JPH0217049B2 - - Google Patents
Info
- Publication number
- JPH0217049B2 JPH0217049B2 JP58223852A JP22385283A JPH0217049B2 JP H0217049 B2 JPH0217049 B2 JP H0217049B2 JP 58223852 A JP58223852 A JP 58223852A JP 22385283 A JP22385283 A JP 22385283A JP H0217049 B2 JPH0217049 B2 JP H0217049B2
- Authority
- JP
- Japan
- Prior art keywords
- cutting line
- cutting
- width
- buried object
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
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- Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Geophysics And Detection Of Objects (AREA)
Description
【発明の詳細な説明】
本発明は、放射線透過による構造物切断位置の
確認方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for confirming the cutting position of a structure using radiographic transmission.
コンクリート、木造など構造物において、例え
ば壁体に開口部を新たに設ける場合、その壁体内
に埋設物が存在することが多い。 In structures such as concrete and wood, when a new opening is provided in a wall, for example, buried objects often exist within the wall.
そこでその構造物の設計図等により埋設物の位
置を確認することが必要になるわけであるが、実
際には図面が粉失してしまつていたり、埋設物の
位置が必ずしも図面と一致していない場合がほと
んどである。 Therefore, it is necessary to confirm the location of the buried objects using the design drawings of the structure, but in reality, the drawings may have been lost or the locations of the buried objects may not always match the drawings. In most cases, it is not.
本発明は上記のような場合に、放射線の透過に
より埋設物の状況を確認し切断線の微調整が出来
るようにした、構造物切断位置の確認方法を提供
することを目的とする。 SUMMARY OF THE INVENTION It is an object of the present invention to provide a method for confirming the cutting position of a structure in the above-mentioned case, by which the state of the buried object can be confirmed by transmitting radiation and the cutting line can be finely adjusted.
次に本発明の実施例について説明する。 Next, examples of the present invention will be described.
ここでは本発明の原理を理解するため、最も簡
単な施工のうち、対象の壁体に垂直方向の切断線
をいれる場合について説明する。 Here, in order to understand the principle of the present invention, we will explain the simplest construction, in which a vertical cutting line is cut into the target wall.
(イ) 標識帯、フイルム、放射線源の設置(第1〜
3図)
まず壁体Aの一面に設計図等により割出した切
断予定部分の切断線1を罫書く。(b) Installation of marker strips, films, and radiation sources (1st to
(Figure 3) First, on one side of wall A, mark the cutting line 1 of the part to be cut, which is determined from a blueprint or the like.
この時、鉄筋等埋設物の正確な位置は未確認で
ある。 At this time, the exact location of buried objects such as reinforcing bars has not been confirmed.
罫書かれた切断線1上に鉛等放射線吸収率が壁
体等の構造物と異なる材料で構成した一定幅を有
する標識帯2を配置する。 A marker band 2 having a constant width and made of a material such as lead whose radiation absorption rate is different from that of a structure such as a wall is placed on a marked cutting line 1.
この標識帯2は必ずしも一本の連続した線材で
ある必要はなく、鉛等の短片を第5図ように切断
線1上に破線状に並べる方法も考えられる。 This marker band 2 does not necessarily have to be a single continuous wire, and a method of arranging short pieces of lead or the like in a broken line shape on the cutting line 1 as shown in FIG. 5 is also conceivable.
このとき標識帯2の幅は切断する刃物の幅、す
なわちダイヤモンドカツタ等の厚さにほぼ等しい
寸法とする。 At this time, the width of the marker band 2 is set to be approximately equal to the width of the cutting tool, that is, the thickness of a diamond cutter or the like.
一方壁体Aの裏面、つまり標識帯2の設置され
ていない側の面に放射線を感知するフイルム、本
実施例ではX線用のフイルム3を配置する。 On the other hand, on the back surface of the wall A, that is, on the side where the marker band 2 is not installed, a radiation sensing film, in this embodiment, an X-ray film 3 is arranged.
更に切断線1の中心線11から壁体Aの面に垂
直に伸ばした面上の一点に、切断線1に向けて放
射線、例えばX線源4を設置する。 Further, a radiation source 4, for example, an X-ray source 4, is installed at a point on a plane extending perpendicularly to the surface of the wall A from the center line 11 of the cutting line 1, facing the cutting line 1.
(ロ) X線照射及び判断
第2図に示すように壁体A内に切断線1にかか
る埋設物Bと、切断線1にかからない埋設物Cが
存在するとき、X線源4からX線を照射したとき
フイルム3には第3図の像が得られる。(b) X-ray irradiation and judgment As shown in Figure 2, when there is a buried object B that falls along cutting line 1 in wall A and a buried object C that does not fall along cutting line 1, X-ray irradiation from X-ray source 4 When irradiated with , the image shown in FIG. 3 is obtained on the film 3.
すなわちB′は埋設物Bの像であり、2′は標識
帯2の像、C′は埋設物Cの像である。 That is, B' is an image of buried object B, 2' is an image of marker band 2, and C' is an image of buried object C.
