JPH0241541B2 - - Google Patents
Info
- Publication number
- JPH0241541B2 JPH0241541B2 JP3256381A JP3256381A JPH0241541B2 JP H0241541 B2 JPH0241541 B2 JP H0241541B2 JP 3256381 A JP3256381 A JP 3256381A JP 3256381 A JP3256381 A JP 3256381A JP H0241541 B2 JPH0241541 B2 JP H0241541B2
- Authority
- JP
- Japan
- Prior art keywords
- styrene
- weight
- parts
- polyethylene wax
- tert
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical group C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 51
- -1 polyethylene Polymers 0.000 claims description 25
- 239000004698 Polyethylene Substances 0.000 claims description 24
- 229920000573 polyethylene Polymers 0.000 claims description 24
- 229920000642 polymer Polymers 0.000 claims description 22
- 239000000203 mixture Substances 0.000 claims description 15
- 239000001993 wax Substances 0.000 description 25
- 239000004793 Polystyrene Substances 0.000 description 11
- 229920002223 polystyrene Polymers 0.000 description 11
- 238000000034 method Methods 0.000 description 9
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 238000002156 mixing Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 5
- 239000006229 carbon black Substances 0.000 description 4
- 235000014113 dietary fatty acids Nutrition 0.000 description 4
- 239000000194 fatty acid Substances 0.000 description 4
- 229930195729 fatty acid Natural products 0.000 description 4
- 229920001903 high density polyethylene Polymers 0.000 description 4
- 239000004700 high-density polyethylene Substances 0.000 description 4
- 238000004898 kneading Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 3
- 239000005977 Ethylene Substances 0.000 description 3
- 238000000748 compression moulding Methods 0.000 description 3
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 3
- 150000004665 fatty acids Chemical class 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000000314 lubricant Substances 0.000 description 3
- 229920005992 thermoplastic resin Polymers 0.000 description 3
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 2
- AFFLGGQVNFXPEV-UHFFFAOYSA-N 1-decene Chemical compound CCCCCCCCC=C AFFLGGQVNFXPEV-UHFFFAOYSA-N 0.000 description 2
- UAJRSHJHFRVGMG-UHFFFAOYSA-N 1-ethenyl-4-methoxybenzene Chemical compound COC1=CC=C(C=C)C=C1 UAJRSHJHFRVGMG-UHFFFAOYSA-N 0.000 description 2
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 2
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 description 2
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 238000000071 blow moulding Methods 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- NNBZCPXTIHJBJL-UHFFFAOYSA-N decalin Chemical compound C1CCCC2CCCCC21 NNBZCPXTIHJBJL-UHFFFAOYSA-N 0.000 description 2
- 238000007872 degassing Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 229920005669 high impact polystyrene Polymers 0.000 description 2
