JPH0219199B2 - - Google Patents
Info
- Publication number
- JPH0219199B2 JPH0219199B2 JP5127881A JP5127881A JPH0219199B2 JP H0219199 B2 JPH0219199 B2 JP H0219199B2 JP 5127881 A JP5127881 A JP 5127881A JP 5127881 A JP5127881 A JP 5127881A JP H0219199 B2 JPH0219199 B2 JP H0219199B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- copper
- hardness
- bath
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 63
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 28
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 27
- 229910052802 copper Inorganic materials 0.000 claims description 27
- 239000010949 copper Substances 0.000 claims description 27
- 229910001220 stainless steel Inorganic materials 0.000 claims description 17
- 239000000654 additive Substances 0.000 claims description 16
- 239000010935 stainless steel Substances 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- 229910052759 nickel Inorganic materials 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 11
- 230000000996 additive effect Effects 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 claims description 4
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 claims description 4
- 150000003464 sulfur compounds Chemical class 0.000 claims description 4
- 229910000831 Steel Inorganic materials 0.000 claims 2
- XPPKVPWEQAFLFU-UHFFFAOYSA-J diphosphate(4-) Chemical compound [O-]P([O-])(=O)OP([O-])([O-])=O XPPKVPWEQAFLFU-UHFFFAOYSA-J 0.000 claims 2
- 235000011180 diphosphates Nutrition 0.000 claims 2
- 239000010959 steel Substances 0.000 claims 2
- 235000019589 hardness Nutrition 0.000 description 30
- PEVJCYPAFCUXEZ-UHFFFAOYSA-J dicopper;phosphonato phosphate Chemical compound [Cu+2].[Cu+2].[O-]P([O-])(=O)OP([O-])([O-])=O PEVJCYPAFCUXEZ-UHFFFAOYSA-J 0.000 description 17
- 238000007789 sealing Methods 0.000 description 14
- 229910000365 copper sulfate Inorganic materials 0.000 description 12
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 12
- LSDPWZHWYPCBBB-UHFFFAOYSA-N Methanethiol Chemical compound SC LSDPWZHWYPCBBB-UHFFFAOYSA-N 0.000 description 9
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 6
- 239000007788 liquid Substances 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 229910021529 ammonia Inorganic materials 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- XPPKVPWEQAFLFU-UHFFFAOYSA-N diphosphoric acid Chemical compound OP(O)(=O)OP(O)(O)=O XPPKVPWEQAFLFU-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229940005657 pyrophosphoric acid Drugs 0.000 description 3
- 238000007665 sagging Methods 0.000 description 3
- RYCLIXPGLDDLTM-UHFFFAOYSA-J tetrapotassium;phosphonato phosphate Chemical compound [K+].[K+].[K+].[K+].[O-]P([O-])(=O)OP([O-])([O-])=O RYCLIXPGLDDLTM-UHFFFAOYSA-J 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- BWFPGXWASODCHM-UHFFFAOYSA-N copper monosulfide Chemical compound [Cu]=S BWFPGXWASODCHM-UHFFFAOYSA-N 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 229910001651 emery Inorganic materials 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000005480 shot peening Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K1/00—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces
