JPH0242406B2 - - Google Patents
Info
- Publication number
- JPH0242406B2 JPH0242406B2 JP18376483A JP18376483A JPH0242406B2 JP H0242406 B2 JPH0242406 B2 JP H0242406B2 JP 18376483 A JP18376483 A JP 18376483A JP 18376483 A JP18376483 A JP 18376483A JP H0242406 B2 JPH0242406 B2 JP H0242406B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- inspected
- light receiving
- receiving system
- reflection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000002159 abnormal effect Effects 0.000 claims description 34
- 230000003287 optical effect Effects 0.000 claims description 19
- 238000001514 detection method Methods 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 17
- 238000007689 inspection Methods 0.000 claims description 9
- 238000011179 visual inspection Methods 0.000 claims description 9
- 230000007547 defect Effects 0.000 description 12
- 238000005520 cutting process Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 230000007423 decrease Effects 0.000 description 5
- 239000000428 dust Substances 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 238000003754 machining Methods 0.000 description 4
- 239000002699 waste material Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 230000003111 delayed effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
- G01B11/303—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces using photoelectric detection means
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Description
【発明の詳細な説明】
技術分野
この発明は外観検査方法およびその装置に関す
る。DETAILED DESCRIPTION OF THE INVENTION Technical Field The present invention relates to a visual inspection method and apparatus.
従来技術
金属加工面、フイルム、圧延鉄板、LSI用Siウ
エハーなどの外観あるいは疵の有無の検査には、
従来より種々の方式の自動検査装置が用いられて
おり、その方式として例えば撮像管を用いる方
式、半導体ライン・センサーを用いる方式、走査
レーザー光による方式などが知られている。また
疵検出の方法にも、被検査面からの反射光量を2
値化してその大小により疵の有無を判別する単純
なものから、空間フイルタリング、回折パターン
のマツチング状態を調べる方法、あるいはホログ
ラフイー技術を応用するものなどがあるが、これ
らの方法のほとんどは、単に被検査面上における
疵の有無を判断するのみで、疵の凹凸状態までを
検出するものは少ない。Conventional technology Inspecting the appearance or presence of flaws on processed metal surfaces, films, rolled iron plates, Si wafers for LSI, etc.
Various types of automatic inspection devices have been used in the past, including, for example, a system using an image pickup tube, a system using a semiconductor line sensor, and a system using a scanning laser beam. In addition, the method of detecting defects involves increasing the amount of light reflected from the surface to be inspected by 2.
There are simple methods that convert the defect into values and determine the presence or absence of flaws based on their size, methods that use spatial filtering, methods that examine the matching state of diffraction patterns, and methods that apply holographic technology, but most of these methods are There are few methods that simply determine the presence or absence of flaws on the surface to be inspected and detect even the unevenness of the flaws.
また近年は、多品種・小ロツト生産の必要上、
FAが強力に推進されているが、そに伴つて加工
工程の途中など環境のあまり良くない場所で、如
上の自動検査装置が使用されることが多くなり、
凹状を呈する本来の加工疵に加えて、汚れ、切削
くず、ごみなどが被検査面上に付着して凸状を呈
し、これが誤判定の原因となり、結果的に自動検
査装置の信頼性を低下させることになる。 In addition, in recent years, due to the need for high-mix, small-lot production,
As FA is being strongly promoted, the automatic inspection equipment described above is increasingly being used in locations with poor environmental conditions, such as in the middle of the processing process.
In addition to the original machining defects that are concave, dirt, cutting chips, dust, etc. adhere to the surface to be inspected and create a convex shape, which causes false judgments and reduces the reliability of automatic inspection equipment. I will let you do it.
第1図は、従来より押なわれている外観検査方
式の1つであるレーザー走査型外観検査方式を示
す模式図で、He−Neレーザー(6328Å赤色)を
光源とするレーザー管1よりレーザー光が投光さ
れる。このレーザー光は全反射ミラー2で反射さ
れて、図中に矢符号Rで示す方向に所定の周期で
揺動する振動ミラー3に入射される。この振動ミ
ラー3の反射光は扇状に拡がりながら光走査用の
ビームとなるが、振動ミラー3上の反射点からの
距離が自己の焦点距離と等しくなる位置に置かれ
た対物レンズ4を挿通することにより、扇状から
平行に走査されるビームに変換されたのち、被検
査面S上に照射される。被検査面Sからの反射光
は、幾何光学的な反射の法則(スネルの法則)を
満たすような、直反射光を中心に被検査面S上の
ランダムな粗さに起因して散乱された拡散反射光
のほか、被検査面Sの粗さが加工方法によつてあ
る程度の規則性をもつときに、その規則性が回折
格子として作用するために生じる回折光による拡
がりを含んでいる。しかし、概して一様(正常)
な被検査面Sからの反射光は、直反射方向を中心
するかなり小さな立体角内に収まる。また直反射
光、拡散反射光、回折光成分の割合いは、被検査
面Sの加工方法によつて異なるが、一般に光の波
長に比べて被検査面Sの面粗さが大きくなる程、
直反射成分が減り拡散反射成分が増大する傾向を
示す。 Figure 1 is a schematic diagram showing the laser scanning type visual inspection method, which is one of the conventional visual inspection methods. is projected. This laser beam is reflected by a total reflection mirror 2 and is incident on a vibrating mirror 3 that swings at a predetermined period in a direction indicated by an arrow mark R in the figure. The reflected light from the vibrating mirror 3 spreads into a fan-shaped beam for optical scanning, and passes through an objective lens 4 placed at a position where the distance from the reflection point on the vibrating mirror 3 is equal to its own focal length. As a result, the fan-shaped beam is converted into a parallel scanning beam, and then the surface S to be inspected is irradiated. The reflected light from the surface to be inspected S is scattered due to random roughness on the surface S to be inspected, mainly direct reflected light that satisfies the geometrical optical law of reflection (Snell's law). In addition to the diffusely reflected light, when the roughness of the surface S to be inspected has a certain degree of regularity due to the processing method, it includes the spread due to the diffracted light that occurs because the regularity acts as a diffraction grating. However, it is generally uniform (normal)
The reflected light from the inspected surface S falls within a fairly small solid angle centered on the direction of direct reflection. In addition, the proportions of the direct reflected light, diffuse reflected light, and diffracted light components vary depending on the processing method of the inspected surface S, but in general, the larger the surface roughness of the inspected surface S compared to the wavelength of the light, the more
It shows a tendency for the direct reflection component to decrease and the diffuse reflection component to increase.