- 239000004797 high-impact polystyrene Substances 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000006082 mold release agent Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 229920002285 poly(styrene-co-acrylonitrile) Polymers 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- BOOBDAVNHSOIDB-UHFFFAOYSA-N (2,3-dichlorobenzoyl) 2,3-dichlorobenzenecarboperoxoate Chemical compound ClC1=CC=CC(C(=O)OOC(=O)C=2C(=C(Cl)C=CC=2)Cl)=C1Cl BOOBDAVNHSOIDB-UHFFFAOYSA-N 0.000 description 1
- GWQOYRSARAWVTC-UHFFFAOYSA-N 1,4-bis(2-tert-butylperoxypropan-2-yl)benzene Chemical compound CC(C)(C)OOC(C)(C)C1=CC=C(C(C)(C)OOC(C)(C)C)C=C1 GWQOYRSARAWVTC-UHFFFAOYSA-N 0.000 description 1
- HMUNWXXNJPVALC-UHFFFAOYSA-N 1-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical group C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)C(CN1CC2=C(CC1)NN=N2)=O HMUNWXXNJPVALC-UHFFFAOYSA-N 0.000 description 1
- JZHGRUMIRATHIU-UHFFFAOYSA-N 1-ethenyl-3-methylbenzene Chemical compound CC1=CC=CC(C=C)=C1 JZHGRUMIRATHIU-UHFFFAOYSA-N 0.000 description 1
- ZZLCFHIKESPLTH-UHFFFAOYSA-N 4-Methylbiphenyl Chemical compound C1=CC(C)=CC=C1C1=CC=CC=C1 ZZLCFHIKESPLTH-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 238000007757 hot melt coating Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000010102 injection blow moulding Methods 0.000 description 1
- 229940057995 liquid paraffin Drugs 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 1
- 150000002976 peresters Chemical class 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- OPQYOFWUFGEMRZ-UHFFFAOYSA-N tert-butyl 2,2-dimethylpropaneperoxoate Chemical compound CC(C)(C)OOC(=O)C(C)(C)C OPQYOFWUFGEMRZ-UHFFFAOYSA-N 0.000 description 1
- SWAXTRYEYUTSAP-UHFFFAOYSA-N tert-butyl ethaneperoxoate Chemical compound CC(=O)OOC(C)(C)C SWAXTRYEYUTSAP-UHFFFAOYSA-N 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- PXXNTAGJWPJAGM-UHFFFAOYSA-N vertaline Natural products C1C2C=3C=C(OC)C(OC)=CC=3OC(C=C3)=CC=C3CCC(=O)OC1CC1N2CCCC1 PXXNTAGJWPJAGM-UHFFFAOYSA-N 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- 239000003039 volatile agent Substances 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Description
本発明は離型性の改良されたスチレン系ポリマ
ー組成物、更に詳しくはスチレン系グラフトポリ
エチレンワツクスを配合してなるスチレン系ポリ
マー組成物に関する。
スチレン系ポリマーで高分子量のものはポリス
チレン、ハイインパクトポリスチレン、スチレ
ン・アクリロニトリル共重合体あるいはABSと
呼ばれる熱可塑性樹脂であり、射出成形、中空成
形、押出成形その他による成形品が各種分野に使
用されている。スチレン系ポリマーをも含めて熱
可塑性樹脂の射出成形品を金型から取出す際には
離型し易いように通常金型に抜き勾配を設けた
り、金型に離型剤を塗布したりしている。ところ
が成形品が精密機械や電気器具部品などに応用さ
れる場合には、しばしば抜き勾配を取ることが許
されない。しかも成形品が複雑な形状のものであ
る場合は、突出ピンの位置、太さなどが制約され
るため、成形品を取り出す際無理を生じ成形品を
破損する頻度が多くなるので離型剤の使用が避け
られないものとなつている。離型性の改良方法と
しては樹脂に高級脂肪酸、高級脂肪酸アミド、高
級脂肪酸の金属塩、高級脂肪酸エステル、流動パ
ラフイン、ワツクス類等の滑剤を添加したり、金
型にシリコーンオイル等の離型剤を塗布したりし
ている。しかしながら樹脂に前記滑剤を添加して
離型性を改良するには多量の滑剤を必要とし、そ
の結果樹脂の機械的強度の低下を来たす恐れがあ
り、また離型剤の塗布は成形時の煩雑さを招き、
成形品の外観、ウエルド強度などを損ねたりする
ので、樹脂の機械的強度を損わずに離型性を改良
する方法が望まれている。
一方スチレン系ポリマーで低分子量のものは電
