JPH0230607B2 - SUISHOSHINDOSHINOHOJIHOHO - Google Patents

Description

[Detailed description of the invention] The present invention relates to a method for holding a crystal resonator.

Tuning fork crystal resonators that perform bending vibrations have become widely used as reference resonators for electronic wristwatches as they have become smaller. The characteristics required of the tuning fork crystal unit used in such electronic wristwatches include a high Q value and small size, but they also have excellent vibration resistance and shock resistance. It is also required that the frequency change over time is small.

Fig. 1 is a diagram showing a holding structure of a conventional tuning fork crystal resonator, in which Fig. 1a is a perspective view, Fig. 1b is a sectional view taken along plane B--B of Fig. 1a, and Fig. 1c is a Figure a
, viewed from direction A, d of the same figure is a view showing the retainer lead wire 4 described below, and e of the same figure is a view showing the support stand 8 described below. In the figures a to e, reference numeral 1 denotes a tuning fork-shaped crystal plate cut into a tuning fork shape. Reference numerals 2 and 3 denote electrodes made of a nickel-gold alloy or a chromium-gold alloy, and the electrodes 2 and 3 are made by vacuum-depositing a nickel-gold alloy or a chromium-gold alloy onto the tuning fork-shaped crystal plate 1. It is applied by a method such as a sputtering method or a sputtering method. Reference numeral 4 denotes a holder lead wire, and the holder lead wire 4 is fixed to a pad portion 3a forming a part of the electrode 3 described above. This fixing method is first [1] As shown in d of the same figure, the retainer lead wire 4 is
On the surface of the fixed part 4a that is fixed to the pad part 3a,
A thin layer 6a made of Kovar material is formed, a thin layer 6b made of a copper material or a nickel material is formed on the surface of the Kovar layer 6a, and a thin layer 6c made of a solder material is further formed on the surface of the copper layer or nickel layer 6b. form. Or a thin layer 6 made of iron material is attached to the fixed portion 4a.
a, a thin layer 6b made of nickel material may be formed on the surface of the iron layer 6a, and further a thin layer 6c made of solder material may be formed on the surface of the nickel layer 6b. Reference numeral 6 denotes a fixed layer of the fixed portion made up of these layers. [2] The adhesive layer 6 is brought into contact with the pad portion 3a of the electrode 3, and thermal energy is applied to the contact portion to melt the solder layer 6c formed on the surface of the adhesive layer 6. The molten solder fills the gap around the pad portion 3a and the fixed portion 4a due to its surface tension. After that, [3] the solder in the solder layer 6c is cooled and solidified to complete the fixation between the retainer lead wire 4 and the pad portion 3a. Reference numeral 8 denotes a support base formed integrally with the retainer base 9, and the support base 8 is fixed on its upper surface to the pad portion 2a of the electrode 2, which is the electrode opposite to the pad portion 3a. The fixing method is to connect the cage lead wire 4 and the pad portion 3a as described above.
The method of fixation is the same as that of . That is, this fixing method is as follows: [1] As shown in FIG.
A thin layer 6'b made of a copper material or a nickel material is formed on the surface of the Kovar layer 6'a, and a thin layer 6'c made of a solder material is further formed on the surface of the copper layer or nickel layer 6'b. . Alternatively, a thin layer 6'a made of iron material is formed on the fixed portion 8b, a thin layer 6'b made of nickel material is formed on the surface of the iron layer 6'a, and further the surface of the nickel layer 6'b is A thin layer 6'c of solder material may be formed on the surface. 6' indicates a fixed layer composed of these layers. [2] Bringing the fixed layer 6' into contact with the pad portion 2a of the electrode 2,
Heat energy is applied to the contact portion to melt the solder layer 6'c formed on the surface of the fixed layer 6'. The molten solder sticks to the pad part 2a due to its surface tension.
and the gap around the fixed portion 8b is filled. after that,
[3] When the solder in the solder layer is cooled and solidified, the adhesion between the support base 8 and the pad portion 2a is completed.
The materials of the support stand 8 and retainer stand 9 are as follows:
A conductive material such as Kovar material is used. Reference numeral 5 denotes a terminal, one end of which is electrically connected to the above-mentioned retainer lead wire 4 by a conventional fixing method, and passes through a hole 7 provided in the holding base 9. The hole 7 is made airtight with an insulating material such as low melting point glass, and the terminal 5 is fixed therein. Reference numeral 10 denotes a terminal, which is directly fixed to the retainer base 9 with a conductive fixing material such as solder. The terminal 5 will be electrically connected to the electrode 3, and the terminal 10 will be electrically connected to the electrode 2.

