JPH0220506B2 - - Google Patents
Info
- Publication number
- JPH0220506B2 JPH0220506B2 JP59171566A JP17156684A JPH0220506B2 JP H0220506 B2 JPH0220506 B2 JP H0220506B2 JP 59171566 A JP59171566 A JP 59171566A JP 17156684 A JP17156684 A JP 17156684A JP H0220506 B2 JPH0220506 B2 JP H0220506B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- adhesive tape
- tape
- mounting hole
- component mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
- Supply And Installment Of Electrical Components (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は下方に曲げられた導線を有する複数
の電子部品をテープ基体に取り付けた電子部品搬
送体に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electronic component carrier in which a plurality of electronic components having conductive wires bent downward are attached to a tape base.
現在、電子部品の製造工程、検査工程、電子部
品を組立基板に供給する組立工程などで、電子部
品を自動的に搬送するテープ状の電子部品搬送体
が使用されている。
Currently, tape-shaped electronic component carriers that automatically transport electronic components are used in electronic component manufacturing processes, inspection processes, assembly processes for supplying electronic components to assembly boards, and the like.
第６図は従来の電子部品搬送体（特開昭58−
27398号公報）を示す図、第７図は第６図のＢ−
Ｂ断面図である。図において、１はテープ基体、
２はテープ基体１の幅方向両端部近傍に等間隔で
設けられた複数個のスプロケツト孔、１２はテー
プ基体１の長手方向に等間隔で設けられた複数個
の電子部品搭載孔、２２はテープ基体１に貼着さ
れた粘着テープで、粘着テープ２２は電子部品搭
載孔１２を覆つている。２３は粘着テープ２２の
基体、２４は粘着テープ２２の粘着剤で、粘着剤
２４は常温で粘性をもち、指圧程度の圧力で被着
体に付着し、また容易に剥がしうる。１５は電子
部品、１６は電子部品１５の導線で、導線１６は
下方に曲がつており、また導線１６はテープ基体
１の粘着テープ２２を貼着した面とは反対側の面
に当接し、粘着テープ２２の電子部品搭載孔１２
に露出した部分が電子部品１５のパツケージ底面
１５ａに貼着されている。 Figure 6 shows a conventional electronic component carrier (Japanese Patent Application Laid-open No.
27398 Publication), Figure 7 is B- of Figure 6.
It is a sectional view of B. In the figure, 1 is a tape base;
2 is a plurality of sprocket holes provided at equal intervals near both ends in the width direction of the tape base 1; 12 is a plurality of electronic component mounting holes provided at equal intervals in the longitudinal direction of the tape base 1; 22 is a tape; An adhesive tape 22 is attached to the base 1 and covers the electronic component mounting hole 12. 23 is the base of the adhesive tape 22, and 24 is the adhesive of the adhesive tape 22. The adhesive 24 has viscosity at room temperature, adheres to the adherend with pressure similar to finger pressure, and can be easily peeled off. 15 is an electronic component, 16 is a conductor of the electronic component 15, the conductor 16 is bent downward, and the conductor 16 is in contact with the surface of the tape base 1 opposite to the surface to which the adhesive tape 22 is attached, Electronic component mounting hole 12 of adhesive tape 22
The exposed portion is attached to the bottom surface 15a of the package of the electronic component 15.
この電子部品搬送体においては、電子部品１５
の導線１６が下方に曲げられており、パツケージ
底面１５ａとテープ基体１の下面との距離が大き
いから、粘着テープ２２の電子部品搭載孔１２に
露出した部分に大きな応力が作用するので、粘着
テープ２２の電子部品搭載孔１２に露出した部分
に復元力が働く。このため、搬送中に粘着テープ
２２が電子部品１５のパツケージ底面１５ａから
剥がれ、電子部品１５がテープ基体１から離脱す
ることがある。
In this electronic component carrier, electronic components 15
Since the conducting wire 16 is bent downward and the distance between the bottom surface 15a of the package and the bottom surface of the tape base 1 is large, a large stress is applied to the portion of the adhesive tape 22 exposed to the electronic component mounting hole 12. A restoring force acts on the portion exposed to the electronic component mounting hole 12 of 22. Therefore, the adhesive tape 22 may peel off from the bottom surface 15a of the package of the electronic component 15 during transportation, and the electronic component 15 may separate from the tape base 1.
この発明は上述の問題点を解決するためになさ
れたもので、搬送中に電子部品がテープ基体から
離脱することがない電子部品搬送体を提供するこ
とを目的とする。 The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide an electronic component carrier in which electronic components do not separate from a tape base during transportation.