子写真用トナー、ホツトメルト型コーテイング材
の基材、顔料分散剤として使用されているが該低
分子量のものも例えば電子写真用トナーとして用
いる場合高速複写においてロールによる加熱融着
時に一部ロールに付着する現象があり、離型性の
改良が望まれている。
そこで本発明者はスチレン系ポリマーの前記欠
点である離型性を改良するために検討を行つた結
果、スチレン系ポリマーにスチレン系グラフトポ
リエチレンワツクスを添加することにより、スチ
レン系ポリマーの機械的強度あるいは溶融流動性
を損うことなく離型性を改良しうることを見出し
た。
すなわち本発明は、スチレン系ポリマー(A):
100重量部に対して、極限粘度0.06dl/gないし
2.0dl/gのポリエチレンワツクス99ないし10重
量部に対してスチレン系モノマーは1ないし90重
量部グラフトしてなるスチレン系グラフトポリエ
チレンワツクス(B)を0.1ないし20重量部配合して
なるスチレン系ポリマー組成物を提供するもので
ある。
本発明に用いるスチレン系ポリマーとはスチレ
ンの単独重合体あるいはアクリロニトリル、ブタ
ジエン、等との共重合体で、ポリスチレン、ハ
イ・インパクトポリスチレン、スチレン・アクリ
ロニトリル共重合体、ABSと呼ばれている分子
量2〜3万以上の熱可塑性樹脂または分子量数百
ないし数万の低分子量ポリスチレンである。
スチレン系モノマーをグラフトするポリエチレ
ンワツクスとは極限粘度0.06dl/gないし2.0
dl/g、好ましくは0.06dl/gないし0.5dl/g
(デカリン溶媒135℃)の範囲のもので、高圧法ポ
リエチレンの熱分解によるもの、高圧でエチレン
をラジカル重合して得た高圧重合ポリエチレンワ
ツクス、更にはエチレン又はエチレンとプロピレ
ン、1―ブテン、1―ヘキセン、4―メチル―1
―ペンテン、1―デセンなどのα―オレフインと
をチーグラー型触媒を用いて低圧重合することに
より得られるものである。又、スチレン系モノマ
ーとはスチレン、α―メチルスチレン、p―メチ
ルスチレン、p―メトキシスチレン、m―メチル
スチレン等である。
前記ポリエチレンワツクスに対するスチレン系
モノマーのグラフト量はポリエチレンワツクス99
ないし10重量部に対して1ないし90重量部であ
る。スチレン系モノマーのグラフト量が1重量部
以下のものはスチレン系ポリマーと配合した場合
分散性が悪く、機械的強度を損うので好ましな
く、一方スチレン系モノマーのグラフト量が90重
量部を越えるものはスチレン系ポリマーに配合し
ても離型性が改良されない。
スチレン系モノマーをポリエチレンワツクスに
グラフトする方法としては公知の方が採用しう
る。例えばポリエチレンワツクスを直接溶融ある
いは溶媒に溶かして、スチレン系モノマーをラジ
カル開始剤を用いてあるいは用いずに添加してグ
ラフトする方法が例示できる。ラジカル開始剤と
しては有機ペルオキシド、有機ペルエステル、例
えばベンゾイルペルオキシド、ジクロルベンゾイ
ルペルオキシド、ジクミルペルオキシド、ジ―
tert―ブチルペルオキシド、2,5―ジメチル―
2,5―ジ(ペルオキシベンゾエート)ヘキシン
―3、1,4―ビス(tert―ブチルペルオキシイ
ソプロピル)ベンゼン、ラウロイルペルオキシ
ド、tert―ブチルペルアセテート、2,5―ジメ
チル―2,5―ジ(tert―ブチルペルオキシ)ヘ
キシン―3、2,5―ジメチル―2,5―ジ
(tert―ブチルペルオキシ)ヘキサン、tert―ブチ
ルペンベンゾエート、tert―ブチルペルフエニル
アセテート、tert―ブチルペルイソブチレート、
tert―ブチルペル―sec―オクトエート、tert―ブ
チルペルピバレート、クミルペルピバレートおよ
びtert―ブチルペルジエチルアセテート、その他
アゾ化合物、例えばアゾビス―イソブチルニトリ
ル、ジメチルアゾイソブチレートがある。これら
のうちではジクミルペルオキシド、ジ―tert―ブ
チルペルオキシド、2,5―ジメチル―2,5―
ジ(tert―ブチルペルオキシ)ヘキジン―3、
2,5―ジメチル―2,5―ジ(tert―ブチルペ
ルオキシ)ヘキサン、1,4―ビス(tert―ブチ
ルペルオキシイソプロピル)ベンゼンなどのジア
ルキルペルオキシドが好ましい。
スチレン系グラフトポリエチレンワツクスのス
チレン系ポリマーに対する配合量は、スチレン系
ポリマー100重量部に対して0.1ないし20重量部、
好ましくは0.5ないし10重量部の範囲、特に好ま
しくは0.5ないし5重量部の範囲である。配合量
が0.1重量部未満では離型性の改良効果がなく、
配合量が20重量部を越えると、強度が低下した
り、熱定着性が悪くなる。スチレン系グラフトポ
リエチレンとスチレン系ポリマーとを混合する方
法は公知の方法、例えばヘンシエルミキサー、V
―ブレンダー、リボンブレンダーで混合後直接用
いたり更に押出機等で混練造粒を行なう方法、バ
ンバリミキサー、単軸あるいは多軸押出機、ニー
ダー等で溶融混練後、造粒したり、粉砕して用い
る方法等が採用できる。またスチレン系ポリマー
には本発明の目的を損わない範囲で他の添加剤、
染顔料、ガラス繊維、カーボンブラツク、耐電防
止剤、耐候安定剤、炭酸カルシウム等の無機物
SBR、NBR、スチレン―マレイン酸共重合ポリ
マー等のポリマーを添加してもよい。
本発明のスチレン系ポリマー組成物は、スチレ
ン系ポリマーが高分子量のものであれば、射出成
形のみならず、中空成形、射出中空成形、圧縮成
形、押出成形、回転成形等において金型、ダイ、
ロール等への粘着が減少し、作業能率を向上せし
め、また流動性も改良されるので外観、寸法精度
の優れた成形品が得られ、工業用部品、電気何具
部品に有用である。一方低分子量のものであれ
ば、熱定着性が良く、しかも定着ロールへの付着
が改善されるので電子写真用トーナー用樹脂とし
て有用である。
以下、実施例により本発明の効果を更に具体的
に説明する。
実施例 1
極限粘度0.07dl/gの高密度ポリエチレンワツ
クス(商品名 三井ハイワツクス100P:三井石
油化学工業(株)製)350gを1のガラス製反応器
に仕込み、140℃にて溶解した。次いでスチレン
モノマー13gおよびジ―tert―ブチルペルオキシ
ド(以下DTBPOと略す)2.8gとを添加し6時
間加熱反応させた後溶融状態のまま5mmHg真空
中で1時間脱気処理して揮発分を除去し、その後
冷却した。得られたスチレングラフトポリエチレ
ンワツクス(以下GR―と呼ぶ)におけるスチ
レンのグラフト量は100gのスチレングラフトポ
