JPH0215628B2 - - Google Patents
Info
- Publication number
- JPH0215628B2 JPH0215628B2 JP16751185A JP16751185A JPH0215628B2 JP H0215628 B2 JPH0215628 B2 JP H0215628B2 JP 16751185 A JP16751185 A JP 16751185A JP 16751185 A JP16751185 A JP 16751185A JP H0215628 B2 JPH0215628 B2 JP H0215628B2
- Authority
- JP
- Japan
- Prior art keywords
- evaporation
- evaporation source
- chamber
- vacuum
- storage chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000001704 evaporation Methods 0.000 claims description 91
- 230000008020 evaporation Effects 0.000 claims description 91
- 238000007738 vacuum evaporation Methods 0.000 claims description 23
- 239000012159 carrier gas Substances 0.000 claims description 14
- 238000007740 vapor deposition Methods 0.000 claims description 9
- 238000011109 contamination Methods 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 2
- 238000005192 partition Methods 0.000 description 6
- 238000001771 vacuum deposition Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 239000011261 inert gas Substances 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は、バツチ式真空蒸着装置用蒸発源収納
装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an evaporation source storage device for a batch type vacuum evaporation apparatus.
[従来の技術]
従来、バツチ式真空蒸着装置としては種々の型
式のものが提案されており、例えば、実公昭49−
18121公報、特公昭43−11370号公報、特公昭58−
3032号公報および特公昭58−17829号公報等に記
載のものを公知例としてあげることができる。こ
れらの公知の装置はいずれも真空容器から成る蒸
着室内に被処理物と蒸発源とを対向させて配置
し、真空中で物質を加熱して蒸発させ、その蒸気
を被処理物上に凝縮させて薄膜を形成するように
構成されている。[Prior Art] Various types of batch-type vacuum evaporation equipment have been proposed in the past, such as the
18121 Publication, Special Publication No. 11370, Special Publication No. 11370, Special Publication No. 11370, Special Publication No. 11370-
Known examples include those described in Japanese Patent Publication No. 3032 and Japanese Patent Publication No. 17829/1983. In all of these known apparatuses, the object to be processed and the evaporation source are placed facing each other in a vapor deposition chamber consisting of a vacuum container, the substance is heated and evaporated in vacuum, and the vapor is condensed on the object to be processed. The structure is configured to form a thin film using the same method.
[発明が解決しようとする問題点]
ところで、このようなバツチ式真空蒸着装置に
おいては、蒸着作業が終了すると、蒸着室を大気
に開放して被処理物の入れ換えを行なう必要があ
る。この場合、蒸着作業終了直後に大気を導入す
ると、蒸発源は、急冷されるため損傷することが
ある。このため蒸着作業終了後、蒸発源がある程
度冷却されるまで蒸着室を大気に開放するのを待
つ必要がある。その結果、1バツチ当りに要する
時間が長くなり、生産性が悪い。[Problems to be Solved by the Invention] Incidentally, in such a batch type vacuum evaporation apparatus, when the evaporation operation is completed, it is necessary to open the evaporation chamber to the atmosphere and replace the objects to be processed. In this case, if the atmosphere is introduced immediately after the completion of the evaporation process, the evaporation source will be rapidly cooled and may be damaged. Therefore, after the vapor deposition process is completed, it is necessary to wait until the evaporation source has cooled down to some extent before opening the vapor deposition chamber to the atmosphere. As a result, the time required per batch increases, resulting in poor productivity.
また、蒸着作業終了後毎に蒸発源が大気中に晒
されるので、酸化等が起こり、消耗が早く、メン
テナンス費用が増大する傾向があつた。 Furthermore, since the evaporation source is exposed to the atmosphere after each evaporation operation, oxidation and the like occur, leading to rapid wear and tear, which tends to increase maintenance costs.