一方、被検査面Sの疵からの反射においては、
直反射光のネスルの法則による反射方向は、
正常な被検査面Sの場合の反射方向と異つたも
のになる。 On the other hand, in the case of reflection from a flaw on the inspected surface S, the direction of reflection according to Nestl's law of directly reflected light is:
The direction of reflection is different from the direction of reflection in the case of a normal surface S to be inspected.
疵エツジなどからの回折に起因する反射光の
拡がりが加わる。 This also adds to the spread of reflected light due to diffraction from flawed edges.
という2つの特徴的な現象がみられる。これら2
つの現象によつて、疵からの反射の場合のビーム
の反射方向および拡がりの立体角は、正常な被検
査面Sでの反射のさいの反射方向および立体角と
大きく異なることになる。したがつて、この場合
に受光レンズ6に入る光は、一般には、正常反射
時の入光量に比べて減少する傾向を示す(ただ
し、疵の種類によつては、正常反射方向に鋭い指
向性を有する場合もある)。There are two characteristic phenomena. These 2
Due to two phenomena, the direction of reflection of the beam and the solid angle of its spread in the case of reflection from a flaw are significantly different from the direction of reflection and the solid angle of the beam in the case of reflection on a normal surface S to be inspected. Therefore, in this case, the amount of light entering the light receiving lens 6 generally tends to decrease compared to the amount of light incident during normal reflection (however, depending on the type of flaw, there may be a sharp directivity in the direction of normal reflection). ).
被検査面Sに関するこのような情報を含む反射
光は受光レンズ6により集光され、光彩絞り7、
レンズ8、干渉フイルター9を通過して光電子増
倍管10により光電変換され、その受光量は電圧
の大小として検出される。光彩絞り7は、被検査
面Sの反射点から受光部を見込む立体角(疵検出
性能は、この立体角に大きく依存する)を適当に
制限し、レンズ8はレンズ6により受光した光の
収束をさらに強める。干渉フイルター9は、レン
ズ8を通過した光の中から単一波長光(6328Å)
を取り出し、外乱光による雑音を除去して良好な
S/Nの疵情報が得られるようにするためのもの
である。光電子増倍管10より取り出された電圧
信号は、被検査面Sにおける反射状態を対応して
変化するので、増幅器11で増幅したその信号波
形を観測することにより、正常反斜面か異常反射
面かの判定、すなわち被検査面Sにおける疵の有
無の判定が行われる。 The reflected light containing such information regarding the surface to be inspected S is collected by a light receiving lens 6,
The light passes through a lens 8 and an interference filter 9 and is photoelectrically converted by a photomultiplier tube 10, and the amount of received light is detected as the magnitude of voltage. The iris diaphragm 7 appropriately limits the solid angle at which the light receiving section is viewed from the reflection point of the inspection surface S (flaw detection performance largely depends on this solid angle), and the lens 8 converges the light received by the lens 6. further strengthen. The interference filter 9 extracts a single wavelength light (6328 Å) from the light that has passed through the lens 8.
This is to remove noise caused by ambient light and obtain defect information with a good S/N ratio. The voltage signal taken out from the photomultiplier tube 10 changes correspondingly to the reflection state on the surface S to be inspected, so by observing the signal waveform amplified by the amplifier 11, it can be determined whether it is a normal reverse slope or an abnormal reflective surface. That is, the presence or absence of flaws on the surface S to be inspected is determined.
以上が、従来行われている疵検出方法の1つで
あるフライング・スポツトレーザー走査方式であ
るが上記の説明で明らかな通り、この方式は疵の
凹凸状態までを判別をするものではない。 The above is a flying spot laser scanning method, which is one of the conventional flaw detection methods, but as is clear from the above explanation, this method does not discriminate even the unevenness of flaws.
目 的
この発明は、被検査面の疵の有無の判別だけで
なく、疵と判断された箇所の凹凸状態をも同時に
検出して、如上の従来例にみられるような被検査
面に付着したごみ、切削くず、研削くず、汚れな
どによる誤判定を回避し、検査の信頼性の向上お
よび装置のメインテナンス、走査性の向上をはか
ることのできる外観検査方法およびその装置を提
供することを目的とする。Purpose This invention not only determines the presence or absence of a flaw on a surface to be inspected, but also simultaneously detects the unevenness of a location determined to be a flaw, thereby eliminating the problem of adhesion to the surface to be inspected, as seen in the conventional example described above. The purpose of the present invention is to provide a visual inspection method and device that can avoid erroneous judgments due to dust, cutting chips, grinding chips, dirt, etc., and improve inspection reliability, equipment maintenance, and scanning performance. do.