リエチレンワツクス中に3.2gであつた。次いで
得られたGR―Iとポリスチレン(商品名 トー
ポレツクス500―51三井東圧化学(株)製)とを第1
表に示す割合でドライブレンドした後15mmφ押出
機(設定温度200℃)で造粒した。造粒した試料
を圧縮成形機にて200×200×1mmの角板を成形し
た。以下次に記す方法で性能評価を行つた。
溶融特性:ASTM D 1238Eにより測定した。
引張特性:ASTM D 638の方法により測定
した。
離型性:成形角板を金枠から取り出す際の状態
により、抵抗なく角板を金枠から取り出せる
状態を5、剃刀などにより角板と金枠との間
を強制剥離しないと取り出せない状態を1と
して、その中間を3段階に分けて、5段階評
価により行つた。
分散性:成形角板の状態を目視により、成形角
板中にポリエチレンワツクスの凝集塊が見え
る状態を1、凝集塊は見えないが不均質な状
態を2、成形角板が均質な状態を3として、
3段階評価により行なつた。
実施例 2
極限粘度0.12dl/gの高密度ポリエチレンワツ
クス(商品名 三井ハイワツクス200P:三井石
油化学工業(株)製)350gを1のガラス製反応器
に仕込み、140℃にて溶解した。次いでスチレン
モノマー:37.1gおよびDTBPO,8.6gとを添加
し6時間加熱反応させた後、溶融状態のまま5mm
Hg真空中で1時間脱気処理して揮発分を除去し
その後冷却した。得られたスチレングラフトポリ
エチレンワツクス(以下GR―と呼ぶ)におけ
るスチレンのグラフト量は100gのスチレングラ
フトポリエチレンワツクス中に9.1gであつた。
以下実施例1と同様の方法でポリスチレンと混合
し組成物を得、性能評価を行つた。結果を第1表
に示す。
実施例 3
極限粘度0.22dl/gの高密度ポリエチレンワツ
クス(商品名 三井ハイワツクス400P:三井石
油化学工業(株)製)350gを2のガラス製反応器
に仕込み140℃にて溶解した。次いでスチレンモ
ノマー742gおよびDTBPO:180gとを添加して
6時間加熱反応させた後溶融状態のまま5mmHg
真空中で1時間脱気処理して揮発分を除去しその
後冷却した。得られたスチレングラフトポリエチ
レンワツクス(以下GR―と呼ぶ)におけるス
チレングラフト量は100gのスチレングラフトポ
リエチレンワツクス中に64gであつた。以下実施
例1と同様の方法でポリエチレンと混合し組成物
を得、性能評価を行なつた。結果を第1表に示
す。
実施例 4
実施例2と同様の方法でスチレンモノマーの代
りにp―メチルスチレンを用いてグラフト反応を
行なつた。得られたグラフトポリエチレンワツク
ス(以下GR−と呼ぶ)におけるp−メチルス
チレンのグラフト量は100gのグラフトポリエチ
レンワツクス中に8.9gであつた。以下実施例1
と同様の方法でポリスチレンと混合し組成物を
得、性能評価を行なつた。結果を第1表に示す。
比較例 1および2
実施例1および実施例2のGR―およびGR
―の代わりにそれぞれ、三井ハイワツクス
100Pおよび三井ハイワツクス200Pを用いる以外
は実施例1および実施例2と同様に行つた。結果
を第1表に示す。
比較例 3
市販の低分子量ポリスチレン(商品名 ハイマ
ーST―95三洋化成(株)製 分子量1400)をポリス
チレン(商品名 トーポレツクス500―51三井東
圧化学(株)製)100重量部に対し1重量部の割合で
ドライブレンドして実施例1と同様の方法で造粒
し、その後圧縮成形機で角板を成形し、性能評価
を行なつた。結果を第1表に示す。
The present invention relates to a styrenic polymer composition with improved mold release properties, and more particularly to a styrenic polymer composition containing a styrenic grafted polyethylene wax. Styrenic polymers with high molecular weight are thermoplastic resins called polystyrene, high-impact polystyrene, styrene-acrylonitrile copolymer, or ABS, and molded products by injection molding, blow molding, extrusion molding, etc. are used in various fields. There is. When taking injection molded thermoplastic resin products, including styrene polymers, out of the mold, a draft angle is usually provided in the mold or a release agent is applied to the mold to make it easier to release the mold. There is. However, when molded products are used in precision machinery or electrical appliance parts, draft angles are often not allowed. Furthermore, if the molded product has a complicated shape, the position and thickness of the ejecting pin are restricted, which may cause strain when removing the molded product, which increases the frequency of damage to the molded product. Its use has become unavoidable. Methods for improving mold release properties include adding lubricants such as higher fatty acids, higher fatty acid amides, metal salts of higher fatty acids, higher fatty acid esters, liquid paraffin, and waxes to the resin, and adding mold release agents such as silicone oil to the mold. They also apply it. However, adding the lubricant to the resin to improve mold release requires a large amount of lubricant, which may result in a decrease in the mechanical strength of the resin, and the application of the mold release agent is complicated during molding. Invite the
