JPH0234480B2 - - Google Patents

Description

[Detailed Description of the Invention] [Field of Application of the Invention] The present invention is applicable to gripping an electronic component having a plurality of lead wires and connecting the plurality of lead wires to the other end, such as in the work of mounting an IC on a printed circuit board. This invention relates to a device that is inserted into a mounting hole of a member.

[Prior art]

FIG. 1 is a perspective view illustrating an electronic component having a plurality of lead wires, and the electronic component 1 shown in FIG.
It has a book lead wire 2. Figure b shows an electronic component having six parallel lead wires, and figure c shows an electronic component having 14 parallel lead wires. Generally, electronic components often have a plurality of parallel leads.

An automatic machine has been put into practical use that grips electronic components and inserts the lead wires into the lead attachment holes provided on the printed circuit board, but it is difficult to automatically detect the success or failure of the insertion operation. There are difficult technical issues.

FIGS. 2a, 2b, and 2c are explanatory diagrams of conventional insertion success/failure detection devices, respectively.

In the device shown in FIG.
This is an insertion success/failure detecting device that is configured to check that the lead wires 2 protrude below the substrate 3 by contacting the leads 2 of the electrodes 7a and 7b of the continuity tester 7 after the wires are inserted into the substrate 3.

Fig. 2b shows a structure in which the gripping claw 6 of the electronic component is also used as one electrode, and Fig. 2c shows a continuity tester 7' that confirms that the movable contact 7c pushed by the lead wire comes into contact with the fixed contact 7d. It is a structure that can be detected by

The insertion success/failure detection device provided with the member that contacts the lead wire 2 as described above becomes very expensive if it is configured to detect the insertion success or failure of a small electronic component having a large number of lead wires. For this reason, there are examples of configurations that detect insertion success or failure by detecting about two lead wires among a large number of lead wires, but failure is detected when one or two of the large number of leads fail to insert. cannot be performed, so the reliability of the detection results is low.

Moreover, since the lead wire is grabbed and inserted during the insertion operation, the grip on the lead wire must be released to insert the lead wire to the specified position, so even if an insertion failure is subsequently detected, the defective part is automatically grabbed. It cannot be fixed or eliminated. Therefore, automatic reinsertion is not possible. Also, if the insertion fails and the
If it becomes as shown in b, since all leads other than the defective leads are normally clinched, it becomes difficult to automatically eliminate them. Therefore, when a defective insertion occurs, the insertion device must be stopped and the defective parts must be removed manually, which reduces the operating rate of the device and requires management of defective boards, which reduces productivity. Ta.

Figures 4a and 4b are perspective views of all the lead wires of the electronic component being deformed due to insertion failure;
6 is a member that guides the lead wire 2 into the insertion hole 4;
This is a member that presses the main body portion of the electronic component 1 toward the substrate 3 after the tip of the lead wire 2 is fitted into the insertion hole 4. In the conventional insertion success/failure detection device, insertion failure cannot be detected until after the lead wire 2 has been deformed as illustrated in this figure.
Even if insertion failure is detected, deformation of the lead wire cannot be prevented.

[Purpose of the invention]

The present invention has been made in view of the above-mentioned circumstances, and an object of the present invention is to provide an electronic component insertion device that can automatically reinsert an electronic component lead without the risk of deforming the lead even if the insertion fails. purpose.

[Summary of the invention]

In order to achieve the above object, the electronic component insertion device of the present invention includes a gripping device that grips an electronic component having a plurality of lead wires, and a gripping device that grips the electronic component so that the plurality of lead wires are inserted into insertion holes of a printed circuit board. In an electronic component insertion device that is provided with a drive device that drives the device, the drive device uses its driving force to overcome the resistance when inserting the plurality of lead wires of the electronic component into the insertion hole of the printed circuit board, and to insert the plurality of lead wires into the insertion hole. The structure is such that the force can be adjusted to be smaller than the force that plastically deforms one of the plurality of lead wires when a failure occurs, and the drive device is equipped with means for detecting the drive stroke. Yes, and includes a servo control device that determines whether or not the drive stroke reaches the stroke set value within a predetermined time, and the servo control device determines whether or not the drive stroke reaches the stroke set value within the predetermined time. It is characterized by a structure that controls the gripping device and the driving device and issues a command signal to repeat the reinsertion operation by replacing the gripping device with another electronic component.

[Embodiments of the invention]

Next, an embodiment of the present invention will be described with reference to FIGS. 5 to 9.

