JPH0232125B2 - - Google Patents
Info
- Publication number
- JPH0232125B2 JPH0232125B2 JP59060251A JP6025184A JPH0232125B2 JP H0232125 B2 JPH0232125 B2 JP H0232125B2 JP 59060251 A JP59060251 A JP 59060251A JP 6025184 A JP6025184 A JP 6025184A JP H0232125 B2 JPH0232125 B2 JP H0232125B2
- Authority
- JP
- Japan
- Prior art keywords
- release agent
- mold
- molding
- exuding
- mold part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Description
【発明の詳細な説明】
技術分野
この発明は成形用金型に係り、より詳細には金
型の型部分に通孔を設け、同通孔を通して離型剤
が成形面に滲出され得る成形用金型に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION Technical Field The present invention relates to a mold for molding, and more particularly to a mold for molding, in which a through hole is provided in the mold part of the mold, and a mold release agent can be exuded onto the molding surface through the through hole. It is related to molds.
従来技術
一般に、射出成形は金型内に合成樹脂やゴム等
の材料を注入して所望の形状に仕上げるものであ
るが、例えばウレタン等、剥離性の悪い材料を使
用して成形加工を行うときは成形後、被成形物が
金型の成形面に接着した状態になり、被成形物が
金型から取り外される際に形状が損われることが
ある。この傾向はリム成形、ブロー成形等、他の
成形方法においても同様である。Conventional technology In general, injection molding involves injecting materials such as synthetic resin or rubber into a mold to form a desired shape. After molding, the molded object becomes adhered to the molding surface of the mold, and the shape may be damaged when the molded object is removed from the mold. This tendency is the same in other molding methods such as rim molding and blow molding.
従つて、剥離性の悪い材料にて成形加工を行う
にあたつては、成形面に予め離型剤を塗布してお
き、成形後に被成形物を取り出すことを容易にし
ておく必要があり、準備作業が煩雑であるという
問題点がある。 Therefore, when molding a material with poor releasability, it is necessary to apply a mold release agent to the molding surface in advance to make it easy to take out the molded object after molding. There is a problem that the preparation work is complicated.
発明の目的
この発明は前記した問題点を解消するためにな
されたものであつて、第一発明は剥離性の悪い材
料を使用して成形を行う場合でも、まえもつて、
金型の成形面に離型剤を塗布する必要がなく、従
つて面倒な準備作業を必要としない成形用金型の
提供を目的としている。そして、第二発明は成形
面に流動抵抗を少なく離型剤を滲出させることの
できる成形用金型の提供を目的としている。Purpose of the Invention This invention has been made to solve the above-mentioned problems, and the first invention is that even when molding is performed using a material with poor releasability,
The object of the present invention is to provide a molding die that does not require applying a mold release agent to the molding surface of the mold and does not require troublesome preparation work. The object of the second invention is to provide a molding die capable of exuding a mold release agent onto a molding surface with less flow resistance.
発明の構成
前記目的を達成するために、第一発明は複数個
の通孔がその型部分の板厚方向に略真直ぐに透設
された成形面を構成する型部分と、その型部分の
裏面に設けられ含浸された離型剤を前記通孔を経
て成形面に滲出させるための離型剤滲出部材と、
その離型剤滲出部材に連通され同離型剤滲出部材
に離型剤を供給するための離型剤供給手段とを備
えてなるものであり、第二発明は成形面から裏面
に向かつて径が増加する複数個の通孔が型部分の
板厚方向に略真直ぐに透設された成形面を構成す
る型部分と、同型部分の裏面に設けられ含浸され
た離型剤を前記通孔を経て成形部の表面に滲出さ
せるための離型剤滲出部材とを備えてなるもので
ある。Structure of the Invention In order to achieve the above-mentioned object, the first invention provides a mold part that constitutes a molding surface in which a plurality of through holes are transparently provided in the thickness direction of the mold part, and a back surface of the mold part. a release agent exuding member provided in the mold release agent for exuding the impregnated mold release agent onto the molding surface through the through hole;
and a mold release agent supply means for communicating with the mold release agent exuding member and supplying the mold release agent to the mold release agent exuding member. A mold part constituting a molding surface in which a plurality of through holes, which increase and a release agent exuding member for causing the mold release agent to exude onto the surface of the molded part.
実施例
以下この発明を具体化した一実施例を図面に従
つて説明する。Embodiment An embodiment embodying the present invention will be described below with reference to the drawings.