Since this may impair the appearance of the molded product, the weld strength, etc., a method for improving the mold releasability without impairing the mechanical strength of the resin is desired. On the other hand, styrene-based polymers with low molecular weights are used as toners for electrophotography, base materials for hot-melt coating materials, and pigment dispersants. There is a phenomenon in which a part of the resin adheres to the roll during heat fusing, and it is desired to improve the mold releasability. Therefore, the present inventor conducted studies to improve the mold releasability, which is the drawback of styrene-based polymers, and found that by adding styrene-based grafted polyethylene wax to styrene-based polymers, the mechanical strength of styrene-based polymers was improved. Alternatively, it has been found that mold releasability can be improved without impairing melt fluidity. That is, the present invention provides a styrenic polymer (A):
Intrinsic viscosity 0.06 dl/g or more per 100 parts by weight
A styrene-based product containing 0.1 to 20 parts by weight of a styrene-based grafted polyethylene wax (B) obtained by grafting 1 to 90 parts by weight of a styrene monomer to 99 to 10 parts by weight of 2.0 dl/g polyethylene wax. A polymer composition is provided. The styrenic polymer used in the present invention is a homopolymer of styrene or a copolymer with acrylonitrile, butadiene, etc., and is called polystyrene, high impact polystyrene, styrene-acrylonitrile copolymer, or ABS with a molecular weight of 2 to It is a thermoplastic resin with a molecular weight of 30,000 or more or a low molecular weight polystyrene with a molecular weight of several hundred to tens of thousands. Polyethylene wax grafted with styrene monomer has an intrinsic viscosity of 0.06 dl/g to 2.0
dl/g, preferably 0.06 dl/g to 0.5 dl/g
(decalin solvent 135°C), products obtained by thermal decomposition of high-pressure polyethylene, high-pressure polymerized polyethylene wax obtained by radical polymerization of ethylene at high pressure, and also ethylene or ethylene and propylene, 1-butene, 1 -hexene, 4-methyl-1
- It is obtained by low-pressure polymerization of α-olefins such as pentene and 1-decene using a Ziegler type catalyst. The styrene monomers include styrene, α-methylstyrene, p-methylstyrene, p-methoxystyrene, m-methylstyrene, and the like. The amount of styrene monomer grafted onto the polyethylene wax is 99%.