- F16K1/32—Details
- F16K1/34—Cutting-off parts, e.g. valve members, seats
- F16K1/36—Valve members
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Gasket Seals (AREA)
- Sealing Devices (AREA)
- Electroplating Methods And Accessories (AREA)
- Lift Valve (AREA)
Description
本発明は金属ガスケツトの製造方法に関し、高
温下長時間の使用においても該ガスケツト自身の
シールエツジがクリープし難く、しかも弁座にも
傷をつけ難い金属ガスケツトの製造方法に関す
る。
金属ガスケツトとしては、一般に、第1図に示
すようなものが知られている。
第1図において、1は弁棒、2は弁ガスケツト
ハウジング、3は弁ガスケツト(金属ガスケツ
ト)、4はガスケツト支持リング、5は弁座、6
は油圧シリンダ、7は金属ベロー、8は油圧シリ
ンダ支持台、9および10はフランジであり、油
圧シリンダ6により弁ガスケツト3を弁座5に押
付け、X,Y間のールを行なう。
上記の弁ガスケツト3は、第2図に示す通り、
通常、ステンレス鋼3′にNiメツキ3″を介して
硫酸銅メツキ3を施したもので、該ステンレス
鋼3′にバネ作用、硫酸銅メツキ3にシール作
用をもたせた皿バネ状ガスケツトで、シールエツ
ジEにてシールされる。なお、Niメツキ3″はス
テンレス鋼3′に直接銅メツキを施すと非常に剥
離し易すいため、ステンレス鋼3′と硫酸銅メツ
キ3の間に介在させて両者の密着性を確保する
作用をなすものである。
上記のような金属ガスケツトを弁閉状態(弁に
負荷荷重が作用していてシールができている状
態)で、高温で、長時間使用すると、シールエツ
ジ部Eがクリープ変形し、第3図に示すように、
ステンレス鋼3′が直接弁座5に接触するように
なり、シールができなくなる欠点がある。
この対策として、硬い銅メツキを施工すること
が考えられるが、該メツキを施工したものはシー
ルするために高荷重が必要となり弁座に傷を生ず
る恐れがある。
本発明は、弁座状態で高温下長時間使用しても
シールエツジEがクリープし難く、弁座に傷をつ
け難い金属ガスケツトを製造する方法を提供する
ものである。
すなわち本発明は、
(1) ステンレス鋼母材の上に塩化ニツケル浴で厚
さ2〜6μm程度のニツケルメツキを施し、その
上に硫黄化合物含有添加剤を添加したピロリン
酸銅浴で厚さ1〜3mm程度、硬さHv180〜220
の銅メツキを施すこと、
(2) 上記(1)の銅メツキを施した後、該銅メツキの
硬さをHv100〜180とする軟化熱処理を施すこ
と、
をそれぞれ特徴とする金属ガスケツトの製造方法
に関するものである。
なお、前記ニツケル浴メツキは母材と銅メツキ
との密着性を向上させる作用をするものであるた
め、理論的にはニツケルの一分子結晶が存在すれ
ば十分であるが、実作業条件下の管理としては下
限値を2μmとするのがやり易く、一方、余り厚く
しても密着力の向上とはならず経済的にも不利と
なるので上限値を6μmに設定するのが実用的であ
る。
また、ニツケル浴メツキ上の銅メツキ厚さは、
本発明の目的であるシール機構を十分果すには1
〜3mmの範囲が通常が適当である。すなわち、銅
メツキ厚さが1mm以下では寿命が短かく、また3
mm以上では座屈変形を起こし性能が低下する傾向
があるからである。
本発明において、ステンレス鋼母材としては、
例えばSUS304,316,326等のオーステナイト系
ステンレス鋼が使用でき、これらの溶体化処理材
(硬さHv150〜160)、あるいは該溶体化処理材に
例えば冷間圧延やシヨツトピーニング加工等の加
工硬化を与えたもの(硬さHv165〜180)等が使
用できる。
本発明においては、上記母材に、先ずニツケル
メツキを施すのであるが、これはステンレス鋼に
直接銅メツキを施すと非常に剥離し易い欠点があ
り、一方ニツケルメツキはステンレス鋼と銅メツ
キの中間にあつて両者の密着性を向上させる作用
があるためである。
次いで、ニツケルメツキの上にピロリン酸銅浴
を用いて銅メツキを施すのであるが、この場合ピ
ロリン酸銅浴に硫黄化合物含有添加剤(例えば、
メルカプタン系添加剤)を添加しておくと、析出
する銅金属の結晶を細かくし、光沢を付与し、後
述する実施例に示すような効果を奏することがで
きる。なお、銅メツキの厚さは余り厚いとメツキ
層の結晶が粗大となり、性質が変化するばかりで
なく、剥離し易く、不経済であるため、数mm、好
ましくは1〜3mm程度である。
以下、実施例により本発明を具体的に説明す
る。
実施例 1
SUS304丸棒の表面をエメリ紙#600で研磨し、
されにその後バフ研磨して鏡面とした後、通常の
方法で脱脂、酸洗、水洗などを行なつて清浄化し
た。これを塩化ニツケル浴240g/塩酸120g/
の電解液(25℃)を用いてNiメツキを施し、
水洗後、次の()または()の条件で、銅メ
ツキ厚が約2mmになるように処理した。
() 硫酸銅浴 硫酸銅:250g/
硫 酸: 50g/
メルカプタン系添加剤:な
し、0.3ml/Ah(注)
陰極電流密度:2A/dm2
液 温:25℃
(注)1時間1アンペアの通電当り0.3ml/の
割合となるように添加したことを意味す
る。
() ピロリン酸銅浴 ピロリン酸銅:90g/
ピロリン酸カリウム:350
g/
全ピロリン酸:230g/
28%アンモニア:1〜6
ml/
メルカプタン系添加剤:な
し、0.1〜3ml/
陰極電流密度:1〜5A/
dm2
液 温:30〜60℃
なお、ピロリン酸銅浴では、添加するアンモニ
ア、メルカプタン系添加剤の量、陰極電流密度お
よび液晶をかなりの範囲でそれぞれ変化させてい
るが、硫黄銅浴における市販添加剤の有無などを
含め、これらはすべて電着メツキ層の硬さに変化
をもたそうとするものである。
得られた銅メツキ層の硬さをミクロビツカース
で測定した結果は表1に示す通りである。
The present invention relates to a method for manufacturing a metal gasket, and more particularly, to a method for manufacturing a metal gasket in which the sealing edge of the gasket itself is difficult to creep even when used at high temperatures for a long period of time, and the valve seat is also unlikely to be damaged. As a metal gasket, one shown in FIG. 1 is generally known. In Fig. 1, 1 is a valve stem, 2 is a valve gasket housing, 3 is a valve gasket (metal gasket), 4 is a gasket support ring, 5 is a valve seat, and 6