概 要
本発明は、投受光系が含まれる面を挾む左右に
補助光学系を分配して、前記受光系による受光量
からの被検査面における以上反射の有無を判別す
る一方、2つの補助光学系の間での受光量変化時
刻の差から被検査面上の凹凸状態を判別するもの
である。Overview The present invention distributes auxiliary optical systems on the left and right sides of a surface including a light projecting and receiving system, and determines the presence or absence of reflection on a surface to be inspected based on the amount of light received by the light receiving system. The uneven state on the surface to be inspected is determined from the difference in the time of change in the amount of received light between the optical systems.
実施例
この発明の一実施例を第2図ないし第9図に基
づいて以下に説明する。Embodiment An embodiment of the present invention will be described below with reference to FIGS. 2 to 9.
第2図において、12はフライング・スポツト
レーザー走査方式の外観検査機構の投光系であつ
て、レーザー管1、全反射ミラー2、振動ミラー
3、対物レンズ4などからなり、13はその外観
検査機構の受光系で、受光レンズ6、光電子増倍
管10、増幅器11などからなる。この投受光系
は、第1図に示す従来のフライング・スポツトレ
ーザー走査方式の光学系と同一の構成であつて、
各構成要素の符号は第1図のものと同じにしてい
る。第2図では、概略の構成のみを示すため、受
光系13において第1図のような光彩絞り7、レ
ンズ8、干渉フイルター9などは省略している。
そして、この投受光系は、被検査面Sを第2図に
おいて紙面に対し垂直な方向に光走査する。 In FIG. 2, 12 is a light projection system of a flying spot laser scanning type visual inspection mechanism, which includes a laser tube 1, a total reflection mirror 2, a vibrating mirror 3, an objective lens 4, etc., and 13 is a light projection system for the visual inspection mechanism. The light receiving system of the mechanism includes a light receiving lens 6, a photomultiplier tube 10, an amplifier 11, etc. This light emitting/receiving system has the same configuration as the conventional flying spot laser scanning system shown in FIG.
The reference numerals of each component are the same as those in FIG. In FIG. 2, since only a schematic configuration is shown, the iris diaphragm 7, lens 8, interference filter 9, etc. shown in FIG. 1 in the light receiving system 13 are omitted.
This light emitting/receiving system optically scans the surface S to be inspected in a direction perpendicular to the plane of the drawing in FIG.
この発明は以上の投受光系に加えて、この投受
光系が含まれる面、(第2図における紙面)を挟
む左右に第1および第2の補助受光系14,15
を分けて配置し、前記受光系13による受光量か
ら被検査面Sにおける異常反射の有無を判別する
一方、2つの補助受光系14,15の間で生じる
後述する受光量変化時刻の差から被検査面Sの凹
凸状態を判別するものである。 In addition to the above-mentioned light emitting and receiving system, the present invention includes first and second auxiliary light receiving systems 14 and 15 on the left and right sides of the plane in which this light emitting and receiving system is included (the plane of the paper in FIG. 2).
The presence or absence of abnormal reflection on the surface S to be inspected is determined based on the amount of light received by the light receiving system 13, and the presence or absence of abnormal reflection on the surface S to be inspected is determined based on the difference in the time of change in the amount of received light occurring between the two auxiliary light receiving systems 14 and 15, which will be described later. This is to determine the uneven state of the inspection surface S.
この実施例では2つの補助受光系14,15
は、第2図において矢符号−の方向からみた
状態を示す第3図のように、先の投受光系が含ま
れる面に対して垂直な面(第3図における紙面と
平行な面)内、すなわち光走査方向Pと平行な面
内にあつて、被検査面Sに異常反射が生じた場
合、その異常反射成分を補助受光系14,15で
それぞれ受光する。補助受光系14は受光レンズ
16、光電子増倍管17、増幅器18からなり、
補助受光系15は受光レンズ19、光電子増倍管
20、増幅器21からなる。 In this embodiment, two auxiliary light receiving systems 14 and 15 are used.
is in a plane perpendicular to the plane containing the light emitting/receiving system (a plane parallel to the plane of the paper in Fig. 3), as shown in Fig. 3, which shows the state seen from the direction of the arrow mark - in Fig. 2. That is, when abnormal reflection occurs on the surface S to be inspected in a plane parallel to the optical scanning direction P, the abnormal reflection components are received by the auxiliary light receiving systems 14 and 15, respectively. The auxiliary light receiving system 14 includes a light receiving lens 16, a photomultiplier tube 17, and an amplifier 18.
The auxiliary light receiving system 15 includes a light receiving lens 19, a photomultiplier tube 20, and an amplifier 21.
受光系13、補助受光系14,15の各増幅器
11,18,21より取り出された電圧信号は、
第4図に示す信号処理系によつて処理され、その
処理結果により、被検査面Sにおける疵の有無お
よび疵の凹凸状態が判定される。 The voltage signals taken out from each amplifier 11, 18, 21 of the light receiving system 13 and auxiliary light receiving systems 14, 15 are as follows.