However, the cage lead wire 4 and pad portion 3 described above
a and the method of fixing the support base 8 and the pad part 2a, due to aging, the gold used for the electrode material may be affected by other metals, causing phenomena such as so-called gold flaking and gold diffusion. This not only changes the frequency but also weakens the adhesion force of the adhering portion, making it vulnerable to shocks such as drops and vibrations. This phenomenon of gold erosion and gold diffusion occurs especially at high temperatures (e.g. +85
℃).

The purpose of the present invention is to prevent the frequency of the crystal resonator from changing due to aging, and to prevent the fixed portions of the cage lead wire and the pad portion of the electrode of the crystal resonator, and the fixed portions between the support base and the pad portion. It is an object of the present invention to provide a method for holding a crystal resonator in a holder in which the fixing force of the crystal oscillator is not weakened or sagged.

Next, one embodiment of the present invention will be described in detail using the drawings. Incidentally, the same parts as in the above conventional example are given the same reference numerals, and detailed explanation thereof will be omitted.

FIGS. 2a to 2e show an embodiment of a method for holding a crystal resonator according to the present invention. Here, 1 is a tuning fork-shaped crystal plate, 2 and 3 are electrodes, 3a and 2a are pad parts, 4 is a retainer lead wire, 4a and 8a are fixed parts, 5 and 10 are terminals, and 6 and 6' are fixed layers. , 7 is a hole, 8 is a support stand, and 9 is a retainer stand, which are similar to the above conventional example. 20a
is a gold layer made of gold, and is thickly formed on the surface of the pad portion 3a of the electrode by electroplating. 20
b is also a gold layer made of gold, and the pad part 2a of the electrode
The surface is thickly formed by electroplating. Here, the fixing portion 4a of the retainer lead wire 4 and the gold layer 20a on the pad portion 3a are fixed as follows. That is, [1] of the cage lead wire 4,
On the surface of the fixed part 4a that is fixed to the pad part 3a,
A thin layer 6a made of Kovar material is formed, a thin layer 6b made of a copper material or a nickel material is formed on the surface of the Kovar layer 6a, and a thin layer 6c made of a solder material is further formed on the surface of the copper layer or nickel layer 6b. form. Or a thin layer 6 made of iron material is attached to the fixed portion 4a.
a, a thin layer 6b made of nickel material may be formed on the surface of the iron layer 6a, and further a thin layer 6c made of solder material may be formed on the surface of the nickel layer 6b. The reference numeral 6 indicates a fixing material made of these layers, which is the same as the above-mentioned conventional example. and,
[2] The fixed layer 6 and the gold layer 20 on the pad portion 3a
The fixing layer 6 and the gold layer 20a on the pad portion 3a are pressed through a predetermined amount of small pieces of gold germanium (AuGe) or gold silicon (AuSi) as a fixing material between the bonding layer 6 and the pad portion 3a. [3] When thermal energy is applied to the fixed layer 6, the gold germanium or gold silicon as the fixed material, and the gold layer 20a on the pad portion 3a, the solder material formed on the surface of the fixed layer 6 is Gold germanium or gold silicon serving as a bonding material is melted, and the gap between the upper surface of the gold layer 20a and the periphery of the bonded portion 4a is filled by its surface tension. After that, [4] the solder material and the gold germanium or gold silicon as the fixing material are cooled and solidified to complete the fixing between the retainer lead wire 4 and the gold layer 20a.