1はステアリングホイール成形用の金型全体を
示し、上型本体1aと下型本体1bからなつてい
る。なお、上型本体1a及び下型本体1bはそれ
ぞれの構成がまつたく同一であるため、本実施例
においては便宜上、下型本体1bについてのみ説
明する。 Reference numeral 1 denotes the entire mold for molding a steering wheel, which consists of an upper mold body 1a and a lower mold body 1b. Incidentally, since the upper mold body 1a and the lower mold main body 1b have the same structure, only the lower mold main body 1b will be described in this embodiment for convenience.
2は下型本体1bの成形面を構成する型部分で
あつて、断面形状は半円弧状(第1図参照)をな
すとともに、平面形状は円環状(第2図参照)を
なしている。この型部分2は後記する電鋳法によ
つて下型本体1bとは別体に形成され、その成形
面が下型本体1bの上面から露出するように下型
本体1bに固着されている。3は同型部分2にそ
の板厚方向に真直ぐに透設した多数個の通孔であ
る。なお、通孔3はその径が、型部分2の成形面
から裏面に向かつて徐々に増加するように形成さ
れ、その最大径が約0.1〜0.2mm、また最小径は特
に定められるものではなく、後記する離型剤を通
過させる大きさならば細いほど好ましい。さら
に、この種の金型では通孔3の径を小さくして、
個数を多くすれば成形加工は容易に行われる。 Reference numeral 2 denotes a mold part constituting the molding surface of the lower mold body 1b, which has a semicircular cross-sectional shape (see FIG. 1) and an annular planar shape (see FIG. 2). This mold portion 2 is formed separately from the lower mold body 1b by an electroforming method to be described later, and is fixed to the lower mold body 1b so that its molding surface is exposed from the upper surface of the lower mold body 1b. Reference numeral 3 denotes a large number of through holes formed straight through the same-shaped portion 2 in the thickness direction thereof. The through hole 3 is formed so that its diameter gradually increases from the molding surface of the mold part 2 toward the back surface, and the maximum diameter is approximately 0.1 to 0.2 mm, and the minimum diameter is not particularly determined. The smaller the size is, the more preferable it is, as long as it is large enough to allow the release agent (described later) to pass therethrough. Furthermore, in this type of mold, the diameter of the through hole 3 is made smaller,
If the number of pieces is increased, the molding process can be easily performed.
4は下型本体1b内において、型部分2の裏面
に沿つて配置した離型剤滲出部材であつて、スポ
ンジ、海綿等の吸湿性の高い材利用にて形成され
ている。なお、この離型剤滲出部材4は後記する
離型剤が含浸されるものであり、第2図に示すよ
うに、金属板等にて円環ドラム状に形成した保持
部材5内に収納されている。6は同保持部材5の
上面において型部分2と対応するように円環状に
形成した開口部であつて、その両周縁部が型部分
2の両周縁部に固定されており、保持部材5は上
面が下型本体1bから露出した状態で、型部分2
に対して移動不能に取り付けられている。 Reference numeral 4 denotes a release agent exuding member disposed along the back surface of the mold portion 2 within the lower mold body 1b, and is made of a highly hygroscopic material such as sponge or sponge. The release agent exuding member 4 is impregnated with a release agent to be described later, and as shown in FIG. ing. Reference numeral 6 denotes an annular opening formed on the upper surface of the holding member 5 so as to correspond to the mold part 2, both peripheral edges of which are fixed to both peripheral edges of the mold part 2, and the holding member 5 is With the upper surface exposed from the lower mold body 1b, the mold part 2
is immovably attached to the
7は前記保持部材5から下型本体1bを貫通し
て外方に延びる供給パイプであつて、同供給パイ
プ7の基端は保持部材5内において離型剤滲出部
材4に連通されるとともに、先端は下型本体1b
外において供給ポンプ8を介して、貯溜槽9に連
結されている。 Reference numeral 7 denotes a supply pipe extending outwardly from the holding member 5 through the lower mold body 1b, and the base end of the supply pipe 7 is communicated with the release agent exuding member 4 within the holding member 5. The tip is the lower mold body 1b
Externally it is connected to a reservoir 9 via a feed pump 8 .
なお、貯溜槽9内にはシリコンオイル、液状天
然ワツクス、液状合成ワツクス等の液状の離型剤
が貯溜されている。そして、この貯溜槽9は前記
供給パイプ7及び供給ポンプ8とともに、離型剤
を離型剤滲出部材4へと供給するための離型剤供
給手段を形成している。 Note that a liquid release agent such as silicone oil, liquid natural wax, liquid synthetic wax, etc. is stored in the storage tank 9. This storage tank 9, together with the supply pipe 7 and the supply pump 8, forms a mold release agent supply means for supplying the mold release agent to the mold release agent exuding member 4.