1 to 10 parts by weight to 1 to 90 parts by weight. If the amount of styrene monomer grafted is less than 1 part by weight, it will have poor dispersibility when blended with styrenic polymer and will impair mechanical strength, so it is not preferable, whereas if the amount of styrenic monomer grafted exceeds 90 parts by weight. Even if it is blended with a styrene polymer, the mold releasability is not improved. Any known method can be used to graft the styrene monomer onto the polyethylene wax. For example, a method can be exemplified in which polyethylene wax is directly melted or dissolved in a solvent, and a styrene monomer is added with or without a radical initiator for grafting. As radical initiators, organic peroxides, organic peresters such as benzoyl peroxide, dichlorobenzoyl peroxide, dicumyl peroxide, di-
tert-butyl peroxide, 2,5-dimethyl-
2,5-di(peroxybenzoate)hexyne-3,1,4-bis(tert-butylperoxyisopropyl)benzene, lauroyl peroxide, tert-butyl peracetate, 2,5-dimethyl-2,5-di(tert- butylperoxy)hexane-3,2,5-dimethyl-2,5-di(tert-butylperoxy)hexane, tert-butyl penbenzoate, tert-butyl perphenylacetate, tert-butyl perisobutyrate,
These include tert-butyl per-sec-octoate, tert-butyl perpivalate, cumyl perpivalate and tert-butyl perdiethyl acetate, as well as other azo compounds such as azobis-isobutylnitrile, dimethylazoisobutyrate. Among these, dicumyl peroxide, di-tert-butyl peroxide, 2,5-dimethyl-2,5-
di(tert-butylperoxy)hexine-3,
Dialkyl peroxides such as 2,5-dimethyl-2,5-di(tert-butylperoxy)hexane and 1,4-bis(tert-butylperoxyisopropyl)benzene are preferred. The blending amount of the styrene-based graft polyethylene wax with respect to the styrene-based polymer is 0.1 to 20 parts by weight per 100 parts by weight of the styrene-based polymer.
The range is preferably from 0.5 to 10 parts by weight, particularly preferably from 0.5 to 5 parts by weight. If the blending amount is less than 0.1 part by weight, there is no improvement in mold release properties,
If the blending amount exceeds 20 parts by weight, strength may decrease and heat fixability may deteriorate. The styrenic graft polyethylene and the styrenic polymer can be mixed using known methods such as Henschel mixer, V
- Use directly after mixing with a blender or ribbon blender, or kneading and granulating with an extruder, etc., or melt-kneading with a Banbury mixer, single-screw or multi-screw extruder, kneader, etc., then granulate or crush. methods etc. can be adopted. In addition, the styrenic polymer may contain other additives within the range that does not impair the purpose of the present invention.
Inorganic substances such as dyes and pigments, glass fibers, carbon black, antistatic agents, weathering stabilizers, calcium carbonate, etc.
Polymers such as SBR, NBR, and styrene-maleic acid copolymer may also be added. If the styrenic polymer has a high molecular weight, the styrenic polymer composition of the present invention can be used not only in injection molding but also in molds, dies, etc. in blow molding, injection blow molding, compression molding, extrusion molding, rotation molding, etc.