It is processed by the signal processing system shown in FIG. 4, and based on the processing results, the presence or absence of flaws on the surface S to be inspected and the uneven state of the flaws are determined.
被検査面Sが疵や汚れなどのない正常反射面の
場合、投光系12より被検査面Sに照射された光
は、ほぼ正常反射方向すなわち受光系13に向け
て反射され、補助受光系14,15の方向へはほ
とんど反射されない。 When the surface S to be inspected is a normal reflective surface without scratches or dirt, the light irradiated onto the surface S to be inspected from the light projection system 12 is almost reflected in the normal reflection direction, that is, toward the light receiving system 13, and is reflected in the auxiliary light receiving system. Almost no light is reflected in the directions 14 and 15.
これに対して被検査面Sが異常反射面である場
合には、正常反射方向への反射光量が減少する一
方、補助受光系14,15が含まれる面の方向へ
の反射光量が増大し、その反射パターンは第6図
および第7図のようになる。すなわち、第6図
A,Bは被検査面Sに切削くず、研削くず、汚れ
の付着などによる凸状部がある場合の反射パター
ンを示し、反射メインビームは光走査の進行に伴
い、始め第6図Aのように光走査方向Pの開始側
へ反射して主として補助受光系14で受光され、
しだいに光走査方向Pの終了側へ反射方向が移つ
て第6図Bのように主として補助受光系15で受
光される。一方、第7図A,Bは被検査面Sに加
工疵などの凹状部がある場合の反射パターン示
し、凸状部の場合とは逆に反射メインビームは光
走査の進行に伴い、始め第7図Aのように光走査
方向Pの終了側へ反射して主として補助受光系1
5で受光され、反射方向はしだいに光走査方向P
の開始側へ移つて第7図Bのように主として補助
受光系14で受光される。このことは、異常反射
の場合において、受光量のピーク時が、光走査方
向Pの終力側に位置する補助受光系15で先にき
て、光走査方向Pの開始側の補助受光系14では
これより少し遅れるときには、被検査面Sに凹状
疵があると判断され、逆に光走査方向Pの開始側
の補助受光系14において受光量のピークが先に
生じるときには、被検査面Sに凸状部を呈する切
削くずなどが付着していると判断されことを意味
する。 On the other hand, when the inspected surface S is an abnormal reflection surface, the amount of reflected light in the normal reflection direction decreases, while the amount of reflected light in the direction of the surface including the auxiliary light receiving systems 14 and 15 increases, The reflection pattern is as shown in FIGS. 6 and 7. That is, FIGS. 6A and 6B show reflection patterns when there is a convex part on the surface S to be inspected due to adhesion of cutting waste, grinding waste, dirt, etc., and the reflected main beam initially changes as the optical scanning progresses. As shown in FIG. 6A, the light is reflected toward the start side of the light scanning direction P and is mainly received by the auxiliary light receiving system 14,
The reflection direction gradually shifts to the end side of the optical scanning direction P, and the light is mainly received by the auxiliary light receiving system 15 as shown in FIG. 6B. On the other hand, FIGS. 7A and 7B show reflection patterns when there is a concave part such as a processing flaw on the surface S to be inspected.Contrary to the case where there is a convex part, the reflected main beam starts at the beginning as the optical scanning progresses. 7 As shown in Fig. 7A, the light is reflected toward the end side of the light scanning direction
5, and the direction of reflection gradually changes to the optical scanning direction P.
Moving to the start side, the light is mainly received by the auxiliary light receiving system 14 as shown in FIG. 7B. This means that in the case of abnormal reflection, the peak of the amount of received light comes first in the auxiliary light receiving system 15 located on the final power side in the optical scanning direction P, and in the auxiliary light receiving system 15 on the starting side in the optical scanning direction P. If it is a little later than this, it is determined that there is a concave flaw on the surface S to be inspected, and conversely, if the peak of the amount of light received occurs first in the auxiliary light receiving system 14 on the starting side of the optical scanning direction P, the surface S to be inspected is judged to have a concave flaw. This means that it is determined that there is cutting waste or the like that has a convex shape attached to it.
前記信号処理系では、受光系13の電圧信号a
を増幅器22で受けて、異常反射の有無を判断す
る判定系と、補助受光系14の電圧信号bを増幅
器23により、また補助受光系15の電圧信号c
を増幅器24によりそれぞれ受けて、異常反射が
被検査面Sの凹状によるか凸状によるかを判断す
る判定系とを有する。増幅器22の出力a′は疵の
有無あるいは異常反射の有無を検出するための比
較器25に入力され、ここで所定の基準レベルと
比較される。例えば、異常反射のあるときには受
光系13の受光量は減少し、比較器25への入力
信号a′のレベルが前記基準レベルを下まわり、比
較器25の出力dは異常反射があることに相当す
るL信号となる。前記基準レベルは、最小どの程
度の大きさまでの疵を検出するかによつて設定レ
ベルが異る。 In the signal processing system, the voltage signal a of the light receiving system 13 is
is received by an amplifier 22 to determine the presence or absence of abnormal reflection, and the voltage signal b of the auxiliary light receiving system 14 is received by the amplifier 23, and the voltage signal c of the auxiliary light receiving system 15 is
is received by the amplifier 24 and determines whether the abnormal reflection is due to the concave or convex shape of the surface S to be inspected. The output a' of the amplifier 22 is input to a comparator 25 for detecting the presence or absence of a flaw or abnormal reflection, and is compared with a predetermined reference level here. For example, when there is an abnormal reflection, the amount of light received by the light receiving system 13 decreases, the level of the input signal a' to the comparator 25 falls below the reference level, and the output d of the comparator 25 corresponds to the presence of an abnormal reflection. This results in an L signal. The setting level of the reference level differs depending on the minimum size of the flaw to be detected.
