JPH0156883B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to improvements in a cutting method and apparatus for cutting a semiconductor ingot into thin slices to obtain wafers.

(Prior art and its problems) Conventionally, the cutting method for cutting semiconductor ingots into thin slices has been to use an outer circumferential rotary blade or an inner circumferential rotary blade, that is, a disk with diamond abrasive material attached to the outer or inner circumferential edge. A method has been proposed in which a shaped rotating blade is applied to the ingot to cut it. Among these, the inner circumference type is often used because it causes less runout during cutting than the outer circumference type, but when the ingot to be cut has a large diameter, even the inner circumference type tends to cause noticeable runout, and The problem is that the device also becomes larger.

Furthermore, problems remain in the processing of wafers after they have been cut into thin slices from the ingot. In other words, since the thinly sliced wafer is fragile, there is a risk that it will be damaged by the shock when it is cut off, and there is a strong desire for a means to safely collect and process the thinly sliced wafer.

(Means for Solving the Problems) This invention was made to solve the above-mentioned problems, and takes advantage of the cutting method using an internal rotary blade (hereinafter referred to as an internal blade). It is an object of the present invention to provide a cutting method and device capable of cutting large-diameter ingots without increasing the diameter of an inner circumferential blade.

Another object of the present invention is to provide a cutting method and apparatus that can significantly improve work efficiency by cutting an ingot into thin slices to obtain wafers and then transferring the wafers.

That is, in the first invention, when cutting a wafer from the ingot by applying rotation to the ingot and relatively moving the rotating ingot and an inner circumferential rotating blade surrounding the rotating ingot, the wafer is cut off. After being adsorbed and held by the negative pressure suction member before and completely cut off, the movable pedestal, the housing disposed above it, the suction tube supported by the housing, and the tip of the suction tube The gist of the invention is a cutting method characterized in that the ingot is transferred by a transfer device consisting of rotatably connected suction cups. A device that rotates by attaching an internal rotary blade to one mouth of a rotary cylinder, and a suction cup inserted into the cylinder from the other mouth of the rotary cylinder before the wafer is cut off from the ingot by the relative movement of both devices. It consists of a transfer device that is inserted and held by suction by negative pressure suction, and then transferred after being completely cut off.
The transfer device is characterized by comprising a movable pedestal, a housing disposed on the movable pedestal, a suction tube supported by the housing, and a suction cup rotatably connected to the tip of the suction tube. The gist of this paper is a cutting device for cutting.

(Example) The present invention will be explained in detail below based on FIGS. 1 and 2 showing an example of its implementation.

In the drawings, reference numerals 1 and 2 indicate pedestals, and a machine for supporting and rotating the ingot is disposed on one pedestal 1. That is, 3 is a motor for rotationally driving the ingot, and its rotating shaft is connected to a driven shaft 6 through a joint 5 in the bearing housing 4, and at the shaft end of the driven shaft 6 protruding from the bearing housing 4, Ingot support plate 8 via joint 7
are connected to each other, and an ingot 9 is bonded and supported on this support plate 8 with an adhesive.

A mechanism is disposed on the pedestal 2 to attach and rotate an inner peripheral blade that surrounds the ingot in order to cut the ingot at the inner peripheral edge. That is, 10 is a bearing body, and 11 is a rotary cylinder supported by it. An internal circumferential blade 12 is attached to the cylinder mouth facing the ingot 9, and is installed on the cylinder mouth and the pedestal 2 on the opposite side. A pulley 14 on the motor 13 side is linked by a belt 15.

16 is a pedestal for the negative pressure suction member. That is,
Reference numeral 17 denotes a housing, into which a suction tube 18 is inserted and supported, and a porous suction cup 19 is rotatably held in communication with the tip of the housing, and the tube portion on the opposite side is connected to a vacuum pump (not shown). ing.

Next, a method of cutting an ingot into thin slices using the cutting device configured as described above will be explained.

First, as shown in FIG. 1, the ingot 9 and the inner circumferential blade 12 are set in a relative position where cutting can be performed using the pedestals 1 and 2, and the pedestals 16
, the suction cup 19 is placed in a position facing the end face of the ingot 9 with a slight gap, and the ingot 9 is driven to rotate at a low speed by the motor 3.
The inner circumferential blade 12 is driven to rotate at high speed by a motor 13. Next, by suctioning negative pressure from the suction pipe 18, the suction cup 19 is adsorbed to the end face of the ingot 9, and when one of the pedestals 1 and 2 is moved upward or downward in the figure, as shown in FIG. As such, the ingot 9 is cut by the internal circumferential blade 12. In addition, when moving the pedestal 1, the pedestal 16 is also moved together with the pedestal 1, and the suction cup 1 is moved.
9 and the ingot so that their opposing positions do not change.