一方、蒸着室と蒸発源室とを別個に設け、これ
らの両室を大口径のバルプで仕切り、蒸発源室を
常に真空状態に保持し、蒸着室のみを大気圧にす
るようにした二室式真空蒸着装置も提案されてい
るが、蒸着室内の被処理物と蒸発源室内の蒸発源
とは対抗させて位置決めしなければならないた
め、装置の構成が自ずと制限を受け、しかも蒸着
室と蒸発源室との間に大口径のバルプを設ける必
要があるので、蒸着室内の被処理物と蒸発源室内
の蒸発源との距離についても制約を受けることに
なる。 On the other hand, a vapor deposition chamber and an evaporation source chamber are provided separately, and these two chambers are separated by a large-diameter valve so that the evaporation source chamber is always kept in a vacuum state and only the vaporization chamber is brought to atmospheric pressure. Type vacuum evaporation equipment has also been proposed, but since the object to be processed in the evaporation chamber and the evaporation source in the evaporation source chamber must be positioned opposite each other, the configuration of the equipment is naturally limited. Since it is necessary to provide a large-diameter valve between the evaporation source chamber and the evaporation source chamber, there are also restrictions on the distance between the object to be processed in the evaporation chamber and the evaporation source in the evaporation source chamber.
そこで、本発明は、上述のような従来技術の問
題点を解決して、1バツチ当りの作業時間を大幅
に短縮でき、しかも蒸発源が毎回大気に晒さずに
しかも不要な蒸発や汚染を防ぐことのできるバツ
チ式真空蒸着装置用蒸発源収納装置を提供するこ
とを目的としている。 Therefore, the present invention solves the above-mentioned problems of the conventional technology, significantly shortens the working time per batch, and prevents unnecessary evaporation and contamination without exposing the evaporation source to the atmosphere each time. It is an object of the present invention to provide an evaporation source storage device for a batch type vacuum evaporation apparatus.
[問題点を解決するための手段]
上記目的を達成するために、本発明によるバツ
チ式真空蒸着装置用蒸発源収納装置は、内部に基
板と蒸発源とを挿置し、上記蒸発源から蒸発させ
た蒸着物質蒸気を上記基板上に凝縮させて蒸着を
行なうようにした真空蒸着室と、上記真空蒸着室
に仕切弁を介して連結し、真空を維持できるよう
にした蒸発源収納室と、上記蒸発源収納室内で上
記蒸発源の蒸発と汚染を防止するキヤリアガスを
上記蒸発源収納室内に導入するキヤリアガス導入
装置とを有し、上記真空蒸着室と上記蒸発源収納
室との間で上記蒸発源を移動できるようにしたこ
とを特徴としている。[Means for Solving the Problems] In order to achieve the above object, the evaporation source storage device for a batch type vacuum evaporation apparatus according to the present invention has a substrate and an evaporation source inserted therein, and evaporation from the evaporation source is provided. an evaporation source storage chamber connected to the vacuum evaporation chamber via a gate valve to maintain a vacuum; a carrier gas introduction device that introduces a carrier gas into the evaporation source storage chamber to prevent evaporation and contamination of the evaporation source in the evaporation source storage chamber; It is characterized by being able to move the source.
[作用]
本発明によるバツチ式真空蒸着装置用蒸発源収
納装置においては、真空蒸着室に仕切弁を介して
連結して別個に蒸発源収納室が設けられ、蒸着処
理中蒸発源はキヤリアガス雰囲気中の蒸発源収納
室から真空蒸着室内の被処理物に対向する位置に
搬入され、蒸着処理終了後の被処理物の取出し時
には再び蒸発源収納室内に収納され、キヤリアガ
ス導入装置によつて導入された不活性ガス雰囲気
内に保持される。[Function] In the evaporation source storage device for a batch type vacuum evaporation apparatus according to the present invention, a separate evaporation source storage chamber is provided which is connected to the vacuum evaporation chamber via a gate valve, and the evaporation source is kept in a carrier gas atmosphere during the evaporation process. The evaporation source is transported from the evaporation source storage chamber to a position facing the object to be processed in the vacuum evaporation chamber, and when the object to be processed is taken out after the completion of the evaporation process, it is stored again in the evaporation source storage chamber and introduced by the carrier gas introduction device. maintained within an inert gas atmosphere.
[実施例]
以下、添付図面を参照して本発明の実施例につ
いて説明する。[Embodiments] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.
