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JPH0230285B2 - - Google Patents
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JPH0230285B2 - - Google Patents

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Publication number
JPH0230285B2
JPH0230285B2 JP59280578A JP28057884A JPH0230285B2 JP H0230285 B2 JPH0230285 B2 JP H0230285B2 JP 59280578 A JP59280578 A JP 59280578A JP 28057884 A JP28057884 A JP 28057884A JP H0230285 B2 JPH0230285 B2 JP H0230285B2
Authority
JP
Japan
Prior art keywords
ultrasonic
liquid level
ultrasonic oscillation
oscillation chip
material layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59280578A
Other languages
Japanese (ja)
Other versions
JPS61153119A (en
Inventor
Eiji Tawara
Eishin Kobayashi
Shushichi Yoshimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Chemical Corp
Original Assignee
Mitsubishi Chemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Chemical Industries Ltd filed Critical Mitsubishi Chemical Industries Ltd
Priority to JP59280578A priority Critical patent/JPS61153119A/en
Priority to DE3535922A priority patent/DE3535922C2/en
Priority to US06/785,680 priority patent/US4693879A/en
Publication of JPS61153119A publication Critical patent/JPS61153119A/en
Publication of JPH0230285B2 publication Critical patent/JPH0230285B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B07SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07BSEPARATING SOLIDS FROM SOLIDS BY SIEVING, SCREENING, SIFTING OR BY USING GAS CURRENTS; SEPARATING BY OTHER DRY METHODS APPLICABLE TO BULK MATERIAL, e.g. LOOSE ARTICLES FIT TO BE HANDLED LIKE BULK MATERIAL
    • B07B2230/00Specific aspects relating to the whole B07B subclass
    • B07B2230/04The screen or the screened materials being subjected to ultrasonic vibration