増幅器22の出力a′、これと平行して計測タイ
ミング・セツト用比較器26および異常反射区間
検出用比較器27へそれぞれ入力される。比較器
26において信号a′と比較される基準レベルは、
異常反射時の信号a′のピークレベルよりもさらに
暗レベル側に近く設定され、これによつて投光系
12からのレーザー光が被検査面Sを正味照射す
る走査区間が計測区間として検出される。比較器
27において信号a′と比較される基準レベルVth
は、第8図Aおよび第9図Aに示すように、明レ
ベル付近すなわち受光系13の受光量増大に対応
するレベル側に近く設定され、受光量の減少がは
じまると、すなわち異常反射が起ると直ちに異常
反射区間の検出が開始されるようになつている。
比較器25および26の出力d,eは次段の疵有
無判別部28へ入力され、その判定出力fは最終
段の総合判定部29へ入力される。一方、異常反
射区間検出用比較器27の出力gは別の比較部3
0へ入力される。なお、第8図A〜Hは、被検査
面Sの凹状疵に起因する異常反射の場合の、前記
信号処理系の各部の出力波形を示し、第9図A〜
Hは、凸状疵(切削くず、ごみの付着など)に起
因する異常反射の場合の信号処理系の各部の出力
波形を示している。 The output a' of the amplifier 22 is input in parallel to a measurement timing setting comparator 26 and an abnormal reflection section detection comparator 27, respectively. The reference level compared with the signal a' in the comparator 26 is:
It is set closer to the dark level side than the peak level of the signal a' at the time of abnormal reflection, so that the scanning section in which the laser beam from the projection system 12 netly irradiates the surface S to be inspected is detected as the measurement section. Ru. Reference level Vth compared with signal a′ in comparator 27
As shown in FIGS. 8A and 9A, is set near the bright level, that is, near the level corresponding to an increase in the amount of light received by the light receiving system 13, and when the amount of received light begins to decrease, that is, abnormal reflection occurs. Detection of the abnormal reflection section starts immediately.
The outputs d and e of the comparators 25 and 26 are input to the flaw presence/absence determining section 28 at the next stage, and the determination output f thereof is input to the comprehensive determining section 29 at the final stage. On the other hand, the output g of the abnormal reflection section detection comparator 27 is
Input to 0. Note that FIGS. 8A to 8H show output waveforms of each part of the signal processing system in the case of abnormal reflection caused by a concave flaw on the surface to be inspected S, and FIGS.
H indicates the output waveform of each part of the signal processing system in the case of abnormal reflection caused by a convex flaw (cutting chips, adhesion of dust, etc.).
他方、増幅器23の出力b′は微分器31で微分
処理され、その微分出力hは次段のゼロクロス検
出器32へ入力される。増幅器24の出力c′も同
様に微分器33で微分処理され、その部分出力j
は次段のゼロクロス検出器34へ入力される。 On the other hand, the output b' of the amplifier 23 is differentiated by a differentiator 31, and the differentiated output h is input to the next stage zero-cross detector 32. The output c' of the amplifier 24 is similarly differentiated by a differentiator 33, and its partial output j
is input to the next stage zero cross detector 34.
第6図のように補助受光系14の配置側から補
助受光系15の配置側へ向けて光走査が行われて
いるとき、被検査面Sに凸状疵(切削くず、ごみ
の付着など)がある場合の信号処理を、第8図A
〜Hに基づいて説明すれば以下のようになる。 When light scanning is performed from the side where the auxiliary light receiving system 14 is placed to the side where the auxiliary light receiving system 15 is placed as shown in FIG. Figure 8A shows the signal processing when
The explanation based on ~H is as follows.
第8図Bのように比較器27が異常反射区間の
検出を開始すると、はじめ同図Cのように補助受
光系14に対応する信号b′にパルス波形が生じ、
これが微分器31により同図Eのような微分信号
hに処理される。ゼロクロス検出器32では、入
力される微分信号hがゼロレベルとクロスする時
点tRにのみ同図Eのような単発パルス波形の出力
kを得て、この出力信号kは次段の比較部30へ
入力される。第6図A,Bに示されるように、異
常反射光の補助受光系15での受光は補助受光系
14より遅れるので、第8図Fのように補助受光
系15に対応する信号c′にパルス波形が生じるの
は異常反射検出区間において時点tRより少し遅れ
た時点となる。この信号c′も同様に微分器33で
同図Gのような微分信号jに処理され、次段のゼ
ロクロス検出器34では、微分信号jがゼロレベ
ルとクロスする時点tLで同図Hのような単発パル
ス波形の出力mを得て、この出力信号mは比較部
30へ入力される。比較部では、補助受光系14
に対応する出力kと補助受光系15に対応する出
力mの単発パルス波形発生時点tR,tLの先後が比
較され、その比較結果は次段の凹凸判定回路35
へ入力される。 When the comparator 27 starts detecting the abnormal reflection section as shown in FIG. 8B, a pulse waveform is first generated in the signal b' corresponding to the auxiliary light receiving system 14 as shown in FIG.
