JPH0213037B2 - - Google Patents
Info
- Publication number
- JPH0213037B2 JPH0213037B2 JP12451781A JP12451781A JPH0213037B2 JP H0213037 B2 JPH0213037 B2 JP H0213037B2 JP 12451781 A JP12451781 A JP 12451781A JP 12451781 A JP12451781 A JP 12451781A JP H0213037 B2 JPH0213037 B2 JP H0213037B2
- Authority
- JP
- Japan
- Prior art keywords
- cleaning
- plating solution
- water
- gold
- workpiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Description
【発明の詳細な説明】
本発明は、自動部分メツキ装置のメツキ液洗浄
回収方法に係り、特に次工程で、例えば電解方式
などによる回収効率の向上を図つたメツキ液洗浄
回収方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a plating solution cleaning and recovery method for an automatic partial plating device, and particularly to a plating solution cleaning and recovery method that improves recovery efficiency in the next step, for example, by using an electrolytic method. .
被処理物たとえば電子交換機用コネクタコンタ
クト等は、高信頼性が要求されるために一般に金
メツキが行われている。ところが前記コネクタコ
ンタクト全面に金メツキを施すことは、コネクタ
のコストに占める金の比率が大きくなる。そこで
前記コネクタコンタクトの金メツキ処理は必要最
小限に止める表面自動部分メツキが一般に行われ
ている。このような従来の自動部分メツキ装置の
メツキ液洗浄回収槽の側断面図を第1図に示す。
図において1は合成樹脂等からなる金メツキ液回
収槽、2はたとえば電子交換機用コネクタコンタ
クト等の被処理物、3は前記被処理物2の一部分
に付着している残存金メツキ液、4は水5を噴射
するノズル、6は前記ノズル4に連なる給水管で
ある。 2. Description of the Related Art Items to be processed, such as connector contacts for electronic exchanges, are generally gold-plated because high reliability is required. However, applying gold plating to the entire surface of the connector contact increases the proportion of gold in the cost of the connector. Therefore, surface automatic partial plating is generally performed to minimize the gold plating of the connector contacts to the necessary minimum. FIG. 1 shows a side sectional view of a plating liquid cleaning and recovery tank of such a conventional automatic partial plating apparatus.
In the figure, 1 is a gold plating liquid collection tank made of synthetic resin, etc., 2 is a workpiece such as a connector contact for an electronic exchange, 3 is a residual gold plating liquid adhering to a part of the workpiece 2, and 4 is a gold plating liquid collection tank made of synthetic resin, etc. A nozzle 6 for injecting water 5 is a water supply pipe connected to the nozzle 4.
この構成において、最終メツキ工程を終了した
被処理物2たとえば電子交換機用コネクタコンタ
クトが移動されて金メツキ液洗浄回収槽1に導か
れ、該金メツキ液回収槽1内において被処理物2
に付着している残存メツキ液3を洗浄するように
なつている。ところがこのような従来の洗浄回収
方法では被処理物2に付着している残存金メツキ
液3を大量又は少量の水5をノズル4を介して両
面から全面を洗浄するので、大量の水5では残存
金メツキ液3が稀薄となり次工程の電解回収の効
率を低下させ、又、少量の水5では全面洗浄によ
る不必要部の濡れによる金メツキ液の持ち出しに
よるロスが発生するという問題点があつた。 In this configuration, the workpiece 2 that has completed the final plating process, for example, a connector contact for an electronic exchange, is moved and guided to the gold plating liquid cleaning recovery tank 1, and the workpiece 2 is moved into the gold plating liquid cleaning recovery tank 1.
The remaining plating liquid 3 adhering to the plate is cleaned. However, in such a conventional cleaning and recovery method, the remaining gold plating solution 3 adhering to the workpiece 2 is washed from both sides with a large amount or a small amount of water 5 through the nozzle 4. There is a problem that the remaining gold plating solution 3 becomes diluted, reducing the efficiency of electrolytic recovery in the next step, and with a small amount of water 5, there is a problem that the gold plating solution is carried out due to wetting unnecessary parts due to full-surface cleaning, resulting in loss. Ta.
本発明の目的は、前記の問題点を解決すべくな
されたもので、少量の水で必要最小限の面のみ洗
浄し、残存金メツキ液の希薄化及び不必要部分の
濡れによる金メツキ液の持出しによるロスを抑え
金メツキ液の回収効率を向上した新規なメツキ液
洗浄回収方法を提供するものである。前述の目的
を達成するため、本発明は、自動部分メツキ装置
により突出した部分がメツキ処理された被処理物
に付着している残存メツキ液の洗浄回収方法にお
いて、前記被処理物の突出した部分の位置以下に
洗浄容器の少なくとも一辺を切削した前記洗浄容
器に洗浄水を給水し、切削部にて溢れさせ、前記
切削部において前記被処理物の突出した片面のみ
を盛り上がつた前記洗浄水の水面上に接触させて
洗浄するとともに、洗浄後のメツキ液を回収槽に
て回収することを特徴とするものである。 The purpose of the present invention was to solve the above-mentioned problems, and the purpose of the present invention is to clean only the minimum necessary surface with a small amount of water, thereby diluting the remaining gold plating solution and removing the gold plating solution by wetting unnecessary parts. The present invention provides a novel plating solution cleaning and recovery method that suppresses losses due to removal and improves the recovery efficiency of the gold plating solution. In order to achieve the above-mentioned object, the present invention provides a method for cleaning and recovering residual plating solution adhering to a workpiece whose protruding parts have been plated by an automatic partial plating apparatus, in which the protruding parts of the workpiece are The cleaning water is supplied to the cleaning container whose at least one side is cut below the position of , and overflows at the cutting part, so that the cleaning water swells only on one side of the object to be treated at the cutting part. The plating solution is brought into contact with the surface of the water for cleaning, and the plating solution after cleaning is collected in a collection tank.
