JPH0211079B2 - - Google Patents
Info
- Publication number
- JPH0211079B2 JPH0211079B2 JP56085508A JP8550881A JPH0211079B2 JP H0211079 B2 JPH0211079 B2 JP H0211079B2 JP 56085508 A JP56085508 A JP 56085508A JP 8550881 A JP8550881 A JP 8550881A JP H0211079 B2 JPH0211079 B2 JP H0211079B2
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- ceramic
- blank
- manufacturing
- ultrasonic probe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Transducers For Ultrasonic Waves (AREA)
Description
【発明の詳細な説明】
本発明は、医療用超音波診断装置等に用いられ
る超音波探触子の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing an ultrasonic probe used in a medical ultrasonic diagnostic device or the like.
従来、電圧体として圧電セラミツクスを使用す
る超音波探触子、例えば、医療用超音波診断装置
に用いられる探触子として配列型探触子が用いら
れているが、その製造方法は、一般に既に第1図
a,b,cのように分極をほどこしたセラミツク
スをダンパーに接着し、切断し、コーテングする
などの製造工程を経て製造される振動素子を探触
子にまとめていた。すなわち第2図に示すように
両面に電極(金属薄)2,3を有する既に分極の
ほどこされた圧電セラミツクスの電極2にダンパ
ー4を接着し、さらに他方の電極3に音響整合層
5を接着し、しかる後に切断機を用いて、これら
圧電セラミツクス、電極整合層を同時に適当な寸
法及び角状、短冊状、輪切状等に切断して振動素
子を製作していた。一般に、ダンパーやコーテン
グあるいは音響整合層5を圧電セラミツクスに接
着する際、より強固に接着するため、及び圧着等
の接着の自動化の都合上、熱硬化性あるいは高温
接着材を用いると良く、又、音響整合層として金
属あるいはアルミナ磁器やセラミツクスを用いる
場合は溶接又はロー付けなどの高温処理すると良
い。しかしながら、圧電セラミツクスのキユーリ
ー点は一般に百数十度(℃)から数百度(℃)で
あるから、このような高温処理による接着を行う
と圧電セラミツクスの分極が破壊されてしまい、
圧電性を失うので、製造方法としてこのような高
温処理による接着は不可能であつた。そこで本発
明はこれらの問題点を解決し、高温処理による接
着による超音波探触子の製造方法を提供すること
を目的とする。 Conventionally, ultrasonic probes that use piezoelectric ceramics as a voltage body have been used, such as array type probes as probes used in medical ultrasonic diagnostic equipment, but the manufacturing method for them has generally already been developed. As shown in FIGS. 1a, b, and c, vibrating elements were assembled into a probe through manufacturing processes such as bonding polarized ceramics to a damper, cutting them, and coating them. That is, as shown in FIG. 2, a damper 4 is bonded to an already polarized piezoelectric ceramic electrode 2 having electrodes (thin metal) 2 and 3 on both sides, and an acoustic matching layer 5 is bonded to the other electrode 3. However, a cutting machine is then used to simultaneously cut the piezoelectric ceramics and the electrode matching layer into appropriate dimensions and shapes such as squares, strips, and rings to produce vibrating elements. Generally, when bonding a damper, coating, or acoustic matching layer 5 to piezoelectric ceramics, it is preferable to use a thermosetting or high-temperature adhesive in order to bond more firmly and to automate bonding such as pressure bonding. When using metal, alumina porcelain, or ceramics as the acoustic matching layer, it is preferable to perform high-temperature treatment such as welding or brazing. However, since the Curie point of piezoelectric ceramics is generally between 100 and several tens of degrees (°C) to several hundred degrees (°C), bonding using such high-temperature treatment will destroy the polarization of piezoelectric ceramics.
Bonding by such high temperature treatment was not possible as a manufacturing method because piezoelectricity would be lost. SUMMARY OF THE INVENTION An object of the present invention is to solve these problems and provide a method for manufacturing an ultrasonic probe by bonding through high-temperature treatment.
