JPH0211029B2 - - Google Patents
Info
- Publication number
- JPH0211029B2 JPH0211029B2 JP11927384A JP11927384A JPH0211029B2 JP H0211029 B2 JPH0211029 B2 JP H0211029B2 JP 11927384 A JP11927384 A JP 11927384A JP 11927384 A JP11927384 A JP 11927384A JP H0211029 B2 JPH0211029 B2 JP H0211029B2
- Authority
- JP
- Japan
- Prior art keywords
- metal
- metal plate
- insulating layer
- groove
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Laminated Bodies (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
【発明の詳細な説明】
〔技術分野〕
本発明は金属板の所定箇所に溝部を形成した金
属ベース積層板に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a metal base laminate in which grooves are formed at predetermined locations on a metal plate.
従来の金属板１に絶縁層２を介して金属箔３を
張着させて形成した金属ベース積層板A′にあつ
ては、金属ベースプリント配線基板B′として発
熱部品を実装した場合には、発熱部品からの熱を
金属板１を通して周囲に伝えてしまい熱に弱い他
の実装部品に悪影響を与えてしまつていた。又所
定寸法に切断したり、スルホール用の孔明け加工
を施した場合には、第８図及び第９図に示すよう
に金属板１に形成しただれ６により切り込みない
しは打ち込み側で絶縁層２が剥離してしまい金属
板１との間に間隙８が形成し、金属ベースプリン
ト配線基板B′としては防錆性、耐湿耐水性の点
で、信頼性に乏しいものであつた。
In the case of a metal base laminate A' formed by pasting a metal foil 3 on a conventional metal plate 1 via an insulating layer 2, when a heat generating component is mounted as a metal base printed wiring board B', Heat from the heat-generating components is transmitted to the surroundings through the metal plate 1, which has an adverse effect on other mounted components that are sensitive to heat. Furthermore, when the metal plate 1 is cut to a predetermined size or drilled for through-holes, the insulating layer 2 may be damaged on the cut or implanted side by the sag 6 formed in the metal plate 1, as shown in FIGS. 8 and 9. As a result of peeling, a gap 8 was formed between the metal plate 1 and the metal base printed wiring board B', which was unreliable in terms of rust prevention, moisture resistance, and water resistance.
本発明は上記事情に鑑みて為されたものであ
り、金属板の所定箇所に溝部を形成することによ
り、発熱部品を実装した場合にも、熱に弱い他の
実装部品に悪影響を与えることがなく、しかも切
断又は孔明け加工を行つた際にも、だれの形成に
より絶縁層が剥離することもなく、防錆性、耐湿
耐水性を確保でき、信頼性の高い金属ベースプリ
ント配線基板を得ることができる金属ベース積層
板を提供することにある。
The present invention has been made in view of the above circumstances, and by forming grooves at predetermined locations on a metal plate, even when a heat-generating component is mounted, it does not adversely affect other mounted components that are sensitive to heat. To obtain a highly reliable metal-based printed wiring board that does not cause peeling of the insulating layer due to the formation of holes even when cutting or drilling, and ensures rust prevention, moisture resistance, and water resistance. The object of the present invention is to provide a metal-based laminate that can be used.
本発明の金属ベース積層板は、金属板１に絶縁
層２を介して金属箔３を張着させて形成した金属
ベース積層板Ａであつて、発熱部品４実装予定箇
所４ａの周辺部に対応する金属板１の部分に溝部
５を形成して成ることを特徴とするものであり、
この構成により上記目的を達成できたものであ
る。即ち、溝部５において熱伝導を低下させるこ
とができるものである。
The metal base laminate A of the present invention is a metal base laminate A formed by adhering a metal foil 3 to a metal plate 1 via an insulating layer 2, and corresponds to the peripheral area 4a of the planned mounting location of the heat generating component 4. It is characterized in that a groove portion 5 is formed in the portion of the metal plate 1 that is
With this configuration, the above object was achieved. That is, heat conduction in the groove portion 5 can be reduced.