This is processed by the differentiator 31 into a differential signal h as shown in FIG. The zero cross detector 32 obtains an output k of a single pulse waveform as shown in FIG . is input to. As shown in FIGS. 6A and 6B, the reception of the abnormally reflected light by the auxiliary light receiving system 15 is delayed from that of the auxiliary light receiving system 14, so that the signal c' corresponding to the auxiliary light receiving system 15 as shown in FIG. The pulse waveform is generated at a time a little later than time tR in the abnormal reflection detection section. This signal c' is similarly processed by the differentiator 33 into a differential signal j as shown in G in the same figure, and in the next stage zero cross detector 34, the differential signal j crosses the zero level at the time t L as shown in H in the same figure. An output m having such a single pulse waveform is obtained, and this output signal m is input to the comparator 30. In the comparison section, the auxiliary light receiving system 14
The output k corresponding to the auxiliary light receiving system 15 and the output m corresponding to the auxiliary light receiving system 15 are compared before and after the single pulse waveform generation time t R , t L , and the comparison result is sent to the unevenness determination circuit 35 in the next stage.
is input to.
以上の場合と異なり、被検査面Sに凹状疵があ
る場合の信号処理では、第9図C〜EおよびF〜
Hに示すように、出力k,mの単発パルス波形発
生時点tR,tLの先後は先の場合とは逆にtR>tLと
なる。 Unlike the above case, in the signal processing when there is a concave flaw on the surface to be inspected S, FIG.
As shown in H, before and after the single pulse waveform generation times t R and t L of the outputs k and m, t R >t L , contrary to the previous case.
第8図および第9図による説明では、補助受光
系14の配置側から補助受光系15の配置側へ向
けて光走査が行われる場合を例示したので、被検
査面Sの凸状疵に対してtL>tR、凹状疵に対して
tL<tRという結果が得られたが、光走査方向が前
記と逆の場合は、被検査面Sの凹凸とtR,tLの先
後の関係は全く逆になる。そこで、第4図に示す
信号処理系では、投光系12の振動ミラー3に付
属の図示しないタコ・ゼネレータから振動ミラー
3の揺動方向に関する2値信号nを得て、これが
比較器36で所定の基準レベルと比較され、その
比較結果は走査方向判別信号qとして凹凸判定回
路35へ入力されるようになつている。例えば、
この実施例では、第6図および第7図のように補
助受光系14の配置側から補助受光系15の配置
側へ走査されるとき(左方向)、前記走査方向判
別信号qはH信号となり、逆に右方向へ走査され
るとき走査方向判別信号qはL信号となるように
設定される。 In the explanations with reference to FIGS. 8 and 9, the case where light scanning is performed from the side where the auxiliary light receiving system 14 is arranged to the side where the auxiliary light receiving system 15 is arranged is illustrated, so that convex defects on the surface S to be inspected can be t L > t R , for concave defects
Although a result of t L <t R was obtained, if the optical scanning direction is opposite to that described above, the relationship between the unevenness of the surface to be inspected S and t R and t L is completely reversed. Therefore, in the signal processing system shown in FIG. It is compared with a predetermined reference level, and the comparison result is input to the unevenness determination circuit 35 as a scanning direction determination signal q. for example,
In this embodiment, when scanning is performed from the side where the auxiliary light receiving system 14 is placed to the side where the auxiliary light receiving system 15 is placed as shown in FIGS. 6 and 7 (leftward direction), the scanning direction discrimination signal q becomes an H signal. On the contrary, when scanning is performed in the right direction, the scanning direction determination signal q is set to be an L signal.
凹凸判定回路35の判定出力および疵有無判別
部28の判定出力fを受けて、総合判定部29で
は、被検査面Sに加工疵など凹状疵の存在を知ら
せる凹状判定信号rおよび切削くずやごみなどの
付着を知らせる凸状判定信号uが出力される。異
常反射の起らない場合には、これらの判定信号
r,uは出力されない。 In response to the determination output of the unevenness determination circuit 35 and the determination output f of the flaw presence/absence determination section 28, the comprehensive determination section 29 outputs a concave determination signal r that indicates the presence of concave defects such as machining defects on the surface S to be inspected, as well as cutting chips and dirt. A convexity determination signal u is output to notify of adhesion. If no abnormal reflection occurs, these determination signals r and u are not output.
一方、第4図の信号処理系では、受光系13に
対応する信号a′、補助受光系14,15に対応す
る信号b′およびc′がアナログ加算器37により加
算されて、その加算出力vが総合判定部29へ入
力される。この加算出力vは、光吸収性を有する
被検査面S上の汚れとほかの疵、ごみなどの非吸
収性の欠陥との識別に供される。すなわち、被検
査面Sに光吸収性を有する汚れが存在するとき
は、受光系13の受光量が大幅に低減するので、
疵有無判別部28の出力fは異常反射の場合に似
た出力波形を示す一方、補助受光系14,15で
も異常反射光は受光されないため、凹凸判定回路
35からは凹凸の判定結果は得られない。この場
合、アナログ加算器37の加算出力vのレベルが
非吸収性の欠陥の場合に比べて低くなるから、総
合判定部29において所定の基準レベルと比較す
ることにより、汚れ判定信号wが得られる。被検
査面Sの欠陥が非吸収性の場合は、被検査面Sが
正常面である場合と反射率は変らないので、この
ときの加算出力vのレベルは正常面の場合と同程
度となる。 On the other hand, in the signal processing system shown in FIG. 4, a signal a' corresponding to the light receiving system 13 and signals b' and c' corresponding to the auxiliary light receiving systems 14 and 15 are added by an analog adder 37, and the added output v is input to the comprehensive determination section 29. This addition output v is used to distinguish between light-absorbing stains on the inspected surface S and non-absorbing defects such as other flaws and dust. That is, when there is light-absorbing dirt on the surface S to be inspected, the amount of light received by the light receiving system 13 is significantly reduced.