次に本発明の製造方法を説明する。第3図に示
すように、分極を施す前のセラミツクス素材1の
第1の面に第1の電極2を設け、第2の電極(裏
面電極)3の一部を導電部32を介して表面に導
出し、第1の面の一部に折返し電極31を設けた
振動子の一方の電極面を、その分極を行う前に第
2図に示すようにダンパー4に熱硬化性あるいは
高温接着材、又は熔接、ロー付等の高温処理にて
接着層6を形成して接着し、さらに、振動子の他
の電極3面には同じく高温処理の接着層7を形成
してコーテング層あるいは音響整合層5を接着
し、しかる後に前記したと同様に切断機を用い
て、切断して第4図の40に示すような探触素子
を製作した後に、該探触子素子に分極を行うので
ある。つまり、従来はセラミツクス素板にあらか
じめ分極させてから、電極の取付、ダンパーある
いはコーテング層、音響整合層を接着していたの
に対して、本発明はセラミツクス素板に分極を行
う前に両電極面にダンパー及び音響整合層を接
着、切断して探触子素子40を制作した後、セラ
ミツクス素板に分極を行うので、高処理による圧
電セラミツクスの分極破壊ということがなくな
り、強度の強い高温接差、圧着等の接着の自由化
が可能になる。又、第4図に示すような配列型探
触子の場合には前記のようにダンパーに接着後に
切断してもよいが、ダンパーを使用しない場合
は、ダンパーへの接着工程をのぞいて音響整合層
の接着後、切断し、分極を行つてもよい。さらに
振動子を従来と全く同じ工程、すなわち分極した
セラミツクス素板に電極を設け、周波数などの振
動子としての定数を測定してから、分極を破壊
し、タンパーや整合層を接着し再分極を施しても
よく、あるいは同じく分極を施したセラミツクス
素板に電極を設けタンパー、整合層を接着、切断
してから分極破壊、再分極を施すこともできる。 Next, the manufacturing method of the present invention will be explained. As shown in FIG. 3, a first electrode 2 is provided on the first surface of the ceramic material 1 before polarization, and a part of the second electrode (back electrode) 3 is connected to the surface through a conductive part 32. Before polarizing one electrode surface of the vibrator, which has a folded electrode 31 on a part of the first surface, a thermosetting or high-temperature adhesive is applied to the damper 4 as shown in FIG. Alternatively, an adhesive layer 6 is formed and bonded by high-temperature treatment such as welding or brazing, and an adhesive layer 7 also treated at high temperature is formed on the other three electrode surfaces of the vibrator to form a coating layer or an acoustic matching layer. Layer 5 is adhered and then cut using a cutting machine in the same manner as described above to produce a probe element as shown at 40 in FIG. 4, after which the probe element is polarized. . In other words, in the past, the ceramic blank was polarized in advance, and then the electrodes were attached, the damper or coating layer, and the acoustic matching layer were attached. After the probe element 40 is fabricated by bonding and cutting the damper and acoustic matching layer on the surface, polarization is applied to the ceramic base plate, so there is no polarization breakdown of the piezoelectric ceramic due to high processing, and strong high-temperature contact is possible. It becomes possible to liberalize adhesion such as differential bonding and pressure bonding. In addition, in the case of an array type probe as shown in Figure 4, it may be cut after adhering to the damper as described above, but if a damper is not used, acoustic matching is not performed except for the process of adhering to the damper. After adhesion of the layers, cutting and polarization may be performed. Furthermore, the resonator is manufactured using the same process as before, that is, electrodes are placed on a polarized ceramic blank plate, the constants of the resonator such as the frequency are measured, the polarization is destroyed, a tamper and a matching layer are attached, and repolarization is performed. Alternatively, electrodes may be provided on a similarly polarized ceramic blank plate, a tamper and a matching layer may be bonded and cut, and then polarization destruction and repolarization may be performed.
分極を施す方法としては、キユーリー点以下の
室温で行う室温分極法、キユーリー点以下のなる
べく高い温度で行う高温分極法、交流電界重畳法
及びその他の方法があるが、何れの方法で行つて
もよい。又、第4図に示すような配列型探触子の
場合は、各々の探触子素子を個々独立に分極する
こともできる。 Methods for polarization include the room temperature polarization method performed at a room temperature below the Curie point, the high temperature polarization method performed at a temperature as high as possible below the Curie point, the alternating current electric field superimposition method, and other methods. good. Further, in the case of an array type probe as shown in FIG. 4, each probe element can be individually and independently polarized.
以上、詳細に説明したように、本発明に係る探
触子の製造方法によれば、圧電振動子をダンパ
ー、音響整合層等に接着し、切断後に圧電セラミ
ツクスの分極を行うので、高温処理による接着、
熔接、ロー付等が可能となり、接着強度の強い探
触子の製造が可能となる。さらに、配列型探触子
の場合は、各々の探触子素子を独立に分極できる
ので、各素子間の分極方向を異ならせこともでき
優れた性能を有する超音波探触子の製造が可能と
なる。 As explained above in detail, according to the method for manufacturing a probe according to the present invention, a piezoelectric vibrator is bonded to a damper, an acoustic matching layer, etc., and the piezoelectric ceramic is polarized after cutting, so the piezoelectric ceramic is polarized by high-temperature treatment. Adhesion,
Welding, brazing, etc. are now possible, making it possible to manufacture probes with strong adhesive strength. Furthermore, in the case of array type probes, each probe element can be polarized independently, so the polarization direction between each element can be made different, making it possible to manufacture ultrasonic probes with excellent performance. becomes.