ここで2′とB′のように重複部が生じてしまう
ということは切断線1の延長上に埋設物Bの一部
がかかつているか、かかつていない場合でも両者
間の距離がかなり近いことを意味する。 Here, the fact that there is an overlapping part like 2' and B' means that part of the buried object B is overlapping the extension of cutting line 1, or even if it is not there, the distance between the two is quite close. means.
一方、C′と2′のように重複部分がないという
ことは切断線1が埋設物Cにかからないことを意
味するだけでなく、切断線1と埋設物C間に充分
な余裕があることを意味する。 On the other hand, the fact that there is no overlap like C' and 2' not only means that cutting line 1 does not overlap buried object C, but also means that there is sufficient space between cutting line 1 and buried object C. means.
この場合は罫書いた切断線1に沿つて切断して
も支障がない。 In this case, there is no problem in cutting along the marked cutting line 1.
それにたいして上記のように重複部分が生じて
しまつたときは切断位置を移動しなければならな
いがその移動幅をどのように設定するかが次の課
導となる。 On the other hand, when an overlapping portion occurs as described above, the cutting position must be moved, and the next lesson is how to set the movement width.
ここでこの移動幅の数値を数式によつて求める
ことも出来る。 Here, the numerical value of this movement width can also be determined using a mathematical formula.
しかしながら次のように考えることにより、よ
り能率的に作業を進めることが出来る。 However, by considering the following, you can proceed with your work more efficiently.
すなわちフイルム3に写つた標識帯や埋設物の
影像はX線源4から放射線状に広がつたX線によ
つて拡大された状態で写つたそれぞれの影であ
る。 In other words, the images of the marker zone and the buried object taken on the film 3 are the respective shadows magnified by the X-rays spread radially from the X-ray source 4.
従つて、フイルム3に影像された重複部分の幅
S′は実際に重複する幅Sより必ず広くなる。 Therefore, the width of the overlapped portion imaged on film 3
S' is always wider than the actual overlapping width S.
従つて、切断線1をフイルム3での重複部分の
の幅S′だけ移動すれば、多少必要以上に移動させ
たことになるが充分安全な移動幅で切断線1を埋
設物Bからそらすことが出来る。 Therefore, if the cutting line 1 is moved by the width S' of the overlapping part on the film 3, it will have been moved somewhat more than necessary, but the cutting line 1 can be deflected from the buried object B by a sufficiently safe movement width. I can do it.
つまり、第4図に示すように始めに設定した切
断線1の中心線11を埋設物Bと反対側にS′だけ
ずらした位置に、新たな切断線1′の中心線1
1′を設定すればよいのである。 In other words, as shown in Fig. 4, the center line 11 of the new cutting line 1' is set at a position where the center line 11 of the initially set cutting line 1 is shifted by S' to the side opposite to the buried object B.
It is sufficient to set it to 1'.
(ハ) 切断
以上のようにして切断線を設定し罫書いた後、
切断すれば埋設物B,Cに接触することなく切断
することが出来る。(c) Cutting After setting the cutting line and marking as described above,
If it is cut, it can be cut without coming into contact with the buried objects B and C.
(ニ) その他の実施例
本実施例では前述したように垂直方向の埋設物
が存在する壁体に垂直方向の切断線をいれるとい
つた最も簡単な場合を説明したが、水平方向の切
断の場合も同じ原理であることはもとより、壁体
Aを矩形に切抜く場合も同じ原理で、第5図よう
に切断線1の角部に標識帯2を配置すれば垂直方
向、水平方向の埋設物に対して同じ様に微調整す
ることが出来る。(d) Other examples In this example, as mentioned above, the simplest case was explained, in which a vertical cutting line is drawn in a wall where there is a vertically buried object, but horizontal cutting The same principle applies not only to cutting out wall A into a rectangular shape, but also to placing marker strips 2 at the corners of cutting line 1 as shown in Figure 5, which allows for vertical and horizontal burial. You can make fine adjustments to objects in the same way.
本発明は以上説明したようになるので次のよう
な効果を期待することが出来る。 Since the present invention is as explained above, the following effects can be expected.
(イ) 設計図等による埋設物の確認だけでは切断作
業が危ぶまれるような場合や、図面が紛失した
場合でも、切断線を照射して埋設物と切断線と
の位置関係を事前に知ることが出来るので、切
断線の微調整が可能であり安心して切断作業を
行うことが出来る。(b) Even in cases where the cutting work is at risk if only checking the buried object using blueprints, etc., or even if the drawings are lost, it is possible to know in advance the positional relationship between the buried object and the cutting line by illuminating the cutting line. This allows fine adjustment of the cutting line and allows cutting to be carried out with peace of mind.
(ロ) 切断位置の移動幅を決定するにあたつて繁雑
な数式をもちいるには及ばない。(b) It is not worth using complicated mathematical formulas to determine the width of movement of the cutting position.