Reference numeral 8 denotes a support base formed integrally with the cage base 9, and the fixed portion 8a of the support base 8 and the gold layer 20b on the pad portion 2a are fixed. The method of fixing is the same as the method of fixing the fixed portion 4a of the retainer lead wire 4 and the gold layer 20a on the pad portion 3a described above. In other words, this fixing method is first [1]
A fixed part 8 of the support base 8 that is fixed to the pad part 2a
A thin layer 6'a made of Kovar material is formed on the surface of the layer 6'a as shown in FIG.
A thin layer 6'b made of copper material or nickel material on the surface of
and further the copper layer or nickel layer 6'b
A thin layer 6'c of solder material is formed on the surface of the solder material.
Or a thin layer 6'a made of iron material is attached to the fixed portion 8a.
, a thin layer 6'b made of nickel material is formed on the surface of the iron layer 6'a, and a thin layer 6'c made of solder material is further formed on the surface of the nickel layer 6'b. good. 6' indicates a fixed layer composed of these layers. [2] A predetermined amount of small pieces of gold germanium (AuGe) or gold silicon (AuSi) is interposed between the fixed layer 6' and the gold layer 20b on the pad portion 2a as a fixed layer. 6' and the gold layer 20b on the pad portion 2a. And [3]
The fixing layer 6', gold germanium or gold silicon as the fixing material, and the gold layer 2 on the pad portion 2a.
When thermal energy is applied to the bonding layer 20b, the solder material formed on the surface of the bonding layer 6' and the gold germanium or gold silicon serving as the bonding material melts, and the surface tension causes the top surface of the gold layer 20b and the periphery of the bonding portion 8a to melt. The gap between the two will be filled. After that, [4] the solder material and the gold germanium or gold silicon as the fixing material are cooled and solidified, thereby completing the fixation between the support base 8 and the gold layer 20b.

As described above, the cage lead wire 4 and the support base 8 on which the Kovar layer, copper layer, solder layer, etc. Gold-germanium or gold-silicon is stable against temperature, so even if the temperature is high (e.g. +85°C), the gold used for the electrode material will not be absorbed by other metals due to aging. Therefore, there is no phenomenon of so-called gold-eating swelling or gold diffusion.
Therefore, the frequency does not change, and the adhesion force of the adhering portion does not become weaker.

FIG. 3 is a perspective view showing another embodiment of the method for holding a crystal resonator according to the present invention. 31 is a tuning fork-shaped crystal plate, 32 and 33 are electrodes, 33a is a pad part,
34 and 35 are cage lead wires, 34a is a fixed portion, 36 is a fixed layer, and 37 is a gold layer, which respectively correspond to the tuning fork-shaped crystal diaphragm 1, electrodes 2, 3, pad portion 3a, and cage lead in FIG. This corresponds to the wire 4, the fixed portion 4a, the fixed layer 6, and the gold layer 20a. The method of fixing the cage lead wire 34 to the gold layer 37 is the same as the method of fixing the cage lead wire 4 and the gold layer 20a in FIG. 2 above. That is, [1] A thin layer made of Kovar material is formed on the surface of the fixed part 34a of the retainer lead wire 34 that is fixed to the pad part 33a, and a thin layer made of copper material or nickel material is formed on the surface of the Kovar layer. A thin layer of solder material is further formed on the surface of the copper layer or nickel layer. Alternatively, a thin layer made of iron material is formed on the surface of the fixed portion 34a, a thin layer made of nickel material is formed on the surface of the iron layer, and a thin layer made of solder material is further formed on the surface of the nickel layer. It's okay. 36
indicates a fixed layer consisting of these layers. [2] A predetermined amount of small pieces of gold germanium (AuGe) or gold silicon (AuSi) is interposed between the fixing layer 36 and the gold layer 37 on the pad portion 33a as a fixing material. , and the gold layer 37 on the pad portion 33a. [3] The fixing layer 36, gold germanium or gold silicon as the fixing material, and the gold layer 37 on the pad portion 33a.
When heat energy is applied to the solder material and the gold germanium or gold silicon as the adhesive material formed on the surface of the adhesive layer 36, the solder material and the gold germanium or gold silicon as the adhesive material are melted, and due to the surface tension, the gap around the upper surface of the gold layer 37 and the adhesive part 34a is is filled. [4] After cooling and solidifying the solder material and the gold germanium or gold silicon as the fixing material, the cage lead wire 34 and the gold layer 3
The fixation with 7 is completed.

In the above embodiments, a crystal plate cut into a tuning fork shape was used as the crystal plate, but the present invention is not limited to a crystal plate cut into a tuning fork shape. Needless to say, a crystal plate treated with the above-mentioned methods may also be used.

