JPH0212863B2 - - Google Patents
Info
- Publication number
- JPH0212863B2 JPH0212863B2 JP55038688A JP3868880A JPH0212863B2 JP H0212863 B2 JPH0212863 B2 JP H0212863B2 JP 55038688 A JP55038688 A JP 55038688A JP 3868880 A JP3868880 A JP 3868880A JP H0212863 B2 JPH0212863 B2 JP H0212863B2
- Authority
- JP
- Japan
- Prior art keywords
- winding
- spool
- wire
- pitch
- windings
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
Landscapes
- Filamentary Materials, Packages, And Safety Devices Therefor (AREA)
- Winding, Rewinding, Material Storage Devices (AREA)
- Wire Bonding (AREA)
Description
<産業上の利用分野>
本発明は半導体素子のボンデイング用金線、す
なわち半導体素子のチツプ電極と外部リード部と
を接続するために使用される金線のスプール巻線
形態に関する。
<従来背景>
一般にボンデイング用金線は金(Au)を主材
とし、それに銀(Ag)、鉄(Fe)等を添加した
合金を25〜50μ径に線引き加工したものが用いら
れる。
従来のスプール巻線形態は、スプールに斯る金
線を整列巻きした一層状のものが多く、金線の長
さは50〜100mが一般的であつた。
ところが、最近、高速自動式のボンデイングマ
シンの開発に伴い、ボンデイング速度が速く、し
かも金線の使用量が増加したために、供給する金
線も従来の50〜100m巻線を使用していてはスプ
ールの交換頻度が早くなり、ボンデイング作業の
作業性及び生産性が低下する原因となつており、
スプール巻線の長さ増長が望まれている。
上記従来の単層巻きスプール巻線で金線の長さ
を増長するにはスプールの径を大きくし及び/又
は巻面長さを大きくすればよいが、所定のボンデ
イングマシンにスプールを装置する関係からスプ
ール形状の変更は好ましくない。
そこで、一般に使用されているスプールを用
い、しかも金線長さを500〜1000mに増長させる
には巻線形態を二層以上の多層状とすることが要
求される。
<発明が解決しようとする問題>
上記従来事情に鑑み、スプール巻線形態を二層
以上の多層状とする場合、ボンデイング用金線は
線径25〜50μ程の極細線であつて、引張り強度が
きわめて小さいために、スプールに従来通りの整
列巻きで多層状としただけでは、次の如き不具合
がある。
すなわち、従来の整列巻き一層形態は、例えば
径2インチ(50.8φmm)のスプールに線径30μmの
金線を整列巻きする場合、ピツチlを300μm
(隣接線の間隙l′=0)に設定して巻込んである
が、それを多層巻きすれば、1層目と2層目の巻
線は必然的に交叉巻線形態となるもののその交叉
角θは、0.0216度であり、この交叉角θ及び前記
ピツチlが極めて小さいために巻線がほぐれにく
くボンデイング作業中に断線を起す原因となる。
又、ボンデイング用金線は軟かく線どうしが交
叉する部分では小さな力で変形したり、線どうし
がくつつき易く、またキズが発生し易いために、
通常の糸巻のようなピツチl、交叉角θ、間隙
l′の小さい密接した交叉巻形態では巻線のくい込
みが強すぎてほぐれにくいとともに折返し部に折
曲部が生じ断線の原因となり作業性が低下し、断
線しないまでもキズの発生によつてボンデイング
用として供し得ず、単に前記ピツチl、交叉角
θ、間隙l′を大きく設定しても、それが過大な場
合には前記不具合を解消し得ない。
而して、本発明は、巻線どうしの適度な係合状
態を得ることによつて過度な巻線のくい込みによ
る断線あるいはキズの発生を防止するとともに巻
線のくずれ落ちを防いで、ボンデイング作業の作
業性を向上させ、且つ金線の信頼を維持させ得る
スプール巻線を提供せんとするものである。
<問題点を解決するための手段>
上記問題点を解決するために本発明が講ずる手
段は、線径が25〜50μの一本のボンデイング用金
線を径が2インチ(50.8φmm)のスプールに所定
のピツチlで巻込み多層状とする巻線形態に於い
て、そのピツチlを2〜8mm、往側巻線と復側巻
線とを1度20分〜5度15分の交叉角θで交叉させ
るとともに往復各側のn回目の巻線と(n−1)
回目の巻線との間に最小0.1mm、最大(l−0.1)
mmの間隙を介在させたことである。
<作用>
上記ピツチlは2mm未満ではボンデイング時は
ほぐれにくく、ひつかかりを生じて断線の原因に
なるとともに8mmを越えると再び断線の原因とな
り、しかも巻線のくずれ落ちの原因となる。
交叉角θは1度20分未満ではボンデイング時に
おける断線の原因となるとともに5度15分を越え
ると巻線のくずれ落ち及び変形、キズの発生原因
