JPH0232350B2 - SHINKUJOCHAKUSOCHI - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a vacuum evaporation apparatus, which is used to form a ferromagnetic metal thin film on a polymer molded substrate to obtain a magnetic recording medium, and to form a semiconductor thin film to produce photovoltaic power generation, etc. The purpose of the present invention is to provide a vacuum evaporation apparatus suitable for applications such as continuously obtaining functional films of

In recent years, with the demands of the times for energy and resource conservation, the application of thin films has been widely studied on a practical scale.

The present invention is particularly effective when only a small portion of the evaporated material can be deposited on the substrate, such as in oblique evaporation, which is often used to impart optical or magnetic anisotropy. Regarding equipment, with conventional equipment, even if efforts are made to increase the deposition efficiency, 30 to 40% of the deposited film does not become directly on the substrate, but adheres in large quantities to internal structures, inner walls, etc. However, it is useful even when applied to such a device.

An embodiment thereof will be described below with reference to the drawings. The present invention is directed to a vapor deposition apparatus equipped with a mechanism for transporting a polymer molded substrate 1 along a rotating support 4 in a vacuum chamber (not shown).

The conveyance mechanism may be configured by appropriately combining known elements such as a take-up shaft, a feed-out shaft, a free roller, an expander roller, and a dancer roller. The rotating support body 4 may be a rotating cylindrical can configured to circulate a temperature-controlled medium therein, and may be a rotating cylindrical can, for example, made of SUS304 0.2~
It may be a belt made of endless thin plates with a thickness of 0.5 mm, or it may be of other types.

An evaporation source is disposed facing the substrate 1, and in the present invention, an electron beam heating type, an induction heating type, a resistance heating type, a laser beam heating type, etc. can be used as the evaporation source. Among these, the electron beam heating type is preferable due to its controllability.

Figure 1 schematically shows the evaporation source, but 2
3 is a container made of a refractory material such as Al ₂ O ₃ or MgO, and 3 is a molten evaporation material. Further, 13 is a weir plate which will be described later.

The accelerated electron beam 5 heats the evaporation material 3 and partially vaporizes it. 6 in the figure schematically shows evaporated atoms. This has an angular distribution, but
Generally, it is said to evaporate in the direction of 2π radians. Although this vapor is blocked by an angle-limiting mask 7 often used in the manufacture of magnetic tapes, a portion of it adheres to the moving substrate 1. Further, another part of the vapor adheres and accumulates on the recovery deposition prevention plate 8.
This collection anti-adhesion plate 8 is fixed to two closed chains 9 having an interval greater than the width of the substrate 1. One of the sprockets 10 and 11 is accessed from the outside of the vacuum chamber.
It is configured so that rotation is transmitted from the introduced rotating shaft and the position is controlled. The evaporative material deposited on the collection prevention plate 8 and shaped into a plate is returned to a part of the container 2. 12 in the figure schematically shows this.
The plate-shaped evaporation material 12 is also preferably melted using an electron beam.

The operation of this device will now be described.

A part of the evaporative material 3 adheres to the recovery adhesion prevention plate 8.
The amount of adhesion is monitored for a certain period of time or preferably the amount of adhesion is monitored, and when necessary, the recovery adhesion prevention plate 8 is moved and the plate material 12 made of the evaporation material adhering thereto is dropped into the recovery zone. At that time, lower the weir plate 13,
In addition, in order to avoid problems with hot water springs, the irradiation of the electron beam 5 is stopped and a portion of the recovered material 12 is solidified. After that, irradiation with the electron beam 5 was resumed,
The evaporation material 12 is melted and evaporated when a specified temperature is reached. Then, in order to replenish the evaporation material 3 reduced by evaporation, the weir plate 13 may be raised.

Note that the presence or absence of a mechanism for supplying new evaporation material in the form of a rod or wire to the recovery zone into which the recovered evaporation material 12 is placed is not a limiting requirement of the present invention, and it should be provided as necessary. Of course.

Although the concept of recovery has been described as an example, it goes without saying that the method of returning the waste to the regeneration zone, the number of mechanisms therefor, the control method, etc. should also be selected appropriately.