第1図には本発明の一実施例によるバツチ式真
空蒸着装置用蒸発源収納装置の要部を概略的に示
し、1は蒸発源収納室で、その内側に断熱材1a
が施されており、従つて保温室を構成している。
この蒸発源収納室1は仕切バルブ2を介して真空
蒸着室3に連結されている。蒸発源収納室1内に
は蒸発源4を搬送するための搬送ローラ5が一平
面上に配列されており、各搬送ローラ5は、第2
図に示すように、外部の駆動系6(図面にはその
うちの一つだけを示す)を介して駆動制御され得
る。図面には示してないが、真空蒸着室3内にも
搬送ローラ5と同様な搬送ローラが上記搬送ロー
ラ5の平面と実質的に同一の平面上に同じ向きで
配列される。蒸発源収納室1内の上部には二つの
ヒータ7が長手方向に沿つて設けられ、電極端子
8を介して外部電源(図示してない)に接続さ
れ、また各ヒータ7と組み合わせて蒸発源収納室
1の上壁には温度制御用の熱電対9(一方のみを
第1図に示す)が設けられている。これらのヒー
タ7および熱電対9の作用により、蒸発源4の温
度は一定温度に維持され得る。一方、蒸発源収納
室1内の下部にはキヤリアガス導入装置10が配
設されており、このキヤリアガス導入装置10は
外部の図示してない適当なキヤリアガス供給源に
連結され、不活性ガスを蒸発源収納室1内に供給
して蒸発源4内の蒸発物質の蒸発を抑えると共に
蒸発源4を周囲からの汚染から保護する。また蒸
発源収納室1は、その上部に設けた排気口11を
介して排気系に連結され、常に所定の真空レベル
に維持され得る。 FIG. 1 schematically shows the main parts of an evaporation source storage device for a batch type vacuum evaporation apparatus according to an embodiment of the present invention.
is provided, and thus constitutes an insulating room.
This evaporation source storage chamber 1 is connected to a vacuum deposition chamber 3 via a partition valve 2. Conveyance rollers 5 for conveying the evaporation sources 4 are arranged on one plane in the evaporation source storage chamber 1, and each conveyance roller 5 has a second
As shown, the drive can be controlled via external drive systems 6 (only one of which is shown in the figure). Although not shown in the drawings, conveyance rollers similar to the conveyance roller 5 are also arranged in the vacuum deposition chamber 3 on substantially the same plane as the plane of the conveyance roller 5 and in the same direction. Two heaters 7 are provided in the upper part of the evaporation source storage chamber 1 along the longitudinal direction, and are connected to an external power source (not shown) via an electrode terminal 8. A thermocouple 9 (only one of which is shown in FIG. 1) for temperature control is provided on the upper wall of the storage chamber 1. By the action of these heaters 7 and thermocouples 9, the temperature of the evaporation source 4 can be maintained at a constant temperature. On the other hand, a carrier gas introduction device 10 is disposed in the lower part of the evaporation source storage chamber 1, and this carrier gas introduction device 10 is connected to a suitable external carrier gas supply source (not shown) to supply an inert gas to the evaporation source. It is supplied into the storage chamber 1 to suppress the evaporation of evaporative substances in the evaporation source 4 and to protect the evaporation source 4 from contamination from the surroundings. Further, the evaporation source storage chamber 1 is connected to an exhaust system through an exhaust port 11 provided at its upper portion, and can be maintained at a predetermined vacuum level at all times.