となる。
間隙l′は1mm未満、(l−0.1)mmを越えた場合
に、ボンデイング時における断線及び巻線の変
形、キズの発生原因となる。
従つて、ピツチlを2〜8mm、交叉角θを1度
20分〜5度15分、間隙l′を最小0.1mm、最大(l−
0.1)mmとするものである。
<実施例>
本発明の実施例を図面により説明すれば、第1
図はスプールAにボンデイング用金線Bを巻き込
んだスプール巻線を示す。
金線Bはその一端をスプールAに止着した後
に、スプールAを等速回転させながら該スプール
を軸方向に、又は金線繰出し端をスプールの軸方
向に沿つて往復動させることによつて巻込まれ、
そのスプール又は金線の一方側の送り時に巻込み
される金線を往側巻線10、反対側の送り時に巻
込みされる金線を復側巻線20として図示する。
すなわち、金線Bはその1本をスプールAの回
転と共にトラバースさせ往復動を繰返して巻込ま
れるが、その往側においてスプールAの、1回転
で巻線11はピツチlだけ進み、そのピツチl毎
にスプールAの他端までトラバースし、次いで復
側となつてその巻線21もまたピツチlで巻始端
側へ戻り、次の往側においては間隙l′をおいた位
置、すなわち12で示す巻線から再びピツチlで
トラバースし、以下同様の動作で巻込まれ、往側
の巻線11と復側の巻線21とは交叉角θで交叉
する(第2図)。
上記巻線10,20のピツチl及び交叉角θは
前記スプールAの回転速度とスプール又は金線の
送り速度とによつて設定される。
巻線10,20の巻込み状態を説明するため第
1層の1ピツチ分を第2図に拡大して示す。
第2図において巻線10は、11が第1回目の
往側巻線、12,13…17が夫々第2回、第3
回…第7回目の往側巻線であり、巻線20は、2
1が第1回目の復側巻線、22,23…27が
夫々第2回、第3回…第7回目の復側巻線であ
る。
上記巻線11,21,12,22…17,27
の各交叉部X…は1ピツチで2ヶ所形成されるが
該交叉部は図示のように円周方向へ順次に移動す
る。
上記の巻込みをさらに継続することによつて、
巻線10,20はその上に2層、3層…と段積み
されるが、その2層目は巻線10上に巻線20
が、巻線20上に巻線10が配列される如く、巻
線10と20とが順次交互に段積みされる(第1
図)。
上記巻線10,20はその各巻き回毎に位相を
ずらし、そのn回目と(n−1)回目との間に
夫々間隙l′を設けるようにする。
上記間隙l′はスプールA又は金線Bの送り端に
おける折返し時期を調節することにより形成さ
れ、あるいは巻線のピツチlと巻線全幅Lとを整
数倍としない開係、例えばピツチlを4mm、Lを
23.5mmとすることによつて自動的に形成される。
上記間隙l′は第1層目だけに限らず、第2層目
以降も同様して形成する。
尚、多層形態の段積み状態は巻線全幅を一定に
する状態、あるいは上層となるにつれて巻線幅を
小さくしていく俵積み状態のいずれであつてもよ
いが、後者の方が折返し端部のくずれ落ちをより
良く防止でき好ましい。
第1図は巻線10,20の第1層から最上層に
至るまで巻線全幅Lを一定にした段積み形態を示
すが、第3図は上層毎に巻線全幅を縮小させてい
く俵積み形態を示す。
第3図の巻線形態においても、巻線10,20
は夫々n回目と(n−1)回目との間に夫々間隙
l′が形成されることは同様であるが、巻線11,
21,12,22…の各交叉部X…が円周方向及
び軸方向、すなわち螺旋状に移動する。
而して上記巻線10と20とはそれらのピツチ
l、交叉状態及び間隙l′の介在によつて適度な係
合状態が得られるが、そのピツチl、交叉角θ、
間隙l′が大きすぎれば、ほぐれやすく、それが小
さすぎればくい込みが強すぎてほぐれ難い結果と
なる。
即ち、巻線10と20のピツチl、交叉角θ、
間隙l′の設定値が、巻線の係合状態における重要
な要因となる。
そこで、以下にピツチl、交叉角θ、間隙l′に
各値をとつた場合の実験データを示す。
尚、実験データは一般的に使用されている2イ
ンチ径のスプールを用いたものであり、また金線
としては直径が30μのものを使用したが25〜50μ
の範囲でみるかぎりでは同様の傾向がみられた。
<Industrial Application Field> The present invention relates to a gold wire for bonding a semiconductor device, that is, a spool winding form of gold wire used for connecting a chip electrode and an external lead portion of a semiconductor device. <Conventional Background> Generally, gold wire for bonding is made of an alloy mainly made of gold (Au), to which silver (Ag), iron (Fe), etc. are added, and is drawn to a diameter of 25 to 50 μm. Most of the