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JPH0229964B2 - SUNHOSOKUTEISOCHI - Google Patents
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JPH0229964B2 - SUNHOSOKUTEISOCHI - Google Patents

SUNHOSOKUTEISOCHI

Info

Publication number
JPH0229964B2
JPH0229964B2 JP2619480A JP2619480A JPH0229964B2 JP H0229964 B2 JPH0229964 B2 JP H0229964B2 JP 2619480 A JP2619480 A JP 2619480A JP 2619480 A JP2619480 A JP 2619480A JP H0229964 B2 JPH0229964 B2 JP H0229964B2
Authority
JP
Japan
Prior art keywords
detection
circuit
measured
width signal
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2619480A
Other languages
Japanese (ja)
Other versions
JPS56122904A (en
Inventor
Seikichi Nishimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP2619480A priority Critical patent/JPH0229964B2/en
Publication of JPS56122904A publication Critical patent/JPS56122904A/en
Publication of JPH0229964B2 publication Critical patent/JPH0229964B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/02Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/04Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness specially adapted for measuring length or width of objects while moving
    • G01B11/043Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness specially adapted for measuring length or width of objects while moving for measuring length

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Description

【発明の詳細な説明】 本発明は、被測定物の光学像からその寸法を測
定する寸法測定装置に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a dimension measuring device that measures the dimensions of an object to be measured from an optical image thereof.

鋼板の圧延または検査ラインにおける被測定物
の板幅を測定する寸法測定装置としては、板端を
光学的に検出する1対の検出ヘツドをサーボ系に
より板端に追従させ、この両ヘツド位置をマグネ
スケールあるいはエンコーダで位置検出して板幅
を測定するものが知られている。
A dimension measuring device that measures the width of a workpiece on a steel plate rolling or inspection line uses a servo system to track a pair of detection heads that optically detect the edge of the plate, and the position of both heads is determined by a servo system. It is known to measure the board width by detecting the position using a magnescale or an encoder.

この板端追従方式では、検出ヘツド視野内に1
つ以上の板端が存在すると、検出ヘツドが所望す
る被測定物の端部に追従できず測定不能となる。
すなわち、1枚の鋼板を縦方向に裁断して複数枚
の鋼板を切り出すスリツタラインにおいては、幅
方向に4以上の複数の板端が存在することになる
ため、上記方式では測定不能となる。
In this plate edge tracking method, there is one point within the detection head field of view.
If more than one plate edge exists, the detection head cannot follow the desired edge of the object to be measured, making measurement impossible.
That is, in a slitting line that cuts one steel plate in the longitudinal direction to cut out a plurality of steel plates, there are four or more plate ends in the width direction, so it is impossible to measure using the above method.

本発明は、所望する被測定物の板端がその視野
内に存在するように検出ヘツドを配置し、その視
野内に他の板材の端部がともに存在した場合、そ
の板材の視野内長さ、および板材と被測定物との
間の長さを除去して被測定物の寸法を測定するよ
うに構成した寸法測定装置を提供しようとするも
のである。
In the present invention, the detection head is arranged so that the edge of the plate of the desired object to be measured exists within its field of view, and when the edge of another plate is also present within the field of view, the length of the plate within the field of view is determined. The object of the present invention is to provide a dimension measuring device configured to measure the dimensions of an object to be measured by removing the length between the plate material and the object to be measured.

以下、本発明の一実施例につき図面を参照して
説明する。
Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

この一実施例では、第1図に示すように検出ヘ
ツド10,20の視野Wf内に被測定物30以外
の板材40,50の板端がそれぞれ存在するよう
な検出ラインを例にとつて説明する。
In this embodiment, as shown in FIG. 1, a detection line in which the ends of the plates 40 and 50 other than the object to be measured 30 are present within the field of view Wf of the detection heads 10 and 20 will be explained as an example. do.

検出ヘツド10,20は、被測定物30の板端
をそれぞれの視野Wf内に十分捕えることができ
るような間隔Wsで配置されている。またこの検
出ヘツド10,20は、被測定物30および板材
40,50がともに搬送されるライン上で、その
搬送方向に交叉する面内に配置されている。ま
た、このヘツド10,20は、それぞれ図示しな
い固体撮像素子群を内装し、これら素子群を一方
向から走査して被測定物30の板端位置を検出す
るものである。
The detection heads 10 and 20 are arranged at a distance Ws such that the edge of the object to be measured 30 can be sufficiently captured within the respective fields of view Wf. Further, the detection heads 10 and 20 are arranged on a line along which both the object to be measured 30 and the plate materials 40 and 50 are conveyed, and in a plane intersecting the conveyance direction thereof. Each of the heads 10 and 20 is equipped with a group of solid-state image pickup devices (not shown), and these device groups are scanned from one direction to detect the position of the plate end of the object to be measured 30.

