Deprecated: The each() function is deprecated. This message will be suppressed on further calls in /home/zhenxiangba/zhenxiangba.com/public_html/phproxy-improved-master/index.php on line 456
JPH021627B2 - - Google Patents
[go: Go Back, main page]

JPH021627B2 - - Google Patents

Info

Publication number
JPH021627B2
JPH021627B2 JP25151085A JP25151085A JPH021627B2 JP H021627 B2 JPH021627 B2 JP H021627B2 JP 25151085 A JP25151085 A JP 25151085A JP 25151085 A JP25151085 A JP 25151085A JP H021627 B2 JPH021627 B2 JP H021627B2
Authority
JP
Japan
Prior art keywords
drilling
hole
serial number
holes
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP25151085A
Other languages
Japanese (ja)
Other versions
JPS62114851A (en
Inventor
Takashi Kobayashi
Kenichi Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP25151085A priority Critical patent/JPS62114851A/en
Publication of JPS62114851A publication Critical patent/JPS62114851A/en
Publication of JPH021627B2 publication Critical patent/JPH021627B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Machine Tool Sensing Apparatuses (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Description

【発明の詳細な説明】 〔概要〕 多層基板を構成する各層基板の製造番号の表示
方法であつて、数値制御孔明け機(NC孔明け
機)を用いた多層基板の各層基板ごとのスルホー
ル孔明け工程において、 各層基板の製造番号を2進数で表示したコード
番号と、目視判別の可能な花文字のパターンに対
応した孔明けを同時に行うことにより、製造工程
中の多種類の基板の識別表示の効率化と目視によ
る判別を可能にする。
[Detailed Description of the Invention] [Summary] A method for displaying the serial number of each layer board constituting a multilayer board, which is a method for displaying the serial number of each layer board of a multilayer board using a numerically controlled drilling machine (NC drilling machine). In the opening process, by simultaneously drilling holes corresponding to the code number that represents the manufacturing number of each layer board in binary numbers and the pattern of flower characters that can be visually identified, it is possible to identify the various types of boards during the manufacturing process. This makes it possible to improve efficiency and visually distinguish.

〔産業上の利用分野〕[Industrial application field]

本発明は多層基板の表示方法に係わり、特に多
層基板のスルホール孔明け工程と同時に製造番号
に対応したコード番号と目視判別可能な花文字と
二つの孔明け表示を行うようにした多層基板の表
示方法に関する。
The present invention relates to a display method for a multilayer board, and more particularly, the present invention relates to a display method for a multilayer board, in which a code number corresponding to the manufacturing number, a visually distinguishable flower character, and two perforation displays are displayed simultaneously with the through-hole drilling process of the multilayer board. Regarding the method.

多種類の多層基板を製造するに際し、基板の混
同を防止するために各種類毎に製造番号を付与し
て管理を行い区別している。なお各基板への製造
番号の記入は、作業者が罫書で行なつており、そ
のために人為的なミスをしぱしば発生し、製造工
程の混乱の原因となり作業効率を低下させること
がある。
When manufacturing many types of multilayer substrates, each type is managed and distinguished by a serial number assigned to each type to prevent confusion. Note that the serial number is written on each board by an operator using a ruled line, and as a result, human errors often occur, causing confusion in the manufacturing process and reducing work efficiency.

そこで、各基板毎の目視による判別と安定な製
造番号の表示とが自動的に行える表示方法の出現
が要望されていた。
Therefore, there has been a demand for a display method that can automatically visually identify each board and display a stable serial number.

〔従来の技術〕[Conventional technology]

第4図は従来例の多層基板の表示方法を説明す
るためのブロツク図である。
FIG. 4 is a block diagram for explaining a conventional display method for a multilayer board.

第4図において、多層基板の中間層1−2のそ
れぞれは、製造番号表示工程2−1〜2−nにお
いて作業者が罫書にて当該する製造番号を記入
し、製造番号が記入された各層の基板はそれぞれ
スルホール孔明け工程3−1〜3−nでスルホー
ル孔が明けられ、中間層基板のパターン形成され
る。
In FIG. 4, each of the intermediate layers 1-2 of the multilayer board is marked by an operator writing in the corresponding manufacturing number using a ruled line in the manufacturing number displaying steps 2-1 to 2-n, and each layer on which the manufacturing number is written. Through-hole holes are formed in each of the substrates in through-hole forming steps 3-1 to 3-n, and a pattern of an intermediate layer substrate is formed.

