JPH0231587B2 - KADOKOIRUKUMITATETAINOSEIZOHOHO - Google Patents

Description

[Detailed Description of the Invention] <Field> The present invention relates to a method for manufacturing a moving coil assembly, which is a moving part of a moving coil type magnet, and particularly relates to a method for manufacturing a moving coil assembly, which is a moving part of a moving coil type magnet, and in particular, a method for manufacturing a flat, extremely thin moving coil assembly without warping, with high precision, and with a high precision. It relates to a manufacturing method for good manufacturing.

<Prior art and background> A flat and thin moving coil assembly is mounted in a parallel magnetic field with a small gap, and by selectively energizing the coil, it is converted into kinetic energy and used as a driving source for printing, etc. So-called moving coil magnets have relatively good mounting efficiency compared to moving reluctance type magnets, have good conversion efficiency even when miniaturized, and have small inductance, so they are often used in printing elements of wire dot printers, etc. This is because these printing elements must move at least a certain stroke in order to print on paper, and in order not to damage the paper, the printing energy cannot be increased unlimitedly, so there is a natural limit to the repetition speed of one element. This is because in order to increase the speed, it is necessary to mount a large number of elements at high density. An example of such a printing magnet is shown below.
As shown in the figure, this is a printing magnet module for a dot line printer that prints patterns using dots while shuttle scanning in the horizontal direction. Groups of 7 are attached to each other forming a predetermined gap to form 12 field magnetic fields, and in the gap where the field magnetic field is formed, groups of thin flat moving coil assemblies 3 are installed with 2 coil assemblies 3 per gap. A total of 24 sheets (top and bottom) are positioned, elastically supported, mounted, and wired to be selectively driven, respectively, and dot printing is performed at the tip of the wire 3e. are mounted in a row corresponding to the printing digit width, and printing is performed while shuttle scanning in the printing digit direction.

In this configuration, two moving coil assemblies are mounted on one field gap in order to increase the mounting density of moving elements. Since there is no guide such as a surface, contact will cause interference, so the negative impact of contact is greater than when only one sheet is accommodated, but the number of permanent magnets can be reduced, and the permanent magnet is less susceptible to the effects of demagnetizing fields. It is constructed by apportioning the positive and negative points of the points that are difficult to receive and the points that can be set slightly larger because the gap in the middle is common, but in any case, it is important to make the coil assembly as thin as possible and to minimize warping. If not formed, contact will occur between the end faces of the magnets and the end faces of the assemblies, which is undesirable.If a gap is left, the magnetic flux density of the field magnetic field will decrease and the generated force will decrease, so such assemblies can be made into small The performance of such printing elements is determined by how these coils are manufactured with minimal warpage in order to accommodate them without contacting the gaps.

Figures 2a, b, c, and d are examples of the structure of such thin coil assemblies, where 3a is a coil, 3b is
3c is an adhesive layer, 3d is another adhesive layer, 3e is a wire, 3f is a spring portion, 3g
is the lead wire, but warping mainly occurs in 3.
This is the part where the flat coil 3a is joined to part b, and the adhesive used to join the coil 3a and the thin stainless steel plate of part 3b is a so-called easy-to-use adhesive that has high adhesive strength and a reasonable curing time. It is necessary to apply a curing temperature higher than room temperature in most cases, but since the thermal conductivity and expansion coefficient are different, each component is molded with considerable precision, then stacked for bonding, and then molded by pressurizing and heating with a jig mold. When you take it out of the mold at room temperature after gluing, there are many cases where it warps, and if you leave it as it is, it will not hold well, but correcting the deformation in advance is only an approximate correction, even if you give a preliminary warp to the base plate. Although it was a little better, it was not a very desirable method because some stress remained.

Also, annealing would certainly improve the problem in that no stress would remain, but it is difficult to control the shape of such a thin plate.

<Purpose and Features> In view of the above, the present invention aims to reduce warpage by preventing residual stress from remaining on the coil side under the reaction hardening conditions of the adhesive in the process of joining the two. An object of the present invention is to provide a manufacturing method that can produce thin coil assemblies in a consistent manner.The characteristics of the present invention are to provide a manufacturing method that can produce thin coil assemblies in a uniform manner. In the moving coil assembly of a moving coil magnet, which is formed by joining the formed coils, the flat coil is formed from a self-fusing wire, and an adhesive that reacts and hardens at a temperature that melts the fusing layer of the coil is used. The above-mentioned thin plate and the above-mentioned coil are overlapped and bonded together by applying pressure and heating under the intervention of.