すなわち、この検出ヘツド10,20は、第2
図に示す光源60からの光線の被測定物30およ
び板材40,50による遮光状態を検出するもの
である。そして、この検出ヘツド10,20は、
駆動回路70により矢印a,b方向に走査されて
いる。また、この検出ヘツド10,20は、レベ
ル設定器11,21の設定レベルとヘツド出力と
を比較して、被測定物30と板材40,50との
間隙W1,W2に相当する幅信号を出力する比較器
12,22に接続されている。この比較器12,
22は、それぞれ検出ヘツド10,20の視野
Wf内の板材40,50の長さW〓1,W〓2から視野
Wf内の被測定物30の存在しない長さW′1,W′2
を検出する回路13,23に接続されている。
That is, the detection heads 10, 20
This detects the state in which light from the light source 60 shown in the figure is blocked by the object to be measured 30 and the plates 40 and 50. The detection heads 10 and 20 are
The drive circuit 70 scans in the directions of arrows a and b. The detection heads 10 and 20 also compare the set levels of the level setters 11 and 21 with the head outputs, and generate width signals corresponding to the gaps W 1 and W 2 between the object to be measured 30 and the plate materials 40 and 50. It is connected to comparators 12 and 22 which output . This comparator 12,
22 are the fields of view of the detection heads 10 and 20, respectively.
View from the length W〓 1 , W〓 2 of the plate materials 40, 50 in W f
Lengths W′ 1 , W′ 2 of the object to be measured 30 that do not exist within W f
It is connected to circuits 13 and 23 for detecting.

すなわち、この検出回路13は、第4図に示す
ように、前記比較器12及び駆動回路70に接続
された板材長さ検出部14と、この検出部14及
び前記比較器12に接続されたオアゲート15と
から構成されている。この板材長さ検出部14
は、前記駆動回路70からの走査開始信号Spと、
前記比較器12からの間隙W1の幅信号の立上り
信号とから前記検出ヘツド10の視野内での板材
長さに相当する幅信号W〓1をオアゲート15へ供
給するものである。また、前記オアゲート15
は、この板材長さの幅信号W〓1及び前記比較器1
2からの間隙幅信号W1を後段のカウンタ16を
介して演算回路80へ供給するものである。
That is, as shown in FIG. 4, this detection circuit 13 includes a plate length detection section 14 connected to the comparator 12 and the drive circuit 70, and an OR gate connected to the detection section 14 and the comparator 12. It consists of 15. This plate length detection section 14
is the scan start signal S p from the drive circuit 70,
A width signal W 1 corresponding to the length of the plate within the field of view of the detection head 10 is supplied to the OR gate 15 from the rising edge of the width signal of the gap W 1 from the comparator 12 . In addition, the or gate 15
is the width signal W 〓 1 of this plate length and the comparator 1
The gap width signal W 1 from 2 is supplied to the arithmetic circuit 80 via the counter 16 at the subsequent stage.

なお、一方の検出回路13につき説明したが、
他方の検出回路23もこの回路13と同様なので
その説明を省略する。
In addition, although the explanation was given for one of the detection circuits 13,
The other detection circuit 23 is also similar to this circuit 13, so its explanation will be omitted.

演算回路80は、予め検出ヘツド10,20の
間隔Ws及び各ヘツド10,20の視野Wfが記憶
されており、前記検出回路13,23からの幅信
号を受け次式から被測定物30の幅Wを算出する
ものである。
The arithmetic circuit 80 stores the distance W s between the detection heads 10, 20 and the field of view W f of each head 10, 20 in advance, and receives the width signals from the detection circuits 13, 23 and calculates the width of the object 30 from the following equation. The width W of is calculated.