この目的を達成するため、この発明において
は、下方に曲げられた導線を有する複数の電子部
品をテープ基体に取り付けた電子部品搬送体にお
いて、上記テープ基体の長手方向に複数個の電子
部品搭載孔を設け、上記テープ基体に上記電子部
品搭載孔を覆つた粘着テープを貼着し、上記粘着
テープの上記電子部品搭載孔に露出した部分に切
断スリツトを設け、上記電子部品の上記導線を上
記テープ基体の上記粘着テープを貼着した面とは
反対側の面に当接し、上記粘着テープの上記電子
部品搭載孔に露出した部分を上記電子部品の本体
底面に貼着する。
In order to achieve this object, in the present invention, in an electronic component carrier in which a plurality of electronic components having downwardly bent conductive wires are attached to a tape base, a plurality of electronic component mounting holes are provided in the longitudinal direction of the tape base. an adhesive tape covering the electronic component mounting hole is attached to the tape base, a cutting slit is provided in a portion of the adhesive tape exposed to the electronic component mounting hole, and the conductive wire of the electronic component is connected to the tape. The part of the adhesive tape exposed to the electronic component mounting hole is attached to the bottom surface of the main body of the electronic component by contacting the surface of the base opposite to the surface to which the adhesive tape is attached.
この発明に係る電子部品搬送体においては、粘
着テープの電子部品搭載孔に露出した部分に切断
スリツトが設けられているから、粘着テープの電
子部品搭載孔に露出した部分に応力が作用するこ
とがない。
In the electronic component carrier according to the present invention, since the cutting slit is provided in the portion of the adhesive tape exposed to the electronic component mounting hole, stress does not act on the portion of the adhesive tape exposed to the electronic component mounting hole. do not have.
第１図はこの発明に係る電子部品搬送体を示す
図、第２図は第１図のＡ−Ａ断面図である。この
電子部品搬送体においては、粘着テープ２２の電
子部品搭載孔１２に露出した部分には、Ｘ形の切
断スリツト１９が設けられている。この切断スリ
ツト１９は刃物を粘着テープ２２の粘着剤面側か
ら垂直に移動させることにより容易に形成するこ
とが可能である。そして、電子部品１５の導線１
６がテープ基体１の粘着テープ２２を貼着した面
とは反対側の面に当接し、粘着テープ２２の電子
部品搭載孔１２に露出した部分が電子部品１５の
パツケージ底面１５ａに貼着されている。
FIG. 1 is a diagram showing an electronic component carrier according to the present invention, and FIG. 2 is a sectional view taken along the line AA in FIG. In this electronic component carrier, an X-shaped cutting slit 19 is provided in a portion of the adhesive tape 22 exposed to the electronic component mounting hole 12. This cutting slit 19 can be easily formed by moving a knife vertically from the adhesive side of the adhesive tape 22. Then, the conductor 1 of the electronic component 15
6 is in contact with the surface of the tape base 1 opposite to the surface to which the adhesive tape 22 is attached, and the portion of the adhesive tape 22 exposed to the electronic component mounting hole 12 is adhered to the bottom surface 15a of the package cage of the electronic component 15. There is.
この電子部品搬送体のテープ基体１に電子部品
１５を取り付けるには、第３図に示すように、搭
載用吸着ノズル２０で電子部品１５を吸着し、電
子部品１５を電子部品搭載孔１２上に位置決めし
たのち、電子部品搭載孔１２よりも小径の貼付け
棒２１を電子部品搭載孔１２内に上昇させ、粘着
テープ２２の電子部品搭載孔１２に露出した部分
を押し上げると、パツケージ底面15aと粘着テー
プ２２との距離に応じて切断スリツト１９が開
き、粘着テープ２２は貼付け棒２１によりパツケ
ージ底面１５ａに貼着されることになる。そし
て、テープ基体１をスプロケツトにより間欠的に
送り、電子部品搭載孔１２が所定位置に停止した
ときに、電子部品１５を粘着テープ２２で貼着す
れば、電子部品１５を順次テープ基体１に確実に
取り付けることができる。 To attach the electronic component 15 to the tape base 1 of this electronic component carrier, as shown in FIG. After positioning, the attachment rod 21, which has a smaller diameter than the electronic component mounting hole 12, is raised into the electronic component mounting hole 12, and when the part of the adhesive tape 22 exposed in the electronic component mounting hole 12 is pushed up, the bottom surface 15a of the package cage and the adhesive tape are pushed up. The cutting slit 19 opens according to the distance from the adhesive tape 22, and the adhesive tape 22 is pasted to the bottom surface 15a of the package by the pasting rod 21. Then, if the tape base 1 is intermittently fed by a sprocket and the electronic components 15 are attached with the adhesive tape 22 when the electronic component mounting hole 12 stops at a predetermined position, the electronic components 15 can be securely attached to the tape base 1 one after another. It can be attached to.
