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JPH0221001B2 - - Google Patents
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JPH0221001B2 - - Google Patents

Info

Publication number
JPH0221001B2
JPH0221001B2 JP17838680A JP17838680A JPH0221001B2 JP H0221001 B2 JPH0221001 B2 JP H0221001B2 JP 17838680 A JP17838680 A JP 17838680A JP 17838680 A JP17838680 A JP 17838680A JP H0221001 B2 JPH0221001 B2 JP H0221001B2
Authority
JP
Japan
Prior art keywords
drilling
coordinates
pattern
printed circuit
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP17838680A
Other languages
Japanese (ja)
Other versions
JPS57101907A (en
Inventor
Takayoshi Imura
Chiaki Handa
Toshiichi Kobayashi
Masanori Nakai
Kenichi Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP17838680A priority Critical patent/JPS57101907A/en
Publication of JPS57101907A publication Critical patent/JPS57101907A/en
Publication of JPH0221001B2 publication Critical patent/JPH0221001B2/ja
Granted legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Program-control systems
    • G05B19/02Program-control systems electric
    • G05B19/18Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form
    • G05B19/182Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form characterised by the machine tool function, e.g. thread cutting, cam making, tool direction control
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/36Nc in input of data, input key till input tape
    • G05B2219/36503Adapt program to real coordinates, software orientation
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/45Nc applications
    • G05B2219/45035Printed circuit boards, also holes to be drilled in a plate
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/45Nc applications
    • G05B2219/45129Boring, drilling
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/49Nc machine tool, till multiple
    • G05B2219/49219Compensation temperature, thermal displacement
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0011Working of insulating substrates or insulating layers
    • H05K3/0044Mechanical working of the substrate, e.g. drilling or punching

Landscapes

  • Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Drilling And Boring (AREA)
  • Numerical Control (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Description

【発明の詳細な説明】 本発明は、NCボール盤を用いて多層プリント
基板に穴明けを行なう際に適用する好適な穴明け
制御方法に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a suitable drilling control method applied when drilling holes in a multilayer printed circuit board using an NC drilling machine.

最近、この種プリント基板は高密度化が進み、
パターンが微細化される傾向にあるが、従来こう
した基板に対してNCボール盤により穴明けを行
なう場合、予め設計段階で設定された穿孔情報を
そのまま使用してボール盤を制御していた。しか
し、こうした制御方法では、各基板において工程
上発生するバラツキ、即ちパターンが全体的にズ
レる形の総合ズレ及び、積層時中間層に生じる基
材伸縮によるズレを補正することができず、しば
しば穴明け位置が目的の中間層ランドパターンを
外れてしまういわゆる中間層ランド切れ不良が発
生する欠点があつた。
Recently, this type of printed circuit board has become more dense,
Although there is a trend toward finer patterns, conventionally when drilling holes in such substrates using an NC drilling machine, the drilling machine was controlled using the drilling information set in advance at the design stage. However, with these control methods, it is not possible to correct the variations that occur during the process in each substrate, that is, the overall deviation of the pattern as a whole, and the deviation due to expansion and contraction of the base material that occurs in the intermediate layer during lamination, and it is not possible to correct the deviation that occurs in the process of each substrate. There is a drawback that so-called intermediate layer land breakage failure occurs in which the opening position deviates from the target intermediate layer land pattern.

そこで、本発明は、プリント基板の中間層に複
数の目標パターンを形成し、それ等目標パターン
の設計上の座標と実際の座標の差から総合ズレ量
を、各パターン間の設計上のピツチと実際のピツ
チの差から基材伸縮量を算出し、これ等の量から
穿孔情報中の穴明け位置の座標を補正して構成
し、もつて前述の欠点を解消したNCボール盤に
おける穴明け制御方法を提供することを目的とす
るものである。
Therefore, the present invention forms a plurality of target patterns on the intermediate layer of a printed circuit board, and calculates the total amount of deviation from the difference between the designed coordinates of the target patterns and the actual coordinates, and calculates the designed pitch between each pattern. A drilling control method for an NC drilling machine that eliminates the above-mentioned drawbacks by calculating the base material expansion/contraction amount from the actual pitch difference, and correcting the coordinates of the drilling position in the drilling information based on these amounts. The purpose is to provide the following.

以下、図面に示す一実施例に基き、本発明を具
体的に説明する。
Hereinafter, the present invention will be specifically explained based on an embodiment shown in the drawings.

NCボール盤1は、第1図に示すように、穿孔
情報の格納されたデーター処理装置2、数値制御
装置3及び本体5からなり、本体5はフレーム6
を有している。フレーム6上にはテーブル7がモ
ーター9により矢印A、B方向に移動駆動自在に
設けられており、更にフレーム6の上部6aには
ヘツド10が、モーター11により矢印A、B方
向とは直角な方向である矢印C、D方向に移動駆
動自在に設けられている。ヘツド10にはサブヘ
ツド12が、モーター13により矢印A、B及び
C、D方向とは直角な方向である矢印E、F方
向、即ち図中上下方向に移動駆動自在に設けられ
ており、サブヘツド12には穴明け用ドリル装置
15,15及びパターン読取り装置16が設けら
れている。なお、読取り装置16は、第2図に示
すように、レーザー17及びレーザー17からの
光を捕捉するセンサー19を有しており、更に多
層プリント基板20の中間層には、第3図に示す
ように、基板四隅の対称的な位置に目標パターン
としてのダミーランドパターン20a,20b,
20c,20dがそれぞれ形成されている。
As shown in FIG. 1, the NC drilling machine 1 consists of a data processing device 2 storing drilling information, a numerical control device 3, and a main body 5. The main body 5 has a frame 6.
have. A table 7 is provided on the frame 6 so as to be movable and driven in the directions of arrows A and B by a motor 9. Furthermore, a head 10 is mounted on the upper part 6a of the frame 6, and a table 7 is mounted by a motor 11 to move at right angles to the directions of arrows A and B. It is provided so that it can be freely moved and driven in the directions of arrows C and D. A sub-head 12 is provided in the head 10 and is movably driven by a motor 13 in the directions of arrows E and F, which are perpendicular to the directions of arrows A, B, C, and D, that is, in the vertical direction in the figure. are provided with drilling devices 15, 15 and a pattern reading device 16. The reading device 16 has a laser 17 and a sensor 19 that captures the light from the laser 17, as shown in FIG. As shown in FIG.
20c and 20d are formed, respectively.

NCボール盤1は、以上のような構成を有する
ので、多層プリント基板20に穴明けを行なう場
合には、まず基板20を座ぐりし、4ケ所のダミ
ーランドパターン20a,20b,20c,20
dを露出させた形で基板20をテーブル7上にセ
ツトする。次に、穿孔情報中に入つているダミー
ランドパターン20a,20b,20c,20d
の位置情報に基き、数値制御装置3はモーター
9,11を駆動してテーブル7を矢印A、B方
向、ヘツド10を矢印C、D方向に移動させ、パ
ターン読取り装置16によりパターン20a,2
0b,20c,20dの各座標位置を読取る。こ
の際、第2図に示すように、読取り装置16のレ
ーザー17からはレーザー光線21がプリント基
板表20eに向けて照射され、センサー19はそ
の反射光22を捕捉するが、テーブル7等の移動
によりレーザー光線21が座ぐり部20fに達す
ると、光線21の反射点21aが、図中下方のパ
ターン20a,20b,20c,20d上にシフ
トするので、反射光22がセンサー19中に入ら
なくなり、その時点でパターン20a,20b,
20c,20dの座標がデーター処理装置2によ
り演算される。こうして、各パターン20a,2
0b,20c,20dの実際の座標がボール盤1
の原点Gを基準として、第3図に示すように、
(X′1、Y′1)、(X′2、Y′2)、(X′3、Y′3)、(
X′4
Y′4)として算出されたところで、それ等ダミー
ランド20a,20b,20c,20dの実際の
座標と設計上の座標との差、即ち総合ズレ量ZX
ZYをX及びY方向について式(1)、(2)により算出す
る。各パターン20a,20b,20c,20d
の設計上の座標を(X1、Y1)、(X2、Y2)、(X3
Y3)、(X4、Y4)として、 ZX=(X′1+X′2+X′3+X′4)/4− (X1+X2+X3+X4)/4 …(1) ZY=(Y′1+Y′2+Y′3+Y′4)/4− (Y1+Y2+Y3+Y4)/4 …(2) 次に、パターン20a,20b,20c,20
dの座標から各パターン間の実際のピツチP′X1
P′X2、P′Y1、P′Y2をX及びY方向について算出し、
設計上のピツチPX、PYとの差の平均を式(3),(4)
から算出し、基板20における中間層パターン間
の基材伸縮量LX、LYをX及びY方向について算
出する。
Since the NC drilling machine 1 has the above-described configuration, when drilling a hole in the multilayer printed circuit board 20, first, the board 20 is counterbore, and four dummy land patterns 20a, 20b, 20c, 20 are formed.
The substrate 20 is set on the table 7 with the portion d exposed. Next, dummy land patterns 20a, 20b, 20c, 20d included in the drilling information
Based on the positional information of
Read each coordinate position of 0b, 20c, and 20d. At this time, as shown in FIG. 2, a laser beam 21 is emitted from the laser 17 of the reading device 16 toward the printed circuit board surface 20e, and the sensor 19 captures the reflected light 22, but due to the movement of the table 7 etc. When the laser beam 21 reaches the counterbore 20f, the reflection point 21a of the beam 21 shifts to the lower patterns 20a, 20b, 20c, and 20d in the figure, so the reflected light 22 no longer enters the sensor 19, and at that point So patterns 20a, 20b,
The coordinates of 20c and 20d are calculated by the data processing device 2. In this way, each pattern 20a, 2
The actual coordinates of 0b, 20c, 20d are drill press 1
With the origin G as a reference, as shown in Figure 3,
(X′ 1 , Y′ 1 ), (X′ 2 , Y′ 2 ), (X′ 3 , Y′ 3 ), (
X'4 ,
Y′ 4 ), the difference between the actual coordinates and the designed coordinates of the dummy lands 20a, 20b, 20c, and 20d, that is, the total amount of deviation Z
Z Y is calculated in the X and Y directions using equations (1) and (2). Each pattern 20a, 20b, 20c, 20d
The design coordinates of (X 1 , Y 1 ), (X 2 , Y 2 ), (X 3 ,
Y 3 ) , ( X 4 , Y 4 ) , Z Y = ( Y'1 + Y'2 + Y'3 + Y'4 )/4- ( Y1 + Y2 + Y3 + Y4 )/4...(2) Next, patterns 20a, 20b, 20c, 20
From the coordinates of d, the actual pitch P′ X1 between each pattern,
Calculate P′ X2 , P′ Y1 , P′ Y2 in the X and Y directions,
The average difference between the design pitches P X and P Y is calculated using equations (3) and (4)
, and the base material expansion/contraction amounts L X and L Y between the intermediate layer patterns on the substrate 20 are calculated in the X and Y directions.

LX={(P′X1−PX) +(P′X2−PX)}/2 …(3) LY={(P′Y1−PY) +(P′Y2−PY)}/2 …(4) こうして得られた総合ズレ量ZX、ZY及び基材
伸縮量LX、LYを用いて、穿孔情報中のパターン
20aを原点とする穴明け位置の座標(x、y)
を式(5)、(6)を用いて補正し、総合ズレ量及び基材
伸縮量の考慮された穴明け位置を座標(x′、y′)
として算出する。
L X = {( P X1 −P X ) + ( P′ X2 −P /2...(4) Using the total deviation amounts Z X , Z Y and the base material expansion/contraction amounts L X , L Y obtained in this way, the coordinates (x, y)
is corrected using equations (5) and (6), and the coordinates (x′, y′) of the drilling position are calculated by taking into account the total amount of deviation and the amount of expansion and contraction of the base material.
Calculated as

x′=x+(x/Px)LX+ZX …(5) y′=y+(Y/Py)LY+ZY …(6) こうして得られた座標(x′、y′)に基いて数値
制御装置3はテーブル7、ヘツド10を駆動し
て、ドリル装置15を補正された穴明け位置の座
標(x′、y′)にセツトし、サブヘツド12をF方
向に下降させて、基板20上に穴を穿設する。
x′ = x+( x /P x ) L X + Z Then, the numerical control device 3 drives the table 7 and the head 10, sets the drill device 15 at the corrected drilling position coordinates (x', y'), lowers the sub-head 12 in the F direction, and lowers the sub-head 12 to the substrate. Drill a hole on 20.

なお、上述の実施例は、パターン読取り装置1
6がダミーランドパターン20a……等の目標パ
ターンをレーザー光線21を用いて検出する場合
について述べたが、目標パターンの検出方法とし
ては他にも種々の方法が考えられる。即ち、第4
図に示すように、X線発生装置23からX線25
を照射させ、ホトマルセンサー26により目標パ
ターン27を補捉する方法や、第5図に示すよう
に、ハーフミラー28により光29を基板20上
に照射しスクリーン30にパターン27を映し出
して捕捉する方法も考えられる。
Note that the above-mentioned embodiment is based on the pattern reading device 1.
Although a case has been described in which a target pattern such as the dummy land pattern 20a 6 is detected using the laser beam 21, various other methods can be considered as a method for detecting the target pattern. That is, the fourth
As shown in the figure, X-rays 25 are emitted from the X-ray generator 23.
A method of irradiating light 29 onto the substrate 20 with a half mirror 28 and capturing the pattern 27 by projecting it on a screen 30 as shown in FIG. 5. can also be considered.

更に、目標パターンの数は、第3図に示すよう
に、4個に限られることはなく、2個以上複数個
設け、2個の場合は基材伸縮量を一方向について
のみ捕捉してより簡略な形で補正し、5個以上の
場合には、基板20を数ブロツクに分割してより
精密に補正を行なうようにすることもできる。
Furthermore, as shown in Fig. 3, the number of target patterns is not limited to four, but two or more can be provided, and in the case of two, the amount of expansion and contraction of the base material can be captured only in one direction. The correction may be made in a simple manner, and if there are five or more blocks, the substrate 20 may be divided into several blocks to perform more precise correction.

以上説明したように、本発明によれば、プリン
ト基板20の中間層にダミーランドパターン20
a,20b……等の目標パターンを複数個形成
し、それ等目標パターンの設計上の座標(X1
Y1)、(X2、Y2)……と実際の座標(X′1、Y′1)、
(X′2、Y′2)……の差、及び各パターン間の実際
のピツチP′X1、P′X2、P′Y1、P′P2と設計上のピツチ
PX、PYの差を算出して、総合ズレ量ZX、ZY及び
基材伸縮量LX、LYを求め、それ等の量から穿孔
情報中の穴明け位置の座標(x、y)を補正する
ようにしたので、多層プリント基板20に対する
穴明けを基板20のバラツキを考慮した形で正確
に行なうことが可能となり、ランド切れ不良等の
発生を防止し、基板20のより一層の高密度化に
寄与し得る。
As explained above, according to the present invention, the dummy land pattern 20 is provided in the intermediate layer of the printed circuit board 20.
A, 20b, etc. are formed, and the design coordinates (X 1 ,
Y 1 ), (X 2 , Y 2 )...and the actual coordinates (X′ 1 , Y′ 1 ),
(X′ 2 , Y′ 2 )...and the actual pitch between each pattern P′ X1 , P′ X2 , P′ Y1 , P′ P2 and the designed pitch
Calculate the difference between P _ y) is corrected, it becomes possible to accurately drill holes in the multilayer printed circuit board 20 while taking into account the variations in the board 20, thereby preventing the occurrence of land breakage defects, etc., and making the board 20 even better. This can contribute to higher density.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明が適用されるNCボール盤の一
例を示す斜視図、第2図はパターン読取り装置を
示す図、第3図はプリント基板を示す平面図、第
4図及び第5図はパターン読取り装置の別の例を
示す図である。 1……NCボール盤、20……プリント基板、
20a,20b,20c,20d……目標パター
ン(ダミーランドパターン)、27……目標パタ
ーン、PX、PY……設計上のピツチ、P′X1、P′X2
P′Y1、P′Y2……実際のピツチ、(X1、Y1)、(X2
Y2)、(X3、Y3)、(X4、Y4)……設計上の座標、
(X′1、Y′1)、(X′2、Y′2)、(X′3、Y′3)、(
X′4
Y′4)……実際の座標。
FIG. 1 is a perspective view showing an example of an NC drilling machine to which the present invention is applied, FIG. 2 is a view showing a pattern reading device, FIG. 3 is a plan view showing a printed circuit board, and FIGS. 4 and 5 are patterns It is a figure which shows another example of a reading device. 1... NC drilling machine, 20... Printed circuit board,
20a, 20b, 20c, 20d...Target pattern (dummy land pattern), 27...Target pattern, PX , PY ...Design pitch, P'X1 , P'X2 ,
P′ Y1 , P′ Y2 ...Actual pitch, (X 1 , Y 1 ), (X 2 ,
Y 2 ), (X 3 , Y 3 ), (X 4 , Y 4 )...Design coordinates,
(X′ 1 , Y′ 1 ), (X′ 2 , Y′ 2 ), (X′ 3 , Y′ 3 ), (
X'4 ,
Y′ 4 )...Actual coordinates.

Claims (1)

【特許請求の範囲】[Claims] 1 多層プリント基板に穿孔情報に基いて穴明け
を行なうNCボール盤において、前記プリント基
板の中間層に複数の目標パターンを形成し、それ
等目標パターンの設計上の座標と実際の座標の差
から総合ズレ量を、各パターン間の設計上のピツ
チと実際のピツチの差から基材伸縮量を算出し、
これ等の量から穿孔情報中の穴明け位置の座標を
補正して構成したNCボール盤における穴明け制
御方法。
1. In an NC drilling machine that drills holes in a multilayer printed circuit board based on drilling information, multiple target patterns are formed in the intermediate layer of the printed circuit board, and the total number of target patterns is calculated based on the difference between the designed coordinates and the actual coordinates of the target patterns. The amount of deviation is calculated by calculating the amount of expansion and contraction of the base material from the difference between the designed pitch and the actual pitch between each pattern.
A drilling control method for an NC drilling machine configured by correcting the coordinates of the drilling position in the drilling information based on these quantities.
JP17838680A 1980-12-17 1980-12-17 Drilling control method of numerical control drilling machine Granted JPS57101907A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17838680A JPS57101907A (en) 1980-12-17 1980-12-17 Drilling control method of numerical control drilling machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17838680A JPS57101907A (en) 1980-12-17 1980-12-17 Drilling control method of numerical control drilling machine

Publications (2)

Publication Number Publication Date
JPS57101907A JPS57101907A (en) 1982-06-24
JPH0221001B2 true JPH0221001B2 (en) 1990-05-11

Family

ID=16047577

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17838680A Granted JPS57101907A (en) 1980-12-17 1980-12-17 Drilling control method of numerical control drilling machine

Country Status (1)

Country Link
JP (1) JPS57101907A (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61225894A (en) * 1985-03-29 1986-10-07 日立化成工業株式会社 Manufacture of multilayer printed interconnection board
JPS61225893A (en) * 1985-03-29 1986-10-07 日立化成工業株式会社 Manufacture of multilayer printed interconnection board
JPS61253508A (en) * 1985-05-07 1986-11-11 Nachi Fujikoshi Corp Method for correcting deviation of position of teaching robot
JPS6352955A (en) * 1986-08-21 1988-03-07 Matsushita Electric Ind Co Ltd Positioning method
JPH0219413U (en) * 1988-07-21 1990-02-08
JPH0269993A (en) * 1988-09-05 1990-03-08 Nec Corp Lamination layer guide hole machining apparatus
US5304773A (en) * 1992-02-19 1994-04-19 Trumpf Inc. Laser work station with optical sensor for calibration of guidance system
US5847960A (en) * 1995-03-20 1998-12-08 Electro Scientific Industries, Inc. Multi-tool positioning system
JP4498230B2 (en) * 2005-06-27 2010-07-07 日立ビアメカニクス株式会社 Drilling method and drilling device
JP4943173B2 (en) * 2007-02-06 2012-05-30 東芝機械株式会社 Slide core hole machining method and measurement / correction system used for slide core hole machining

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