Landscapes

  • Physical Or Chemical Processes And Apparatus (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は超音波を利用した過装置に関するも
のでより詳しくは超音波発振エネルギーを有効利
用した過効果の大きい超音波過装置に関する
ものである。 〔従来の技術〕 一般に各種の過操作において超音波を利用す
ることは周知である。その際、超音波発振チツプ
が空中に露出すると超音波が液中に殆んど通入し
ない為に安全をみて、発振チツプ全体を完全に液
中に浸漬させることが通常行われている。 〔発明が解決しようとする問題点〕 しかしながら本発明者等の検討によれば、かゝ
る従来方式では、相当の超音波発振エネルギーを
損失していることとなる。即ち、一般に超音波発
振ホーンと発振チツプは形状が異なり、かつ発振
チツプの方が大きいことがしばしばであるが、こ
の場合に超音波発生装置で発生される振動が超音
波発振面全面から液体中に伝達されるため、実際
に過処理に必要な超音波以上の超音波を発振す
ることとなり、超音波発振エネルギーに対し過
効率が低く、更に大量の液体を過処理する場合
は、超音波発生装置の能力を大きくしなければな
らず、設備的、エネルギー的に相当の損失を生じ
ていることが見出された。 〔問題点を解決する手段〕 本発明者等はかゝる問題点を解決すべく鋭意検
討した結果、超音波を発振するに際し超音波発振
面がガラス体中にある場合は、超音波発振面が液
体中にある場合に比べて格段と発振エネルギーが
少なくて良い事に着目し、過処理に有効に活用
される超音波発振チツプの下方部だけを液体中に
浸漬し、過処理に有効に活用されない超音波発
振チツプの上方部をガス体中におくことにより同
一の過能力に対し超音波発振エネルギーを著し
く効率化し得ることを見い出し本発明に到達し
た。 すなわち、本発明の目的は超音波発振エネルギ
ーを有効的に利用して過処理能力の大きな超音
波過装置を提供することにあり、この目的は被
過体供給導管を有する過機本体、該本体内に
設けられた材層、該材層の表面に対面して設
けられた超音波発振チツプ、前記材層の裏面側
から過機本体外に通ずる過処理体抜出導管を
有する超音波過装置において、過機本体に気
体室を設け、前記超音波発振チツプを該気体室に
おいて被過体に浸漬せしめると共に、前記超音
波発振チツプの発振側先端を被過体内に常時浸
漬させる為の液面調節機構を設けた事を特徴とす
る超音波過装置によつて達成され、更により好
ましくは、上記液面調節機構の最も簡便な方式と
して具体的に、液面調節機構が過機本体内に挿
入され、所望液面に開口する液面調節用挿入管か
ら成る方式を提案するものである。 以下、本発明を詳細に説明するが、本発明にお
いて被過体とは一般に過除去されるべき懸濁
固体を含有する各種液体であり得るが、特に本発
明は、例えばカーボンブラツク、染顔料、微粒シ
リカ等の凝集性を有する微粒子を含有する液体で
あつて、このスラリーから該微粒子以外の固形異
物のみを選択的に除去する場合に最も効果的であ
る。 以下、図面に基づいて説明すると、第1図は本
発明装置の一例を示す縦断面模式図であつて同図
において1は過装置本体、2は材体、3は
材層、4は被過体帯域、5は過処理体帯域、
6は被過体導入管、7は過処理体抜出管、8
は超音波発生装置、9は超音波発振ホーン、10
は超音波発振チツプ、11は気体室、12は液面
調節用挿入管、13はガス供給管、14は発振チ
ツプ側面に設けられたスリツトを示す。 過装置本体1の被過体帯域4に被過体導
入管6より被過体を供給し、超音波発振チチツ
プ10により超音波を材層3に照射することに
より材層3上に捕捉された被過体中の固形物
に振動、分散力を与えながら過処理を行なう。 得られた過処理体は過処理体域5を経て
過処理体抜出管7より機外へ排出される。材層
3にて過されなかつた被過体は液面調節用挿
入管12により機外に排出される。この機外に排
出される被過体量は過処理体量に対し1〜5
倍程度にするのが良い。 被過体から、懸濁固体粒子を除去する場合
は、液が抜出管7から取出され、濃縮されたス
ラリーが挿入管12から排出されることとなり、
又被過体から例えば凝集性微粒子以外の大きい
固形異物を除去する場合は、精製された微粒子含
有スラリーが抜出管7から、固形異物を濃縮して
含んだ被過体が挿入管12からそれぞれ取出さ
れる。なお、この液面調節用挿入管12は過装
置本体1の下方より上向きに挿入されていても良
い。 液面調節用挿入管12により被過体の液面が
調節されるため被過体帯域4の上方部に気体室
11が形成される。気体室を形成する気体は特段
限定されるものではないが、非凝縮性気体が好ま
しく、好便には、空気等が採用される。なお、液
面の調節を正確に行なうためには、気体室内の圧
力により液面調節用挿入管の開口部より上方の被
過体を押出すようにすればよく、供給管13よ
り気体室11に供給されるガス圧力は過装置本
体1内の圧力より若干高い圧力であれば良い。よ
り好ましくは気体室11の圧力を被過体の液面
水準に連動して適宜調節する圧力調節機構を介し
てガス供給管13からのガスの給排を操作するこ
ともできる。 かゝる液面調節用挿入管は、いわば被過体の
排出管を発振チツプの下端より上の適当位置に開
口させたことで液面調節を行うものであるが、本
発明ではこの様な方式に限らず、一般に液面水準
の調節機構として周知の各種の方式を採用し得る
ことが理解されよう。また超音波の特性上、超音
波発振チツプの一辺の長さが超音波発振チツプの
材質における振動の波長の1/4倍を超える場合、
超音波発振チツプに異常振動が発生しやすくなる
ので、この異常振動を抑制するため超音波発振チ
ツプにスリツトを設けるが、この超音波発振チツ
プに設けるスリツトの上・下面も超音波発振面と
なる事から、超音波発振チツプの一辺の長さが長
くなればなる程、過処理に有効に活用されない
超音波エネルギーが増加する事になる。超音波発
振チツプにスリツトを設けた場合、液面調節位置
を超音波発振チツプ下端面と超音波発振チツプに
設けられたスリツトの下端面との間にすれば過
処理に有効に活用されない超音波エネルギーを最
少限にする事が出来る。 なお図面では長方形状の超音波発振チツプを装
着した過装置について説明したが、本発明では
発振チツプの形状については特に制限されず、円
筒形状の発振チツプを装着した過装置に適用す
ることが可能である。 〔発明の効果〕 本発明の装置では従来の超音波過装置と同一
処理能力を得るのに必要な超音波発振エネルギー
を低減化することができ、その結果、超音波発振
子の性能上超音波発振エネルギーに限界があるた
め超音波過装置の大型化が困難であつた点を解
消し大型の超音波過装置を製造することができ
る。 〔実施例〕 第1図に示す装置において、超音波発振周波数
19KHz、超音波発振々幅量20μm過装置内封入
液体を水とし、第2図に示す超音波発振チツプを
用いて、超音波発生装置で消費された電力を、
過装置内加圧々力の影響、液面の影響(第2図に
示すイ、ロ、ハにて測定)についてその結果を第
1表に示す。 【表】
[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to an ultrasonic device that uses ultrasonic waves, and more particularly, to an ultrasonic device that effectively utilizes ultrasonic oscillation energy and has a large effect. . [Prior Art] Generally, it is well known that ultrasonic waves are used in various overoperations. At this time, if the ultrasonic oscillation chip is exposed in the air, almost no ultrasonic waves will penetrate the liquid, so for safety reasons, the entire oscillation chip is usually completely immersed in the liquid. [Problems to be Solved by the Invention] However, according to the studies of the present inventors, such a conventional method results in a considerable loss of ultrasonic oscillation energy. In other words, the ultrasonic oscillation horn and the oscillation chip generally have different shapes, and the oscillation chip is often larger. Because the ultrasonic waves are transmitted to It was found that