conventional spool winding configurations are single-layered, in which such gold wire is wound in an aligned manner around the spool, and the length of the gold wire is generally 50 to 100 m. However, with the recent development of high-speed automatic bonding machines, the bonding speed is faster and the amount of gold wire used has increased. The replacement frequency becomes faster, which causes a decline in workability and productivity of bonding work.
It is desirable to increase the length of the spool winding. In order to increase the length of the gold wire in the conventional single-layer spool winding mentioned above, it is possible to increase the diameter of the spool and/or increase the length of the winding surface, but there is a need to install the spool in a predetermined bonding machine. Therefore, it is not desirable to change the spool shape. Therefore, in order to use a commonly used spool and increase the length of the gold wire to 500 to 1000 m, it is required that the wire be wound in a multilayered form with two or more layers. <Problems to be Solved by the Invention> In view of the above-mentioned conventional circumstances, when the spool winding form is multilayered with two or more layers, the gold wire for bonding must be an ultra-fine wire with a wire diameter of about 25 to 50 μm, and the tensile strength Since the spool is extremely small, simply winding the spool in multiple layers in the conventional manner would cause the following problems. In other words, in the conventional single-layer aligned winding method, for example, when winding gold wire with a wire diameter of 30 μm onto a spool with a diameter of 2 inches (50.8φmm), the pitch l is set to 300 μm.
(gap between adjacent wires l' = 0), but if it is wound in multiple layers, the first and second layer windings will inevitably have a cross-winding configuration, but the cross-winding The angle θ is 0.0216 degrees, and since the intersecting angle θ and the pitch l are extremely small, the windings are difficult to unravel, causing wire breakage during bonding work. In addition, the gold wire for bonding is soft and the parts where the wires intersect are easily deformed by a small force, the wires are easy to stick to each other, and scratches are easily generated.
