JPH021621B2 - - Google Patents
Info
- Publication number
- JPH021621B2 JPH021621B2 JP59244292A JP24429284A JPH021621B2 JP H021621 B2 JPH021621 B2 JP H021621B2 JP 59244292 A JP59244292 A JP 59244292A JP 24429284 A JP24429284 A JP 24429284A JP H021621 B2 JPH021621 B2 JP H021621B2
- Authority
- JP
- Japan
- Prior art keywords
- jet
- nozzle
- fluid
- laser
- machining
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F3/00—Severing by means other than cutting; Apparatus therefor
- B26F3/004—Severing by means other than cutting; Apparatus therefor by means of a fluid jet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Laser Beam Processing (AREA)
Description
【発明の詳細な説明】
〔技術分野〕
本発明は流体ジエツトにより穴明、切断、輪郭
カツト等の加工をする装置の改良に係る。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to an improvement in an apparatus for drilling, cutting, contour cutting, etc. using a fluid jet.
ジエツト加工は、例えば媒体に水を使用したと
き、被加工体表面に速度Ｖの水粒が衝突して比例
した圧力Ｐを生じ、この圧力が被加工体に作用し
て加工が行なわれるが、水流の運動エネルギを利
用するだけでは限界があり、加工速度を上げるこ
とはできなかつた。
In jet machining, for example, when water is used as a medium, water droplets at a velocity V collide with the surface of the workpiece, creating a proportional pressure P, and this pressure acts on the workpiece to perform the machining. There was a limit to just using the kinetic energy of the water flow, and it was not possible to increase the processing speed.
本発明は加工速度を高めるために発明されたも
ので、レーザビームの照射装置を設け、レーザビ
ームをノズルから噴出するジエツト流に沿つて照
射するようにし、且つ前記レーザービームを集束
するレンズを液体ジエツトノズル内の流通する流
体に接触させて設けたことを特徴とする。
The present invention was invented in order to increase the processing speed, and includes a laser beam irradiation device that irradiates the laser beam along a jet flow ejected from a nozzle, and a lens that focuses the laser beam is made of liquid. It is characterized by being provided in contact with the fluid flowing in the jet nozzle.
以下図面の一実施例により本発明を説明する。 The present invention will be explained below with reference to an embodiment of the drawings.
１はジエツトノズルで、先端が狭窄して線状に
ジエツト噴射２する。３はレーザ発振器で、反射
鏡４及びレンズ５を通してレーザビーム６を流体
ジエツト２の中心に照射する。レンズ５は図のよ
うに流体ジエツトノズル１内の流通流体に接触し
て設けられる。７は被加工体で、Ｘ−Ｙ駆動テー
ブル８上のタンク９内に固定して設けられ、Ｘ軸
モータ１０及びＹ軸モータ１１によつて所要加工
形状の送りが与えられる。１２が形状送り信号を
供給するNC制御装置、１３はジエツト流体の、
例えば水を加圧供給する高圧ポンプ、１４が水貯
蔵タンク、１５は必要に応じて設けられる加工部
分に砥粒を供給するノズルである。 1 is a jet nozzle, which has a narrow tip and sprays jet 2 in a linear manner. A laser oscillator 3 irradiates a laser beam 6 to the center of the fluid jet 2 through a reflecting mirror 4 and a lens 5. Lens 5 is provided in contact with the flowing fluid within fluid jet nozzle 1 as shown. Reference numeral 7 denotes a workpiece, which is fixedly provided in a tank 9 on an X-Y drive table 8, and fed into a desired shape by an X-axis motor 10 and a Y-axis motor 11. 12 is an NC control device that supplies a shape feed signal; 13 is a jet fluid;
For example, a high-pressure pump supplies water under pressure, 14 is a water storage tank, and 15 is a nozzle that supplies abrasive grains to a processing section provided as necessary.
ジエツト流により切断、輪郭カツト等の加工し
ようとする加工形状は予めプログラムしておき、
NC制御装置１２から駆動モータ１０，１１に信
号を加えて所要の加工形状送りをし被加工体７を
ノズル１との間に相対移動させながら加工する。
勿論相対移動はノズル１に駆動装置を設けて移動
させてもよい。ノズル１と被加工体７との対向間
隙の制御はノズル１にＺ軸送りを与えて調整制御
を行なう。加工は移動対向する被加工体７の加工
部分にノズル１から約50Kg／cm2程度以上の超高圧
で噴射するジエツトを衝突させ、衝突時の圧力に
よる剥離作用等を動かせて加工するが、これと同
時にレーザ６を照射する。 The machining shape to be processed, such as cutting or contour cutting, is programmed in advance using the jet flow.