the capacity of the equipment had to be increased, resulting in considerable equipment and energy losses. [Means for Solving the Problems] As a result of intensive studies to solve such problems, the inventors of the present invention found that when oscillating ultrasonic waves, if the ultrasonic oscillation surface is inside the glass body, the ultrasonic oscillation surface Focusing on the fact that the oscillation energy is much lower than when it is in a liquid, we immerse only the lower part of the ultrasonic oscillation chip, which is effectively used for overtreatment, into the liquid, making it effective for overtreatment. The inventors have discovered that by placing the upper part of the ultrasonic oscillation chip, which is not utilized, in a gas body, it is possible to significantly improve the efficiency of ultrasonic oscillation energy for the same overcapacity, and have arrived at the present invention. That is, an object of the present invention is to provide an ultrasonic device having a large throughput capacity by effectively utilizing ultrasonic oscillation energy. An ultrasonic filtration device having a material layer provided therein, an ultrasonic oscillation chip provided facing the surface of the material layer, and an overtreated material extraction conduit leading from the back side of the material layer to the outside of the filtration machine body. A gas chamber is provided in the ultrasonic device body, and the ultrasonic oscillation chip is immersed in the object in the gas chamber, and a liquid level is maintained so that the oscillation side tip of the ultrasonic oscillation chip is constantly immersed in the object. This is achieved by an ultrasonic device characterized by having an adjustment mechanism, and even more preferably, as the simplest method of the liquid level adjustment mechanism, the liquid level adjustment mechanism is provided inside the ultrasonic device body. We propose a method consisting of a liquid level adjustment insertion tube that is inserted and opens to a desired liquid level. Hereinafter, the present invention will be explained in detail. In the present invention, the analyte may generally be various liquids containing suspended solids to be removed, but in particular, the present invention is applicable to, for example, carbon black, dyes and pigments, It is a liquid containing cohesive fine particles such as fine silica, and is most effective when selectively removing only solid foreign matter other than the fine particles from this slurry. Hereinafter, explanation will be given based on the drawings. FIG. 1 is a schematic vertical cross-sectional view showing an example of the device of the present invention, in which 1 is the coating device body, 2 is the material body, 3 is the material layer, and 4 is the coating device body. body band, 5 is overprocessed body band,
Reference numeral 6 denotes a tube for introducing the treated body, 7 denotes a tube for extracting the treated body, and 8
is an ultrasonic generator, 9 is an ultrasonic oscillation horn, 10
11 is an ultrasonic oscillation chip, 11 is a gas chamber, 12 is an insertion tube for liquid level adjustment, 13 is a gas supply pipe, and 14 is a slit provided on the side surface of the oscillation chip. The analyte is supplied to the analyte zone 4 of the analyte main body 1 from the analyte introduction pipe 6, and the ultrasonic wave is irradiated onto the material layer 3 by the ultrasonic oscillation chip 10, so that the material is captured on the material layer 3. Overtreatment is performed while applying vibration and dispersion force to the solids in the target object. The obtained overtreated body passes through the overtreated body area 5 and is discharged from the overtreated body extraction pipe 7 to the outside of the machine. The material that has not passed through the material layer 3 is discharged to the outside of the machine through the liquid level adjustment insertion tube 12. The amount of waste material discharged outside the machine is 1 to 5 times the amount of overprocessed material.