以下本発明を添付の図面に示す実施例に基づい
て詳細に説明する。本発明における金属板１とし
ては銅板、アルミニウム板、真ちゆう板、鉄板、
ステンレス鋼板、ニツケル板、ケイ素鋼板などい
ずれをも採用でき、通常厚み0.5〜2.0mmの範囲の
ものを用いる。この金属板１の片面に溝部５を設
けている。この溝部５の平面形状は第１図に示す
ように四角形状に形成しており、断面形状は第２
図に示すように三角形状としている。尚、溝部５
の平面形状は第３図に示すようにｙ字状とかであ
つてもよく、発熱部品４実装予定箇所４ａの周辺
部に対応するような形状であればよい。又溝部５
の断面形状も第４図に示すように四角形状（同図
ａ）又は半円形状（同ｂ）等いずれでもよく、更
にこの溝部５は第４図に示すように金属板１の両
面に形成しておいてもよい。この金属板１の両面
に絶縁層３を介して金属箔４を張着させて、例え
ば１ｍ×１ｍの金属ベース積層板Ａを形成してい
る。絶縁層２としてはガラス布、アスベストペー
パー、合織布などの基材にエポキシ樹脂、エノー
ル樹脂、不飽和ポリエステル樹脂等の熱硬化性樹
脂又は熱可塑性樹脂を含浸させたものを用いるこ
とができる。金属箔３としては銅箔、アルミニウ
ム箔、真ちゆう箔、鉄箔、ステンレス鋼箔、ニツ
ケル箔、ケイ素鋼箔などいずれをも採用できる。
この金属箔３を金属板１の片面にのみ絶縁層２を
介して張着させてもよい。尚、この金属ベース積
層板Ａは熱盤間に、金属板１の両面に絶縁層２を
配置し、絶縁層２の両面に金属箔３を配置したも
のを一セツトとし複数セツト配置し、通常の条件
にて積層成形して得ることができる。金属箔３の
裏面に接着剤を塗布して絶縁層２との接着強度を
大きくするようにしてもよい。このように構成し
た金属ベース積層板Ａにあつては、このまま金属
ベースプリント配線基板Ｂとして用い発熱部品実
装予定箇所４ａに発熱部品４を実装すれば、溝部
５内にも絶縁層２が存在することから、この溝部
５で金属板１の熱伝導が低下し、他の箇所に実装
した他の部品に熱により悪影響を与えることがな
い。又６図に示すように金属板１の溝部５側から
溝部５に即して金型によるプレス加工又はシヤー
による切断等で切断又は孔明け加工を施して金属
ベースプリント配線基板Ｂを形成した場合には、
金属板１の溝部５内にも絶縁層２が存在している
ので、第６図に示すように加工により金属板１の
溝部５の底壁でだれ６が形成したとしても、絶縁
層２の剥離はＣ部分でのみ発生し、溝部５の側壁
が段部となり、形成した回路７の下の絶縁層２は
剥離することがない。例えば、加工端面からＬ＝
２mmの部分に回路７を形成した場合にあつては、
塩水（５重量％）を96時間噴霧した際、第７図に
示す本発明の実施例のもの（L1＝L2＝１mm）で
は96時間後にも回路６の下の絶縁層２部分が剥離
することがなかつたが、従来のもの（第９図）で
は剥離していて実用に供せないものであつた。又
溝部５に即して加工を行うので、加工端面では金
属板１の露出面積が小さくなり、防錆性もそれだ
け良好となる。尚、金属板１に第３図に示すよう
に溝部５を両面に設けておけば、切断又は孔明け
加工を金属ベース積層板Ａの両面側から行うこと
ができる。 The present invention will be described in detail below based on embodiments shown in the accompanying drawings. The metal plate 1 in the present invention includes a copper plate, an aluminum plate, a brass plate, an iron plate,
Stainless steel plates, nickel plates, silicon steel plates, etc. can be used, and the thickness is usually in the range of 0.5 to 2.0 mm. A groove portion 5 is provided on one side of this metal plate 1. The planar shape of this groove portion 5 is square as shown in FIG.