FIG. 5 is an overall view of one embodiment of the insertion device of the present invention, where F is a gripping device for gripping the electronic component 1, and E is a device for supporting the above-mentioned gripping device F and driving it up and down. The drive device E is guided by the traveling section C and travels in the X-X' direction, and is reciprocated between the component supply section B and the component mounting section D together with the gripping device. The above component supply section B arranges the electronic components 1 of each type in a predetermined manner and delivers them to the gripping device F. In addition, the component mounting section moves in the X-X' direction and the Y-Y' direction.
A printed circuit board 3 is positioned and placed on a table 8.

The gripping device F chucks the electronic component 1 at the supply section B, and inserts a plurality of lead wires 2 of the electronic component into the insertion holes 4 of the board 3. A cross-sectional view of the gripping device F and drive device E described above is shown in FIG.

The main body 10 of the drive device E is guided by the traveling section C and travels in a direction perpendicular to the plane of the paper.

This main body 10 supports a block 12 of a gripping device F through a guide groove 11 so as to be slidable in the vertical direction. Reference numeral 13 denotes a rack fixed vertically on the block 12 and meshed with the pinion 15. This pinion 15 is fixed to the shaft of the DC motor 14. 16 is a bracket. With the above configuration, the block 12 of the gripping device F is driven up and down by the DC motor 14.

The invention provides means for driving and adjusting the gripping device F.

In this embodiment, a servo control device 40 and a microcomputer 41 are provided.
The current set value a of the DC motor 14 necessary for insertion of the motor is given. Based on this, the servo control device 40 supplies a set current b to the DC motor 14 to operate the motor, and receives current value feedback c to perform current value control. Since the output torque of a DC motor is determined by the current value, the electronic component 1 held by the gripping device F has a preset setting current b.
is pushed down by a driving force corresponding to .

The value of the above set current b is determined as follows. That is, when all of the plurality of lead wires 2 have slipped into the insertion hole 4, the force for pushing down the electronic component 1 is as follows:
The force is set to be enough to overcome the sliding friction, and to be smaller than the force that would cause plastic deformation of one lead wire 2 if insertion of any one lead wire 2 fails. In this case, the set current value b that generates a push-down driving force that does not deform the lead wire is complicated to calculate because it is affected by the weight of each component, frictional force, etc., but it cannot be determined experimentally. It's easy.

The gripping device F is configured to be able to freely grip and release the electronic component 1 in the following manner.

Two chuck claws 30 are connected to a pair of guide rods 3.
1 to be slidably guided in the horizontal direction, and a compression spring 32
energized in the direction of separating from each other.

On the other hand, a pin 28 is fixed to each of the two chuck claws 30, and the chuck claws 30 are configured as follows so that they can be driven by an air cylinder 20 in a direction in which both chuck claws 30 are brought closer to each other via a pair of chuck levers 25. do.

The pair of chuck levers 25 are rotatably supported near their centers by pins 26, and have rollers 27 pivotally supported at their upper ends. A chuck bracket 24 is fixed to the gripping device block 12 via a spacer 23, and supports the pin 26.

The air cylinder 20 is fixed to the block 12, and a triangular prism-shaped cam 21a is fixed to the tip of the piston rod 21. 22 is a compression spring that urges the piston of the air cylinder 20 upward.

When compressed air is fed into the hole 20a communicating with the cylinder bottom of the air cylinder 20, the piston rod 21 descends, and the cam 21a pushes the roller 27 to drive the two chuck pawls 30 in the approaching direction. to hold it.

When the communication hole 20a of the air cylinder 20 is released to the atmosphere, the piston rod 21 is moved by the compression spring 2.
It rises due to the biasing force of 2, and the two chuck claws 3
0 is urged by the compression spring 32 and moves away, releasing its grip on the electronic component 1.

In the electronic component insertion device configured as described above, if even one of the plurality of lead wires 2 fails to be inserted, the drive device E is controlled so as not to generate a pushing force that would deform the lead wire 2. Therefore, there is no risk of deforming a lead wire that fails to be inserted. Also, for the same reason, electronic components 1
Since excessive pushing down force is not applied to the main body of the device, there is no risk of damaging the electronic component itself even when the electronic component is easily damaged (ceramic IC, LSI, etc.).

In the case of this embodiment, the microcomputer 41
By storing multiple types of current setting values a so as to provide different appropriate driving forces for each type of electronic component, it is possible to perform the appropriate insertion operation for multiple types of electronic components. can.

In this embodiment, an encoder 17 is attached to the DC motor 14 so as to be able to detect the rotational speed of the motor, that is, the vertical sliding stroke of the gripping device F. Encoder 17 inputs position signal d to servo control device 40 . On the other hand, the microcomputer 41 supplies the stroke setting value f to the servo control device 40 along with the start signal e.