次に、型部分2を製造する電鋳方法について以
下述べるに先だち、通常の電鋳方法について説明
するが、ここでは電鋳を広義の意味でメツキと称
する。 Next, before describing the electroforming method for manufacturing the mold part 2, a normal electroforming method will be described, and here, electroforming is referred to as plating in a broad sense.
一般にメツキ方法は、メツキが施されるメツキ
素材に電導性付与塗膜、例えばペースト状銀ラツ
カーと酢酸プチル溶液を混合して形成したスプレ
ー液を噴射してメツキ素材に電導性を付与したの
ち、純水に塩酸、塩化第1スズを混入して形成し
た前処理液をはけ等にて塗布し、メツキ素材の表
面を活性化させてピンホールの発生を防止するた
めの前処理を行つている。 Generally, the plating method involves spraying a conductive coating film, such as a spray liquid formed by mixing a paste silver lacquer and a butyl acetate solution, onto the plating material to impart conductivity to the plating material. A pretreatment liquid made by mixing hydrochloric acid and stannous chloride in pure water is applied with a brush, etc., to activate the surface of the plating material and perform pretreatment to prevent pinholes from forming. There is.
また、メツキ液はスルフアミン酸ニツケル液、
硼酸を混合したのち、表面活性添加剤として、例
えば少量のラウリル硫酸ナトリウムを添加して形
成している。このラウリル硫酸ナトリウムはメツ
キ加工時において、メツキ素材表面上のメツキ層
にピンホールが発生することを防止するものであ
る。 In addition, the coating liquid is nickel sulfamate liquid,
After mixing boric acid, a small amount of sodium lauryl sulfate, for example, is added as a surface active additive. This sodium lauryl sulfate prevents pinholes from forming in the plating layer on the surface of the plating material during plating processing.
このあと、メツキ液槽内に貯溜したメツキ液中
にメツキ材料及びメツキ素材を浸し、メツキ液を
循環させるとともにカソードロツカーを作動さ
せ、さらにメツキ素材をメツキ液中で移動させて
ピンホールの発生を防止しながらメツキ材料及び
メツキ素材の間に、メツキ素材100cm3について
0.6Aの電流を3〜4時間流してメツキ素材の表
面全体にメツキ層が付着するようにしている。メ
ツキ層が付着されたのを確認したのち、電流をメ
ツキ素材100cm3について1〜2Aに変換して、メツ
キ層が平滑になるようにメツキ加工を続けて、所
望の形状に仕上げ、さらにメツキ素材とメツキ層
とを分離して成形部2が形成される。なお、電流
を上記の値より強くするとメツキ素材の表面には
ピンホールが発生する。 After this, the plating material and the plating material are immersed in the plating liquid stored in the plating liquid tank, the plating liquid is circulated, the cathode locker is operated, and the plating material is further moved in the plating liquid to generate pinholes. About 100cm 3 of the plating material between the plating material and the plating material while preventing
A current of 0.6 A is passed for 3 to 4 hours to ensure that the plating layer adheres to the entire surface of the plating material. After confirming that the plating layer has been adhered, convert the current to 1 to 2 A per 100cm3 of the plating material, continue plating so that the plating layer is smooth, finish it in the desired shape, and then continue plating the plating material. The molded part 2 is formed by separating the plating layer and the plating layer. Note that if the current is made stronger than the above value, pinholes will occur on the surface of the plating material.
上記したメツキ法においては型部分2にピンホ
ールの発生を防止しているがこの発明では、下記
の方法によつて、ピンホールの発生を促進して、
このピンホールを通孔3へと成長させるようにし
たものである。すなわち、
(1) メツキ液に、例えばラウリル硫酸ナトリウム
等の表面活性添加剤を添加しない。 In the above-mentioned plating method, the generation of pinholes in the mold part 2 is prevented, but in this invention, the generation of pinholes is promoted by the following method,
This pinhole is made to grow into a through hole 3. That is, (1) Do not add surface active additives such as sodium lauryl sulfate to the plating solution.
(2) メツキ加工前に、メツキ素材に対して塩化ビ
ニル等の絶縁物質を混入したラツカー液を噴射
して約15μmの槽を形成し、メツキ素材表面の
通電性を低下させる。(2) Before the plating process, a lacquer solution mixed with an insulating material such as vinyl chloride is sprayed onto the plating material to form a tank of approximately 15 μm to reduce the electrical conductivity of the surface of the plating material.