Figure 2 is a plan view to help you understand the evaporation source container. Appropriately divided pieces of Al ₂ O ₃ , MgO, etc. are brought together and glued together or placed in another shape, such as an iron container. The grooves are shown divided into A zone, B zone, C ₁ and C ₂ zones.

The A zone is a groove for storing molten material at the evaporation temperature, and 15 schematically represents the scanning locus of this electron beam. 16 similarly shows the scanning locus of the electron beam. The B zone is a place where new evaporation material is supplied as needed and evaporation material that has been evaporated and re-solidified is redissolved. C ₁ and C ₂ are supply paths connecting both zones A and B, and there are weir plates 13 in the middle of these supply paths C ₁ and C _2.
It's being dammed up. This weir plate 13 is preferably selected from refractories such as Al ₂ O ₃ and MgO, rather than being made of a water-cooled copper plate.

Supplementary heating of the C ₁ and C ₂ paths may be carried out if necessary as described above, but it may be selected from among heating by a sheathed heater, induction heating, electron beam heating, etc.

The collection prevention plate 8 is, for example, a stainless steel plate with a smooth surface of about 0.5S, and the evaporated material deposited on the surface and formed into a plate shape is in a weak adhesive state, and the impact occurs on the B zone. It can be dropped by force, or it can be made into a jacket structure and cooled to apply stress, which can be devised as appropriate.

As another embodiment, it is also effective to use a plate, block, wire, etc. made of the same material as the evaporation material in place of the recovery adhesion prevention plate 8. It is noteworthy that this method also has the advantage of being able to supply another new evaporation material.

The effects obtained by the present invention were confirmed by manufacturing a vapor-deposited tape suitable for short wavelength recording using the apparatus of the present invention.

A 5000 m long polyethylene terephthalate is moved along a cylindrical can (1 m diameter) at a speed of 45 m/min, and Co80 is deposited onto this substrate at an incident angle of 60° or more.
A 0.1 μm thick magnetic layer consisting of 20%-Ni was deposited.

If the above vapor deposition is carried out only by supplying a new material that is not based on the present invention, 100 kg of evaporation material is required,
The supply equipment was large-scale and required an average of 56KW (30KV, 1.87A) of melting power for supply.
On the other hand, a thickness of 1.5% consisting of 80% Co and 20% Ni
When using the present invention and using a plate of 1.5 mm as the anti-adhesion plate, the weight of the evaporated material is only 30 kg, and since the material is vacuum melted again, the stability of the coercive force in the longitudinal direction of the substrate and the corrosion resistance are improved, which is thought to be due to improved purity. Other major benefits, such as stability, were also identified.

Furthermore, in the present invention, when oxygen is introduced for vapor deposition, some oxides may float in the recovery zone, and if this can be removed by scooping some of it with a water-cooled copper cup, it will not affect the quality. The apparatus of the present invention can be applied to the production of long functional membranes without any adverse effects. This also applies to nitrides and the like.

According to the present invention, the technical application and development of semi-continuous coiled deposition will lead to the production of a wide range of functional films, and its industrial value is extremely large.

[Brief explanation of drawings]

FIG. 1 is a sectional view of a main part of an embodiment of a vacuum evaporation apparatus according to the present invention, and FIG. 2 is a plan view showing an example of an evaporation source device used in the vacuum evaporation apparatus of the present invention. DESCRIPTION OF SYMBOLS 1... Polymer molded substrate, 2... Container made of refractory material, 3... Evaporation material, 4... Rotating support, 5
... Electron beam, 6 ... Evaporated atoms, 7 ... Mask, 8 ... Collection prevention plate, 9 ... Chain, 1
0, 11... Sprocket, 12... Recovered plate-shaped evaporation material, 13... Weir plate.

Claims (1)

[Claims] 1 In a vacuum chamber, a mechanism for transporting a polymer molded substrate along a rotating support, a mechanism for recovering a substance evaporated from an evaporation source in a direction different from the direction of the substrate, and a mechanism for transferring the recovered evaporation substance to an evaporation source container. A vacuum evaporation apparatus characterized by having a supply mechanism.