As shown in the figure, it has a triangular shape. In addition, the groove part 5
The planar shape of may be a Y-shape as shown in FIG. 3, or may be any shape that corresponds to the periphery of the location 4a where the heat generating component 4 is scheduled to be mounted. Also groove part 5
The cross-sectional shape of the metal plate 1 may be either square (a) or semicircular (b) as shown in FIG. You can leave it as is. Metal foils 4 are attached to both sides of this metal plate 1 via an insulating layer 3 to form a metal base laminate A of, for example, 1 m x 1 m. As the insulating layer 2, a base material such as glass cloth, asbestos paper, or woven fabric impregnated with thermosetting resin or thermoplastic resin such as epoxy resin, enol resin, or unsaturated polyester resin can be used. As the metal foil 3, copper foil, aluminum foil, brass foil, iron foil, stainless steel foil, nickel foil, silicon steel foil, etc. can be used.
This metal foil 3 may be attached only to one side of the metal plate 1 with the insulating layer 2 interposed therebetween. In addition, this metal base laminate A is arranged in plural sets, with one set consisting of an insulating layer 2 arranged on both sides of a metal plate 1 and a metal foil 3 arranged on both sides of the insulating layer 2, between hot platens. It can be obtained by lamination molding under the following conditions. An adhesive may be applied to the back surface of the metal foil 3 to increase the adhesive strength with the insulating layer 2. If the metal base laminate A configured in this way is used as the metal base printed wiring board B as it is and the heat generating component 4 is mounted in the heat generating component mounting location 4a, the insulating layer 2 will also exist in the groove 5. Therefore, the heat conduction of the metal plate 1 is reduced in the groove portion 5, and other components mounted at other locations are not adversely affected by the heat. Further, as shown in Fig. 6, when the metal base printed wiring board B is formed by cutting or punching from the groove 5 side of the metal plate 1 by pressing with a mold or cutting with a shear in line with the groove 5. for,
Since the insulating layer 2 is also present in the groove 5 of the metal plate 1, even if a drop 6 is formed on the bottom wall of the groove 5 of the metal plate 1 due to processing as shown in FIG. Peeling occurs only at portion C, the side wall of the groove 5 becomes a stepped portion, and the insulating layer 2 under the formed circuit 7 does not peel off. For example, L= from the machined end surface
In the case where the circuit 7 is formed in the 2mm part,
When salt water (5% by weight) was sprayed for 96 hours, in the embodiment of the present invention shown in Fig. 7 (L 1 = L 2 = 1 mm), two portions of the insulating layer under the circuit 6 peeled off even after 96 hours. However, the conventional one (FIG. 9) peeled off and could not be put to practical use. Further, since the processing is carried out in line with the groove 5, the exposed area of the metal plate 1 at the processed end face is reduced, and the rust prevention properties are improved accordingly. If grooves 5 are provided on both sides of the metal plate 1 as shown in FIG. 3, cutting or drilling can be performed from both sides of the metal base laminate A.
本発明にあつては、発熱部品実装予定箇所の周
辺部に対応する金属板の部分に溝部を形成してい
るので、金属ベースプリント配線基板として発熱
部品を実装した場合、溝部内にも絶縁層が存在す
ることから、この溝部で金属板の熱伝導性が低下
し、他の箇所の熱に弱い実装部品に悪影響を与え
ることがなく、又金属板の溝部側から溝部に即し
て金型によるプレス加工又はシヤーによる切断等
で切断又は孔明け加工を施して金属ベースプリン
ト配線基板を形成した場合には、打し込み側ない
し切り込み側で溝部の底壁にだれが形成しても側
壁が段部となり、形成した回路の下の絶縁層は金
属板から剥離することがなく、しかも溝部に即ち
て加工を行うので、加工端面では金属板の露出面
積が小さくなり、防錆性もそれだけ良好となるも
のであり、このように防錆性、耐湿耐水性を有
し、信頼性の高い金属ベースプリント配線基板を
得ることができる。
In the present invention, since the groove is formed in the part of the metal plate corresponding to the peripheral area of the place where the heat generating component is planned to be mounted, when the heat generating component is mounted as a metal-based printed wiring board, an insulating layer is also formed in the groove. Because of the presence of this groove, the thermal conductivity of the metal plate decreases in this groove, which does not adversely affect the mounted components that are sensitive to heat in other parts. If a metal-based printed wiring board is formed by cutting or drilling by pressing or shearing, the sidewalls will be damaged no matter who forms the bottom wall of the groove on the driving side or the notch side. The insulating layer under the formed circuit does not peel off from the metal plate, and since the processing is performed along the groove, the exposed area of the metal plate at the processed end is small, and the rust prevention is also improved accordingly. As described above, it is possible to obtain a highly reliable metal-based printed wiring board that has rust resistance, moisture resistance, and water resistance.