W=Ws+Wf−(W′1+W′2) また、この回路80には、前記比較回路12,
22からの幅信号を受け、被測定物30と板材4
0,50との間隙W1,W2を判別する回路90が
接続されている。この判別回路90は、その間隙
W1,W2が所定値と比較し、所定値以下の場合
に、前記演算回路80に演算禁止指令を供給する
もので、被測定物30と板材40,50とがオー
バラツプした場合などに誤つた測定が行なわれな
いように設けられている。
W=W s +W f −(W′ 1 +W′ 2 ) Also, this circuit 80 includes the comparison circuit 12,
Upon receiving the width signal from 22, the object to be measured 30 and the plate material 4
A circuit 90 for determining the gaps W 1 and W 2 with respect to 0 and 50 is connected. This discrimination circuit 90
W 1 and W 2 are compared with predetermined values, and if they are less than the predetermined values, a computation prohibition command is supplied to the arithmetic circuit 80, which prevents errors such as when the object to be measured 30 and the plate materials 40, 50 overlap. It is provided so that no overlapping measurements are taken.

また、100は、演算回路80に接続された表
示部で、適正な測定が成された場合にその値を表
示するメータ、あるいは前記判別回路90から演
算禁止指令が出力されている場合を知らせる警報
器などで構成されている。
Further, 100 is a display unit connected to the arithmetic circuit 80, which is a meter that displays the value when a proper measurement is made, or an alarm that indicates when a computation prohibition command is output from the discrimination circuit 90. It consists of utensils, etc.

次に、このように構成された一実施例の作用を
説明する。
Next, the operation of one embodiment configured as described above will be explained.

まず、一方の検出ヘツド10につき説明する。
このヘツド10の視野内には、被測定物30及び
板材40の各端部が間隙W1を有して存在する。
したがつて、この検出ヘツド10は、この間隙
W1を通した光源60の光線を検出し、その信号
を比較器12へ供給する。この比較器12では、
その信号を設定レベルと比較し、前記間隙W1
相当する間隙幅信号W1を出力する。この間隙幅
信号W1は、検出回路13へ供給される。そして、
第3図Aの1に示すように板材40の視野内長さ
W〓1が板材長さ検出部14で検出される。すなわ
ち、前記駆動回路70からの走査開始信号Spと、
前記間隙幅信号W1の立上り信号とにより視野内
長さW〓1に相当する幅信号W〓1が形成され、オア
ゲート15へ供給される。
First, one detection head 10 will be explained.
Within the field of view of this head 10, the object to be measured 30 and each end of the plate 40 exist with a gap W1 between them.
Therefore, this detection head 10
Detects the light beam of light source 60 through W 1 and provides the signal to comparator 12 . In this comparator 12,
The signal is compared with a set level, and a gap width signal W 1 corresponding to the gap W 1 is output. This gap width signal W 1 is supplied to the detection circuit 13 . and,
The length within the field of view of the plate material 40 as shown in 1 of Fig. 3A.
W〓 1 is detected by the plate length detection section 14. That is, the scan start signal S p from the drive circuit 70,
A width signal W 〓 1 corresponding to the length within the field of view W 〓 1 is formed by the rising signal of the gap width signal W 1 and is supplied to the OR gate 15 .

このオアゲート15には、この幅信号W〓1及び
前記比較器12からの間隙幅信号W1が供給され
る。したがつて、このオアゲート15からは、両
幅信号の和であるW′1(=W1+W〓1)がカウンタ
16へ出力される。つまり、前記光学ヘツド10
の視野内の被測定物30以外の長さに相当する幅
信号W′1がカウンタ16を介して演算回路80に
供給される。
The OR gate 15 is supplied with the width signal W 1 and the gap width signal W 1 from the comparator 12 . Therefore, the OR gate 15 outputs W′ 1 (=W 1 +W〓 1 ), which is the sum of both width signals, to the counter 16 . That is, the optical head 10
A width signal W' 1 corresponding to the length of the object other than the object to be measured 30 within the field of view is supplied to the arithmetic circuit 80 via the counter 16 .

また、この演算回路80には、他方の検出ヘツ
ド20、比較器22、検出回路23そしてカウン
タ26を通して、その視野内の被測定物30以外
の長さに相当する幅信号W′2が供給されている。
そして、この回路80では、 W=Ws+Wf−(W′1+W′2)の式から被測定物
30の幅Wを算出する。そして、この値は、後段
の表示回路100により表示されるので、被測定
物30の正しい板幅Wを知ることができる。
Further, this arithmetic circuit 80 is supplied with a width signal W' 2 corresponding to the length of the object other than the object to be measured 30 within its field of view through the other detection head 20, comparator 22, detection circuit 23, and counter 26. ing.
Then, this circuit 80 calculates the width W of the object to be measured 30 from the formula W=W s +W f -(W' 1 +W' 2 ). Since this value is displayed by the display circuit 100 at the subsequent stage, the correct width W of the object to be measured 30 can be known.