1 is a hydraulic cylinder, 7 is a metal bellows, 8 is a hydraulic cylinder support base, and 9 and 10 are flanges. The hydraulic cylinder 6 presses the valve gasket 3 against the valve seat 5 and performs a roll between X and Y. The above valve gasket 3 is as shown in FIG.
Usually, stainless steel 3' is coated with copper sulfate plating 3 through Ni plating 3'', and the stainless steel 3' has a spring action and the copper sulfate plating 3 has a sealing action.It is a disc spring-like gasket with a sealing edge. The Ni plating 3'' is very likely to peel off if copper plating is applied directly to the stainless steel 3', so it is interposed between the stainless steel 3' and the copper sulfate plating 3. This serves to ensure adhesion. If the metal gasket described above is used at high temperatures for a long period of time with the valve closed (a state in which a load is applied to the valve and a seal is formed), the seal edge E will undergo creep deformation, as shown in Figure 3. like,
There is a drawback that the stainless steel 3' comes into direct contact with the valve seat 5, making it impossible to seal. As a countermeasure to this problem, applying hard copper plating may be considered, but such plating requires a high load to seal, which may cause damage to the valve seat. The present invention provides a method for manufacturing a metal gasket in which the seal edge E is less likely to creep and the valve seat is less likely to be damaged even if the gasket is used in the valve seat state at high temperatures for a long period of time. That is, the present invention provides the following advantages: (1) Nickel plating is applied to a stainless steel base material to a thickness of about 2 to 6 μm using a nickel chloride bath, and then nickel plating is applied to a thickness of about 1 to 6 μm using a copper pyrophosphate bath containing a sulfur compound-containing additive. Approximately 3mm, hardness Hv180~220
(2) After applying the copper plating according to the above (1), a method for manufacturing a metal gasket is characterized in that: (2) After applying the copper plating according to the above (1), a softening heat treatment is performed to make the hardness of the copper plating 100 to 180 Hv. It is related to. The above-mentioned nickel bath plating has the effect of improving the adhesion between the base material and the copper plating, so theoretically the presence of single molecule crystals of nickel is sufficient, but under actual working conditions In terms of control, it is easy to set the lower limit to 2 μm, but on the other hand, if it is too thick, it will not improve the adhesion and will be economically disadvantageous, so it is practical to set the upper limit to 6 μm. . In addition, the thickness of copper plating on nickel bath plating is
In order to fully achieve the sealing mechanism which is the objective of the present invention, 1.