このように構成した図示装置の動作において
は、真空蒸着室3内において被処理物(図示して
いない)に対する所要の蒸着作業が終了すると、
まず、真空蒸着室3と蒸発源収納室1との間の仕
切バルブ2を開き、蒸発源収納室1および真空蒸
着室3内の搬送ローラ5を外部の駆動系6により
駆動して真空蒸着室3内に位置している蒸発源4
を高温真空状態に保たれた蒸発源収納室1へ搬出
する。しかる後、仕切バルブ2を閉じ、真空蒸着
室3を大気に開放して真空蒸着室3内の蒸着処理
の終つた被処理物を取り出す。その後、処理すべ
き別の被処理物を真空蒸着室3内に装着し、再び
真空蒸着室3内を排気する。排気終了後、仕切バ
ルブ2を開き、搬送ローラ5を逆方向に駆動して
高温状態に保たれている蒸発源4を真空蒸着室3
内に搬入し、仕切バルブ2を閉じて蒸着作業を再
開する。このような動作を繰返すことによつて一
連の蒸着作業を行なうことができる。 In the operation of the illustrated apparatus configured in this way, when the required vapor deposition work on the object to be processed (not shown) is completed in the vacuum vapor deposition chamber 3,
First, the partition valve 2 between the vacuum evaporation chamber 3 and the evaporation source storage chamber 1 is opened, and the conveyor rollers 5 in the evaporation source storage chamber 1 and the vacuum evaporation chamber 3 are driven by an external drive system 6 to create a vacuum evaporation chamber. Evaporation source 4 located within 3
is carried out to the evaporation source storage chamber 1, which is maintained in a high-temperature vacuum state. Thereafter, the partition valve 2 is closed, the vacuum evaporation chamber 3 is opened to the atmosphere, and the processed object from the vacuum evaporation chamber 3 is taken out. Thereafter, another object to be processed is placed in the vacuum deposition chamber 3, and the vacuum deposition chamber 3 is evacuated again. After the exhaust is finished, the partition valve 2 is opened and the transport roller 5 is driven in the opposite direction to move the evaporation source 4 maintained at a high temperature to the vacuum deposition chamber 3.
Then, the partition valve 2 is closed and the vapor deposition operation is restarted. By repeating such operations, a series of vapor deposition operations can be performed.
なお、図示実施例では、キヤリアガス導入管1
0は蒸発源収納室1の下部に配設されているが、
代りに蒸発源収納室1の上部または左右両側部に
設けてもよく、ヒータ7についてもその数および
位置を適宜変更することができる。また、搬送ロ
ーラの代りに他の適当な搬送機構、例えばベルト
式やチエーン式等の搬送手段を使用してもよい。
また図示実施例では、一つの蒸発源が使用されて
いるが、当然処理目的に応じて複数個の蒸発源を
用いてもよく、また蒸発源の型式についても種々
の型式のものに対して同様に適用できる。さらに
各部の動作は、自動的に制御しても手動で制御し
てもよい。 In addition, in the illustrated embodiment, the carrier gas introduction pipe 1
0 is located at the bottom of the evaporation source storage chamber 1,
Alternatively, the heaters 7 may be provided in the upper part or on both left and right sides of the evaporation source storage chamber 1, and the number and position of the heaters 7 can be changed as appropriate. Further, instead of the conveyance rollers, other suitable conveyance mechanisms, such as belt-type or chain-type conveyance means, may be used.
In addition, although one evaporation source is used in the illustrated embodiment, it is of course possible to use a plurality of evaporation sources depending on the processing purpose, and the types of evaporation sources are the same for various types. Applicable to Furthermore, the operation of each part may be controlled automatically or manually.
[発明の効果]
以上、説明してきたように、本発明によれば、
内部に基板と蒸発源とを挿置し、上記蒸発源から
蒸発させた蒸着物質蒸気を上記基板上に凝縮させ
て蒸着を行なうようにした真空蒸着室と、上記真
空蒸着室に仕切弁を介して連結し、真空を維持で
きるようにした蒸発源収納室と、上記蒸発源収納
室内で上記蒸発源の蒸発と汚染を防止するキヤリ
アガスを上記蒸発源収納室内に導入するキヤリア
ガス導入装置とを有し、上記真空蒸着室と上記蒸
発源収納室との間で上記蒸発源を移動できるよう
に構成しているので、蒸着終了後従来行なわれて
いた蒸発源の冷却を省くことができ、1バツチ当
りの作業時間が短かくなり、その分生産性を向上
させることができる。また、蒸発源が蒸着終了毎
に大気に晒されず、キヤリアガス雰囲気中に保た
れるので、常に安定した品質で蒸着を行なうこと
ができしかも蒸発源の消耗を従来の1/10程度に押
えることができ、それにより、ランニングコスト
を低減できるだけでなく、メンテナンス時間も大
幅に短縮できる。[Effects of the Invention] As explained above, according to the present invention,
A vacuum evaporation chamber in which a substrate and an evaporation source are inserted, and a vapor deposition material vapor evaporated from the evaporation source is condensed onto the substrate to perform evaporation, and a gate valve is connected to the vacuum evaporation chamber. and a carrier gas introduction device that introduces a carrier gas into the evaporation source storage chamber to prevent evaporation and contamination of the evaporation source in the evaporation source storage chamber. Since the evaporation source is configured to be movable between the vacuum evaporation chamber and the evaporation source storage chamber, cooling of the evaporation source, which is conventionally performed after the completion of evaporation, can be omitted, and The working time is shortened, and productivity can be improved accordingly. In addition, since the evaporation source is not exposed to the atmosphere after each evaporation and is kept in a carrier gas atmosphere, evaporation can always be performed with stable quality, and consumption of the evaporation source can be reduced to about 1/10 of conventional methods. This not only reduces running costs but also significantly reduces maintenance time.