以下図面を参照しながら本発明に係るメツキ液
洗浄回収方法の実施例について詳細に説明する。 DESCRIPTION OF THE PREFERRED EMBODIMENTS Examples of the plating liquid cleaning and recovery method according to the present invention will be described in detail below with reference to the drawings.
第2図は、本発明の一実施例を説明するための
側断面図で、前図と同等の部分については同一符
号が付してあり、7は合成樹脂等からなる金メツ
キ液回収槽、8は合成樹脂等の円筒からなり、段
付切削部81を形成した洗浄容器、9は前記洗浄
容器への給水管である。 FIG. 2 is a side sectional view for explaining one embodiment of the present invention, in which the same parts as in the previous figure are given the same reference numerals, and 7 is a gold plating liquid recovery tank made of synthetic resin or the like; Reference numeral 8 designates a cleaning container made of a cylinder made of synthetic resin or the like and having a stepped cutting portion 81 formed therein, and 9 designates a water supply pipe to the cleaning container.
この構成において、金メツキ処理を終了した被
処理物2、例えば電子交換機用コネクタコンタク
トが移動して金メツキ液を洗浄する洗浄容器8の
段付切削部81に導かれ、前記被処理物2に付着
した残存金メツキ液3の部分が、給水管9により
前記洗浄容器8に供給された水5によつて洗浄さ
れる。コンタクトの残存金メツキ液3のついた突
出した部分が水5により洗浄されれば足りること
から、給水管9から供給される水5は段付切削部
81から溢れる程度に供給される。この洗浄容器
8の上に近接して配置されるコンタクトの残存金
メツキ液3のついた突出部分が、洗浄容器8に溜
められる水の盛り上つた水面により濡れること
で、必要最小限の片面のみ洗浄され、残存金メツ
キ液3は水5の内に比較的高濃度を保ち金メツキ
液回収槽7に溢れ、図示しないメツキ液を回収す
る電解式処理装置に送られメタルとして再生され
る。 In this configuration, the workpiece 2 that has been gold-plated, for example, a connector contact for an electronic exchange, is moved and guided to the stepped cutting part 81 of the cleaning container 8 for cleaning the gold plating solution, and is guided to the workpiece 2. The adhering remaining portion of the gold plating solution 3 is washed with water 5 supplied to the washing container 8 through the water supply pipe 9. Since it is sufficient to wash the protruding portion of the contact with the remaining gold plating liquid 3 with the water 5, the water 5 supplied from the water supply pipe 9 is supplied to the extent that it overflows from the stepped cutting portion 81. The protruding parts of the contacts placed close to the top of the cleaning container 8 with the remaining gold plating solution 3 are wetted by the rising water surface of the water stored in the cleaning container 8, so that only one side of the contacts is necessary. After being washed, the remaining gold plating solution 3 maintains a relatively high concentration in the water 5 and overflows into the gold plating solution recovery tank 7, and is sent to an electrolytic processing device (not shown) for recovering the plating solution and recycled as metal.
従つて、従来技術によれば、コネクタコンタク
トの金メツキ部分に上下から噴射ノズルにより洗
浄水をかけるので、少なくともコンタクトにぶつ
かるように水圧をあげる必要があるのに対し、本
発明では、洗浄容器の切削部より水を溢れさせ、
その表面上にコンタクトの突出部を接触させて濡
らすことにより残存金メツキ液を回収するので、
その洗浄水を常時供給するとしても、洗浄容器の
切削部部分で僅かに溢れさせれば足りるものとな
り、従来に比べ大幅に洗浄水の量を減らすことが
できる。従つて、その回収液から金を再生する効
率も向上できる。 Therefore, according to the prior art, cleaning water is sprayed from above and below onto the gold-plated portion of the connector contact using spray nozzles, so it is necessary to increase the water pressure to at least hit the contacts. Let water overflow from the cutting part,
The remaining gold plating solution is recovered by contacting the protruding part of the contact with the surface and wetting it.
Even if the washing water is constantly supplied, it is sufficient to cause it to slightly overflow at the cut portion of the washing container, and the amount of washing water can be significantly reduced compared to the conventional method. Therefore, the efficiency of regenerating gold from the recovered liquid can also be improved.