It is better to double the amount. When removing suspended solid particles from the subject, the liquid is taken out from the extraction tube 7 and the concentrated slurry is discharged from the insertion tube 12.
In addition, when removing large solid foreign matter other than cohesive fine particles from the analyte, a purified slurry containing fine particles is removed from the extraction tube 7, and a analyte containing concentrated solid foreign matter is removed from the insertion tube 12. taken out. Note that this liquid level adjustment insertion tube 12 may be inserted upward from the bottom of the device main body 1. Since the liquid level of the object is adjusted by the liquid level adjustment insertion tube 12, a gas chamber 11 is formed above the object zone 4. The gas forming the gas chamber is not particularly limited, but a non-condensable gas is preferred, and air or the like is conveniently employed. In order to accurately adjust the liquid level, the pressure inside the gas chamber may be used to push out the object above the opening of the insertion tube for adjusting the liquid level. It is sufficient that the gas pressure supplied to the filter is slightly higher than the pressure inside the filter main body 1. More preferably, the supply and discharge of gas from the gas supply pipe 13 can also be controlled via a pressure adjustment mechanism that appropriately adjusts the pressure in the gas chamber 11 in conjunction with the liquid level of the subject. Such an insertion tube for adjusting the liquid level adjusts the liquid level by opening the discharge tube of the subject body at an appropriate position above the lower end of the oscillation chip. It will be understood that the present invention is not limited to this method, and that various well-known methods may be employed as a liquid level adjustment mechanism. Also, due to the characteristics of ultrasonic waves, if the length of one side of the ultrasonic oscillation chip exceeds 1/4 times the wavelength of vibration in the material of the ultrasonic oscillation chip,
Since abnormal vibrations are likely to occur in the ultrasonic oscillation chip, slits are provided in the ultrasonic oscillation chip to suppress this abnormal vibration, but the upper and lower surfaces of the slits provided in the ultrasonic oscillation chip also serve as ultrasonic oscillation surfaces. Therefore, as the length of one side of the ultrasonic oscillation chip becomes longer, the amount of ultrasonic energy that is not effectively utilized for overtreatment increases. When a slit is provided in the ultrasonic oscillation chip, if the liquid level adjustment position is between the lower end surface of the ultrasonic oscillation chip and the lower end surface of the slit provided in the ultrasonic oscillation chip, ultrasonic waves that are not effectively utilized for overtreatment can be removed. Energy can be minimized. In the drawings, an explanation has been given of an ultrasonic device equipped with a rectangular ultrasonic oscillation chip, but the present invention is not particularly limited to the shape of the oscillation chip, and can be applied to an ultrasonic device equipped with a cylindrical oscillation chip. It is. [Effects of the Invention] The device of the present invention can reduce the ultrasonic oscillation energy required to obtain the same processing capacity as conventional ultrasonic devices, and as a result, the ultrasonic oscillation energy This solves the difficulty in increasing the size of an ultrasonic device due to the limited oscillation energy, and it is possible to manufacture a large-sized ultrasonic device. [Example] In the device shown in Fig. 1, the ultrasonic oscillation frequency
19KHz, ultrasonic oscillation width 20μm The liquid sealed inside the device is water, and the power consumed by the ultrasonic generator is
Table 1 shows the results regarding the influence of the pressurizing force inside the filter device and the influence of the liquid level (measured at A, B, and C shown in Figure 2). 【table】