(3) メツキ素材の前処理において、前処理液を使
用しない。(3) Do not use pre-treatment liquid in pre-treatment of plating materials.
(4) メツキ時において、メツキ液を循環させず、
さらにカソードロツカーも静止状態にしてお
く。(4) When plating, do not circulate the plating liquid,
Furthermore, the cathode rocker is also kept stationary.
(5) メツキ時に通常より強い電流を流す。(5) A stronger current than usual is passed during plating.
ことによつて行われるが、このうち少なくとも1
つの方法のみによつて、型部分2に通孔3を形成
することは可能である。At least one of these
It is possible to form the through holes 3 in the mold part 2 by only one method.
さて、上記のように構成した成形用金型の使用
方法を以下に述べる。 Now, how to use the molding die configured as described above will be described below.
まず、供給ポンプ8を作動させ、貯溜槽9内の
離型剤を供給パイプ7を経て離型剤滲出部材4へ
送り、同離型剤滲出部材4に離型剤を保持し得る
だけ含浸させる。次に、再び供給ポンプ8を弱く
作動させて、微量の離型剤を離型剤滲出部材4に
送ると同時に、離型剤滲出部材4に含浸された離
型剤に微圧を加えると離型剤は離型剤滲出部材4
から滲み出る。この滲み出た離型剤は型部分2の
通孔3内へ毛管現象及びこれを促す圧力によつて
進入し、成形面に達する。従つて、成形面は離型
剤が塗布されたのと同じ状態となる。なお、前述
したように通孔3は型部分2の板厚方向に真直ぐ
に透設されているので目詰まりするおそれが少な
く、また型部分2の裏面ほど径が大きくなつてい
るので、離型剤が通孔3内に進入するとき受ける
流動抵抗は非常に小さい。 First, the supply pump 8 is activated to send the mold release agent in the storage tank 9 to the mold release agent exuding member 4 through the supply pipe 7, and the mold release agent exuding member 4 is impregnated with as much mold release agent as it can hold. . Next, the supply pump 8 is operated weakly again to send a small amount of mold release agent to the mold release agent exuding member 4, and at the same time, when a slight pressure is applied to the mold release agent impregnated in the mold release agent exuding member 4, the mold release agent is released. The mold agent is a mold release agent exuding member 4
It oozes out from. This oozing mold release agent enters the through hole 3 of the mold part 2 by capillary action and the pressure that promotes this, and reaches the molding surface. Therefore, the molding surface is in the same state as if the mold release agent had been applied. As mentioned above, the through hole 3 is cut straight through the mold part 2 in the thickness direction, so there is little risk of clogging, and since the diameter becomes larger toward the back of the mold part 2, it is easier to release the mold. The flow resistance encountered by the agent as it enters the through hole 3 is very small.
離型剤が成形面全体に滲み出たら、剥離性の悪
い材料にて成形加工を行つても被成形物は型部分
2から容易に剥離される。このように金型1を使
用すれば、被成形物の材質に応じて所望量の離型
剤を型部分2に滲出させることが可能である。 Once the mold release agent oozes out over the entire molding surface, the molded object can be easily peeled off from the mold portion 2 even if molding is performed using a material with poor peelability. By using the mold 1 in this manner, it is possible to exude a desired amount of mold release agent into the mold portion 2 depending on the material of the object to be molded.
なお、この金型1にて一度成形加工を行つたあ
とは、微量の離型剤を離型剤滲出部材4に送れ
ば、離型剤が成形面に滲み出るため、金型1の再
度の使用に備えることができる。 Note that once the molding process is performed using this mold 1, if a small amount of mold release agent is sent to the mold release agent exuding member 4, the mold release agent will ooze out onto the molding surface, so that the mold 1 cannot be re-molded. Ready for use.
また、図面においては、供給ポンプ8を1個の
み図示したが、離型剤滲出部材4に離型剤が均等
に含浸されるためには、供給ポンプ8は等距離を
置いて複数本配設されることが望ましい。 In addition, although only one supply pump 8 is shown in the drawing, in order for the release agent to be evenly impregnated into the release agent exuding member 4, a plurality of supply pumps 8 are arranged at equal distances. It is desirable that
また、前述したように、金型1の上型本体1a
と下型本体1bとは全く同一の構成であるため、
上型本体1aも下型本体1bと同じ方法で使用さ
れるものである。 Moreover, as mentioned above, the upper mold body 1a of the mold 1
and the lower die main body 1b have exactly the same configuration,
The upper mold body 1a is also used in the same manner as the lower mold body 1b.