It reduces adhesion to rolls, etc., improves work efficiency, and improves fluidity, so molded products with excellent appearance and dimensional accuracy can be obtained, and are useful for industrial parts and electrical appliance parts. On the other hand, if the resin has a low molecular weight, it has good heat fixability and improves adhesion to the fixing roll, so it is useful as a resin for electrophotographic toners. Hereinafter, the effects of the present invention will be explained in more detail with reference to Examples. Example 1 350 g of high-density polyethylene wax (trade name: Mitsui Hiwax 100P, manufactured by Mitsui Petrochemical Industries, Ltd.) having an intrinsic viscosity of 0.07 dl/g was charged into a glass reactor 1 and melted at 140°C. Next, 13 g of styrene monomer and 2.8 g of di-tert-butyl peroxide (hereinafter abbreviated as DTBPO) were added and reacted by heating for 6 hours, followed by degassing in a 5 mmHg vacuum for 1 hour to remove volatile components. , then cooled. The amount of styrene grafted in the obtained styrene-grafted polyethylene wax (hereinafter referred to as GR-) was 3.2 g per 100 g of styrene-grafted polyethylene wax. Next, the obtained GR-I and polystyrene (trade name: Toporex 500-51 manufactured by Mitsui Toatsu Chemical Co., Ltd.) were mixed into a first
After dry blending at the ratio shown in the table, the mixture was granulated using a 15 mmφ extruder (temperature set at 200°C). The granulated sample was molded into a square plate of 200 x 200 x 1 mm using a compression molding machine. Performance was evaluated using the method described below. Melt properties: Measured according to ASTM D 1238E. Tensile properties: Measured by ASTM D 638 method. Mold releasability: Depending on the condition when taking out the formed square plate from the metal frame, 5 indicates a state in which the square plate can be removed from the metal frame without resistance, and a state in which it cannot be removed without forcibly peeling between the square plate and the metal frame with a razor etc. 1, and the middle was divided into 3 stages, and the evaluation was performed on a 5-stage scale. Dispersibility: By visual inspection of the condition of the formed square plate, 1 indicates a state in which polyethylene wax agglomerates are visible in the formed square plate, 2 indicates a state in which no agglomerates are visible but is heterogeneous, and 2 indicates a state in which the formed square plate is homogeneous. As 3,
This was done using a three-level evaluation. Example 2 350 g of high-density polyethylene wax (trade name: Mitsui Hiwax 200P, manufactured by Mitsui Petrochemical Industries, Ltd.) having an intrinsic viscosity of 0.12 dl/g was charged into a glass reactor No. 1 and melted at 140°C. Next, 37.1 g of styrene monomer and 8.6 g of DTBPO were added and reacted by heating for 6 hours.
The volatiles were removed by degassing in a Hg vacuum for 1 hour and then cooled. The amount of styrene grafted in the obtained styrene-grafted polyethylene wax (hereinafter referred to as GR-) was 9.1 g per 100 g of styrene-grafted polyethylene wax.
Thereafter, it was mixed with polystyrene in the same manner as in Example 1 to obtain a composition, and its performance was evaluated. The results are shown in Table 1. Example 3 350 g of high-density polyethylene wax (trade name: Mitsui Hiwax 400P, manufactured by Mitsui Petrochemical Industries, Ltd.) having an intrinsic viscosity of 0.22 dl/g was charged into a glass reactor (No. 2) and melted at 140°C. Next, 742 g of styrene monomer and 180 g of DTBPO were added and reacted by heating for 6 hours.
The mixture was degassed in vacuum for 1 hour to remove volatile components, and then cooled. The amount of styrene grafted in the obtained styrene grafted polyethylene wax (hereinafter referred to as GR-) was 64 g in 100 g of styrene grafted polyethylene wax. Thereafter, it was mixed with polyethylene in the same manner as in Example 1 to obtain a composition, and its performance was evaluated. The results are shown in Table 1. Example 4 A graft reaction was carried out in the same manner as in Example 2, using p-methylstyrene instead of the styrene monomer. The amount of p-methylstyrene grafted in the obtained grafted polyethylene wax (hereinafter referred to as GR-) was 8.9 g per 100 g of grafted polyethylene wax. Example 1 below
A composition was obtained by mixing it with polystyrene in the same manner as above, and its performance was evaluated. The results are shown in Table 1. Comparative Examples 1 and 2 GR- and GR of Example 1 and Example 2
- Mitsui Hiwatukus in place of each
The same procedure as in Example 1 and Example 2 was carried out except that 100P and Mitsui Hiwax 200P were used. The results are shown in Table 1. Comparative Example 3 1 part by weight of commercially available low molecular weight polystyrene (trade name Hymer ST-95 manufactured by Sanyo Kasei Co., Ltd., molecular weight 1400) was added to 100 parts by weight of polystyrene (trade name Toporex 500-51 manufactured by Mitsui Toatsu Chemical Co., Ltd.). The mixture was dry blended in the same proportion as in Example 1, and then granulated in the same manner as in Example 1. Thereafter, a square plate was formed using a compression molding machine, and the performance was evaluated. The results are shown in Table 1.
