JPH0218399B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for plating one side of a strip.

[Prior Art] Conventionally conventional electrochemical plating methods for metal strips include the full-surface immersion method, in which the strip is immersed in a plating liquid if necessary, and then plated. There is a method of plating only the lower surface of the strip by ejecting a plating liquid flow from the lower part of the strip running on the liquid surface.

[Problems to be Solved by the Invention] First, in the latter method, the plating liquid flow is ejected from the lower part of the strip toward the plating surface, so that the plating speed increases due to the stirring effect of the plating liquid after it comes into contact with the plating surface. This has the advantage that only one piece of masking tape is required because the plating liquid hits only the lower surface of the strip and does not wrap around the upper surface. However, when plating work that combines double-sided plating and single-sided plating, for example, when performing nickel plating on the entire surface of a strip and then plating silver stripes on one side, it is difficult to perform double-sided plating on a horizontal strip. Since it is in a certain plating solution (it is difficult to hold the strip horizontally), it is impossible to perform the plating work in one step, and it is inconvenient that it must be divided into separate steps.

On the other hand, the former full-surface dipping method has the advantage that if the strip is held vertically, plating can be performed in one step without the need for separate steps as described above. However, this method is not as satisfactory as the latter method in terms of the flow rate and stirring effect of the plating liquid that contacts the plating surface, and the plating speed is also inferior.

An object of the present invention is to provide a novel method for plating metal strips, which eliminates the drawbacks of the prior art described above and can significantly improve plating speed and cost reduction.

[Means and effects for solving the problems] The gist of the present invention is to provide a plurality of slits in the side wall of an upper chamber filled with a plating solution together with an electrode, and to allow the plating solution to flow out from the slits. On the other hand, while holding the wide side of the elongated body to be plated substantially vertically opposite to the side wall, the strip is run horizontally in its longitudinal direction, and the side wall and the strip are A method of plating one side of a band-like object, characterized in that the plating is applied to one side of the band-like object on the side facing the down-flow path by forming a flow path for the plating liquid.

FIG. 1 is a sectional view of a plating device used when plating one side of a strip 1 according to the method of the present invention. Lower chamber to collect 1
It consists of 7. Side wall 18 of upper chamber 16
In order to flow the plating liquid 10 into the stripe plating part 12 of the strip body 1 in the direction of the arrow at a constant flow rate, the difference in electrical resistance in the solution is reduced and the current distribution is applied to the plating liquid outlet 14 and the stripe plating part 12. A plurality of fine slits 13 are provided to make the plating liquid 10 uniform, and a side wall 18 is provided along the flow path of the plating liquid 10 flowing out from the plating liquid outlet 14 in order to increase the flow rate of the plating liquid 10 as much as possible.
A skirt portion 19 is attached to the lower end of.
Although not shown, the plating liquid 10 is circulated by a pump or the like. The strip 1 is held facing the side wall 18 of the upper chamber 16 so that the plating liquid 10 can flow out from the top of the stripe plating section 12 in the direction of the arrow. The distance from the side wall 18 and the vertical position of the strip 1 can be adjusted using the guide roll 2 shown in FIG. 3, but if necessary, the guide roll 2 can be installed in the plating tank 4. You may. As is clear from FIG. 1, since the plating liquid 10 does not wrap around the back surface of the strip 1, that is, the non-masking surface, the masking tape 7 can be saved compared to the full-surface immersion method, and the flow rate of the plating liquid 10 can be effectively increased. Since it can be utilized, it greatly contributes to improving the plating speed.