中間層基板のパターン形成が完了すると、第5
図の多層基板の模式図に示すように、面揃え工程
4において最上層基板1−1と最下層基板1−n
との間に中間層1−2を挿入して面揃えを行い、
積層した後、最上層への製造番号表示工程5にお
いて、作業者が罫書にて当該する製造番号Nを最
上層の基板表面に記入する。
When the pattern formation of the intermediate layer substrate is completed, the fifth
As shown in the schematic diagram of the multilayer substrate in the figure, in the surface alignment step 4, the uppermost layer substrate 1-1 and the lowermost layer substrate 1-n
Insert intermediate layer 1-2 between and align the surfaces.
After lamination, in the manufacturing number display step 5 on the uppermost layer, an operator writes the corresponding manufacturing number N on the surface of the uppermost layer substrate using a ruled line.

製造番号が記入された多層基板は、スルホール
孔明け工程6において中間層基板1−2のスルホ
ール孔7−1〜スルホール孔7−nと合致する位
置にスルホール孔が明けられた後、諸工程を経て
完成する。
The multilayer substrate with the serial number written thereon undergoes various steps after through holes are drilled at positions that match the through holes 7-1 to 7-n of the intermediate layer substrate 1-2 in the through hole drilling step 6. It will be completed after a while.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

この従来方法では、各層の基板を分類表示する
製造番号は全て作業者の罫書による記入方法によ
つてなされている。
In this conventional method, all the serial numbers for classifying and displaying the substrates of each layer are entered by an operator using a ruled line.

この罫書作業は、人為的なミスを誘発し、分類
表示と現物とが異なることがしぱしば発生する。
また、各層の基板の厚さが0.1m/m程度と極め
て薄いため、罫書作業に時間を要するとともに、
細かい作業となるため、作業者が疲労して作業効
率がわるくなるといつた問題がある。
This scribing work induces human error, and the classification display often differs from the actual product.
In addition, since the thickness of each layer of the board is extremely thin at around 0.1 m/m, it takes time to do the marking work, and
Since the work is detailed, there is a problem in that workers become fatigued and work efficiency decreases.

本発明はこのような点に鑑みて創作されたもの
で、スルホール孔明け工程において、NC孔明け
機を用いて製造番号に対応したコード番号孔と、
目視にて判別可能な花文字孔とを多層基板の各層
の基板毎に孔明けした多層基板の表示方法の提供
を目的としている。
The present invention was created in view of these points, and in the through-hole drilling process, a code number hole corresponding to the serial number is created using an NC drilling machine.
The object of the present invention is to provide a display method for a multilayer substrate in which a visually distinguishable flower character hole is formed in each layer of the multilayer substrate.

〔課題を解決するための手段〕[Means to solve the problem]

第1図は本発明の多層基板の表示方法のブロツ
ク図を示している。
FIG. 1 shows a block diagram of a method for displaying a multilayer substrate according to the present invention.

第1図において、多層基板の各層基板に孔明け
を行うNC孔明け機7と、予め花文字信号のパタ
ーンを記憶しており制御部8を介して外部より入
力する製造番号孔明け信号に対応した花文字信号
を読み出すパターン記憶部9と、パターン記憶部
9より読み出された花文字信号と、外部より入力
されるスルホール孔明け信号及び製造番号孔明け
信号とにより、NC孔明け機7を制御して各層の
基板の所定箇所にスルホール孔および花文字孔の
製造番号の孔明けを行うように制御する制御部8
と、よりなる表示手段10を備えた構成としてい
る。
In Fig. 1, there is an NC drilling machine 7 that drills holes in each layer of a multilayer board, and a serial number drilling signal that stores the pattern of the Hanaji signal in advance and is input from the outside via the control unit 8. The NC drilling machine 7 is operated by the pattern storage section 9 which reads out the flower character signal read out, the flower character signal read out from the pattern storage section 9, and the through-hole drilling signal and serial number drilling signal inputted from the outside. A control unit 8 that performs control to drill through-hole holes and flower letter holes with manufacturing numbers at predetermined locations on the substrate of each layer.
The configuration includes a display means 10 consisting of the following.

〔作用〕[Effect]

外部よりスルホール孔明け信号と製造番号を規
定する製造番号孔明け信号が制御部8に入力され
る。
A through-hole drilling signal and a serial number drilling signal that defines the serial number are input to the control unit 8 from the outside.