A range of 3 mm to 3 mm is usually appropriate. In other words, if the copper plating thickness is less than 1 mm, the life will be short, and
This is because if it exceeds mm, buckling deformation occurs and performance tends to deteriorate. In the present invention, the stainless steel base material is
For example, austenitic stainless steels such as SUS304, 316, and 326 can be used, and these solution-treated materials (hardness Hv150 to 160) or work-hardened materials such as cold rolling or shot peening are applied to the solution-treated materials. (hardness Hv165-180) can be used. In the present invention, nickel plating is first applied to the base material, but this has the disadvantage that if copper plating is applied directly to stainless steel, it will peel off easily, whereas nickel plating is between stainless steel and copper plating. This is because it has the effect of improving the adhesion between the two. Next, copper plating is applied on the nickel plating using a copper pyrophosphate bath. In this case, additives containing sulfur compounds (for example,
By adding a mercaptan additive, it is possible to make the crystals of the deposited copper metal finer, impart luster, and produce effects as shown in the Examples described below. The thickness of the copper plating is several mm, preferably about 1 to 3 mm, because if the thickness of the copper plating is too thick, the crystals of the plating layer will become coarse, which will not only change the properties but also cause them to peel off easily and be uneconomical. Hereinafter, the present invention will be specifically explained with reference to Examples. Example 1 The surface of a SUS304 round bar was polished with emery paper #600,
After that, it was buffed to a mirror surface, and then cleaned by degreasing, pickling, washing with water, etc. in the usual way. Add this to nickel chloride bath 240g/hydrochloric acid 120g/
Ni plating was applied using electrolyte solution (25℃),
After washing with water, it was treated under the following conditions () or () so that the copper plating thickness was approximately 2 mm. () Copper sulfate bath Copper sulfate: 250g/Sulfuric acid: 50g/Mercaptan additive: None, 0.3ml/Ah ( Note ) Cathode current density: 2A/dm 2 liquid Temperature: 25℃ (Note) 1 ampere for 1 hour This means that it was added at a rate of 0.3 ml/per energization. () Copper pyrophosphate bath Copper pyrophosphate: 90g/ Potassium pyrophosphate: 350
g/ Total pyrophosphoric acid: 230g/ 28% Ammonia: 1-6
ml/Mercaptan additive: None, 0.1~3ml/Cathode current density: 1~5A/
dm 2 liquid Temperature: 30 to 60°C In addition, in the copper pyrophosphate bath, the amount of ammonia and mercaptan additives added, the cathode current density, and the liquid crystal are varied within a considerable range, but the commercially available sulfur copper bath All of these, including the presence or absence of additives, are intended to change the hardness of the electrodeposited plating layer. Table 1 shows the results of measuring the hardness of the copper plating layer obtained using a micro-Vickers.