なお、この発明は前記実施例に拘束されるもの
ではなく、例えば型部分2を被成形物の形状に応
じて他の形にしたり、型部分2を鋳造、切削加工
等にて形成したり、通孔3をレーザー光線、先端
の直径が細い錐等で穿孔するか、又はポーラス生
成法等によつて透設するなど、発明の趣旨から逸
脱しない限りにおいて任意の変更は可能である。 Note that the present invention is not limited to the above-mentioned embodiments, and, for example, the mold portion 2 may be formed into a different shape depending on the shape of the object to be molded, or the mold portion 2 may be formed by casting, cutting, etc. Any changes can be made without departing from the spirit of the invention, such as by drilling the through holes 3 with a laser beam, a cone with a narrow tip, or by creating a porosity.
発明の効果
以上詳述したように、本願第一発明は複数個の
通孔がその型部分の板厚方向に略真直ぐに透設さ
れた成形面を構成する型部分と、その型部分の裏
面に設けられ含浸された離型剤を前記通孔を経て
成形面に滲出させるための離型剤滲出部材と、そ
の離型剤滲出部材に連通され同離型剤滲出部材に
離型剤を供給するための離型剤供給手段とから構
成したことにより、離型剤を含浸された離型剤滲
出部材に離型剤供給手段を介して圧力を加えるだ
けで、通孔を経て離型剤が成形面に達するので、
剥離性の悪い材料を使用して成形を行う場合で
も、従来と異なり、まえもつて金型の成形面に離
型剤を塗布するという面倒な準備作業を不要とす
ることができ、また一度成形加工を行つた後も離
型剤供給手段を作動させれば離型剤が成形面に滲
出されるので金型の再度の使用に備えることがで
き、しかも離型剤供給手段の作動を調節すれば被
成形物の材質に応じた所望量の離型剤を成形面に
滲出させることができ、さらに通孔が型部分の板
厚方向に略真直ぐに透設されているので目詰まり
を生じるおそれを少なくすることができ、また第
二発明は成形面から裏面に向かつて径が増加する
複数個の通孔が型部分の板厚方向に略真直ぐに透
設された成形面を構成する型部分と、同型部分の
裏面に設けられ含浸された離型剤を前記通孔を経
て成形部の表面に滲出させるための離型剤滲出部
材とを備えたことにより、通孔内の目詰まりのお
それを少なくできるだけでなく、離型剤が通孔内
に滲出するとき受ける流動抵抗を非常に小さくで
きるので、成形面に離型剤を抵抗少なく滲出させ
ることができるという優れた効果を奏する。Effects of the Invention As detailed above, the first invention of the present application includes a mold part that constitutes a molding surface in which a plurality of through holes are transparently provided in the thickness direction of the mold part, and a back surface of the mold part. a mold release agent exuding member provided in the mold release agent for exuding the impregnated mold release agent onto the molding surface through the through hole; and a mold release agent exuding member communicated with the mold release agent exuding member to supply the mold release agent to the mold release agent exuding member. By simply applying pressure to the release agent exuding member impregnated with the release agent through the release agent supply means, the release agent is released through the through holes. As it reaches the molding surface,
Even when molding is performed using materials with poor releasability, unlike conventional methods, the troublesome preparation work of applying a mold release agent to the molding surface of the mold beforehand can be eliminated, and once the molding If the mold release agent supply means is operated even after processing, the mold release agent will ooze out onto the molding surface, making it possible to prepare the mold for reuse.Moreover, the operation of the mold release agent supply means can be adjusted. In this case, a desired amount of mold release agent can be exuded onto the molding surface according to the material of the molded object, and since the through hole is provided almost straight in the thickness direction of the mold part, there is no risk of clogging. In addition, the second invention provides a mold part that constitutes a molding surface in which a plurality of through holes whose diameters increase from the molding surface to the back surface are transparently provided substantially straight in the thickness direction of the mold part. and a release agent exuding member provided on the back surface of the same mold part for exuding the impregnated mold release agent onto the surface of the molded part through the through hole, thereby reducing the risk of clogging in the through hole. Not only can the mold release agent be reduced, but also the flow resistance experienced when the mold release agent oozes into the through-holes can be made very small, resulting in the excellent effect that the mold release agent can ooze out onto the molding surface with less resistance.