<Example> Figures 2a, b, c, and d are explanatory diagrams of an embodiment of the present invention that also serve as explanatory diagrams of a conventional example, and Figures 3 and 4 are explanatory diagrams of an embodiment of the present invention. be.

Jigs 10a and 10b are used for stacking the coil 3a of this embodiment with the coil accommodating portion 3b, an adhesive, and an adhesive prepared on the surface side that will result in a protective layer, and forming and pressurizing the coil 3a as shown in FIG. The manufacturing process itself is essentially the same as that described in the conventional example, in which the coil is sandwiched between the coils and heated to undergo a hardening reaction, cooled to room temperature, and then taken out. However, in this example, the coil is wound into a flat plate. A conductor part 3p, an insulating layer part 3g, and a fusion layer part 3r as shown in FIG. 3 are used as wire materials for forming.
The use of a temporarily formed self-fusing wire made of The melting point of the material is set higher than the melting point (the practical pour point is the softening point), and the self-fusing layer is pressed between the jigs 10a and 10b and heated. This is because the adhesive 3c, 3 is set so that it melts and has no rigidity.
d is solidified when taken out at room temperature after reaction hardening, but no stress is left during the process.

To give a specific example, a 0.1 mm stainless steel plate is press-formed to create a coil housing section with a depth of 0.25 mm - 0 + 0.05 mm, and the entire surface is finished to a flatness of 0.1 mm or less. Layer the pre-formed coils thickly, apply a 0.025mm thick epoxy film adhesive 3c between them, and apply the same adhesive 3c on top.
(b) are stacked, sandwiched between jigs 10a and 10b with a release-treated surface and a 0.4 mm accommodating part, and placed in a furnace or the like to be heated to 180°C, the reaction curing temperature of the above epoxy adhesive. Heat and harden. At this time, the self-fusing layer 3r on the coil side is made of a thermoplastic resin such as polyamide that fluidizes at about 160°C, and the insulating layer 3q is made of, for example, polyimide resin, which does not soften or deteriorate at 180°C. If it is, the insulation on the coil side will not deteriorate during this process.

After the epoxy resin is reacted and cured for the required time, the entire jig is taken out of the furnace, cooled to room temperature, and taken out.The fusion layer 3r hardens in the mold, so the coil becomes a thin plate and becomes a flat plate. As a result of this process, the coil assembly 3 warps to the side where the coil bends by about 0.05 mm in terms of flatness when converted to an average value, but the amount of variation is quite stable.

In addition, since the average value of these press-formed shallow plate-shaped thin plates is that the concave side of the plate, i.e., the inner surface, has a convex curvature, this characteristic can be effectively canceled out, and the flatness of the press-formed thin plate is better than that of the press-formed thin plate. It has been found that the flatness of the assembly with such coils bonded is better.

<Effects> As explained above, according to the present invention, the coil is formed of a self-fusing wire, and an adhesive whose reaction curing temperature is higher than the melting point of the fusing material having the above-mentioned self-melting point line is reacted under high conditions. By hardening and applying pressure with a mold, the coil assembly can be stably assembled with little variation in dimensions due to warpage and warping, and
That it can be manufactured.

In addition, since the warpage on the side to be corrected when press-molding a thin plate is almost stable and without variation, the average value is that the warpage after assembly is less than the warpage of structural members, and is about half that. Since it is also possible to do this, it has a unique effect, such as being able to manufacture an assembly with almost the desired flatness without annealing or the like.

[Brief explanation of drawings]

Fig. 1 is a general explanatory diagram of the object of the invention, Fig. 2 is an explanatory diagram of an embodiment of the present invention that also serves as an explanatory diagram of a conventional example, and Figs. 3 and 4 are explanatory diagrams of an embodiment of the present invention. shows. In the figure, 1 is the base structure, 2 is the permanent magnet for the field, 3 is the moving coil assembly, A is the general term for the printing module, ``suffix'' indicates the partial structure, and 3 is the moving coil assembly.
a shows the coil, 3b shows the coil housing part, 3c and 3d the adhesive layer, 3e shows the wire, 3f shows the spring part, 3g shows the lead wire, and 10a and 10b show the upper and lower parts of the jig. . 3p is the conductor of the coil wire, 3q is the insulating layer, and 3r is the self-fusing agent layer.

Claims (1)

[Claims] 1. In the moving coil assembly of a moving coil magnet, which is formed by joining a molded non-magnetic thin plate that is a rigid member and a flat coil, the flat coil is formed from a self-fused wire, and A movable coil assembly characterized in that the thin plate and the coil are stacked and bonded together by applying pressure and heating in the presence of an adhesive that reacts and hardens at a temperature at which the fusion layer of the coil melts. Production method.