【表】
(注):メツキ層の硬さの高いものほど金属粒子
が微細であることを光学顕微による観察
で確認している。
上記の銅メツキしたステンレス鋼丸棒から第4
図に示す試験片を加工した。この試験片先端部a
の形状は第5図に示す通りで、前記第2図の弁ガ
スケツトのシール部の形状と同一である。なお、
第4図中、3′はステンレス鋼、3″はNiメツキ、
3は銅メツキを示す。
これらの試験片(硬さの異なる銅メツキを施し
たもの)を用いて、真空中、温度250℃、線荷重
5Kg/mmの条件下で、先端部(シールエツジ)ヘ
タリ量(第5図中、Hで示す量)および試験後の
弁座の外観状況を目視観察した。
このうち、試験時間と先端部のヘタリ量との関
係についての試験結果は、第6図に示す通りであ
つた。第6図中、直線の符号は表1中のNo.に相当
し、Hoのラインは弁ガスケツトのステンレス鋼
が直接弁座に接触するまでのシールエツジのヘタ
リ量を示す。
第6図より次のことが明らかである。
すなわち、硫酸銅浴はもとよりピロリン酸銅浴
から得られるメツキ層でもメルカプタン系添加剤
無添加のものは、一般に非常に軟質であるため、
試験時間t1あるいはt3で許容量(弁ガスケツトの
ステンレス鋼が直接弁座に接触するまでのシール
エツジのヘタリ量Ho)の変形を起したのに対し、
メルカポタン系添加剤を添加して浴から得られた
メツキ層は硬さが高いためヘタリ量は少ない。特
に、ピロリン酸銅浴から得られた硬いメツキ層は
一段とヘタリ量が少なく、長時間に亘つて優れた
シール性能を発揮する。しかし非常に硬いメツキ
層では、試験後に弁座の当り面を見ると、傷が発
生(正確には凹部が発生)しており、シール性能
の面からは好ましくない。
以上の試験から、本発明では硬い銅メツキ層を
得ることも重要ではあるが、硬過ぎると弁座に傷
が発生するため、適当な硬さが必要であることが
明らかとなり、その硬さはミクロビツカース硬さ
で180〜220であることが確認された。弁座の硬さ
は165〜180であるので銅メツキの硬さはこれより
幾分硬いものがよい性能を示したこととなる。
次いで、第2図に示す弁ガスケツトを、上記の
試験の結果、良好なシール特性を発揮する180〜
220の硬さのメツキ層が得られるメルカプタン系
添加剤を添加した下記ピロリン酸銅浴を用いて製
作し、常温および150℃で前記試験条件でシール
試験を実施した。その結果、この温度条件におい
てもよいシール特性を示すことが確認された。
ピロリン酸銅浴 ピロリン酸銅:90g/
ピロリン酸カリウム:350
g/
全ピロリン酸:230g/
28%アンモニア:3.3〜3.4
ml/
メルカプタン系添加剤:0.5
〜1.5ml/
陰極電流密度:3A/dm2
液 温:53℃±1℃
以上の結果から明らかなように、本発明で目的
とするガスケツトを製作するには、先づメツキ浴
の種類の選定が大切であり、次いでメツキ浴中に
添加される各種薬剤量を決定しビツカース硬さで
180〜220のメツキ層を得ることが極めて肝要であ
り、単に添加剤を添加しただけでは本発明の目的
は達成できない。
実施例 2
実施例1では弁座材料の硬さがビツカース硬さ
で165〜180のものを使用した場合、銅メツキ層の
硬さ180〜220のものが最も良好なシール特性を示
すことが明らかとなつたが、ここでは弁座材料の
硬さが、実施例1より軟かい場合の銅メツキ層の
硬さについて実験した。
SUS304丸棒を用い実験例1と同じ処理法を用
い、次に示す()または()の条件でメツキ
厚さが約2mmになるように処理した。
() 硫酸銅浴 硫酸銅:250g/
硫酸:50g/
メルカプタン系添加剤:0.3
ml/Ah
陰極電流密度:2A/dm2
液 温:25℃
() ピロリン酸銅浴 :ピロリン酸銅:90g/
ピロリン酸カリウム:350
g/
全ピロリン酸:230g/
28%アンモニア水:3.3〜3.4
ml/
メルカプタン系添加剤:0.5
〜1.5ml/
陰極電流密度:3A/dm2
液 温:53℃±1℃
この処理によつて得られたメツキ層のミクロビ
ツカース硬さは、(の硫酸銅浴のものは100〜
120、()のピロリン酸銅浴のものは190〜200の
範囲に納つていた。
これらの銅メツキしたステンレス鋼棒から第4
図に示す試験片を加工し実施例1と同方法、同条
件によつて先端部(シールエツジ)のヘタリ量お
よび試験後の弁座の外観状況を観察し、シール性
能を調べた。なお、この弁座の硬さはミクロビツ
カース硬さ150〜160であつた。
上記の結果、この試験においてもピロリン酸銅
から得られたメツキ層のヘタリ量は硫酸銅のもの
より少なく良好であつた。しかし、試験後の弁座
を見ると、先端部の当り面に傷の発生が認めら
れ、弁座が軟質な場合は硬さ180〜220の銅メツキ
層では十分な性能を発揮しているとは云えないこ
とが判明した。
そこで、ピロリン酸銅からのメツキ層につい
て、次に示すような熱処理を施して、その軟質化
をはかつた。
(1) 250℃の環境で20分間放置した後、第4図の
試験片に加工
(2) 250℃の環境で4分間放置した後、第4図の
試験片に加工
(3) 250℃の環境で1時間放置した後、第4図の
試験片に加工
(4) 250℃の環境で3時間放置した後、第4図の
試験片に加工
図の試験片に加工
上記の熱処理後のメツキ層の硬さを測定する
と、次の通りであつた。
(1) 160〜170
(2) 130〜150
(3) 103〜110
(4) 95〜105
以上の4種類の熱処理を施したメツキ層の試験
片と硫酸銅浴から得られるメツキ層の試験片(硬
さ100〜120)について、前記の方法と同条件でシ
ール特性を調査した。
この結果は表2の通りであり、弁座の硬さが
150〜160のときは、ピロリン酸銅から得られるメ
ツキ層硬さ(180〜220)のものを熱処理すること
によつて軟質化させて使用するとシール特性のよ
くなることが判明し、その硬さの範囲はミクロビ
ツカースで103〜170の範囲にあるものが優れた性
能を発揮した。この場合でも軟質化が過ぎると先
端部のヘタリ量が多く、また同じ硬さを有する銅