制御部8は、スルホール孔明け信号によつて
NC孔明け機7を制御し、中間層のスルホール孔
明け工程3−1および積層後のスルホール孔明け
工程6−1において中間層の各基板および最上層
基板1−1と最下層基板1−nのスルホール孔明
けが行われる。
The control unit 8 uses the through-hole drilling signal to
The NC drilling machine 7 is controlled, and each substrate of the intermediate layer, the top layer substrate 1-1, and the bottom layer substrate 1-n are Through-hole drilling is performed.

更に制御部8では、製造番号孔明け信号によつ
てNC孔明け機7およびパターン記憶部9を制御
し、コード番号孔明け工程3−1aにおいて製造
番号を規定するコード番号の孔明けを行うととも
に、パターン記憶部9に予め格納されている当該
製造番号に対応した花文字を読み出して花文字孔
明け工程3−2bにおいて花文字の孔明けを行な
う。
Further, the control section 8 controls the NC drilling machine 7 and the pattern storage section 9 according to the serial number drilling signal, and in the code number drilling step 3-1a, performs drilling of the code number that defines the serial number. , the flower character corresponding to the serial number stored in advance in the pattern storage section 9 is read out, and the flower character is punched in the flower character hole punching step 3-2b.

すなわち本発明では、NC孔明け機7を用いて
スルホール孔明けを行うとともに、多層基板の各
層基板の製造番号に対応したコード番号孔及び花
文字孔を設けた表示をすることにより、従来の人
為的に行つたいた罫書表示をなくして表示作業の
能率の向上を図るともに、目視による多種類の基
板の判別を容易としている。
That is, in the present invention, the NC drilling machine 7 is used to drill through-holes, and by displaying code number holes and flower letter holes corresponding to the serial number of each layer board of a multilayer board, the conventional human-made method is eliminated. This improves the efficiency of display work by eliminating the traditional markings, and also makes it easier to visually distinguish between various types of substrates.

〔実施例〕〔Example〕

第1図は多層基板の表示方法の一実施例のブロ
ツク図、第2図は一実施例の製造番号孔図、第3
図a,bは一実施例の花文字図である。
Fig. 1 is a block diagram of an embodiment of a display method for a multilayer board, Fig. 2 is a serial number hole diagram of an embodiment, and Fig. 3 is a block diagram of an embodiment of a display method for a multilayer board.
Figures a and b are flower character diagrams of one embodiment.

第1図において、各層基板の中間層および積層
後の最上層基板と最下層基板のスルホール孔明け
工程3−1,6−1、コード番号孔明け工程3−
1a,6−1a及び花文字孔明け工程3−2a,
6−2bにおいて、中間層の各基板および最上、
最下層の基板のそれぞれにスルホール孔と製造番
号に対応したコード番号孔と花文字孔の孔明け表
示を行うNC孔明け機7と、予め花文字信号のパ
ターンを格納し製造番号信号に対応した花文字信
号のパターンを読み出すパターン記憶部9と、パ
ターン記憶部9より読み出された花文字信号およ
び外部より入力するスルホール信号、製造番号信
号によつてNC孔明け機7の孔明け動作を制御す
る制御部8と、から成る表示手段10とを備えた
構成としている。
In FIG. 1, the through-hole drilling steps 3-1 and 6-1 of the intermediate layer of each layer substrate, the uppermost layer substrate and the lowermost layer substrate after lamination, and the code number drilling step 3-
1a, 6-1a and flower character hole punching step 3-2a,
6-2b, each substrate and the top layer of the intermediate layer;
An NC punching machine 7 is installed to display through-hole holes, code number holes corresponding to the serial number, and flower character holes on each of the bottom layer substrates, and a pattern of flower character signals is stored in advance to correspond to the serial number signal. Controls the drilling operation of the NC drilling machine 7 based on the pattern storage section 9 that reads out the pattern of the flower character signal, the flower character signal read out from the pattern storage section 9, the through-hole signal and the serial number signal that are input from the outside. The configuration includes a control section 8, and a display means 10 consisting of.

まず、中間層基板1−2のスルホール孔明け工
程3−1において、制御部8は外部より入力され
るスルホール孔明け信号によりNC孔明け機7を
制御して中間層基板の所定の箇所にスルホール7
−1〜7−nの孔明けを行う。
First, in the through-hole drilling process 3-1 of the intermediate layer substrate 1-2, the control unit 8 controls the NC drilling machine 7 using a through-hole drilling signal inputted from the outside to form through-holes at predetermined locations on the intermediate layer substrate. 7
-Drill holes from -1 to 7-n.