Pitch l, intersection angle θ, and gap like a normal pincushion
In a closely-spaced cross-wound configuration with a small l′, the windings are too wedged and difficult to unravel, and the folded portions are bent, causing wire breakage, reducing workability, and even if wires do not break, scratches may occur, resulting in bonding Even if the pitch l, the crossing angle θ, and the gap l' are set large, the problem cannot be solved if they are too large. Accordingly, the present invention prevents wire breakage or scratches due to excessive winding by obtaining an appropriate state of engagement between the windings, and also prevents the windings from falling off, thereby facilitating bonding work. It is an object of the present invention to provide a spool winding wire that can improve the workability of the wire and maintain the reliability of the gold wire. <Means for Solving the Problems> The means taken by the present invention to solve the above problems is to spool a single gold bonding wire with a wire diameter of 25 to 50μ onto a spool with a diameter of 2 inches (50.8φmm). In the winding configuration in which the wire is wound at a predetermined pitch l to form a multilayer structure, the pitch l is 2 to 8 mm, and the crossing angle between the forward winding and the return winding is 1 degree 20 minutes to 5 degrees 15 minutes. Cross at θ and reciprocate with the n-th winding on each side (n-1)
Minimum 0.1mm between the second winding and maximum (l-0.1)
This is because a gap of mm was provided. <Function> If the pitch l is less than 2 mm, it will be difficult to unravel during bonding, causing snags and causing wire breakage, and if it exceeds 8 mm, it will cause wire breakage again and cause the winding to fall off. If the crossing angle θ is less than 1 degree and 20 minutes, it will cause wire breakage during bonding, and if it exceeds 5 degrees and 15 minutes, it will cause the winding to fall off, deform, and cause scratches. If the gap l' is less than 1 mm, and exceeds (l-0.1) mm, it may cause wire breakage, deformation of the winding, or scratches during bonding. Therefore, the pitch l should be 2 to 8 mm, and the intersection angle θ should be 1 degree.
20 minutes to 5 degrees 15 minutes, gap l' is minimum 0.1 mm, maximum (l-
0.1) mm. <Example> To explain an example of the present invention with reference to the drawings, the first example is as follows.
The figure shows a spool winding in which bonding gold wire B is wound around spool A. After fixing one end of the gold wire B to the spool A, the spool is rotated at a constant speed while the spool is axially moved, or the wire feeding end is reciprocated along the axial direction of the spool. caught up in
The gold wire that is wound when feeding one side of the spool or gold wire is shown as an outgoing winding 10, and the gold wire that is wound when feeding the other side is shown as a returning winding 20. That is, one of the gold wires B is traversed with the rotation of the spool A, and is wound up by repeating reciprocating motion, but on the forward side, the winding 11 advances by a pitch l in one rotation of the spool A, and for each pitch l traverses to the other end of the spool A, then on the return side, the winding 21 also returns to the winding start end side at the pitch l, and on the next forward side, the winding 21 returns to the position with a gap l', that is, the winding indicated by 12. The wire is traversed from the wire again at pitch l, and thereafter wound in the same manner, and the winding 11 on the forward side and the winding wire 21 on the backward side intersect at an intersection angle θ (FIG. 2). The pitch l and crossing angle θ of the windings 10 and 20 are set by the rotational speed of the spool A and the feeding speed of the spool or gold wire. In order to explain the winding state of the windings 10 and 20, one pitch of the first layer is shown enlarged in FIG. In FIG. 2, the windings 10 are shown as follows: 11 is the first outgoing winding, 12, 13...17 are the second and third outgoing windings, respectively.
times...This is the seventh outgoing winding, and the winding 20 is the 2nd
1 is the first return winding, and 22, 23, . . . 27 are the second, third, ... seventh return windings, respectively. The above windings 11, 21, 12, 22...17, 27
The crossing portions X... are formed at two locations in one pitch, and the crossing portions sequentially move in the circumferential direction as shown in the figure. By continuing the above-mentioned involvement,
The windings 10 and 20 are stacked on top of each other in two, three, etc. layers, and the second layer has the winding 20 on top of the winding 10.
However, the windings 10 and 20 are sequentially and alternately stacked so that the windings 10 are arranged on the winding 20 (first
figure). The phase of the windings 10 and 20 is shifted for each winding, and a gap l' is provided between the n-th and (n-1)th windings. The above-mentioned gap l' can be formed by adjusting the turn-back timing at the feeding end of the spool A or the gold wire B, or by adjusting the opening ratio where the pitch l of the winding wire and the total width L of the winding wire are not an integral multiple, for example, the pitch l is 4 mm. , L
It is automatically formed by setting it to 23.5mm. The gap l' is formed not only in the first layer but also in the second and subsequent layers. Note that the stacked state of the multilayer structure may be either a state in which the overall width of the winding is constant, or a state in which the winding width is reduced as the upper layer is stacked in bales, but the latter is preferable because the folded end This is preferable because it can better prevent the material from falling off. Fig. 1 shows a stacked structure in which the windings 10 and 20 have a constant overall width L from the first layer to the top layer, whereas Fig. 3 shows a stacked structure in which the overall width L of the windings is reduced for each upper layer. Shows the stacking form. Also in the winding form shown in FIG. 3, the windings 10, 20
are the gaps between the n-th and (n-1)th times, respectively.