第１図及び第２図は本発明の一実施例を示す平
面図及び断面図、第３図は本発明の他の実施例を
示す平面図、第４図ａ，ｂ及び第５図ａ，ｂ，ｃ
はそれぞれ本発明の更に他の実施例を示す断面
図、第６図は第１図に示す実施例により得た金属
ベースプリント配線基板を示す断面図、第７図は
第６図に示す金属ベースプリント配線基板に回路
を形成した状態で示す断面図、第８図及び第９図
は従来例から得た金属ベースプリント配線基板を
示す断面図及び一部省略した断面図、第１０図は
同上より得た金属ベースプリント配線基板に回路
を形成した状態を示す断面図であつて、Ａは金属
ベース積層板、Ｂは金属ベースプリント配線基
板、１は金属板、２は絶縁層、３は金属箔、４は
発熱部品、４ａは発熱部品実装予定箇所、５は溝
部である。
1 and 2 are a plan view and a sectional view showing one embodiment of the present invention, FIG. 3 is a plan view showing another embodiment of the present invention, FIGS. 4 a, b, and 5 a, b, c
6 is a sectional view showing still another embodiment of the present invention, FIG. 6 is a sectional view showing a metal base printed wiring board obtained according to the embodiment shown in FIG. 1, and FIG. A cross-sectional view showing a state in which a circuit is formed on a printed wiring board, FIGS. 8 and 9 are a cross-sectional view and a partially omitted cross-sectional view showing a metal-based printed wiring board obtained from a conventional example, and FIG. 10 is from the same. 1 is a cross-sectional view showing a state in which a circuit is formed on the obtained metal-based printed wiring board, in which A is a metal-based laminate, B is a metal-based printed wiring board, 1 is a metal plate, 2 is an insulating layer, and 3 is a metal foil. , 4 is a heat-generating component, 4a is a planned location for mounting the heat-generating component, and 5 is a groove.
Claims (1)
形成した金属ベース積層板であつて、発熱部品実
装予定箇所の周辺部に対応する金属板の部分に溝
部を形成して成ることを特徴とする金属ベース積
層板。1. A metal base laminate formed by pasting metal foil on a metal plate through an insulating layer, with grooves formed in the part of the metal plate corresponding to the periphery of the area where heat-generating components are planned to be mounted. Characteristic metal-based laminate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11927384A JPS60262636A (en) | 1984-06-11 | 1984-06-11 | Metallic-base laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11927384A JPS60262636A (en) | 1984-06-11 | 1984-06-11 | Metallic-base laminated board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60262636A JPS60262636A (en) | 1985-12-26 |
| JPH0211029B2 true JPH0211029B2 (en) | 1990-03-12 |
Family
ID=14757281
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11927384A Granted JPS60262636A (en) | 1984-06-11 | 1984-06-11 | Metallic-base laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60262636A (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0691303B2 (en) * | 1987-11-30 | 1994-11-14 | イビデン株式会社 | Printed wiring board equipment with electronic components |
| SG162620A1 (en) | 2003-04-15 | 2010-07-29 | Denki Kagaku Kogyo Kk | Metal base circuit board and its production process |
| JP2005039112A (en) * | 2003-07-17 | 2005-02-10 | Denki Kagaku Kogyo Kk | Metal base circuit board |
| DE102019208108A1 (en) * | 2019-06-04 | 2020-12-10 | Zf Friedrichshafen Ag | SUBSTRATE STRUCTURE IN ONE PERFORMANCE MODULE AND MANUFACTURING PROCESS FOR IT |
-
1984
- 1984-06-11 JP JP11927384A patent/JPS60262636A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60262636A (en) | 1985-12-26 |
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