スルホール孔明けが完了した時点で、制御部8
に製造番号孔明け信号が入力される。制御部8
は、NC孔明け機7を制御して第2図のAに示す
ような製造番号を規定する配列をもつた例えば2
進数で表されたコード番号の孔明けをコード番号
孔明け工程3−1aにて行う。この製造番号孔A
の配列によつて基板の種類やパターン形成等を表
す製造番号を規定している。
When the through-hole drilling is completed, the control unit 8
The serial number drilling signal is input. Control unit 8
controls the NC drilling machine 7 to create, for example, a 2
The code number expressed in base numbers is punched in the code number punching step 3-1a. This serial number hole A
The serial number, which indicates the type of substrate, pattern formation, etc., is defined by the arrangement of .

またパターン記憶部9には、予め第3図aに示
すような花文字を表すドツト信号を格納してい
る。いま、外部より製造番号孔明け信号が制御部
8に入力されると、制御部8は製造番号孔明け信
号に対応して第3図bに示すような花文字信号を
記憶部9より順次読み出し、花文字孔明け工程3
−1bにおいてNC孔明け機7を制御して基板の
表面の所定個所に第2図のBに示す花文字を孔明
けにより形成する。
Further, the pattern storage section 9 stores in advance a dot signal representing a flower character as shown in FIG. 3a. Now, when a serial number punching signal is inputted to the control section 8 from the outside, the control section 8 sequentially reads out flower character signals as shown in FIG. 3b from the storage section 9 in response to the serial number punching signal. , Flower character perforation process 3
-1b, the NC punching machine 7 is controlled to form a flower character shown in B in FIG. 2 at a predetermined location on the surface of the substrate by punching.

積層後のスルホール孔明け工程6においても上
記の要領によつて、最上層基板1−1と最下層基
板1−nのスルホール孔明けを行うと共に、最上
層基板の表面の所定位置に製造番号としてコード
番号と花文字の2種類の孔明けを行い、製造番号
の表示を行つている。
In the through-hole drilling step 6 after lamination, through-holes are drilled in the top layer substrate 1-1 and the bottom layer substrate 1-n according to the above-mentioned procedure, and at the same time, a serial number is marked at a predetermined position on the surface of the top layer substrate. Two types of holes are made, one for the code number and the other for flower characters, to display the serial number.

〔発明の効果〕〔Effect of the invention〕

以上の説明から明らかなように本発明によれ
ば、スルホール孔明け工程において、NC孔明け
機を用いたスルホール孔明け、および製造番号を
表すコード番号と花文字の2種類の孔明け表示を
行うことにより、表示作業の自動化による作業効
率の向上を図るとともに、目視による基板の判別
を可能にしている。
As is clear from the above description, according to the present invention, in the through-hole drilling process, through-hole drilling is performed using an NC drilling machine, and two types of drilling display are performed: a code number representing the manufacturing number and a flower character. This not only improves work efficiency by automating display work, but also enables visual identification of boards.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は多層基板の表示方法の一実施例のブロ
ツク図、第2図は一実施例の製造番号孔図、第3
図はa,bは一実施例の花文字図、第4図は従来
の多層基板の表示方法のブロツク図、第5図は多
層基板の模式図である。 図において、1は多層基板、1−1は最上層基
板、1−2は中間層基板、1−nは最下層基板、
2−1〜2−nは製造番号表示工程(罫書)、3
−1はスルホール孔明け工程、3−1aはコード
番号孔明け工程、3−1bは花文字孔明け工程、
4は面揃え工程、5は最上層への製造番号表示工
程、6はスルホール孔明け工程、6−1aはコー
ド番号孔明け工程、6−1bは花文字孔明け工
程、7はNC孔明け機、8は制御部、9はパター
ン記憶部、10は表示手段、を示す。
Fig. 1 is a block diagram of an embodiment of a display method for a multilayer board, Fig. 2 is a serial number hole diagram of an embodiment, and Fig. 3 is a block diagram of an embodiment of a display method for a multilayer board.
In the figures, a and b are flower letters of one embodiment, FIG. 4 is a block diagram of a conventional display method for a multilayer board, and FIG. 5 is a schematic diagram of a multilayer board. In the figure, 1 is a multilayer substrate, 1-1 is a top layer substrate, 1-2 is an intermediate layer substrate, 1-n is a bottom layer substrate,
2-1 to 2-n are manufacturing number display steps (marker), 3
-1 is a through hole drilling process, 3-1a is a code number drilling process, 3-1b is a flower character drilling process,
4 is the surface alignment process, 5 is the manufacturing number display process on the top layer, 6 is the through hole drilling process, 6-1a is the code number drilling process, 6-1b is the flower character drilling process, 7 is the NC drilling machine , 8 is a control section, 9 is a pattern storage section, and 10 is a display means.