メツキでも硫酸銅浴から得られるものはシール特
性に乏しいことが明らかとなつた。
なお、熱処理温度を270℃とに上昇させると短
期間内に所定のメツキ硬さに調整できるが、103
〜170の硬さ範囲内にあれば熱処理条件に関係な
く優れたシール特性を発揮した。[Table] (Note): Observation using an optical microscope has confirmed that the harder the plating layer is, the finer the metal particles are.
No. 4 from the copper-plated stainless steel round bar above.
The test piece shown in the figure was processed. This test piece tip a
The shape is as shown in FIG. 5, and is the same as the shape of the seal portion of the valve gasket shown in FIG. In addition,
In Figure 4, 3' is stainless steel, 3'' is Ni plating,
3 indicates copper plating. Using these test pieces (copper plated with different hardnesses), the amount of settling of the tip (seal edge) (in Fig. 5, The amount indicated by H) and the appearance of the valve seat after the test were visually observed. Among these, the test results regarding the relationship between the test time and the amount of settling of the tip were as shown in FIG. In FIG. 6, the symbols of the straight lines correspond to the numbers in Table 1, and the Ho line indicates the amount of sag of the seal edge until the stainless steel of the valve gasket directly contacts the valve seat. The following is clear from FIG. In other words, plating layers obtained not only from copper sulfate baths but also from copper pyrophosphate baths without mercaptan additives are generally very soft.
While the deformation of the allowable amount (the amount of settling Ho of the seal edge until the stainless steel of the valve gasket directly contacts the valve seat) occurred at test time t 1 or t 3 ,
The plating layer obtained from the bath with the addition of mercapotane additives has a high hardness, so the amount of sagging is small. In particular, the hard plating layer obtained from the copper pyrophosphate bath exhibits even less settling and exhibits excellent sealing performance over a long period of time. However, with a very hard plating layer, when looking at the contact surface of the valve seat after the test, scratches (more precisely, recesses) were observed, which is not desirable from the standpoint of sealing performance. From the above tests, it has become clear that although it is important to obtain a hard copper plating layer in the present invention, it is necessary to have an appropriate hardness because if it is too hard, it will cause scratches on the valve seat. It was confirmed that the microvits hardness was 180 to 220. Since the hardness of the valve seat is between 165 and 180, a copper plating with a hardness slightly harder than this indicates good performance. Next, the valve gasket shown in FIG.