As explained in detail above, the present invention provides a holding method for holding a pad portion on a crystal resonator in a holder for the crystal resonator, in which a gold layer is formed on the surface of the pad portion, and a gold layer is formed on the surface of the pad portion. A Kovar layer made of a Kovar material is placed on the surface of the fixed part of the device, a copper layer made of a copper material or a nickel layer made of a nickel material is placed on the surface of the Kovar layer, and a solder material is placed on the surface of the copper layer or the nickel layer. form a solder layer,
Either the gold layer on the pad part and the solder layer on the fixed part are fixed via a bonding material made of an alloy of gold and semiconductor that is stable against temperature, or the pad part on the crystal resonator is fixed to the solder layer on the fixed part. In a holding method for holding a crystal resonator in a holder, a gold layer is formed on the surface of the pad part, and an iron layer made of iron material is placed on the surface of the fixed part of the holder of the crystal oscillator. A nickel layer made of a nickel material is formed, a solder layer made of a solder material is formed on the surface of the nickel layer, and the gold layer on the pad part and the solder layer on the fixed part are made of an alloy of gold and semiconductor that is stable against temperature. Since we decided to use a bonding material made of , even at high temperatures (e.g. +85°C), the gold used for the electrode material may deteriorate over time due to other metals, causing so-called gold erosion. It does not cause the phenomenon of gold diffusion and therefore the frequency does not change.
Further, it has the effect that the adhesion force of the adhesion portion does not become weak.

[Brief explanation of drawings]

Fig. 1 is a diagram showing a holding structure of a conventional tuning fork crystal resonator, in which Fig. 1a is a perspective view, Fig. 1b is a sectional view taken along plane B--B of Fig. 1a, and Fig. 1c is a Figure a
is seen from direction A, and d in the same figure shows the cage lead wire 4.
FIG. 3E is a diagram showing the support base 8. Figures 2a to 2e are views showing an embodiment of the method for holding a crystal resonator according to the present invention, and Figure 2a is a perspective view;
Figure b is a cross-sectional view of figure a taken along plane B-B, figure c is a view of figure a seen from direction A, figure d is a figure showing the cage lead wire 4, figure e is 3 is a diagram showing a support stand 8. FIG. FIG. 3 is a perspective view showing another embodiment of the method for holding a crystal resonator according to the present invention. DESCRIPTION OF SYMBOLS 1... Tuning fork-shaped crystal plate, 2... Electrode, 2a... Pad part, 3... Electrode, 3a... Pad part, 4...
Cage lead wire, 4a...Fixed portion, 5...Terminal, 6...Fixed layer, 6a to 6c...Thin layer, 6'...
... Fixed layer, 6'a to 6'c... Thin layer, 7... Hole,
8...Support stand, 8a...Fixed portion, 9...Cage base, 10...Terminal, 20a...Gold layer, 20b...
Gold layer, 31... Tuning fork-shaped crystal plate, 32... Electrode, 3
3... Electrode, 33a... Pad portion, 34... Cage lead wire, 34a... Fixed portion, 35... Cage lead wire, 36... Fixed layer, 37... Gold layer.

Claims (1)

[Claims] 1. In a holding method for holding a pad portion on a crystal resonator in a holder of the crystal resonator, a gold layer is formed on the surface of the pad portion, and a fixed portion of the holder of the crystal resonator is A Kovar layer made of a Kovar material is formed on the surface of the pad, a copper layer made of a copper material is formed on the surface of the Kovar layer, a solder layer made of a solder material is formed on the surface of the copper layer, and the metal of the pad part and the solder of the fixed part are formed. A method for holding a crystal resonator, characterized in that the layers are fixed via a fixing material made of an alloy of gold and a semiconductor. 2. In a holding method in which the pad portion on the crystal resonator is held in the holder of the crystal resonator, a gold layer is formed on the surface of the pad portion, and a Kovar material is applied to the surface of the fixed part of the holder of the crystal resonator. A nickel layer made of a nickel material is formed on the surface of the kovar layer, a solder layer made of a solder material is formed on the surface of the nickel layer, and the gold layer on the pad part and the solder layer on the fixed part are made of gold. A method for holding a crystal resonator, characterized by fixing it through a fixing material made of a semiconductor alloy. 3. In the holding method of holding the pad part on the crystal resonator in the crystal resonator holder, a gold layer is formed on the surface of the pad part, and the surface of the fixed part of the crystal resonator holder is made of iron material. A nickel layer made of a nickel material is formed on the surface of the iron layer, a solder layer made of a solder material is formed on the surface of the nickel layer, and the gold layer of the pad part and the solder layer of the fixed part are made of gold and semiconductor. A method for holding a crystal resonator, characterized by fixing it through a fixing material made of an alloy of.