The servo control device 40 determines that the insertion is successful when the value of the position signal d of the encoder 17 reaches a value corresponding to the stroke setting value f of the microcomputer, and sends a positioning completion signal g to the microcomputer 41.

Furthermore, if the position signal d does not reach the stroke set value f even after a preset period of time has elapsed, it is determined that the insertion has failed, and the electronic component 1 is replaced with another electronic component and the reinsertion operation is performed. A command signal (not shown) is issued to repeat.

The automatic control action described above is shown in a flowchart as shown in FIG.

In flow 51, the current value of the DC motor 14 is set, the required insertion operation time is set, and the timer operation is started.

In flow 52, the gripping device F is lowered. As a result, the position signal d is input from the encoder 17, so in flow 53 it is compared and judged whether or not the value of this position signal d reaches the specified stroke (stroke setting value f), and the specified stroke is reached within a predetermined time. If this is reached, the process goes to flow 54 and it is determined that the insertion is successful. If it is determined in flow 55 that the time has elapsed before the specified stroke is reached, the process proceeds to flow 56 to perform a reinsertion operation (changing the electronic component).

FIG. 8a shows a case where one lead wire 2 does not fit into the insertion hole 4. In such cases,
Since no excessive depressing force is applied to the chuck claws 30 that grip the electronic component 1, there is no risk of deformation of the single lead wire 2. After the specified time has elapsed in this way, the chuck claw 30 picks up the electronic component 1, transports it toward the defective product storage area as indicated by the arrow W, grips another electronic component again, and repeats the insertion operation.

If the drive device E is provided with a means for detecting the drive stroke as in this embodiment, it is possible to detect insertion failure before the lead wire 2 is deformed, so that defective electronic components can be re-inspected and corrected. Reuse becomes possible.

Further, as in this embodiment, if the stroke detected by the drive stroke detection means does not reach a predetermined dimension within a predetermined time, it is determined that the insertion operation has failed, and the electronic component is replaced. With this configuration, even if an insertion failure occurs, the failure can be automatically eliminated and the insertion operation can be continued.

9a, b, c, and d show the state when the insertion operation is performed normally. When the insertion operation has descended by a stroke S from the state shown in FIG. 5A to the state shown in FIG. The reason for this is that, as described above, if the insertion fails, the stroke S will not be lowered. When the insertion is successful, the chuck claw 30 opens as shown in figure c, and the chuck claw 30 opens as shown in figure d.
It rises like this and moves on to the next cycle.

〔Effect of the invention〕

As described above in detail, the electronic component insertion device of the present invention has no possibility of deforming one lead among the plurality of lead wires of an electronic component even if the insertion of one lead fails. It has excellent practical effects.

[Brief explanation of drawings]

FIG. 1 is a perspective view of an electronic component having a plurality of lead wires, and FIGS. 2 a, b, and c are explanatory diagrams of an insertion success/failure detection device in a conventional electronic component insertion device, respectively.
Figures 3a and b are perspective views with one lead wire deformed, Figures 4a and b are perspective views with two lead wires deformed, and Figures 5 to 9 are perspective views with two lead wires deformed. One embodiment of the electronic component insertion device of the present invention is shown, and FIG. 5 is an overall external view, FIG. 6 is a vertical sectional view with a control system diagram added, FIG. 7 is a flow diagram of control action, and FIG. FIG. 8 is an explanatory diagram of the operation when the insertion operation fails, and FIG. 9 is an explanatory diagram of the operation when the insertion operation is successful. B...Component supply section, C...Traveling section, D...Component mounting section, E...Drive device, F...Gripping device, 1...
...Electronic component, 2...Lead wire, 3...Printed circuit board, 13...Rack, 14...DC motor, 15
...Pinion, 17...Encoder, 40...Servo control device, 41...Microcomputer.

Claims (1)

[Scope of Claims] 1. A gripping device that grips an electronic component having a plurality of lead wires, and a drive device that drives the gripping device so that the plurality of lead wires are inserted into insertion holes of a printed circuit board. In the electronic component insertion device, the driving device applies its driving force to overcome the resistance when inserting the plurality of lead wires of the electronic component into the insertion hole of the printed circuit board, and to insert the plurality of lead wires into the plurality of lead wires when insertion fails. The structure is such that the force can be adjusted to be smaller than the force that plastically deforms one lead wire, and the drive device is equipped with a means for detecting the drive stroke, and the drive stroke is set to a predetermined value. The servo control device is provided with a servo control device that determines whether or not the stroke set value is reached within a predetermined time, and the servo control device controls the gripping device and the drive device when the stroke set value is not reached within a predetermined time. An electronic component insertion device characterized in that the electronic component insertion device is structured to issue a command signal so as to repeat the re-insertion operation by replacing the electronic component with another electronic component.