A plating layer with a hardness of 220 was obtained using the following copper pyrophosphate bath containing a mercaptan additive, and a sealing test was conducted under the above test conditions at room temperature and 150°C. As a result, it was confirmed that good sealing properties were exhibited even under this temperature condition. Copper pyrophosphate bath Copper pyrophosphate: 90g/ Potassium pyrophosphate: 350
g/ Total pyrophosphoric acid: 230g/ 28% Ammonia: 3.3-3.4
ml/Mercaptan additive: 0.5
~1.5ml/ Cathode current density: 3A/dm Two liquids Temperature: 53℃±1℃ As is clear from the above results, in order to manufacture the gasket targeted by the present invention, the first step is to select the type of plating bath. is important, and then the amount of various chemicals added to the plating bath is determined and determined based on the Bitkers hardness.
It is extremely important to obtain a plating layer of 180 to 220, and the object of the present invention cannot be achieved simply by adding additives. Example 2 In Example 1, when a valve seat material with a Vickers hardness of 165 to 180 is used, it is clear that a copper plating layer with a hardness of 180 to 220 exhibits the best sealing properties. However, here, an experiment was conducted on the hardness of the copper plating layer when the hardness of the valve seat material was softer than that in Example 1. Using the same processing method as in Experimental Example 1 using a SUS304 round bar, processing was performed under the following conditions () or () so that the plating thickness was approximately 2 mm. () Copper sulfate bath Copper sulfate: 250g/Sulfuric acid: 50g/Mercaptan additive: 0.3
ml/Ah Cathode current density: 2A/dm 2 liquid temperature: 25℃ () Copper pyrophosphate bath: Copper pyrophosphate: 90g/
Potassium pyrophosphate: 350
g/ Total pyrophosphoric acid: 230g/ 28% ammonia water: 3.3-3.4
ml/Mercaptan additive: 0.5
~1.5ml/ Cathode current density: 3A/dm Two liquids Temperature: 53℃±1℃ The microvits hardness of the plating layer obtained by this treatment is 100 ~
120, and that of the copper pyrophosphate bath in () was within the range of 190-200. From these copper-plated stainless steel bars, the fourth
The test piece shown in the figure was processed and the sealing performance was examined by the same method and under the same conditions as in Example 1, by observing the amount of sagging at the tip (seal edge) and the appearance of the valve seat after the test. The hardness of this valve seat was 150 to 160 microbits hardness. As a result of the above, even in this test, the amount of settling of the plating layer obtained from copper pyrophosphate was smaller than that of copper sulfate, and was better. However, when looking at the valve seat after the test, scratches were observed on the abutment surface of the tip, and if the valve seat is soft, the copper plating layer with a hardness of 180 to 220 would have demonstrated sufficient performance. It turned out that I couldn't say it. Therefore, the plating layer made of copper pyrophosphate was subjected to the following heat treatment to soften it. (1) After being left in an environment of 250℃ for 20 minutes, it was processed into the test piece shown in Figure 4. (2) After being left in an environment of 250℃ for 4 minutes, it was processed into the test piece shown in Figure 4. Processed into the test piece shown in Figure 4 after being left in an environment for 1 hour at 250℃ (4) Processed into the test piece shown in Figure 4 after being left in an environment of 250°C for 3 hours The hardness of the layer was measured as follows. (1) 160-170 (2) 130-150 (3) 103-110 (4) 95-105 Test pieces of plating layers subjected to the above four types of heat treatment and test pieces of plating layers obtained from copper sulfate baths (hardness 100 to 120), the sealing properties were investigated under the same conditions as the above method. The results are shown in Table 2, and the hardness of the valve seat is
When the hardness is 150 to 160, it has been found that the sealing properties can be improved by using a plating layer obtained from copper pyrophosphate that has a hardness of 180 to 220 and is softened by heat treatment. The microbit scales in the range of 103 to 170 showed excellent performance. Even in this case, it has become clear that if the softening is excessive, the amount of sagging at the tip is large, and that even copper plating of the same hardness obtained from a copper sulfate bath has poor sealing properties. In addition, by increasing the heat treatment temperature to 270℃, it is possible to adjust the plating hardness to the specified level within a short period of time.