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明装置の縦断面模式図、第2図は
第1図に示す超音波発振チツプの拡大正面図であ
る。 1:過装置本体、2:材体、3:材層、
4:被過体帯域、5:過処理体帯域、6:被
過体導入管、7:過処理体抜出管、8:超音
波発生装置、9:超音波発振ホーン、10:超音
波発振チツプ、11:気体室、12:液面調節用
挿入管、13:ガス供給管、14:スリツト。
FIG. 1 is a schematic vertical cross-sectional view of the device of the present invention, and FIG. 2 is an enlarged front view of the ultrasonic oscillation chip shown in FIG. 1: main body, 2: material body, 3: material layer,
4: Subject zone, 5: Overtreated body zone, 6: Subject introduction pipe, 7: Overtreated body extraction pipe, 8: Ultrasonic generator, 9: Ultrasonic oscillation horn, 10: Ultrasonic oscillation Chip, 11: Gas chamber, 12: Insertion tube for liquid level adjustment, 13: Gas supply tube, 14: Slit.

Claims (1)

【特許請求の範囲】 1 被過体供給導管を有する過機本体、該本
体内に設けられた材層、該材層の表面に対面
して設けられた超音波発振チツプ、前記材層の
裏面側から過機本体外に通ずる過処理体抜出
管を有する超音波過装置において、過機本体
に気体室を設け、前記超音波発振チツプを該気体
室において被過体に浸漬せしめると共に、前記
超音波発振チツプの発振側先端を被過体内に常
時浸漬させる為の液面調節機構を設けた事を特徴
とする超音波過装置。 2 特許請求の範囲第1項における液面調節機構
が過機本体内に挿入され所望液面に開口する液
面調節用挿入管から成ることを特徴とする特許請
求の範囲第1項記載の超音波過装置。
[Scope of Claims] 1. A main body of the transducer having an analyte supply conduit, a material layer provided within the main body, an ultrasonic oscillation chip provided facing the surface of the material layer, and a back surface of the material layer. In an ultrasonic device having an overtreated body extraction pipe leading from the side to the outside of the body of the body, a gas chamber is provided in the body of the body, and the ultrasonic oscillation chip is immersed in the body in the gas chamber; An ultrasonic device characterized by being provided with a liquid level adjustment mechanism for constantly immersing the oscillating side tip of an ultrasonic oscillating chip in a subject. 2. The liquid level adjustment mechanism set forth in claim 1 comprises a liquid level adjustment insertion tube inserted into the filter body and opened to a desired liquid level. Sonic wave device.
JP59280578A 1984-10-09 1984-12-26 Ultrasonic filter Granted JPS61153119A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP59280578A JPS61153119A (en) 1984-12-26 1984-12-26 Ultrasonic filter
DE3535922A DE3535922C2 (en) 1984-10-09 1985-10-08 Process for cleaning soot using an ultrasonic vibration screening device
US06/785,680 US4693879A (en) 1984-10-09 1985-10-09 Ultrasonic vibration sieving apparatus and process for purifying carbon black by using the apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59280578A JPS61153119A (en) 1984-12-26 1984-12-26 Ultrasonic filter

Publications (2)

Publication Number Publication Date
JPS61153119A JPS61153119A (en) 1986-07-11
JPH0230285B2 true JPH0230285B2 (en) 1990-07-05

Family

ID=17626985

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59280578A Granted JPS61153119A (en) 1984-10-09 1984-12-26 Ultrasonic filter

Country Status (1)

Country Link
JP (1) JPS61153119A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0476167U (en) * 1990-11-16 1992-07-02

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0476167U (en) * 1990-11-16 1992-07-02

Also Published As

Publication number Publication date
JPS61153119A (en) 1986-07-11

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