While the output f of the flaw determination unit 28 shows an output waveform similar to that in the case of abnormal reflection, the abnormal reflection light is not received by the auxiliary light receiving systems 14 and 15, so the unevenness determination circuit 35 cannot obtain an unevenness determination result. do not have. In this case, since the level of the addition output v of the analog adder 37 is lower than that in the case of a non-absorbing defect, the overall judgment section 29 compares it with a predetermined reference level to obtain the dirt judgment signal w. . When the defect on the inspected surface S is non-absorbing, the reflectance is the same as when the inspected surface S is a normal surface, so the level of the added output v in this case is about the same as when the inspected surface S is a normal surface. .
補助受光系14および15にそれぞれ対応する
ゼロクロス検出器32および34の出力k,mの
単発パルス波形発生時点tR,tLの先後を判定する
比較部30の具体的な回路構成の一例を第5図に
示している。同図において、PRは図示しないパ
ルス発生回路より出力されるリセツト・パルスで
あり、異常反射区間検出出力gの立上りエツジに
おいてパルス幅の短かい(0.1μsec以下)単発波
形として得られる。このリセツト・パルスPRを
受けて図中の全てのフリツプ・フロツプF1〜F6
はリセツトされ、ゼロクロス検出器32および3
4の出力k,mの受入れの可能な待機状態とな
る。出力k,mがともに入力されたあとは、この
2つの信号k,mのいずれが早く入力されたかに
依存して、フリツプ・フロツプF3,F6の一方が
セツト状態となり、他方はリセツト状態を保つ。
この状態によつてtR,tLの大小関係が判定される
ことになる。第6図に示す例では、tL<tRの場
合、フリツプ・フロツプF3がセツトされ、tL>tR
の場合、フリツプ・フロツプF6がセツトされる。 An example of a specific circuit configuration of the comparator 30 that determines whether the outputs k, m of the zero-cross detectors 32 and 34 corresponding to the auxiliary light receiving systems 14 and 15, respectively, are ahead of or after the single pulse waveform generation time points t R and t L will be described below. It is shown in Figure 5. In the figure, P R is a reset pulse output from a pulse generation circuit (not shown), and is obtained as a single waveform with a short pulse width (0.1 μsec or less) at the rising edge of the abnormal reflection section detection output g. In response to this reset pulse PR , all flip-flops F1 to F6 in the figure
is reset and zero cross detectors 32 and 3
A standby state is entered in which outputs k and m of No. 4 can be accepted. After both outputs k and m are input, one of the flip-flops F 3 and F 6 is in the set state, and the other is in the reset state, depending on which of the two signals k and m is input earlier. keep it.
Based on this state, the magnitude relationship between t R and t L is determined. In the example shown in FIG. 6, if t L <t R , flip-flop F 3 is set, and if t L > t R
If , flip-flop F6 is set.
効 果
この発明によれば、被検査面への切削くず、ご
みなどの付着あるいは加工きずなどに起因する異
常反射の有無を判別できるだけでなく、その異常
反射が被検査面の凹状個所の存在によるものか凸
状個所の存在によるものかをも判別できるので、
加工きずの存在(凹状個所)や切削くず、ごみな
どの付着(凸状個所)を識別することが可能とな
り、外観検査の信頼性が大幅に向上する。Effects According to the present invention, it is possible not only to determine the presence or absence of abnormal reflections caused by adhesion of cutting chips, dust, etc. to the surface to be inspected, or machining scratches, but also to determine whether the abnormal reflections are caused by the presence of concave portions on the surface to be inspected. It is also possible to determine whether the problem is due to the presence of a convex part or a convex part.
It is now possible to identify the presence of machining flaws (concave areas) and adhesion of cutting waste, dirt, etc. (convex areas), greatly improving the reliability of visual inspection.
とくに実施例の装置のように、受光系13およ
び補助受光系14,15のそれぞれの検出出力を
アナログ加算器37で加算して、その出力を欠陥
判定情報の1つに加えることにより、その出力レ
ベルから光吸収性を呈する汚れなどによる異常反
射をも識別することができ、検査精度を一層向上
させることができる。 In particular, as in the device of the embodiment, the detection outputs of the light receiving system 13 and the auxiliary light receiving systems 14 and 15 are added together by the analog adder 37, and the output is added to one piece of defect determination information. Abnormal reflection due to light-absorbing dirt or the like can also be identified from the level, further improving inspection accuracy.