【表】【table】
【表】
*:金型内部で成形角板が破壊
実施例5、比較例4、5
比較例3で用いた低分子量ポリスチレン93重量
部と実施例2で得られたGR―5重量部及びカ
ーボンブラツク(三菱化成工業(株)製MA―100)
2部とを130℃に加熱した3本ロールで4分間混
練した。その結果該混合物はロールに殆ど付着せ
ず、混練後もロールから容易に剥離できた。
それに対して、比較例3で用いた低分子量ポリ
スチレン98重量部に前記カーボンブラツク2重量
部を添加し、同様に3本ロールで混練したとこ
ろ、該混合物はロールに対する付着が著しく作業
性が非常に悪く、混練後もロールからの剥離が非
常に困難であつた。
一方、前記GR―の代わりに高密度ポリエチ
レンワツクス(商品名三井ハイワツクス200P:
三井石油化学工業(株)製)を用いた低分子量ポリス
チレン及びカーボンブラツクとの混合物はロール
に対する付着性は著しく改良されたが、該混合物
からのワツクスのブリードアウトが著しく実用に
供せなかつた。[Table] *: Molded square plate breaks inside the mold Example 5, Comparative Examples 4 and 5 93 parts by weight of low molecular weight polystyrene used in Comparative Example 3, GR-5 parts by weight obtained in Example 2 and carbon Black (MA-100 manufactured by Mitsubishi Chemical Industries, Ltd.)
2 parts were kneaded for 4 minutes using three rolls heated to 130°C. As a result, the mixture hardly adhered to the rolls and could be easily peeled off from the rolls even after kneading. On the other hand, when 2 parts by weight of the carbon black was added to 98 parts by weight of the low molecular weight polystyrene used in Comparative Example 3 and similarly kneaded using three rolls, the mixture showed significant adhesion to the rolls and was extremely difficult to work with. Unfortunately, it was very difficult to peel off from the roll even after kneading. On the other hand, high-density polyethylene wax (product name Mitsui Hiwax 200P:
A mixture of low molecular weight polystyrene and carbon black (manufactured by Mitsui Petrochemical Industries, Ltd.) had significantly improved adhesion to rolls, but wax bleed out from the mixture was so severe that it could not be put to practical use.
Claims (1)
極限粘度0.06dl/gないし2.0dl/gのポリエチ
レンワツクス99ないし10重量部に対してスチレン
系モノマーを1ないし90重量部グラフトしてなる
スチレン系グラフトポリエチレンワツクス(B)を
0.1ないし20重量部配合してなることを特徴とす
るスチレン系ポリマー組成物。1 Styrenic polymer (A): For 100 parts by weight,
Styrenic grafted polyethylene wax (B) obtained by grafting 1 to 90 parts by weight of a styrene monomer to 99 to 10 parts by weight of polyethylene wax with an intrinsic viscosity of 0.06 dl/g to 2.0 dl/g.
A styrenic polymer composition characterized by containing 0.1 to 20 parts by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3256381A JPS57147533A (en) | 1981-03-09 | 1981-03-09 | Styrene polymeric composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3256381A JPS57147533A (en) | 1981-03-09 | 1981-03-09 | Styrene polymeric composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57147533A JPS57147533A (en) | 1982-09-11 |
| JPH0241541B2 true JPH0241541B2 (en) | 1990-09-18 |
Family
ID=12362371
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3256381A Granted JPS57147533A (en) | 1981-03-09 | 1981-03-09 | Styrene polymeric composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57147533A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59191706A (en) * | 1983-04-15 | 1984-10-30 | Mitsui Petrochem Ind Ltd | Production of styrene monomer-grafted polyolefin wax |
| JPS60188463A (en) * | 1984-03-09 | 1985-09-25 | Mitsui Petrochem Ind Ltd | Aromatic polymer composition |
| KR100572282B1 (en) * | 1999-08-17 | 2006-04-19 | 제일모직주식회사 | ABS resin composition excellent in chemical resistance |
-
1981
- 1981-03-09 JP JP3256381A patent/JPS57147533A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57147533A (en) | 1982-09-11 |
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