工具揺動用モータ、１２……
テーブル送り用モータ、１３……変位検出器、１
４……油圧シリンダ、１５……定圧倣い制御装
置、１６，１７……リミツトスイツチ、１８……
金型載置テーブル、２７……油圧タンク、２８…
…サーボバルブ、２９……サーボ回路、３０……
増幅器、３６……比較器、３７……傾き方向判別
回路、３８……研磨面傾き角制御回路、４１……
研磨工具の上昇動作制御回路、４２……スイツ
チ、４４，４５……ドツク、４６……研磨ヘツド
外側フレーム、４７……操作盤、４８……工具駆
動用モータ。
Fig. 1 is an overall configuration diagram showing an example of an apparatus for carrying out the polishing method according to the present invention, Fig. 2 is a configuration diagram showing the configuration of constant pressure profiling control, and Fig. 3 explains mold attitude control. FIG. 4 is a side view showing details of the polishing head, FIG. 5 is an explanatory diagram for explaining the mold attitude control signal, and FIG. 6 is a control block diagram for mold attitude control. Figure 7 is a diagram showing the relationship between the position of the polishing tool, mold rotation speed, and table feed speed, Figure 8 is an explanatory diagram showing the tool movement trajectory, and Figure 9 is an explanation of the intermittent raising movement of the polishing tool. FIG. 10 is a configuration diagram showing a configuration for controlling the intermittent lifting operation of the polishing tool. 1... Polishing head, 2... Polishing tool, 3... Mold, 4, 6... DC motor, 5... Support, 7
...Table, 8...Photo sensor, 9...Mold rotation speed, table feed rate control device, 10...Position control device, 11...Tool swing motor, 12...
Table feed motor, 13... Displacement detector, 1
4... Hydraulic cylinder, 15... Constant pressure copying control device, 16, 17... Limit switch, 18...
Mold mounting table, 27... Hydraulic tank, 28...
...Servo valve, 29...Servo circuit, 30...
Amplifier, 36... Comparator, 37... Inclination direction discrimination circuit, 38... Polishing surface inclination angle control circuit, 41...
A control circuit for raising the polishing tool, 42... switch, 44, 45... dock, 46... polishing head outer frame, 47... operation panel, 48... tool drive motor.
Claims (1)
により倣わせながら研磨する非球面研磨装置にお
いて、加工物の研磨面に加わる研磨荷重が一定に
なるように制御する手段と、加工物の研磨面の法
線が研磨工具の軸方向に一致するよう加工物の姿
勢を制御する手段と、研磨面の各点における研磨
工具の移動速度が一定となると共に研磨工具の移
動軌跡が等間隔渦巻状になるように加工物の回転
速度及び研磨工具の送り速度を研磨工具が加工物
の回転中心に近づくに従い大きくする手段と、研
磨面に対して研磨工具を間欠的に上下動させる手
段とを備えたことを特徴とする非球面研磨装置。1. In an aspherical surface polishing device that polishes the aspherical shape of a workpiece that is symmetrical about the rotational axis while tracing it with a polishing tool, there is provided a means for controlling the polishing load applied to the polished surface of the workpiece to be constant, and a method for polishing the workpiece. A means for controlling the posture of the workpiece so that the normal to the surface coincides with the axial direction of the polishing tool, a means for controlling the posture of the workpiece so that the speed of movement of the polishing tool at each point on the polishing surface is constant, and a movement trajectory of the polishing tool is spirally spaced at equal intervals. means for increasing the rotational speed of the workpiece and the feed rate of the polishing tool as the polishing tool approaches the center of rotation of the workpiece, and means for intermittently moving the polishing tool up and down with respect to the polishing surface. This is an aspherical surface polishing device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8954681A JPS57205058A (en) | 1981-06-12 | 1981-06-12 | Abrasion method of non-spherical surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8954681A JPS57205058A (en) | 1981-06-12 | 1981-06-12 | Abrasion method of non-spherical surface |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57205058A JPS57205058A (en) | 1982-12-16 |
| JPH0155946B2 true JPH0155946B2 (en) | 1989-11-28 |
Family
ID=13973809
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8954681A Granted JPS57205058A (en) | 1981-06-12 | 1981-06-12 | Abrasion method of non-spherical surface |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57205058A (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60114458A (en) * | 1983-11-26 | 1985-06-20 | Nippon Kogaku Kk <Nikon> | Spherical surface generating grinding device for lenses |
| JPS63232940A (en) * | 1987-03-19 | 1988-09-28 | Canon Inc | polishing equipment |
| JPS63232939A (en) * | 1987-03-19 | 1988-09-28 | Canon Inc | polishing equipment |
| JPS63232956A (en) * | 1987-03-19 | 1988-09-28 | Canon Inc | Polishing method |
| JPH01146652A (en) * | 1987-11-30 | 1989-06-08 | Matsushita Electric Ind Co Ltd | Aspheric polishing device |
| JP6437337B2 (en) * | 2015-02-17 | 2018-12-12 | 東芝機械株式会社 | Grinding apparatus and grinding method |
-
1981
- 1981-06-12 JP JP8954681A patent/JPS57205058A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57205058A (en) | 1982-12-16 |
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