FIG. 2 is a sectional view showing another embodiment of the plating device according to the method of the present invention. In the figure, 2
0 is a liquid level adjusting plate provided at the upper end of the plating liquid outlet 14 of the side wall 18. That is, in order for the plating liquid 10 to flow down from the plating liquid outlet 14, a certain gap is required between the strip 1 to be plated and the surface of the side wall 18, and as shown in the figure, the plating liquid 10 is allowed to flow inside this gap. Therefore, it is desirable that the plating liquid 10 is filled and that the filled plating liquid 10 is allowed to flow down at a constant flow rate. However, the plating liquid level in the gap has uneven parts in the longitudinal direction of the wide width surface of the strip 1, and due to fluctuations in the liquid level height, the plating liquid level
Since there is a possibility that the liquid may get over the masking tape 7 and wrap around the back surface of the strip 1, stable plating work can be performed by providing a liquid level adjustment plate 20 as shown. Further, as shown in the figure, in this embodiment, the plating liquid 1 on the side wall 18 is
Since the wall surface on the side where the 0 flows down is formed in a wavy or uneven shape, stirring of the plating liquid 10 is promoted, and the plating work is performed more efficiently.

Incidentally, FIG. 3 is a flow sheet showing an outline of plating the strip 1 by the method of the present invention. In the figure, a strip 1 masked to a predetermined size is fed in the direction of the arrow, pretreated in a pretreatment tank 3, and then striped to a predetermined size in a plating tank 4. After the plating is completed, the striped plating strip 9 passes through the cleaning tank 5 and is dried in the drying section 6, and then the masking tape 7 that is no longer needed is peeled off from the striped plating strip 9 by the tape peeling roll 15 and the masking tape take-up reel 8. Wind it up. Although not shown, the striped plating strip 9 from which the masking tape 7 has been peeled off is wound around a drum to become a product.

[Effects of the Invention] As explained above, according to the present invention, the following effects can be achieved.

(1) Since the plating liquid flow is supplied vertically from above the striped plating part of the strip conductor along the plating part, the flow velocity and stirring effect in the plating part are large, and the plating speed is improved.

(2) For partial plating such as stripe plating or spot plating on only one side of a strip-shaped conductor, only one masking tape is used only on the side that is in contact with the plating liquid, compared to the two masking tapes used in the conventional full-surface immersion method. Since only a few steps are required, the cost reduction effect is significant.

(3) When performing stripe silver plating on either the front or back side of a strip conductor after the entire surface has been nickel-plated, conventionally, the entire surface has been nickel-plated using an immersion line, and then plating liquid is jetted from the bottom of the strip conductor. Previously, silver plating was performed on one side by transferring to a horizontal plating line (horizontal plating line) or an immersion line, but with this invention, these can be done efficiently in one step, and the plating speed is also improved. . It should be noted that the dipping method can also be done in one process by connecting the entire surface plating and the stripe plating before and after, but in this case, the plating speed is slow and two pieces of masking tape are used, making it expensive.

[Brief explanation of drawings]

1 and 2 are cross-sectional views of a plating device according to the method of the present invention, and FIG. 3 is a flow sheet showing an outline of the plating operation of a strip-shaped conductor. In each figure, the same or corresponding parts are given the same reference numerals, 1: strip conductor (strip body), 2: guide roll,
3: Pretreatment tank, 4: Plating tank, 5: Washing tank, 6:
drying section, 7: masking tape, 8: masking tape take-up reel, 9: stripe plating strip, 10: plating liquid, 11: electrode plate, 12: stripe plating part, 13: slit, 14: plating liquid outlet, 15: Masking tape peeling roll,
16: Upper chamber, 17: Lower chamber, 18: Side wall, 1
9: Skirt portion, 20: Liquid level adjustment plate.

Claims (1)

[Claims] 1 A plurality of slits are provided in the side wall of the upper chamber filled with the plating solution together with the electrode, and the plating solution flows out from the slits and flows further down, while the length to be plated is placed opposite to the side wall. While holding the wide side of the body substantially vertically, the strip is run horizontally in its longitudinal direction, and the side wall and the strip form a flow path for the plating liquid, thereby reducing the flow rate. A single-sided plating method for a strip-shaped body, characterized by plating one side of the strip-shaped body on the side facing a passageway.