このような電子部品搬送体においては、粘着テ
ープ２２の電子部品搭載孔１２に露出した部分に
切断スリツト１９が設けられているから、電子部
品１５の導線１６が下方に曲げられており、パツ
ケージ底面１５ａとテープ基体１の下面との距離
が大きくとも、粘着テープ２２の電子部品搭載孔
１２に露出した部分に応力が作用することはない
ので、粘着テープ２２の電子部品搭載孔１２に露
出した部分に復元力が働くことはない。このた
め、搬送中に粘着テープ２２が電子部品１５のパ
ツケージ底面１５ａから剥がれないから、電子部
品１５がテープ基体１から離脱することはないの
で、電子部品１５を確実に搬送することができ
る。 In such an electronic component carrier, since the cutting slit 19 is provided in the portion of the adhesive tape 22 exposed to the electronic component mounting hole 12, the conductive wire 16 of the electronic component 15 is bent downward, and the bottom surface of the package Even if the distance between the adhesive tape 15a and the lower surface of the tape base 1 is large, no stress is applied to the portion of the adhesive tape 22 exposed to the electronic component mounting hole 12, so that the portion of the adhesive tape 22 exposed to the electronic component mounting hole 12 No resiliency will work. Therefore, since the adhesive tape 22 does not peel off from the bottom surface 15a of the package of the electronic component 15 during transportation, the electronic component 15 does not separate from the tape base 1, so that the electronic component 15 can be transported reliably.
なお、上述実施例においては、粘着テープ２２
にＸ形の切断スリツト１９を設けたが、切断スリ
ツト１９の形状は粘着テープ２２の粘着力や電子
部品に作用する外力の方向によつて決める必要が
あり、切断スリツト１９の形状を第４図、第５図
に示すようにしてもよいが、これらは例示で、切
断スリツト１９の形状は第１図、第４図、第５図
に示した形状に限定されるものではない。また、
上述実施例においては、電子部品搭載孔１２の形
状を角形にしたが、電子部品搭載孔の形状は電子
部品の形状に応じてどんな形状にしてもよい。さ
らに、テープ基体１、粘着テープ２２の基体２３
の材質としては、プラスチツクフイルム、紙、金
属箔等を用いることができ、粘着テープ２２の粘
着剤２４としては、アクリル系、ゴム系、シリコ
ーン系等の粘着剤の中から電子部品を確実に固定
し、必要に応じて離脱できるものを選ぶことがで
きる。また、上述実施例においては、スプロケツ
ト孔２をテープ基体１の幅方向両端部近傍に設け
たが、テープ基体１の幅方向の一方端部近傍にの
み設けてもよい。 In addition, in the above-mentioned embodiment, the adhesive tape 22
An X-shaped cutting slit 19 was provided in the slit 19, but the shape of the cutting slit 19 must be determined depending on the adhesive force of the adhesive tape 22 and the direction of the external force acting on the electronic component.The shape of the cutting slit 19 is shown in FIG. , and FIG. 5, but these are just examples, and the shape of the cutting slit 19 is not limited to the shapes shown in FIGS. 1, 4, and 5. Also,
In the above embodiment, the electronic component mounting hole 12 has a rectangular shape, but the electronic component mounting hole may have any shape depending on the shape of the electronic component. Furthermore, the tape base 1 and the base 23 of the adhesive tape 22
Plastic film, paper, metal foil, etc. can be used as the material of the adhesive tape 22, and the adhesive 24 of the adhesive tape 22 can be selected from acrylic, rubber, and silicone adhesives to securely fix electronic components. However, you can choose to leave if necessary. Further, in the above embodiment, the sprocket holes 2 are provided near both ends of the tape base 1 in the width direction, but they may be provided only near one end of the tape base 1 in the width direction.
以上説明したように、この発明に係る電子部品
搬送体においては、粘着テープの電子部品搭載孔
に露出した部分に応力が作用することはないか
ら、粘着テープの電子部品搭載孔に露出した部分
に復元力が働くことはなく、搬送中に粘着テープ
が電子部品の本体底面から剥がれないので、電子
部品がテープ基体から離脱することはないため、
電子部品を確実に搬送することができる。このよ
うに、この発明の効果は顕著である。
As explained above, in the electronic component carrier according to the present invention, since no stress is applied to the portion of the adhesive tape exposed to the electronic component mounting hole, the portion of the adhesive tape exposed to the electronic component mounting hole is Restoring force does not work, and the adhesive tape does not peel off from the bottom of the electronic component during transportation, so the electronic component does not separate from the tape base.
