JPH0241922B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a ceramic thin plate-shaped element, which allows a part of the electrodes on the front and back surfaces of the ceramic thin plate element to be easily short-circuited.

Conventionally, ceramic thin plate elements used for signal pick-up elements, etc. are often used by pasting them onto objects, and as shown in Figure 1, one side of the ceramic thin plate element 1 is equipped with a soldering plate for signal extraction. In order to attach the folded electrode 2 and establish conduction with the back electrode 3, the signal extraction electrode 2 is connected to the short-circuit electrode 4.
It is short-circuited to the back electrode 3 at. 5 is a surface electrode.

In order to actually produce such a ceramic element, first, the front surface electrode 5 and the signal extraction electrode 2 are screen printed, and after drying, the back surface electrode 3 is printed, and after drying, the shorting electrode 4 is printed with a brush or the like. was granted. For this reason, productivity was low and labor was required.

The manufacturing method of the present invention eliminates these conventional drawbacks and aims to achieve the original purpose without requiring the provision of electrodes for short circuiting as in the conventional method.

That is, the present invention will be described with reference to FIGS. 2 and 3, with the same numbers assigned to the same parts as above, and a front surface electrode 5, a signal extraction electrode 2, and a back surface electrode 5, a signal extraction electrode 2 and a back surface Electrode 3
After applying and baking, a through hole 6 is made in the portion of the signal extraction electrode 2 using a laser beam. At this time,
Parts of the ceramic thin plate element 1 and the electrodes 2 and 3 on the front and back surfaces are evaporated, and the evaporated electrodes 2 and 3 are
A part of the through hole 6 adheres to the inner surface of the through hole 6, and the electrode 2 and the electrode 3 are electrically connected to each other. By providing lead wires to the surface electrode 5 and the signal extraction electrode 2 of the ceramic element thus produced, it becomes possible to extract signals from both surfaces of the ceramic.

Next, specific examples will be given and explained. A thin plate sintered body (30φ) of PZT piezoelectric material is used as a ceramic.
x 0.15 tmm), and a baked silver electrode was applied in the shape shown in the figure using a screen printing method. The baking thickness is 10μ per side. Next, after baking at 700°C, a through hole with a diameter of 100μ was made using a laser beam. The resistance between electrodes 2 and 3 in FIGS. 2 and 3 of this ceramic element was several ohms. When the device according to this example was subjected to the same sensitivity test as the conventional device, no difference was found.

In addition to baking silver, the electrodes of the present invention can also be formed by a plating method, a vacuum evaporation method, or the like. The thickness of the ceramic thin plate element depends on the diameter of the through hole, but is approximately 1 mm.
If it is not below, the resistance value of short circuit will be large.

Furthermore, if the amount of electrodes attached to the inner wall of the through hole is small, the conduction resistance will increase, so the diameter of the through hole cannot be made very large. That is, although it depends on the thickness of the electrode, it is preferable that the ratio is 10 or less of the element thickness to the through hole diameter of 1.

According to the manufacturing method of the present invention, at the same time as the through hole is formed, the electrodes and ceramic components formed on the front and back surfaces evaporate under the high temperature of the laser beam and adhere to the inner wall of the through hole. This method creates electrical continuity between the electrodes on the back side and the electrodes on the back side, making it possible to form through holes and electrical continuity in the same process.
It is possible to short-circuit the electrodes on the front and back surfaces of a ceramic thin plate element with very good productivity, and is of great industrial value.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of a ceramic element made by the conventional method, FIG. 2 is a top view of a ceramic element made by the method of the present invention, and FIG. 3 is a sectional view taken along line A--A' in FIG. 1... Ceramic thin plate element, 2... Signal extraction electrode, 3... Back electrode, 5... Surface electrode, 6
...through hole.

Claims (1)

[Claims] 1. A ceramic element in which a through hole is formed in a part of a ceramic thin plate element with electrodes provided on the front and back surfaces using a laser beam, and the through hole establishes electrical continuity between the electrodes on the front and back surfaces. manufacturing method.