Since the suction cup 19 attached to the end face of the ingot is rotatable, it rotates the ingot and rotates accordingly, and when the cutting process is completed and the wafer is completely cut off, It is sucked and held as it is on the suction cup 19 without falling. The wafer is transferred to a predetermined location by moving the pedestal 16 and removed from the suction cup, completing one cutting operation.

(Effects of the Invention) Thus, by carrying out the cutting method of the present invention using the cutting device of the present invention, the following effects can be obtained.

(1) Since this cutting method uses an internal rotating blade, the advantage of this method with less runout can be utilized as is.

(2) Since the ingot also rotates during cutting,
The depth of cut into the ingot by the internal blade is only half the diameter of the ingot, so that a large-diameter ingot can be cut with a small-diameter blade and the cutting speed is approximately twice that.
Also, there is no "belly button" left in the center of the ingot.

(3) Even if the diameter of the ingot increases, it is possible to avoid increasing the size of the internal blade and equipment.

(4) Wafers that are cut into thin slices from an ingot are held by suction before being cut off, so fragile wafers can be safely recovered.

(5) The inner circumferential blade is attached to one opening of the rotating cylinder, and the other opening is wide open, so it is easy to insert a suction cup from here and bring it close to the ingot to attract it. Since the cut wafer can be immediately transferred to a predetermined location while being adsorbed on the suction cup, the structure is simple and work efficiency is improved.

As described above, according to the cutting method and apparatus of the present invention, it is possible to cut large-diameter ingots, greatly increase cutting speed, and safely and quickly cut wafers after they have been completely cut. The cutting device can be recovered at a low cost, and the cutting device can be manufactured at a low cost, all of the problems of conventional cutting methods and devices can be solved.

[Brief explanation of drawings]

Fig. 1 is a longitudinal sectional view of a cutting device showing an embodiment of the present invention, Fig. 2 is a partial end view thereof, and Fig. 3 is an explanatory diagram showing a state in which an ingot is cut with an internal blade. be. 1, 2, 16... cradle, 3, 13... motor,
4... Bearing housing, 5, 7... Joint, 6...
Driven shaft, 8... Support plate, 9... Ingot, 10
... Bearing body, 11 ... Rotating cylinder, 12 ... Inner circumferential blade, 14 ... Pulley, 15 ... Belt, 1
7... Housing, 18... Suction pipe, 19... Suction cup.

Claims (1)

[Scope of Claims] 1. When cutting a wafer from the ingot by applying rotation to the ingot and relatively moving the rotating ingot and an internal rotary blade surrounding it, before the wafer is cut off. After being suctioned and held by a negative pressure suction member and completely cut off, a movable pedestal, a housing disposed above it, a suction tube supported by the housing, and a rotation at the tip of the suction tube are attached. A cutting method characterized in that the cutting material is transported by a transporting device consisting of freely communicated suction cups. 2. A device that supports and rotates the ingot, and a device that rotates an internal rotary blade surrounding the ingot by attaching it to the opening of a rotating cylinder, and the relative movement of both devices causes the wafer to be cut off from the ingot. A suction cup is inserted into the cylinder from the other cylinder opening of the rotary cylinder, and the suction cup is suctioned and held by a negative pressure suction action, and the transfer device is transferred after being completely cut off. A cutting device comprising: a housing disposed thereon; a suction tube supported by the housing; and a suction cup rotatably connected to the tip of the suction tube. 3. The device that supports and rotates the ingot is
3. The apparatus according to claim 2, comprising a movable pedestal, a motor installed on the movable pedestal, and an ingot support plate rotationally driven by the motor. 4. The device that rotates the internal rotary blade that surrounds the ingot by attaching it to the mouth of a rotary cylinder includes a movable pedestal, a motor installed on the movable pedestal, and an internal rotary blade that is rotationally driven by the movable pedestal. 3. The device according to claim 2, comprising a rotary tube equipped with a blade.