第1図は本発明の一実施例を示す概略断面図、
第2図は第1図の装置の横断面図である。
図中、1:蒸発源収納室、1a:断熱材、2:
仕切バルブ、3:真空蒸着室、4:蒸発源、5:
搬送ローラ、10:キヤリアガス導入装置。
FIG. 1 is a schematic sectional view showing an embodiment of the present invention;
2 is a cross-sectional view of the apparatus of FIG. 1; FIG. In the figure, 1: Evaporation source storage chamber, 1a: Heat insulating material, 2:
Partition valve, 3: Vacuum deposition chamber, 4: Evaporation source, 5:
Conveyance roller, 10: carrier gas introduction device.
Claims (1)
から蒸発させた蒸着物質蒸気を上記基板上に凝縮
させて蒸着を行なうようにした真空蒸着室と、上
記真空蒸着室に仕切弁を介して連結し、真空を維
持できるようにした蒸発源収納室と、上記蒸発源
収納室内で上記蒸発源の蒸発と汚染を防止するキ
ヤリアガスを上記蒸発源収納室内に導入するキヤ
リアガス導入装置とを有し、上記真空蒸着室と上
記蒸発源収納室との間で上記蒸発源を移動できる
ようにしたことを特徴とするバツチ式真空蒸着装
置用蒸発源収納装置。1. A vacuum evaporation chamber in which a substrate and an evaporation source are inserted, and vapor deposition material vapor evaporated from the evaporation source is condensed onto the substrate to perform evaporation, and a gate valve is provided in the vacuum evaporation chamber. an evaporation source storage chamber that is connected to the evaporation source storage chamber through the evaporation source storage chamber to maintain a vacuum, and a carrier gas introduction device that introduces a carrier gas into the evaporation source storage chamber to prevent evaporation and contamination of the evaporation source in the evaporation source storage chamber. An evaporation source storage device for a batch type vacuum evaporation apparatus, characterized in that the evaporation source can be moved between the vacuum evaporation chamber and the evaporation source storage chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16751185A JPS6230875A (en) | 1985-07-31 | 1985-07-31 | Evaporating source housing chamber for batch-operated vacuum deposition device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16751185A JPS6230875A (en) | 1985-07-31 | 1985-07-31 | Evaporating source housing chamber for batch-operated vacuum deposition device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6230875A JPS6230875A (en) | 1987-02-09 |
| JPH0215628B2 true JPH0215628B2 (en) | 1990-04-12 |
Family
ID=15851036
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16751185A Granted JPS6230875A (en) | 1985-07-31 | 1985-07-31 | Evaporating source housing chamber for batch-operated vacuum deposition device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6230875A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04185807A (en) * | 1990-11-21 | 1992-07-02 | Nikken Tokushu Kogyo Kk | Intake device for surface water in river mouth |
| JP5619028B2 (en) * | 2009-12-21 | 2014-11-05 | 株式会社アルバック | Vacuum deposition apparatus and maintenance method thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02250958A (en) * | 1989-03-23 | 1990-10-08 | Matsushita Electric Ind Co Ltd | Vacuum deposition equipment |
-
1985
- 1985-07-31 JP JP16751185A patent/JPS6230875A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04185807A (en) * | 1990-11-21 | 1992-07-02 | Nikken Tokushu Kogyo Kk | Intake device for surface water in river mouth |
| JP5619028B2 (en) * | 2009-12-21 | 2014-11-05 | 株式会社アルバック | Vacuum deposition apparatus and maintenance method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6230875A (en) | 1987-02-09 |
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| Date | Code | Title | Description |
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| R250 | Receipt of annual fees |
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| LAPS | Cancellation because of no payment of annual fees |