Electronic components can be transported reliably. As described above, the effects of this invention are remarkable.
第１図はこの発明に係る電子部品搬送体を示す
図、第２図は第１図のＡ−Ａ断面図、第３図は第
１図、第２図に示した電子部品搬送体の製造説明
図、第４図、第５図はそれぞれこの発明に係る他
の電子部品搬送体の一部を示す図、第６図は従来
の電子部品搬送体を示す図、第７図は第６図のＢ
−Ｂ断面図である。
１……テープ基体、２……スプロケツト孔、１
２……電子部品搭載孔、１５……電子部品、１５
ａ……パツケージ底面、１６……導線、１９……
切断スリツト、２２……粘着テープ。
FIG. 1 is a diagram showing an electronic component carrier according to the present invention, FIG. 2 is a sectional view taken along the line A-A in FIG. 1, and FIG. 3 is a diagram showing the manufacture of the electronic component carrier shown in FIGS. Explanatory drawings, FIGS. 4 and 5 respectively show a part of another electronic component carrier according to the present invention, FIG. 6 shows a conventional electronic component carrier, and FIG. B of
-B sectional view. 1... Tape base, 2... Sprocket hole, 1
2...Electronic component mounting hole, 15...Electronic component, 15
a...bottom of package cage, 16...conductor, 19...
Cutting slit, 22...Adhesive tape.
Claims (1)
品をテープ基体に取り付けた電子部品搬送体にお
いて、上記テープ基体の長手方向に複数個の電子
部品搭載孔を設け、上記テープ基体に上記電子部
品搭載孔を覆つた粘着テープを貼着し、上記粘着
テープの上記電子部品搭載孔に露出した部分に切
断スリツトを設け、上記電子部品の上記導線を上
記テープ基体の上記粘着テープを貼着した面とは
反対側の面に当接し、上記粘着テープの上記電子
部品搭載孔に露出した部分を上記電子部品の本体
底面に貼着したことを特徴とする電子部品搬送
体。 ２ 上記テープ基体の幅方向端部の少なくとも一
方の近傍に複数個のスプロケツト孔を設けたこと
を特徴とする特許請求の範囲第１項記載の電子部
品搬送体。[Claims] 1. In an electronic component carrier in which a plurality of electronic components having conductive wires bent downward are attached to a tape base, a plurality of electronic component mounting holes are provided in the longitudinal direction of the tape base, and the tape An adhesive tape covering the electronic component mounting hole is pasted on the base, a cutting slit is provided in a portion of the adhesive tape exposed to the electronic component mounting hole, and the conductive wire of the electronic component is connected to the adhesive tape on the tape base. An electronic component carrier, characterized in that a portion of the adhesive tape exposed in the electronic component mounting hole is attached to the bottom surface of the main body of the electronic component. 2. The electronic component carrier according to claim 1, wherein a plurality of sprocket holes are provided near at least one widthwise end of the tape base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59171566A JPS6150398A (en) | 1984-08-20 | 1984-08-20 | Electronic part conveying unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59171566A JPS6150398A (en) | 1984-08-20 | 1984-08-20 | Electronic part conveying unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6150398A JPS6150398A (en) | 1986-03-12 |
| JPH0220506B2 true JPH0220506B2 (en) | 1990-05-09 |
Family
ID=15925513
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59171566A Granted JPS6150398A (en) | 1984-08-20 | 1984-08-20 | Electronic part conveying unit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6150398A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2737513B2 (en) * | 1992-02-18 | 1998-04-08 | 日本電気株式会社 | Adhesive tape for attaching semiconductor devices |
| US10542337B2 (en) | 2017-07-18 | 2020-01-21 | Shure Acquisition Holdings, Inc. | Moving coil microphone transducer with secondary port |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL8005051A (en) * | 1980-09-08 | 1982-04-01 | Philips Nv | PACKAGING FOR ELECTRICAL AND / OR ELECTRONIC COMPONENTS. |
| JPS5827398A (en) * | 1981-08-11 | 1983-02-18 | 松下電器産業株式会社 | electronic parts assembly |
-
1984
- 1984-08-20 JP JP59171566A patent/JPS6150398A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6150398A (en) | 1986-03-12 |
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