As long as the hardness was within the range of ~170, excellent sealing properties were exhibited regardless of the heat treatment conditions.
【表】
(注):(1)〜(4)はピロリン酸銅浴から得
られたもので熱処理条件の異なるも
の
(5)は硫酸銅浴から得られたもの
[Table] (Note): (1) to (4) were obtained from a copper pyrophosphate bath and were obtained under different heat treatment conditions.
of
(5) was obtained from copper sulfate bath
第1図は一般の金属ガスケツトの説明図、第2
図は第1図に示す金属ガスケツト3の拡大模式
図、第3図は該金属ガスケツト3の長時間使用後
の状態を示す拡大模式図、第4図は本発明の実施
例で調製した試験片を示す図、第5図は第4図中
a部の拡大図、第6図は本発明の実施例で得られ
た結果を示す図表である。
Figure 1 is an explanatory diagram of a general metal gasket, Figure 2
The figure is an enlarged schematic diagram of the metal gasket 3 shown in Figure 1, Figure 3 is an enlarged schematic diagram showing the state of the metal gasket 3 after long-term use, and Figure 4 is a test piece prepared in an example of the present invention. FIG. 5 is an enlarged view of part a in FIG. 4, and FIG. 6 is a chart showing the results obtained in an example of the present invention.
Claims (1)
さ2〜6μm程度のニツケルメツキを施し、その上
に硫黄化合物含有添加剤を添加したピロリン酸鋼
浴で厚さ1〜3mm程度、硬さHv180〜220の銅メ
ツキを施すことを特徴とする金属ガスケツトの製
造方法。 2 ステンレス鋼母材の上に塩化ニツケル浴で厚
さ2〜6μm程度のニツケルメツキを施し、その上
に硫黄化合物含有添加剤を添加したピロリン酸鋼
浴で厚さ1〜3mm程度、硬さHv180〜220の銅メ
ツキを施し、さらにこれに該銅メツキの硬さを
Hv100〜180とする250℃×20分〜3時間の熱処理
を施すことを特徴とする金属ガスケツトの製造方
法。[Scope of Claims] 1 Nickel plating is applied to a thickness of about 2 to 6 μm on a stainless steel base material using a nickel chloride bath, and then nickel plating is applied to a thickness of about 1 to 3 mm using a pyrophosphate steel bath containing an additive containing a sulfur compound. A method for manufacturing a metal gasket, characterized by applying copper plating to a degree and hardness of Hv180 to Hv220. 2. Apply nickel plating to a thickness of about 2 to 6 μm on a stainless steel base material using a nickel chloride bath, and then apply nickel plating to a thickness of about 1 to 3 mm and a hardness of Hv180 to Hv180 using a pyrophosphate steel bath containing additives containing sulfur compounds. 220 copper plating is applied, and the hardness of the copper plating is further increased.
A method for producing a metal gasket, characterized by heat treatment at 250° C. for 20 minutes to 3 hours at Hv 100 to 180.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5127881A JPS57167568A (en) | 1981-04-07 | 1981-04-07 | Manufacture of metal gasket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5127881A JPS57167568A (en) | 1981-04-07 | 1981-04-07 | Manufacture of metal gasket |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57167568A JPS57167568A (en) | 1982-10-15 |
| JPH0219199B2 true JPH0219199B2 (en) | 1990-04-27 |
Family
ID=12882469
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5127881A Granted JPS57167568A (en) | 1981-04-07 | 1981-04-07 | Manufacture of metal gasket |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57167568A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB9616214D0 (en) * | 1996-08-01 | 1996-09-11 | Electrotech Ltd | A high pressure seal |
| WO2009076777A1 (en) * | 2007-12-18 | 2009-06-25 | Integran Technologies Inc. | Method for preparing polycrystalline structures having improved mechanical and physical properties |
-
1981
- 1981-04-07 JP JP5127881A patent/JPS57167568A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57167568A (en) | 1982-10-15 |
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