JPH0228262B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a lead terminal bending device for a semiconductor device, which bends lead terminals extending from both sides of a semiconductor device downward.

[Prior art]

After the resin-sealed semiconductor device is resin-sealed and molded, lead terminals are formed as shown in FIGS. 1 to 3. As shown in a plan view in FIG. 1, a semiconductor chip (not shown) mounted on a lead frame 1 and wire-bonded is sealed with a resin sealing body 3 formed by synthetic resin molding. 1a is a connection part in the width direction of the lead frame, 2 is a large number of lead terminals, the tips are connected at the connection part 1a, and the middle part is the connection part 1.
They are connected by b.

When the lead frame 1 in this state is subjected to a cutting press and the connecting parts 1a and 1b are separated, the result is as shown in FIG.
As shown in a plan view and a front view in FIG. 4B, the semiconductor devices 4 are separated into individual semiconductor devices 4.

Each lead terminal 2 on both sides of this semiconductor device 4 is bent downward by a lead terminal bending device as shown in the front and side views of FIGS. 3a and 3b.

This type of conventional lead terminal bending device has a fourth
It was designed as shown in the front view in the figure. 5 is a die plate on the fixed side, and 6 is a bending die fixed to this die plate, which positions the semiconductor device 4 from below and receives the root portion of each lead terminal 2. A punch plate 7 is fixed to a press ram (not shown) and is lowered and returned to the upper position. 8 is a support member fixed to the punch plate 7, and arms 8 on both sides
A bending roll 10 is attached to the lower end of a by a support pin 9.
is rotatably supported. 11 is a semiconductor device 4
A presser plate corresponding to the upper side is held at the lower end of the holding rod 12, and is normally pressed downward by a compression spring 13. Presser plate 11
is provided with protrusions 11a on both sides of the lower end,
Hold the base of each lead terminal 2 in the lowered position.

The lead terminals 2 of the semiconductor device 4 were bent in the following manner using the conventional apparatus described above. The semiconductor device 4 in the state shown in FIG. 2 is placed on the bending die 6 as shown in FIG. The press is operated to lower the punch plate 7, and first, the protrusions 11a on both sides of the presser plate 11 press the base portions of the multiple lead terminals 2 on both sides to fix the semiconductor device 4. In the subsequent lowering to the set lowering position, the bending rolls 10 on both sides push down the respective lead terminals 2 on both sides from above, and each lead terminal 2 is received by both upper ends of the bending die 6 and bent downward. During this bending process, the bending roll 10 bends the lead terminal 2 while rotating.

[Problem to be solved by the invention]

In the conventional device described above, the reaction force applied to the bending roll 10 when the lead terminal 2 is bent is received by the support pin 9, and the support pin 9 is subjected to contact rotation of the bending roll 10. Support pin 9
And wear occurs on the inner circumferential portion of the bending roll 10. For this reason, when both wear progresses and the gap exceeds a predetermined value, the lead terminals 2 are insufficiently bent, resulting in defective products. Therefore, it was necessary to interrupt the work and replace the bending rolls 10 and support pins 9, which took a lot of time, stopped the production line, and hindered productivity.

This invention was made in order to eliminate the drawbacks of the above-mentioned conventional devices, and the wear of the rolls and support pins is reduced, bending work can be performed continuously for a long time, and
It is an object of the present invention to provide a bending device for lead terminals of semiconductor devices, which can improve productivity.

[Means to solve the problem]

The present invention is applied to a lead terminal bending device for a semiconductor device for bending lead terminals protruding on both sides from a sealed portion of a semiconductor downward at a predetermined position.

The lead terminal bending device for a semiconductor device according to the present invention includes a support member that supports predetermined positions of the lead terminals on both sides of a sealing part and keeps the lead terminals horizontally, and first and second arms arranged vertically above each other and movable up and down in the vertical direction; and a first vertical position relatively below the first and second arms and relatively connected to the lead terminal. The first and second arms are rotatably supported by support pins at a first horizontal position that is far from a predetermined position, and when the first and second arms descend, they abut against the lead terminal and rotate, thereby holding the lead terminal at a relatively shallow angle. A first roll that is bent downward and a second vertical position relatively above the first and second arms and a second horizontal position relatively close to a predetermined position of the lead terminal are respectively rotatable by support pins. supported by the first and second
and a second roll which, when the arm portion of the second roll comes into contact with the lead terminal and rotates when lowered, bends the lead terminal bent at a relatively shallow angle downward at a relatively deep angle.

[Effect]

In this invention, since the bending of the lead terminal is shared between the first and second rolls, the friction between the support pin and the first and second rolls is reduced.