第1図は従来の外観検査方式の一例を示す模式
図、第2図はこの発明の一実施例の光学系を示す
模式図、第3図は第2図の−線矢視図、第4
図は信号処理系のブロツク図、第5図は信号処理
系の比較部の具体的構成の一例を示す回路図、第
6図A,Bおよび第7図A,Bはそれぞれ異常反
射の場合の反射パターンを示す説明図、第8図A
〜Hおよび第9図A〜Hはそれぞれ信号処理系の
各部の出力波形図である。
1……レーザー管、2……全反射ミラー、3…
…振動ミラー、4……対物レンズ、6……受光レ
ンズ、10……光電子増倍管、11……増幅器、
12……投光系、13……受光系、14,15…
…補助受光系、16……受光レンズ、17……光
電子増倍管、19……受光レンズ、20……光電
子増倍管、21……増幅器、25……比較器(異
常反射検出用)、26……比較器(計測タイミン
グ・セツト用)、27……比較器(異常反射区間
検出用)、28……疵有無判別部、29……総合
判別部、30……比較部、31,33……微分
器、32,34……ゼロクロス検出器、35……
凹凸判定回路。
FIG. 1 is a schematic diagram showing an example of a conventional visual inspection method, FIG. 2 is a schematic diagram showing an optical system according to an embodiment of the present invention, FIG. 3 is a view taken along the - line in FIG. 2, and FIG.
The figure is a block diagram of the signal processing system, Figure 5 is a circuit diagram showing an example of a specific configuration of the comparing section of the signal processing system, and Figures 6A and B and Figures 7A and B are respectively for cases of abnormal reflection. Explanatory diagram showing the reflection pattern, Fig. 8A
-H and FIGS. 9A-H are output waveform diagrams of each part of the signal processing system, respectively. 1... Laser tube, 2... Total reflection mirror, 3...
... Vibration mirror, 4 ... Objective lens, 6 ... Light receiving lens, 10 ... Photomultiplier tube, 11 ... Amplifier,
12... Light emitting system, 13... Light receiving system, 14, 15...
... Auxiliary light receiving system, 16 ... Light receiving lens, 17 ... Photomultiplier tube, 19 ... Light receiving lens, 20 ... Photomultiplier tube, 21 ... Amplifier, 25 ... Comparator (for abnormal reflection detection), 26... Comparator (for measurement timing/setting), 27... Comparator (for abnormal reflection section detection), 28... Flaw presence/absence discrimination section, 29... Comprehensive discrimination section, 30... Comparison section, 31, 33 ... Differentiator, 32, 34 ... Zero cross detector, 35 ...
Unevenness determination circuit.
Claims (1)
向に被検査面を光走査して、その反射光量を検出
するようにした外観検査方法において、前記投受
光系が含まれる面を挟む左右に補助受光系を分配
して、前記受光系による受光量から被検査面にお
ける異常反射の有無を判別する一方、2つの補助
受光系の間での受光量変化時刻の差から被検査面
上の凹凸状態を判別することを特徴とする外観検
査方法。 2 投光系と受光系を対向させてその対向方向と
交差する所定方向に被検査面を光走査する走査光
学系、前記投受光系が含まれる面を挟む左右に分
配した第1・第2の補助受光系、前記受光系での
光入力を光電変換しこれを所定レベルと比較して
異常反射の有無を判別する異常反射検出手段、第
1の補助受光系での光入力を光電変換し入力のピ
ーク時を検出する第1の受光ピーク時検出手段、
第2の補助受光系での光入力を光電変換し入力の
ピーク時を検出する第2の受光ピーク時検出手
段、第1・第2の受光ピーク時検出手段の出力す
る検出時刻の先後を比較する時刻比較手段、前記
走査光学系による走査方向を検出する走査方向検
出手段、この走査方向検出手段の出力および前記
時刻比較手段の出力を受け被検査面の凹凸状態を
判別する凹凸判別手段からなる外観検査装置。[Scope of Claims] 1. A visual inspection method in which a surface to be inspected is scanned with light in a predetermined direction intersecting with a direction in which the light projecting system and the light receiving system face each other, and the amount of reflected light is detected. Auxiliary light-receiving systems are distributed on the left and right sides of the included surface, and the presence or absence of abnormal reflection on the surface to be inspected is determined from the amount of light received by the light-receiving systems. An appearance inspection method characterized by determining an uneven state on a surface to be inspected. 2. A scanning optical system for optically scanning a surface to be inspected in a predetermined direction intersecting the opposing direction with a light projecting system and a light receiving system facing each other; an auxiliary light receiving system, an abnormal reflection detection means for photoelectrically converting the optical input in the first light receiving system and comparing it with a predetermined level to determine the presence or absence of abnormal reflection; and photoelectrically converting the optical input in the first auxiliary light receiving system. first light reception peak time detection means for detecting the peak time of input;
The second light reception peak time detection means photoelectrically converts the optical input in the second auxiliary light reception system and detects the peak time of the input, and the first and second light reception peak time detection means outputs are compared before and after the detection time. scanning direction detection means for detecting the scanning direction by the scanning optical system; and unevenness determining means for receiving the output of the scanning direction detection means and the output of the time comparison means and determining the unevenness state of the surface to be inspected. Appearance inspection equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18376483A JPS6073409A (en) | 1983-09-30 | 1983-09-30 | Method and device for inspecting outward appearance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18376483A JPS6073409A (en) | 1983-09-30 | 1983-09-30 | Method and device for inspecting outward appearance |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6073409A JPS6073409A (en) | 1985-04-25 |
| JPH0242406B2 true JPH0242406B2 (en) | 1990-09-21 |
Family
ID=16141558
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18376483A Granted JPS6073409A (en) | 1983-09-30 | 1983-09-30 | Method and device for inspecting outward appearance |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6073409A (en) |
-
1983
- 1983-09-30 JP JP18376483A patent/JPS6073409A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6073409A (en) | 1985-04-25 |
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