なぜならフイルムに影像された埋設物と切断線
との重複幅は実際の重複幅より広いので、実際の
移動幅をフイルム上の重複幅とすれば充分余裕を
もつて移動することになるからである。 This is because the overlap width between the buried object imaged on the film and the cutting line is wider than the actual overlap width, so if the actual movement width is taken as the overlap width on the film, the object will move with sufficient margin. .
つまりフイルムに影像された埋設物と切断線の
重複幅は、切断線が埋設物に抵触しない必要最小
限の幅よりは確実に大きく、かつ必要最小限の幅
ということになるからである。 In other words, the overlap width between the buried object imaged on the film and the cutting line is definitely larger than the necessary minimum width that does not cause the cutting line to come into contact with the buried object, and is also the minimum necessary width.
(ハ) 従来公知の方法として、少なくとも2箇所の
X線源を使用して測定を行うような方法が存在
する。(c) As a conventionally known method, there is a method in which measurement is performed using at least two X-ray sources.
しかし、こうした公知の方法は、X線を2箇所
あるいは複数箇所から照射するから投影図には二
重あるいは多重の映像が照射される。 However, in these known methods, since X-rays are irradiated from two or more locations, double or multiple images are irradiated on the projection view.
ところが、使用中の病院やオフイスビルなど、
狭い現場においては、実際に2箇所に照射源をセ
ツトして測定を行うことは、空間確保の上からき
わめて困難である。 However, hospitals and office buildings in use, etc.
In a narrow field, it is extremely difficult to actually set up irradiation sources at two locations and perform measurements due to space constraints.
その上に二重に投影された像の解析には多大の
労力を必要とする。 Analysis of the image doubly projected onto it requires a great deal of effort.
ところが本発明は、1箇所のX線源からの放射
線によつてすべてを解決できるように構成したも
のである。 However, the present invention is configured so that all problems can be solved using radiation from one X-ray source.
その結果、使用する機材の量も小さくなり、占
有する空間が最少で済む。 As a result, the amount of equipment used is reduced and the space taken up is minimal.
そのために使用中のビルの改造など、作業条件
の悪い場合でもきわめて効率の良い作業をするこ
とができるようになつた。 As a result, it has become possible to work extremely efficiently even when working conditions are poor, such as when remodeling a building that is currently in use.
さらに、本発明の方法によつて撮影したフイル
ムには、二重に投影された像は存在しない。 Furthermore, there are no double projected images in the film taken by the method of the present invention.
だから、その測定はきわめて容易であり、現場
において迅速な処理を行うことができるものであ
る。 Therefore, it is extremely easy to measure and can be quickly processed in the field.
第1図:本発明の一実施例の説明図、第2〜4
図:放射線照射及び影像の説明図、第5図:その
他の実施例の説明図。
1:切断線、2:標識帯、2′:標識帯像、
3:フイルム、4:X線源、11:切断線中心
線、A:壁体。
Figure 1: Explanatory diagram of one embodiment of the present invention, parts 2 to 4
Figure: Explanatory diagram of radiation irradiation and images; FIG. 5: Explanatory diagram of other embodiments. 1: cutting line, 2: sign band, 2': sign band image,
3: film, 4: X-ray source, 11: cutting line center line, A: wall.
Claims (1)
識帯を配置し、 構造物の他の側に放射線を感知するフイルムを
配置し、 標識帯を配置した面に1箇所のX線源から放射
線を照射し、 フイルムに投影した標識帯像と埋設物像の重複
幅だけ切断線をずらして微調整を行うことを特徴
とする、 構造物切断位置の確認方法。[Scope of Claims] 1. Placing a marker strip with approximately the same width as the cutting blade on the cutting line of the structure, arranging a radiation-sensing film on the other side of the structure, and placing 1 marker strip on the surface on which the marker strip is placed. A method for confirming the cutting position of a structure, characterized by irradiating radiation from an X-ray source at the location and finely adjusting the cutting line by shifting the cutting line by the overlap width of the marker belt image and the buried object image projected on a film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58223852A JPS60114784A (en) | 1983-11-28 | 1983-11-28 | Method for confirming cutting position of structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58223852A JPS60114784A (en) | 1983-11-28 | 1983-11-28 | Method for confirming cutting position of structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60114784A JPS60114784A (en) | 1985-06-21 |
| JPH0217049B2 true JPH0217049B2 (en) | 1990-04-19 |
Family
ID=16804721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58223852A Granted JPS60114784A (en) | 1983-11-28 | 1983-11-28 | Method for confirming cutting position of structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60114784A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6653885B2 (en) * | 2016-05-09 | 2020-02-26 | 株式会社レジスタ | Image processing apparatus, image processing method, and program |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5773609A (en) * | 1980-10-25 | 1982-05-08 | Taisei Kiso Sekkei Kk | Measuring method for position and diameter of buried reinforcement in concrete |
-
1983
- 1983-11-28 JP JP58223852A patent/JPS60114784A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60114784A (en) | 1985-06-21 |
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