A signal is applied from the NC control device 12 to the drive motors 10 and 11 to feed the required machining shape, and the workpiece 7 is machined while being moved relative to the nozzle 1.
Of course, relative movement may be achieved by providing a drive device to the nozzle 1. The opposing gap between the nozzle 1 and the workpiece 7 is controlled by applying Z-axis feed to the nozzle 1. Machining is performed by colliding a jet sprayed from the nozzle 1 at an ultra-high pressure of about 50 kg/cm 2 or more onto the machining part of the moving workpiece 7, and by moving the peeling effect due to the pressure at the time of collision. At the same time, the laser 6 is irradiated.
レーザ発振器３には、CO2レーザ（波長10μ）、
YAGレーザ（波長1.06n〜532n〜355n〜266n）
Arレーザ、エキシマレーザ（波長337.1n〜
800n）、その他が用いられ、加工目的、加工条
件、ジエツト流体等により波長を選択して利用す
る。反射鏡４によつてノズル１に平行させ、レン
ズ５で集束し、その集束ビーム６をノズルの中
心、又は周縁に合わせ、ジエツト流２の中心軸に
一致させ、又はジエツト流束の周縁に合わせて照
射する。ジエツト流体に透明な水を用いることに
よつてレーザビーム６は妨害損失することなく加
工部に達し熱エネルギの加工作用を働かせる。
又、このレーザ照射によつて被加工体加工部が常
に活性化し、水ジエツトとの共働により浸蝕作用
が働き、強いキヤビテーシヨン作用、剥離作用が
働き、これらの相互効果により加工性が高まり加
工速度が向上する。 Laser oscillator 3 includes a CO 2 laser (wavelength 10μ),
YAG laser (wavelength 1.06n~532n~355n~266n)
Ar laser, excimer laser (wavelength 337.1n ~
800n) and others, and the wavelength is selected and used depending on the processing purpose, processing conditions, jet fluid, etc. It is made parallel to the nozzle 1 by a reflector 4, focused by a lens 5, and the focused beam 6 is aligned with the center or periphery of the nozzle, aligned with the central axis of the jet stream 2, or aligned with the periphery of the jet stream. irradiate. By using transparent water as the jet fluid, the laser beam 6 reaches the processing area without interference losses and exerts the processing action of thermal energy.
In addition, this laser irradiation constantly activates the machined part of the workpiece, and works in conjunction with the water jet to produce an erosive effect, a strong cavitation effect, and a peeling effect, and these mutual effects increase workability and speed up the process. will improve.
実験によれば、0.1mmφのノズルから4000atm
の水ジエツトでAl2O3板を切断加工するとき、
15pulse／secでCO2レーザを平均出力50Wで加え
たとき、切断加工速度が約15mm／minで加工でき
た。これはレーザ照射を中止したとき約５mm／
minであつたのに比較して３倍の高速加工が得ら
れた。又レーザービームの集束レンズ５は表面が
ポンプ１３から供給される水ジエツトによつて常
に洗浄されるので、加工中レーザの損失がなく安
定した照射、加工効果が得られた。 According to experiments, 4000atm from a 0.1mmφ nozzle
When cutting Al 2 O 3 plate with water jet,
When applying a CO 2 laser with an average output of 50W at 15pulse/sec, the cutting speed was approximately 15mm/min. This is approximately 5mm/ when laser irradiation is stopped.
3 times higher speed machining was achieved compared to min. Furthermore, since the surface of the laser beam focusing lens 5 is constantly cleaned by the water jet supplied from the pump 13, there is no laser loss during processing, and stable irradiation and processing effects can be obtained.
尚、加工により深い孔加工するためには加工進
行に応じてノズル間隔を追従制御し、常にジエツ
ト流の最大エネルギを、又、レーザビームの焦点
を被加工体７の加工部分に衝撃するよう制御する
ことによつて最高効率をもつて加工することがで
き、形状カツトを行なうためにはNC制御装置１
２によつてＸ軸及びＹ軸モータ１０，１１を駆動
し被加工体７に定速移動を与えながら加工すれば
集束されたジエツト流の溝幅をもつて所要形状の
輪郭カツトができ、形状加工中コーナ等で送り速
度を変えたとき、又は定速移動のとき、レーザ３
の発振を制御した出力制御する等して高精度加工
することができる。 In addition, in order to drill deep holes, the nozzle interval is controlled in accordance with the progress of processing, and the maximum energy of the jet flow is always controlled, and the focal point of the laser beam is controlled so that it impacts the processing part of the workpiece 7. By doing this, it is possible to process with maximum efficiency, and in order to cut the shape, the NC control device 1
2 drives the X-axis and Y-axis motors 10 and 11 to machine the workpiece 7 while moving it at a constant speed, it is possible to cut the contour of the desired shape with the groove width of the focused jet flow, and the shape When changing the feed speed at a corner during machining, or when moving at a constant speed, the laser 3
High-precision machining can be achieved by controlling the output by controlling the oscillation.