l′ is formed in the same way, but the windings 11,
Each intersection X of 21, 12, 22... moves in the circumferential direction and the axial direction, that is, in a spiral shape. The above-mentioned windings 10 and 20 can be appropriately engaged due to their pitch l, crossing state, and gap l', but the pitch l, crossing angle θ,
If the gap l′ is too large, it will easily come undone, and if it is too small, the biting will be too strong and it will be difficult to come undone. That is, the pitch l of the windings 10 and 20, the crossing angle θ,
The set value of the gap l' is an important factor in the engagement state of the windings. Therefore, experimental data for various values of pitch l, crossing angle θ, and gap l' are shown below. Note that the experimental data used a commonly used 2-inch diameter spool, and the gold wire used had a diameter of 30μ, but it has a diameter of 25 to 50μ.
A similar trend was observed within the range of .
【表】【table】
【表】
るまでに何回ひつかかつた
かを測定
(注2):くずれは、振動テスト後の
くずれの有無を目視で判定
上記実験結果による効果を表にまとめると次の
通りである。[Table] Measure how many times it was hit before
(Note 2): Deformation is determined visually after the vibration test. The effects of the above experimental results are summarized in the table below.
【表】
○印:良い効果 ×印:悪い効果
これらの実験結果によれば次の範囲の値が最適
であることが知られた。
すなわち金線Bの直径が25〜50μ、スプールの
径が2インチのものを使用した場合で、ピツチl
を2〜8mm、交叉角θを1度20分〜5度15分、間
隙l′を最小0.1mm、最大(l−0.1)mmの範囲とし
た場合である。
このように、巻線10,20のピツチl、交叉
角θ、間隙l′を上記の範囲の値に設定することに
よつて、金線Bのひつかかり、くずれ、変形・キ
ズともに最良の巻線状態となり、最適な巻線係合
状態を得ることができる。
尚、上記ピツチlは常に一定であることを要せ
ず、前記2〜8mmの範囲を巻き回毎に、あるいは
各層毎に変動させることも任意である。
<効果>
本発明は叙上の如く、一本のボンデイング用金
線をスプールに所定のピツチ、交叉角及び間隙で
巻込み多層状とするので、従来の単層巻きに較べ
同一のスプールを使用した場合でも金線の長さを
数倍に増長させることができる。
そして、その往側巻線と復側巻線とを所定角度
で交叉させるので、巻線のくずれ落ちが防止で
き、しかも巻線のピツチlを2〜8mmとし、往復
各側のn回目の巻線と(n−1)回目の巻線との
間に最小0.1mm、最大(l−0.1)mmの間隙を介在
させるので、従来周知の交叉巻形態の如く往側巻
線と復側巻線とが各本宛交互に配糸し且つ相互に
密接する形態と違い、1ピツチ内に複数巻回の往
側巻線群と復側巻線群とが配列され、且つそれら
各線間に間隙が介在する巻線形態が得られ、した
がつて巻線どうしが密着せず過度なくい込みを抑
えた適度な巻線どうしの係合状態が得られる。
従つて、巻線のほぐれや断線がなく、しかもス
プール交換の頻度の少ないスプール巻線を提供
し、ボンデイング作業の生産性を向上させること
ができ、所期の目的を達成し得る。[Table] ○ mark: Good effect × mark: Bad effect According to these experimental results, it was found that the values in the following range are optimal. In other words, when using gold wire B with a diameter of 25 to 50μ and a spool with a diameter of 2 inches, the pitch is
is 2 to 8 mm, the intersection angle θ is 1 degree 20 minutes to 5 degrees 15 minutes, and the gap l' is in the range of minimum 0.1 mm and maximum (l-0.1) mm. In this way, by setting the pitch l, crossing angle θ, and gap l' of the windings 10 and 20 to values within the above ranges, the winding can be made in the best way to prevent snagging, deformation, and scratches of the gold wire B. This results in an optimal winding engagement state. Incidentally, the pitch l does not need to be constant at all times, and may be varied within the range of 2 to 8 mm for each winding or for each layer. <Effects> As described above, the present invention winds a single gold wire for bonding onto a spool at a predetermined pitch, intersecting angle, and gap to form a multilayer structure, so the same spool is used compared to conventional single-layer winding. Even in this case, the length of the gold wire can be increased several times. Since