なお、被測定物30と板材40あるいは50と
の間隙W1あるいはW2が所定値以下の場合には、
前記判別回路90から演算禁止指令が出力される
ので、演算回路80は演算せず、後段の表示回路
100へ警報信号を供給する。これにより被測定
物30と板材40あるいは50がオーバーラツプ
し、板端信号が検出されない状態での誤つた測定
結果が出力されることはなくなる。
Note that if the gap W 1 or W 2 between the object to be measured 30 and the plate material 40 or 50 is less than a predetermined value,
Since the calculation prohibition command is output from the discrimination circuit 90, the calculation circuit 80 does not perform calculation and supplies an alarm signal to the display circuit 100 at the subsequent stage. This prevents the object to be measured 30 and the plate material 40 or 50 from overlapping and outputting erroneous measurement results in a state where the plate edge signal is not detected.

また、検出ヘツド10,20の走査方向を矢印
a,bで示した説明したがこれに限るものではな
く、共に同一方向に走査するようにしても良い。
また、被測定物30を測定する場合について説明
したが、さらに検出ヘツドを板材40,50の両
端にそれぞれ配置すれば、板材40,50につい
ても測定することができる。この際、先の検出ヘ
ツド10,20と、これらヘツド10,20の視
野内に捕えられない各板材50,60の端部にそ
れぞれ検出ヘツドを設け、計4個のヘツドにより
被測定物30、板材40,50を全て測定するこ
とも可能となる。すなわち、例えば板材40の測
定信号としては、検出ヘツド10からの信号によ
り生じる板材長さ検出部14からの幅信号W〓1
用いれば良い。
Further, although the scanning directions of the detection heads 10 and 20 have been described as indicated by arrows a and b, the present invention is not limited to this, and they may both scan in the same direction.
Furthermore, although the case where the object to be measured 30 is measured has been described, if the detection heads are placed at both ends of the plates 40 and 50, the plates 40 and 50 can also be measured. At this time, a detection head is provided at the end of each plate material 50, 60 that is not caught within the field of view of the detection heads 10, 20, and a total of four heads detect the object to be measured 30, It also becomes possible to measure all the plate materials 40 and 50. That is, for example, as the measurement signal for the plate 40, the width signal W 1 from the plate length detecting section 14 generated by the signal from the detection head 10 may be used.

また、検出ヘツド視野内に被測定物以外の端部
が存在しない場合には、当然に視野内の板材長さ
に相当する幅信号W〓1あるいはW〓2が生じないの
で、何ら測定に支障をきたさないが、予めはつき
りしている場合、例えば被測定物の搬送ラインの
幅方向端部に設置する場合などには、検出回路1
3をシヨートするようにしても良い。もちろん、
その該当する一方に従来公知の方式の検出部を設
けても良いことはもちろんである。
Furthermore, if there are no edges other than the object to be measured within the field of view of the detection head, the width signal W〓 1 or W〓 2 corresponding to the length of the plate within the field of view will not occur, so this will not interfere with measurement in any way. The detection circuit 1 may
You may also shoot 3. of course,
Of course, a detection section of a conventionally known method may be provided on the corresponding one.

本発明は、このように構成したので、従来のよ
うに被測定物の板端に追従できず測定不能となる
ことがなく、各視野内での被測定物の長さを確実
に検出することができ、スリツタラインのように
裁断された複数の鋼板が同一ライン上で搬送され
る場合に適用できるなどの効果を奏する。
Since the present invention is configured in this way, it is possible to reliably detect the length of the object to be measured within each field of view without being unable to follow the plate edge of the object to be measured and becoming unable to measure as in the conventional case. This has the advantage that it can be applied when a plurality of cut steel plates are conveyed on the same line, such as on a slitting line.

【図面の簡単な説明】[Brief explanation of drawings]

図は本発明の一実施例を説明するためのもの
で、第1図は測定状態を示す概略図、第2図は回
路構成図、第3図A,Bはパルス波形図、第4図
は第2図に示した検出回路の詳細を示す回路構成
図である。 10,20;検出ヘツド、13,23;検出回
路、14;板材長さ検出部、15;オアゲート、
30;被測定物、70;駆動回路、80;演算回
路、90;判別回路、100;表示回路。
The drawings are for explaining one embodiment of the present invention, and Fig. 1 is a schematic diagram showing a measurement state, Fig. 2 is a circuit configuration diagram, Fig. 3 A and B are pulse waveform diagrams, and Fig. 4 is a schematic diagram showing a measurement state. FIG. 3 is a circuit configuration diagram showing details of the detection circuit shown in FIG. 2; 10, 20; Detection head, 13, 23; Detection circuit, 14; Plate length detection section, 15; OR gate,
30; Object to be measured; 70; Drive circuit; 80; Arithmetic circuit; 90; Discrimination circuit; 100; Display circuit.