Claims (1)

【特許請求の範囲】 1 数値制御孔明け機7によるスルホール孔明け
工程を含んだ多層基板の製造方法において、 積層すべき複数の基板のそれぞれのスルホール
孔明けに際し、前記数値制御孔明け機7に対して
スルホール孔明け信号を与えて所定位置へのスル
ホール孔明けを行うと共に、当該基板の製造番号
に対応したコードを表す孔明け信号と目視判別の
可能な花文字パターンを表す孔明け信号とを与え
て、当該基板のスルホール孔明け領域外にコード
表示用孔明けと花文字表示用の孔明けを行うよう
にしことを特徴とする多層基板の表示方法。
[Scope of Claims] 1. In a method for manufacturing a multilayer substrate including a through-hole drilling step using a numerically controlled drilling machine 7, when drilling through holes in each of a plurality of substrates to be laminated, the numerically controlled drilling machine 7 A through-hole drilling signal is given to the board to drill a through-hole at a predetermined position, and a drilling signal representing a code corresponding to the serial number of the board and a drilling signal representing a visually distinguishable flower character pattern are also sent to the board. A method for displaying a multilayer substrate, characterized in that holes for displaying a code and holes for displaying flower characters are formed outside the through-hole area of the substrate.
JP25151085A 1985-11-08 1985-11-08 Method for displaying multi-layer substrate Granted JPS62114851A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25151085A JPS62114851A (en) 1985-11-08 1985-11-08 Method for displaying multi-layer substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25151085A JPS62114851A (en) 1985-11-08 1985-11-08 Method for displaying multi-layer substrate

Publications (2)

Publication Number Publication Date
JPS62114851A JPS62114851A (en) 1987-05-26
JPH021627B2 true JPH021627B2 (en) 1990-01-12

Family

ID=17223882

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25151085A Granted JPS62114851A (en) 1985-11-08 1985-11-08 Method for displaying multi-layer substrate

Country Status (1)

Country Link
JP (1) JPS62114851A (en)

Also Published As

Publication number Publication date
JPS62114851A (en) 1987-05-26

Similar Documents

Publication Publication Date Title
CN107949172B (en) Flexible circuit board process tracing two-dimensional code drilling manufacturing method
JPH021627B2 (en)
JP4262425B2 (en) Method and apparatus for operating machine tool
JPS58181107A (en) Automatic programming device of compound work
CN110816133A (en) Lettering processing method, CNC processing device and computer storage medium
JPH0382501A (en) Timber-working control system
JPH0810791B2 (en) How to display the notation name of a multilayer ceramic substrate
JPH0757461B2 (en) Drawing check device for NC processing data
JPH11161691A (en) Method and system for manufacturing process drawing by process
JP5357816B2 (en) Identification mark applying method, printed circuit board drilling machine, and program
JPS62228353A (en) Device for checking drawing for nc machining data
JPH0548240A (en) Method for manufacturing printed wiring board
JPS6039049A (en) Preparation system of machining information
JPS62292349A (en) Continuous machining control device for different machining program
JPH07261817A (en) Cutting path drawing method
JP2770234B2 (en) Machining control method for machine tools
JPH03294135A (en) Control unit for boring machine
JPH0264711A (en) Dialogue system setup procedure monitoring method
JPH02224998A (en) Method for selecting/judging machining pattern of sheet piercing device
JPH0337788Y2 (en)
JPS6055696A (en) Ceramic sheet information display method
JP2003318498A (en) Printed board, identification method for same, and identification apparatus
JPH05218601A (en) Discrimination and display method of printed-circuit board and its circuit board
JPH09307212A (en) Synthetic method for hole boring data of a plurality of printed circuit boards
JPS6377632A (en) Control device for hole drilling machine equipped with automatic tool exchanger