第3図は、本発明の要部斜視図で、第2図と同
等の部分については同一符号を付している。 FIG. 3 is a perspective view of essential parts of the present invention, in which the same parts as in FIG. 2 are given the same reference numerals.
金メツキ処理を終了した被処理物2が矢印方向
に搬送されて、洗浄容器8の段付切削部81に導
かれ、前記被覆処理物2に付着した金メツキ液3
が、給水管9より供給される水により第2図で説
明した順序にしたがつて洗浄回収される。 The workpiece 2 that has been gold-plated is transported in the direction of the arrow and guided to the stepped cutting part 81 of the cleaning container 8, where the gold-plating liquid 3 adhering to the coated workpiece 2 is removed.
are washed and recovered using water supplied from the water supply pipe 9 in the order explained in FIG.
なお、本実施例の最終メツキ処理として金を用
いて説明したが、金に限らず銀その他の貴金属で
あつても構わない。また洗浄容器8の断面形状を
円筒について説明したが、円筒に限らず角状、台
形状その他如何なる形状であつても構わない。 Although gold is used as the final plating process in this embodiment, it is not limited to gold, and silver or other noble metals may be used. Furthermore, although the cross-sectional shape of the cleaning container 8 has been described as being cylindrical, it is not limited to the cylindrical shape, but may be angular, trapezoidal, or any other shape.
以上の説明から明らかなように、本発明に係る
メツキ液洗浄回収方法によれば、従来のメツキ液
洗浄回収方法にくらべて洗浄水を溢れさせるだけ
の極めて少量の洗浄水量となるので残存メツキ液
の高濃度回収が可能となり、次工程での電解回収
作業能率の向上が期待できるとともに経済的効果
も期待できる。 As is clear from the above description, according to the plating liquid cleaning and recovery method according to the present invention, the amount of cleaning water used is extremely small compared to the conventional plating liquid cleaning and recovery method. It is possible to recover a high concentration of , and it is expected that the efficiency of electrolytic recovery in the next process will be improved, as well as economic effects.
第1図は従来のメツキ液洗浄回収槽を説明する
ための側断面図、第2図は本発明に係るメツキ液
洗浄回収槽の一実施例を説明するための側断面
図、第3図は、本発明の要部斜視図である。
図において、1および7は金メツキ液回収槽、
2は被処理物、3は残存金メツキ液、4はノズ
ル、5は水、6および9は給水管、8は洗浄容
器、81は段付切削部、を示す。
FIG. 1 is a side sectional view for explaining a conventional plating liquid cleaning and recovery tank, FIG. 2 is a side sectional view for explaining an embodiment of the plating liquid cleaning and recovery tank according to the present invention, and FIG. FIG. 2 is a perspective view of essential parts of the present invention. In the figure, 1 and 7 are gold plating liquid recovery tanks;
Reference numeral 2 indicates an object to be processed, 3 indicates a residual gold plating solution, 4 indicates a nozzle, 5 indicates water, 6 and 9 indicate water supply pipes, 8 indicates a cleaning container, and 81 indicates a stepped cutting section.
Claims (1)
ツキ処理された被処理物に付着している残存メツ
キ液の洗浄回収方法において、 前記被処理物の突出した部分の位置以下に洗浄
容器の少なくとも一辺を切削した前記洗浄容器に
洗浄水を給水し、切削部にて溢れさせ、 前記切削部において前記被処理物の突出した片
面のみを盛り上がつた前記洗浄水の水面上に接触
させて洗浄するとともに、洗浄後のメツキ液を回
収糟にて回収する ことを特徴とするメツキ液洗浄回収方法。[Scope of Claims] 1. A method for cleaning and recovering residual plating solution adhering to a workpiece whose protruding parts have been plated by an automatic partial plating device, comprising: washing below the position of the protruding parts of the workpiece; Cleaning water is supplied to the cleaning container which has been cut at least one side of the container, and overflows at the cutting part, and in the cutting part, only one protruding side of the object to be treated is brought into contact with the raised water surface of the washing water. A method for cleaning and collecting a plating solution, which comprises cleaning the plating solution by washing the plating solution, and collecting the plating solution after washing in a recovery pot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12451781A JPS5834190A (en) | 1981-08-08 | 1981-08-08 | Plating liquid washing and collecting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12451781A JPS5834190A (en) | 1981-08-08 | 1981-08-08 | Plating liquid washing and collecting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5834190A JPS5834190A (en) | 1983-02-28 |
| JPH0213037B2 true JPH0213037B2 (en) | 1990-04-03 |
Family
ID=14887430
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12451781A Granted JPS5834190A (en) | 1981-08-08 | 1981-08-08 | Plating liquid washing and collecting method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5834190A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7290700B2 (en) | 1999-08-09 | 2007-11-06 | Pil, L.L.C. | Method and system for illustrating sound and text |
-
1981
- 1981-08-08 JP JP12451781A patent/JPS5834190A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7290700B2 (en) | 1999-08-09 | 2007-11-06 | Pil, L.L.C. | Method and system for illustrating sound and text |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5834190A (en) | 1983-02-28 |
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