the outgoing winding and the incoming winding intersect at a predetermined angle, the winding can be prevented from falling off.Moreover, the pitch l of the winding is 2 to 8 mm, and the nth winding on each reciprocating side Since a gap of minimum 0.1 mm and maximum (l-0.1) mm is interposed between the wire and the (n-1)th winding, the outgoing winding and the returning winding are Unlike the case where the yarns are arranged alternately for each book and in close contact with each other, a plurality of outgoing winding groups and incoming winding groups are arranged in one pitch, and there is a gap between each wire. An intervening winding configuration is obtained, so that the windings do not come into close contact with each other, and an appropriate state of engagement between the windings is obtained in which excessive digging is suppressed. Therefore, it is possible to provide a spool winding that does not cause unraveling or disconnection of the winding and that requires less frequent spool replacement, thereby improving the productivity of bonding work and achieving the intended purpose.
第1図は本発明スプール巻線の部分断面図、第
2図はその第1層目の1ピツチ部分の拡大図、第
3図は変形例の要部拡大図である。
図中、Aはスプール、Bは金線、10は往側巻
線、20は復側巻線、lはピツチ、l′は間隙、θ
は交叉角である。
FIG. 1 is a partial sectional view of the spool winding of the present invention, FIG. 2 is an enlarged view of the first pitch portion of the first layer, and FIG. 3 is an enlarged view of the main part of a modified example. In the figure, A is the spool, B is the gold wire, 10 is the forward winding, 20 is the return winding, l is the pitch, l' is the gap, θ
is the intersection angle.
Claims (1)
を径が2インチ(50.8φmm)のスプールに所定の
ピツチlで巻込み多層状とする巻線形態に於い
て、そのピツチlを2〜8mm、往側巻線と復側巻
線とを1度20分〜5度15分の交叉角θで交叉させ
るとともに往復各側のn回目の巻線と(n−1)
回目の巻線との間に最小0.1mm、最大(l−0.1)
mmの間隙を介在させた半導体素子のボンデイング
用金線のスプール巻線。1. In a winding configuration in which a single gold wire for bonding with a wire diameter of 25 to 50μ is wound onto a spool with a diameter of 2 inches (50.8φmm) at a predetermined pitch l to form a multilayer structure, the pitch l is 2 ~8mm, the outgoing winding and the returning winding intersect at a crossing angle θ of 1 degree 20 minutes to 5 degrees 15 minutes, and the nth winding on each side (n-1)
Minimum 0.1mm between the second winding and maximum (l-0.1)
Spool winding of gold wire for bonding semiconductor devices with a gap of mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3868880A JPS56136764A (en) | 1980-03-25 | 1980-03-25 | Spooled gold wire for bonding semiconductor element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3868880A JPS56136764A (en) | 1980-03-25 | 1980-03-25 | Spooled gold wire for bonding semiconductor element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56136764A JPS56136764A (en) | 1981-10-26 |
| JPH0212863B2 true JPH0212863B2 (en) | 1990-03-28 |
Family
ID=12532227
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3868880A Granted JPS56136764A (en) | 1980-03-25 | 1980-03-25 | Spooled gold wire for bonding semiconductor element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56136764A (en) |
-
1980
- 1980-03-25 JP JP3868880A patent/JPS56136764A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56136764A (en) | 1981-10-26 |
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