Claims (1)

【特許請求の範囲】 1 複数の固体撮像素子群を直線的に配置して構
成されるとともに被測定物の対向する板端をそれ
ぞれの視野内で捕えるように配置された一対の検
出ヘツドと、 これらの検出ヘツドの固体撮像素子群を一方向
から走査する駆動回路と、 前記検出ヘツドからの検出信号を受け各ヘツド
の視野内の前記被測定物と被測定物以外の板材と
の板端の間隙の長さに相当する間隙幅信号をそれ
ぞれ出力する比較回路と、 前記駆動回路の走査開始信号および前記比較回
路からの間隙幅信号とより前記検出ヘツドの視野
内の測定すべき被測定物以外の長さに相当する幅
信号を出力する検出回路と、 この検出回路の幅信号、前記検出ヘツド間の長
さおよび各検出ヘツドの視野長さとより前記被測
定物の寸法を算出する演算回路と、 前記比較回路からの間隙幅信号が所定値以下の
場合に前記演算回路の演算を停止させる判別回路
とを具備したことを特徴とする寸法測定装置。 2 検出回路が、検出ヘツドの視野端から検出す
べき被測定物以外の板材の板端までの視野内長さ
を検出する検出部と、この検出部からの板材幅信
号および比較回路からの被測定物の板端と前記板
材の板端との間隙に相当する間隙幅信号とより測
定すべき被測定物以外の長さに相当する幅信号を
出力するオアゲート回路とから構成されたことを
特徴とする特許請求の範囲第1項記載の寸法測定
装置。
[Scope of Claims] 1. A pair of detection heads configured by linearly arranging a plurality of solid-state imaging device groups and arranged so as to capture opposing plate ends of the object to be measured within their respective fields of view; A drive circuit that scans the solid-state image sensor group of these detection heads from one direction, and a drive circuit that receives detection signals from the detection heads and detects the edge of the object to be measured and a plate other than the object to be measured within the field of view of each head. a comparison circuit that outputs a gap width signal corresponding to the length of the gap, and a scanning start signal of the drive circuit and the gap width signal from the comparison circuit to detect objects other than the object to be measured within the field of view of the detection head. a detection circuit that outputs a width signal corresponding to the length; and an arithmetic circuit that calculates the dimensions of the object from the width signal of the detection circuit, the length between the detection heads, and the field of view length of each detection head. A dimension measuring device comprising: a determination circuit that stops calculation of the calculation circuit when the gap width signal from the comparison circuit is less than or equal to a predetermined value. 2. The detection circuit includes a detection section that detects the length within the field of view from the field of view of the detection head to the edge of the plate other than the object to be measured, and a plate width signal from this detection section and the width signal from the comparison circuit. It is characterized by being comprised of an OR gate circuit that outputs a gap width signal corresponding to the gap between the plate end of the object to be measured and the plate end of the plate material, and a width signal corresponding to the length of the object other than the object to be measured. A dimension measuring device according to claim 1.
JP2619480A 1980-03-04 1980-03-04 SUNHOSOKUTEISOCHI Expired - Lifetime JPH0229964B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2619480A JPH0229964B2 (en) 1980-03-04 1980-03-04 SUNHOSOKUTEISOCHI

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2619480A JPH0229964B2 (en) 1980-03-04 1980-03-04 SUNHOSOKUTEISOCHI

Publications (2)

Publication Number Publication Date
JPS56122904A JPS56122904A (en) 1981-09-26
JPH0229964B2 true JPH0229964B2 (en) 1990-07-03

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2619480A Expired - Lifetime JPH0229964B2 (en) 1980-03-04 1980-03-04 SUNHOSOKUTEISOCHI

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Country Link
JP (1) JPH0229964B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4570643B2 (en) * 2006-05-25 2010-10-27 豊田スチールセンター株式会社 Plate width measuring system and plate width measuring method

Also Published As

Publication number Publication date
JPS56122904A (en) 1981-09-26

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