[Embodiments of the invention]

FIG. 5 is a front view of a lead bending device according to an embodiment of the present invention.
13 and 11a are the same as those in the conventional device described above. Reference numeral 21 denotes a support member fixed to the punch plate 7, and the lower end of the arm portions 21a on both sides is connected to the lower bending roll 23 by a support pin 9 in the bending direction.
However, the upper bending roll 2 is fixed by the support pin 24.
5 are rotatably supported. The positions of the rolls 23 on both sides of the lower stage are shifted outward in both directions from the positions of the rolls 25 on both sides of the upper stage. The rolls 23 on both sides of the lower stage bend the lead terminal 2 at a shallow angle, and immediately after this, the rolls 23 on both sides of the upper stage bend the lead terminal 2 at a deep predetermined angle.

The lead terminals 2 of the semiconductor device 4 are bent in the following manner using the apparatus of the above embodiment. As shown in FIG. 5, the semiconductor device 4 in the state shown in FIG. 2 is placed on the bending die 6. The press machine is operated to lower the punch plate 7, and both protrusions 11 of the presser plate 11 are removed.
Press the bases of the many lead terminals 2 on both sides with a.
As the punch plate 7 continues to descend, the lower bending rolls 23 on both sides first bend the lead terminals 2 on both sides.
As shown in Figure 6, make a rough bend at a shallow angle.

Furthermore, as the punch plate 7 continues to descend, the upper bending rolls 25 on both sides bend the roughly bent lead terminals 2 on both sides, as shown in FIG.
Finish bending at an angle close to 90°. Next, the punch plate 7 moves up.

In this way, the lead terminals 2 of a large number of semiconductor devices 4 are sequentially bent.
and the upper roll 25 share the first and second half of the bending.
24 and the rolls 23 and 25 are less abrasive and can be used continuously for a long time.

〔Effect of the invention〕

As described above, according to the present invention, the first and second
rotatably supported by support pins at a first vertical position relatively below the arm of the lead terminal and at a first horizontal position relatively far from a predetermined position of the lead terminal;
a first roll that bends the lead terminal downward at a relatively shallow angle by abutting the lead terminal and rotating when the first and second arms descend;
The first and second arms are rotatably supported by support pins at a second vertical position relatively above the second arm and at a second horizontal position relatively near a predetermined position of the lead terminal. a second roll that contacts the lead terminal when the roll is lowered and rotates to bend the lead terminal bent at a relatively shallow angle downward at a relatively deep angle;
Since the bending of the lead terminals is shared between the two rolls, the friction between the support pin and the first and second rolls is reduced, and as a result, the work of bending the lead terminals can be continued for a long period of time, which reduces production. It has the effect of significantly improving performance.

[Brief explanation of drawings]

FIG. 1 is a plan view showing a state in which a semiconductor chip is sealed with resin in a lead frame, FIGS. 2 a and b are a plan view and a front view of the semiconductor device separated from the state shown in FIG. 1, and FIG. FIG. 2 is a front view and side view of a semiconductor device with lead terminals bent, FIG. 4 is a front view of a conventional lead terminal bending device, and FIG. 5 is a lead terminal folding device according to an embodiment of the present invention. A front view of the bending device, FIGS. 6 and 7 are front views of main parts showing the bending of a lead terminal by the device of FIG. 5 in the order of operation. 1...Lead frame, 2...Lead terminal, 4
... Semiconductor device, 5 ... Die plate, 6 ... Bending die, 7 ... Punch plate, 9 ... Support pin, 21 ... Support member, 21a ... Arm part, 23 ...
...Lower side roll, 24...Support pin, 25...
Upper roll. Note that the same reference numerals in the figures indicate the same or equivalent parts.

Claims (1)

[Scope of Claims] 1. A lead terminal bending device for a semiconductor device for bending lead terminals protruding on both sides from a sealed portion of a semiconductor device downward at a predetermined position, comprising: a support member that supports the lead terminal at a predetermined position and keeps the lead terminal horizontally; and a first support member that is disposed vertically above each of the lead terminals on both sides supported by the support member and that is vertically movable. , a second arm, and a first vertical position relatively below the first and second arms and a first horizontal position relatively far from a predetermined position of the lead terminal, respectively, by means of a support pin. a first roll that is freely supported and that bends the lead terminal downward at a relatively shallow angle by contacting and rotating the lead terminal when the first and second arm portions are lowered; The first and second parts are rotatably supported by support pins at a second vertical position relatively above the second arm and at a second horizontal position relatively close to a predetermined position of the lead terminal. and a second roll that bends the lead terminal bent at a relatively shallow angle downward at a relatively deep angle by abutting the lead terminal and rotating when the arm is lowered. Device.