図面中、第1図はこの発明の成形用金型を具体
化して示す断面図、第2図は下型の要部を示す斜
視図である。
成形面を構成する型部分……2、通孔……3、
離型剤滲出部材……4、供給パイプ……7、供給
ポンプ……8、貯溜槽……9(前記供給パイプ
7、供給ポンプ8及び貯溜槽9によつて離型剤供
給手段が構成されている)。
In the drawings, FIG. 1 is a sectional view embodying the molding die of the present invention, and FIG. 2 is a perspective view showing the main parts of the lower mold. Mold part that constitutes the molding surface...2, Through hole...3,
Release agent exuding member...4, supply pipe...7, supply pump...8, storage tank...9 (The supply pipe 7, supply pump 8, and storage tank 9 constitute a release agent supply means. ing).
Claims (1)
略真直ぐに透設された成形面を構成する型部分2
と、 その型部分2の裏面に設けられ含浸された離型
剤を前記通孔3を経て成形面に滲出させるための
離型剤滲出部材4と、 その離型剤滲出部材4に連通され同離型剤滲出
部材4に離型剤を供給するための離型剤供給手段
7,8,9とを備えたことを特徴とする成形用金
型。 2 前記離型剤滲出部材4は吸湿性の高い材料に
て形成されていることを特徴とする特許請求の範
囲第1項記載の成形用金型。 3 前記離型剤滲出部材4は金属板等にてほぼ環
状に形成した保持部材5内に収納されていること
を特徴とする特許請求の範囲第1項記載の成形用
金型。 4 前記離型剤供給手段は離型剤滲出部材4に連
通された供給パイプ7と、同供給パイプ7に取り
付けられた供給ポンプ8と、同供給ポンプ8を介
して供給パイプ7に連結された離型剤を貯溜する
ための貯溜槽9とからなることを特徴とする特許
請求の範囲第1項記載の成形用金型。 5 成形面から裏面に向かつて径が増加する複数
個の通孔3が型部分2の板厚方向に略真直ぐに透
設された成形面を構成する型部分2と、 同型部分2の裏面に設けられ含浸された離型剤
を前記通孔3を経て成形面に滲出させるための離
型剤滲出部材4とを備えたことを特徴とする成形
用金型。[Scope of Claims] 1. A mold part 2 that constitutes a molding surface in which a plurality of through holes 3 are transparently provided substantially straight in the thickness direction of the mold part 2.
a release agent exuding member 4 provided on the back surface of the mold portion 2 for exuding the impregnated mold release agent onto the molding surface through the through hole 3; A molding die characterized by comprising release agent supply means 7, 8, and 9 for supplying a release agent to the release agent exuding member 4. 2. The molding die according to claim 1, wherein the release agent exuding member 4 is made of a highly hygroscopic material. 3. The molding die according to claim 1, wherein the release agent exuding member 4 is housed in a holding member 5 formed of a metal plate or the like in a substantially annular shape. 4. The release agent supplying means was connected to the supply pipe 7 through the supply pipe 7 that communicated with the release agent exuding member 4, the supply pump 8 attached to the supply pipe 7, and the supply pump 8. The molding die according to claim 1, further comprising a reservoir tank 9 for storing a mold release agent. 5 A mold part 2 constituting a molding surface in which a plurality of through holes 3 whose diameter increases from the molding surface to the back surface are transparently provided almost straight in the thickness direction of the mold part 2, and a back surface of the same mold part 2. A molding die characterized by comprising a release agent exuding member 4 for exuding the impregnated mold release agent onto the molding surface through the through hole 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59060251A JPS60201910A (en) | 1984-03-27 | 1984-03-27 | Molding die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59060251A JPS60201910A (en) | 1984-03-27 | 1984-03-27 | Molding die |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60201910A JPS60201910A (en) | 1985-10-12 |
| JPH0232125B2 true JPH0232125B2 (en) | 1990-07-18 |
Family
ID=13136767
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59060251A Granted JPS60201910A (en) | 1984-03-27 | 1984-03-27 | Molding die |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60201910A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01216380A (en) * | 1988-02-24 | 1989-08-30 | Nec Corp | Electrophotographic recorder |
| JPH01145412U (en) * | 1988-03-30 | 1989-10-05 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5712607A (en) * | 1980-06-27 | 1982-01-22 | Hitachi Ltd | Metallic mold for resin |
-
1984
- 1984-03-27 JP JP59060251A patent/JPS60201910A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60201910A (en) | 1985-10-12 |
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