実施例に於て、被加工体７に送りを与えたが、
ノズル１にＸ軸、Ｙ軸の駆動モータを設け、NC
制御、倣制御の加工送りを与えることができる。
又、ノズル１に対向方向に傾斜させる送りを与え
てテーパカツトを行なうこともできる。 In the example, feed was applied to the workpiece 7, but
Nozzle 1 is equipped with X-axis and Y-axis drive motors, and NC
It is possible to provide machining feed for control and copying control.
It is also possible to make a taper cut by feeding the nozzle 1 so that it is tilted in opposite directions.
ジエツト流体には水以外に、水を主体として、
これに表面活性剤、還元剤、電解質、その他を混
合した液、粉末微粒子を混合した液、或いは空
気、各種ガス、蒸気等も用いることができる。 In addition to water, jet fluids include mainly water,
A liquid mixed with a surfactant, a reducing agent, an electrolyte, etc., a liquid mixed with powder particles, air, various gases, steam, etc. can also be used.
以上のように本発明は、流体ジエツトにレーザ
ビームを重畳するようにしたので、両エネルギの
相互作用によつて加工速度を著しく高めることが
でき、加工性能を向上し高能率のジエツト加工を
行なうことができる。しかも前記レーザービーム
を集束するレンズを流体ジエツトノズル内の流通
する流体に接触させて設け、レンズ表面が流通す
る流体によつて常に洗浄されるようにしたので、
レーザの損失がなく安定したエネルギ照射と加工
効果が得られる。これによりセラミツクス、プラ
スチツク、金属、半導体、その他複合材等の加工
に効果が大きい。
As described above, in the present invention, since the laser beam is superimposed on the fluid jet, the machining speed can be significantly increased through the interaction of both energies, improving machining performance and performing highly efficient jet machining. be able to. Moreover, the lens for focusing the laser beam is provided in contact with the fluid flowing in the fluid jet nozzle, so that the lens surface is constantly cleaned by the flowing fluid.
Stable energy irradiation and processing effects can be obtained with no laser loss. This is highly effective in processing ceramics, plastics, metals, semiconductors, and other composite materials.
図面は本発明の一実施例装置の構成図である。
１……ノズル、２……流体ジエツト、３……レ
ーザ発振器、４……反射鏡、５……レンズ、６…
…レーザビーム、７……被加工体、１０，１１…
…Ｘ軸、Ｙ軸モータ、１２……NC制御装置、１
３……流体ポンプ、１５……砥粒ノズル。
The drawing is a configuration diagram of an apparatus according to an embodiment of the present invention. DESCRIPTION OF SYMBOLS 1...Nozzle, 2...Fluid jet, 3...Laser oscillator, 4...Reflector, 5...Lens, 6...
... Laser beam, 7... Workpiece, 10, 11...
...X-axis, Y-axis motor, 12...NC control device, 1
3... Fluid pump, 15... Abrasive grain nozzle.
Claims (1)
に沿つてレーザービームを照射する装置を設けた
流体ジエツト加工装置に於て、前記流体ジエツト
ノズル内の流通する流体に接触させて前記レーザ
ービームの集束レンズを設けたことを特徴とする
流体ジエツト加工装置。1. In a fluid jet processing device equipped with a device for irradiating a laser beam along a jet stream ejected from a liquid jet nozzle, a focusing lens for the laser beam is provided in contact with the fluid flowing in the fluid jet nozzle. A fluid jet processing device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59244292A JPS61121837A (en) | 1984-11-19 | 1984-11-19 | Fluid jet machining device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59244292A JPS61121837A (en) | 1984-11-19 | 1984-11-19 | Fluid jet machining device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61121837A JPS61121837A (en) | 1986-06-09 |
| JPH021621B2 true JPH021621B2 (en) | 1990-01-12 |
Family
ID=17116569
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59244292A Granted JPS61121837A (en) | 1984-11-19 | 1984-11-19 | Fluid jet machining device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61121837A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7163875B2 (en) * | 2000-04-04 | 2007-01-16 | Synova S.A. | Method of cutting an object and of further processing the cut material, and carrier for holding the object and the cut material |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59166391A (en) * | 1983-03-11 | 1984-09-19 | Inoue Japax Res Inc | Laser working device |
-
1984
- 1984-11-19 JP JP59244292A patent/JPS61121837A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61121837A (en) | 1986-06-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |