JPH0224379B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a pellet bonding apparatus, and more particularly to a wafer ring holding apparatus.

(Prior art) Semiconductor manufacturing processes involve pellet bonding operations in which semiconductor pellets are sequentially placed and fixed at predetermined positions on a substrate.
58-37986) is used.

(Problem to be Solved by the Invention) Semiconductor pellets used in pellet bonding equipment are generally produced by bonding a semiconductor wafer to a flexible sheet, scribing the semiconductor wafer, and then dicing it into a large number of semiconductor pellets. The pellets are obtained by dividing the pellets, and then holding the periphery of the flexible sheet with a wafer ring and stretching it to form gaps between each pellet.
This wafer ring is mounted on a ring holder of a pellet bonding apparatus, and a large number of semiconductor pellets are taken out one by one from the sheet using a suction tool called a collect and transferred to a predetermined position on the substrate.

Semiconductor pellets loaded into the pellet bonding apparatus thus require various processes in the pre-processing process, which is inefficient. In addition, it has been reported that the semiconductor pellets, which are regularly divided and aligned on the sheet in the above process, may become misaligned during transportation until the wafer ring is attached to the ring holder, or when the wafer ring is attached. This positional deviation is dangerous and has been a problem in automating pellet bonding operations.

Furthermore, due to the size of the pellets, etc., the amount of gaps to be formed between each pellet must be set to an optimum value, but this setting cannot be done easily.

The present invention has been made to eliminate the above-mentioned drawbacks, and after stretching a flexible sheet to which a semiconductor wafer is attached, it is possible to provide semiconductor pellets as they are to a pellet bonding apparatus. Another object of the present invention is to provide a wafer ring holding device in a pellet bonding apparatus that allows for easy adjustment of the gap between semiconductor pellets.

(Example) An example of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view of a wafer ring holding device incorporated into a pellet bonding device, and FIG. 2 is a partial sectional view of the right front side thereof. In the figure, 1 is a base placed on an XY table (not shown), and 2 is a bracket.
is fixed to the base 1 through a long hole 3 with bolts 4 or the like. Reference numeral 5 denotes a holding base for holding a ring holder 8, which will be described later, and a through hole 2a provided in the bracket 2.
It is mounted on and held horizontally. This holding stand 5
has a circular fitting part 6 in the figure on its upper outer periphery, a small diameter part 6a in the upper part, and a through hole 7 in the center, where the small diameter part 6a intersects with the upper surface 5a of the holding base 5. is smoothly formed. A ring holder 8 is fitted into the fitting part 6 of the holding base 5.
Forked protrusions 9, 9 are provided at three locations on the outer periphery of the ring holder 8. As shown in detail in FIG. 3a, a claw 10 is arranged between the protrusions 9, 9, and this claw 10 is interposed between the protrusions 9, 9 as shown in FIG. 3b. Eccentric pin 11
(the amount of eccentricity e), and is rotatable between the protrusions 9, 9. Note that 11a in FIG. 1 is a set screw for the eccentric pin 11. Further, a side view of only the pawl 10 is shown in FIG. A bolt 12 is fastened to one end 14 of the ring holder 8 via the bolt 12. However, a compression spring 15 is interposed between one end 10a of the claw 10 and one side end 14 of the ring holder 8, so that the bolt 1
By changing the amount of tightening 2, the set position of the pawl 10 can be freely adjusted to the position shown by the solid line or the position shown by the dashed-dotted line in FIG. 3a. Further, as shown in FIG. 4, the ring holder 8 has three holes on its outer periphery: a hole 17 for inserting the bolt 16, a recess 18 for the head of the bolt 16 to come into contact with, and a recess 2 for inserting the compression spring 19.
0 is provided, and after inserting the compression spring 19 of the recess 20, the bolt 16 is inserted into the screw hole 21 provided in the holding base 5.
By tightening the ring holder 8, the ring holder 8 is attached to the holding base 5. Therefore, by adjusting the amount of tightening of the three bolts 16, the mounting position of the ring holder 8 on the holding base 5 can be freely adjusted in a substantially perpendicular direction to the upper surface 5a of the holding base 5.

As shown in FIG. 2, FIG. 3a, and FIG. 4, an annular groove 22 is provided on the upper surface of the ring holder 8, and an annular rubber ring 23 is mounted within this groove 22. When this rubber ring 23 is installed in the annular groove 22, its upper surface is attached to the bolt 16.
The thickness is located above the top surface of.

Further, a V-shaped groove 24 is formed on the outer periphery of the holding base 5. On the other hand, bolts 25 are screwed into three locations on the outer periphery of the bracket 2 at positions corresponding to the V-shaped grooves 24, and the tips of the bolts 25 come into contact with the V-shaped grooves 24. After rotating the holding stand 5 in the horizontal direction relative to the bracket 2 and adjusting the position of the holding stand 5 relative to the bracket 2, tighten the bolt 25 at the adjusted position and further tighten the fixing nut 26 to fix it. I'm starting to be able to do it. Also, as shown in FIG. 5, there are pins 27 at two locations on the top surface of the ring holder 8.
is installed protrudingly.

Now, the wafer ring 28 used in the above embodiment is shown in FIG. In addition, in FIG. 1, only the outer shape is shown by a dashed line. As shown in the figure, the outer periphery of the wafer ring 28 is cut out from the circular shape at two corresponding places a and b and one place c sandwiched between them, and also at a position 2 corresponding to the pin 27.
It has a shape in which notches d and e are formed at these locations. Further, a through hole 29 is formed in the central portion, and the diameter of this through hole 29 is approximately the same as the diameter of the fitting portion 6 of the holding portion 5. The outer periphery of a flexible sheet 30 is adhered to the lower surface of this wafer ring 28, and a semiconductor wafer 31 that has been diced and divided into individual semiconductor pellets 32 is adhered to the upper surface of the sheet 30. ing.

Next, the operation of the above configuration will be explained.

First, a wafer ring 28 as shown in FIG.
Prepare. As mentioned above, on the flexible sheet 30 whose outer periphery is adhered to the wafer ring 28,
A semiconductor wafer 31 that has been scribed and diced and divided into individual semiconductor pellets 32 by a known method is attached. Next, bolt 1
By adjusting the degree of tightening of the ring holder 6, the mounting position of the ring holder 8 with respect to the holding base 5 is adjusted. That is, if the amount of tightening of the bolts 16 is increased, the ring holder 8 will be lowered, and as will be clear from the explanation below, when the wafer ring 28 is attached to the ring holder 8, the amount of stretching of the flexible sheet 30 can be increased. On the other hand, if the amount of tightening of the bolts 16 is reduced, the amount of stretching of the flexible sheet 30 can be reduced. After adjusting the tightening amount of the bolt 16, the notches d and e of the wafer ring 28
is brought into contact with a pin 27 protruding from the ring holder 8, and then the entire wafer ring 28 is pressed vertically against the holding table 5. Due to this pressing, the wafer ring 28 descends on the outer periphery of the holding table 5,
The flexible sheet 30 is uniformly stretched as it descends, and gaps are formed between each pellet due to this stretching. Finally, the wafer ring 28 comes into contact with the rubber ring 23 and its descent is stopped.

Although the order of explanation is reversed, when the wafer ring 28 is pressed vertically as explained above, the claws 10 provided at three locations on the outer periphery of the ring holder 8 will move as the wafer ring 28 descends. 28, it is rotated outward (clockwise in FIG. 3) against the compression spring 15.
However, when the wafer ring 28 comes into contact with the rubber ring 23, the claw 10 rotates in the opposite direction (counterclockwise in FIG. 3) due to the action of the compression spring 15 and presses the top surface of the wafer ring 28. , this wafer ring 28 is completely fixed to the ring holder 8. By adjusting the amount of tightening of the bolt 12, the position of the claw 10 about the eccentric pin 11 can be adjusted as shown in FIG. 3a, and by rotating the eccentric pin 11, the position of the ring holder 8 can be adjusted. The position of the claw 10 in the radial direction can be adjusted,
These should be adjusted in advance to match the wafer ring to be used.

In this way, attach the wafer ring 28 to the ring holder 8.
Once mounted, the flexible sheet 30 is uniformly stretched, and gaps are formed between the individual semiconductor pellets 32. Wafer ring 28 if necessary
After mounting on the ring holder 8, the nuts 26 and bolts 25 are loosened, and the holding table 5 is rotated relative to the bracket 2 to adjust the direction of the semiconductor pellet 32 in the θ direction.

Although illustration is omitted hereafter, one semiconductor pellet 3 is lifted from the bottom of the sheet 30 using a known push-up pin.
At the same time as pushing up the semiconductor pellet 32, the suction tool is lowered from above the sheet 30 to suction and hold the semiconductor pellet 32 pushed up, and then transferred to a predetermined position on the substrate.
Perform normal pellet bonding work to ensure fixation.

Also, to remove the wafer ring 28, use the claw 1.
This is done by pushing the wafer ring 28 outward and lifting the wafer ring 28 upward. At least 1
If each claw 10 is provided with an arm 33 as shown in FIG. 7, this can be done more easily by folding down this arm 33.

In the embodiment described above, the sheet 30 can be stretched at the stage of attaching the wafer ring 28 to the ring holder 8. Therefore, after stretching the sheet 30, the pellets 32 can be provided to the pellet bonding apparatus in that state. This makes it possible to simplify the process. Furthermore, for the same reason, it is possible to prevent the semiconductor pellet 32 from shifting on the sheet 30, compared to the conventional device in which the sheet is stretched and then attached to a ring holder. Also, the amount of stretching of the sheet 30 is
The amount of tightening of the bolt 16 can be varied simply by adjusting the amount of tightening, and the optimum amount of stretching for the semiconductor wafer 31 and each pellet 32, that is, the optimum amount of gap between each pellet, can be obtained. Furthermore, after the wafer ring 28 has been attached to the ring holder 8, the position of the semiconductor pellet 32 in the θ direction with respect to the base 1 can be adjusted by loosening the nuts 26 and bolts 25 and rotating the holding base 5 with respect to the bracket 2. Also, the vertical position of the top surface of the semiconductor pellet 32 from the base 1 can be determined by loosening the bolt 4 and adjusting the bracket 2.
By moving up and down with respect to the base 1, each can be adjusted.

(Effects of the Invention) As described above, according to the present invention, after stretching a flexible sheet to which a semiconductor wafer is attached, semiconductor pellets can be provided to a pellet bonding apparatus in that state, which simplifies the process. can be achieved.

Further, the amount of gap between each semiconductor pellet can be easily adjusted and set.

[Brief explanation of drawings]

Fig. 1 is a plan view of a wafer ring holding device which is an embodiment of the present invention, Fig. 2 is a partial sectional view of the right front side thereof, and Fig. 3 is a detailed view of the chuck mechanism of the wafer ring. is a front view, b is an enlarged view of the eccentric pin, c is a right side view of the claw, Fig. 4 is a detailed view showing the adjustment mechanism for the mounting position of the ring holder on the holding base, Fig. 5 is a detailed view of the pin, FIG. 6 is a diagram showing an example of a wafer ring, in which FIG. 6A shows a plan view, FIG. 6B shows a side view, and FIG. 7 shows a front view showing another embodiment of the claw. DESCRIPTION OF SYMBOLS 1... Base, 2... Bracket, 5... Holding stand, 6... Fitting part (annular part), 8... Ring holder, 10... Claw (holding claw), 11... Eccentric pin,
15, 19... Compression spring, 16... Bolt (adjustment mechanism), 23... Rubber ring, 24... V-shaped groove,
28...Wafer ring, 30...Flexible sheet,
31...Semiconductor wafer, 32...Semiconductor pellet.

Claims (1)

[Scope of Claims] 1. A base, a holding stand that is held horizontally on the base and has an annular portion at the top, a ring holder attached to the outer periphery of the annular portion of the holding stand, and a ring holder that is attached to the outer periphery of the annular portion of the holding stand. The adjustment mechanism is provided between the holding stands and is configured to adjust the attachment position of the ring holder to the holding stand, and the ring holder is provided with a flexible sheet to which a semiconductor pellet after cutting the wafer is attached. When the wafer ring that holds the outer peripheral portion of the wafer ring is moved in a direction substantially perpendicular to the upper surface of the annular portion of the holding stand, the wafer ring is provided with a holding claw that holds the wafer ring at the position after the movement. Wafer ring holding device in pellet bonding equipment. 2. A wafer ring in a pellet bonding apparatus according to claim 1, wherein the holding table is rotatably adjustable in a horizontal plane with respect to the base and fixed at an adjusted position. holding device. 3. Claims 1 or 2, characterized in that the holding stand is held by a base via a bracket, and the bracket is capable of vertically adjusting its attachment position with respect to the base. A wafer ring holding device in the pellet bonding apparatus described above.