第1図a,b,cは既に分極の施された圧電セ
ラミツクスを示す図、第2図は探触子の断面図、
第3図は圧電セラミツクスの構造を示す斜視図、
第4図は配列型探触子の構造を示す図である。
1……圧電セラミツクス、2,3……電極、4
……ダンパー、5……コーテング層あるいは音響
整合層、6,7……接着あるいは熔接、ロー付等
の層、40……探触子素子。
Figures 1a, b, and c show piezoelectric ceramics that have already been polarized; Figure 2 is a cross-sectional view of the probe;
Figure 3 is a perspective view showing the structure of piezoelectric ceramics;
FIG. 4 is a diagram showing the structure of an array type probe. 1... Piezoelectric ceramics, 2, 3... Electrode, 4
... Damper, 5 ... Coating layer or acoustic matching layer, 6, 7 ... Adhesion, welding, brazing, etc. layer, 40 ... Probe element.
Claims (1)
意する工程と、前記素板の一方の電極側にダンパ
ー材を接着する工程と、他方の電極側に整合層を
接着する工程と、前記各工程で形成されたセラミ
ツクス素板に分極処理を施す工程とを具備してな
ることを特徴とする超音波探触子の製造方法。 2 前記分極処理したセラミツクス素板を超音波
探触子として加工した後、再分極処理を施すこと
を特徴とする特許請求の範囲第1項に記載の超音
波探触子の製造方法。 3 前記分極処理したセラミツクス素板を超音波
探触子として切断加工した後、再分極処理を施す
ことを特徴とする特許請求の範囲第1項に記載の
超音波探触子の製造方法。 4 セラミツクスの両面に電極を設けた素板を用
意する工程と、前記素板の一方の電極側にダンパ
ー材を接着する工程と、他方の電極側に整合層を
接着する工程と、前記セラミツクスの素板を切断
加工する工程と、前記各工程で形成されたセラミ
ツクス素板に分極処理を施す工程とを具備してな
ることを特徴とする超音波探触子の製造方法。[Claims] 1. A step of preparing a blank ceramic plate with electrodes provided on both sides, a step of bonding a damper material to one electrode side of the blank plate, and a step of bonding a matching layer to the other electrode side. 1. A method for manufacturing an ultrasonic probe, comprising: a step of polarizing the ceramic blank formed in each of the steps described above. 2. The method of manufacturing an ultrasonic probe according to claim 1, wherein the polarized ceramic blank is processed into an ultrasonic probe and then repolarized. 3. The method for manufacturing an ultrasonic probe according to claim 1, wherein the polarized ceramic blank is cut into an ultrasonic probe and then repolarized. 4. A step of preparing a blank plate with electrodes provided on both sides of the ceramic, a step of bonding a damper material to one electrode side of the blank plate, a step of bonding a matching layer to the other electrode side, and a step of bonding a matching layer to the other electrode side of the ceramic blank. 1. A method for manufacturing an ultrasonic probe, comprising the steps of cutting a blank plate and subjecting the ceramic blank formed in each of the above steps to polarization treatment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8550881A JPS57201399A (en) | 1981-06-03 | 1981-06-03 | Manufacture of ultrasonic probe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8550881A JPS57201399A (en) | 1981-06-03 | 1981-06-03 | Manufacture of ultrasonic probe |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57201399A JPS57201399A (en) | 1982-12-09 |
| JPH0211079B2 true JPH0211079B2 (en) | 1990-03-12 |
Family
ID=13860867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8550881A Granted JPS57201399A (en) | 1981-06-03 | 1981-06-03 | Manufacture of ultrasonic probe |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57201399A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6359499U (en) * | 1986-10-06 | 1988-04-20 | ||
| JPH01190099A (en) * | 1988-01-25 | 1989-07-31 | Murata Mfg Co Ltd | Aerial ultrasonic transducer |
| JPH07113789A (en) * | 1993-10-19 | 1995-05-02 | Japan Atom Energy Res Inst | PZT detector for photoacoustic spectroscopy analyzer |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5773592A (en) * | 1980-10-27 | 1982-05-08 | Toshiba Corp | Ultrasonic wave probe and its production |
-
1981
- 1981-06-03 JP JP8550881A patent/JPS57201399A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57201399A (en) | 1982-12-09 |
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