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JPH0242911B2 - - Google Patents
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JPH0242911B2 - - Google Patents

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Publication number
JPH0242911B2
JPH0242911B2 JP56192610A JP19261081A JPH0242911B2 JP H0242911 B2 JPH0242911 B2 JP H0242911B2 JP 56192610 A JP56192610 A JP 56192610A JP 19261081 A JP19261081 A JP 19261081A JP H0242911 B2 JPH0242911 B2 JP H0242911B2
Authority
JP
Japan
Prior art keywords
plating
metal
ions
anode
anode chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP56192610A
Other languages
Japanese (ja)
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JPS5893888A (en
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Filing date
Publication date
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Priority to JP19261081A priority Critical patent/JPS5893888A/en
Publication of JPS5893888A publication Critical patent/JPS5893888A/en
Publication of JPH0242911B2 publication Critical patent/JPH0242911B2/ja
Granted legal-status Critical Current

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Description

【発明の詳細な説明】 本発明は、陰イオン交換膜隔膜を用いる電気メ
ツキにあつて、陽極室から回収した酸により金属
を溶解させることにより、メツキ溶室へ金属イオ
ンを供給させる方法に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for supplying metal ions to a plating chamber by dissolving metals with acid recovered from an anode chamber in electroplating using an anion exchange membrane diaphragm.

従来一般に、電気メツキ方法における陽極とし
ては、不溶性陽極または可溶性陽極が用いられて
いる。
Conventionally, an insoluble anode or a soluble anode has been used as an anode in an electroplating method.

可溶性陽極にあつては、たとえばZnメツキの
場合Zn陽極が、Zn―Niメツキ等の合金メツキの
場合、Zn陽極、Ni陽極等の個々の陽極を組み合
せた陽極系が用いられている。かかる可溶性陽極
を用いると、メツキ浴中に含まれるFe2+イオン
がFe3+になる酸化反応は進行しないし、またメ
ツキ浴の金属イオンを陽極そのものの溶出によつ
て賄える利点があるが、主として次のような欠点
がある。
As for the soluble anode, for example, in the case of Zn plating, a Zn anode is used, and in the case of alloy plating, such as Zn--Ni plating, an anode system is used in which individual anodes such as a Zn anode and a Ni anode are combined. When such a soluble anode is used, the oxidation reaction in which Fe 2+ ions contained in the plating bath become Fe 3+ does not proceed, and there is an advantage that the metal ions in the plating bath can be supplied by elution from the anode itself. The main drawbacks are as follows.

(1) Znメツキ、Ni―Znメツキ、およびFe―Znメ
ツキ等のZnメツキでは、Znのドロス(Znの析
出物)がメツキ浴中に生成し、そのドロスを回
収せねばならない。
(1) In Zn plating such as Zn plating, Ni-Zn plating, and Fe-Zn plating, Zn dross (Zn precipitate) is generated in the plating bath, and the dross must be recovered.

(2) Zn―Niメツキ等の合金メツキでは、Ni陽
極、Zn陽極等を複数個の電解槽に分離して設
置するが、浴中の金属イオンのバランスを取る
ことがきわめて難しい。
(2) In alloy plating such as Zn-Ni plating, Ni anodes, Zn anodes, etc. are installed separately in multiple electrolytic baths, but it is extremely difficult to balance the metal ions in the baths.

(3) 可溶性陽極では、陽極そのものの溶出によつ
て金属イオンを供給するため、陽極が徐々に消
耗し新しい陽極にその都度取換える必要があ
る。しかも陽極の消耗により、陽極と鋼板との
間隔が変つてしまう。そして同一ラインで、多
品種のメツキ、たとえばZnメツキ、Zn―Niメ
ツキ等のメツキを行う際には、メツキの品種を
変更する度に各々陽極を変更する必要がある。
(3) With soluble anodes, metal ions are supplied by elution from the anode itself, so the anode gradually wears out and must be replaced with a new anode each time. Moreover, as the anode wears out, the distance between the anode and the steel plate changes. When plating various types of plating, such as Zn plating and Zn-Ni plating, on the same line, it is necessary to change the anode each time the type of plating is changed.

(4) Fe系メツキにおいてFe陽極を用いた場合に
ついてみれば、Fe2+イオン濃度やPH等の浴組
成の変化が大きいし、また高電流密度、たとえ
ば40A/dm2以上とすると、Fe陽極の不働態化
が生じ、陽極においてFe2+イオンがFe3+イオ
ンに酸化され、メツキ性状を阻害する問題があ
る。
(4) When using an Fe anode in Fe-based plating, there are large changes in bath composition such as Fe 2+ ion concentration and pH, and when the current density is high, for example 40 A/dm 2 or higher, the Fe anode Passivation occurs, and Fe 2+ ions are oxidized to Fe 3+ ions at the anode, which impairs plating properties.

一方、不溶性陽極を用いたとしても、次のよう
な問題がある。
On the other hand, even if an insoluble anode is used, there are the following problems.

(1) 鋼板の被メツキ物裏面の裸面等より溶出する
Fe2+ならびにFeメツキ、Zn―Fe合金メツキ等
のFe系メツキ浴中のメツキ成分であるFe2+は、
陽極での電極反応または陽極で発生するO2
スによりFe3+イオンに酸化される。そしてこ
の酸化によるFe3+イオンのメツキ浴中での存
在は、被メツキ物裏面のFeやコンダクターロ
ール(Niメツキ等)の腐食が促進されてしま
うばかりでなく、PHが3程度以上ではFe
(OH)3となり、メツキ浴管理上問題となる。
(1) Elutes from the bare back surface of the steel plate to be plated.
Fe 2+ and Fe 2+ , which is a plating component in Fe-based plating baths such as Fe plating and Zn-Fe alloy plating, are
It is oxidized to Fe 3+ ions by electrode reactions at the anode or O 2 gas generated at the anode. The presence of Fe 3+ ions in the plating bath due to this oxidation not only accelerates the corrosion of Fe on the back side of the object to be plated and conductor rolls (Ni plating, etc.), but also causes Fe
(OH) 3 , which poses a problem in managing the plating bath.

(2) Fe―Zn合金メツキ等のメツキ浴中にFe3+
含有するFe系メツキの場合には、Fe2+が生成
されるメツキ皮膜の組成に変化をもたらすばか
りか、色調のムラや電流効率の低下をきたす問
題がある。
(2) In the case of Fe-based plating that contains Fe 3+ in the plating bath, such as Fe-Zn alloy plating, it not only changes the composition of the plating film in which Fe 2+ is generated, but also causes uneven color tone and There is a problem that current efficiency decreases.

他方、不溶性陽極を用いて電気メツキを行うに
当り、イオン交換膜隔膜を使用する方法も種々提
案されており、その一例として特公昭51−2900号
公報記載のもの(公報記載従来技術という)があ
る。しかし、この方法を採つたとしても、第1に
陰イオン交換膜隔膜により、Ni2+およびZn2+
がメツキ浴室から陽極室へ透過移動することを防
止しているが、陰イオン交換膜隔膜の性能上、
Fe2+についてみれば、実際には濃度勾配により
陽極室への透過移動があり、浴管理上の問題とな
る。また第2に、陽極室で生成されるH+は陰イ
オン交換膜隔膜によつてメツキ浴室へ透過移動し
ないはずであるが、隔膜の性能上、H+のような
小さなイオンの透過は無視できず、特に陽極室中
に1〜3NのH2SO4の如く濃い酸を循環させた場
合、H+の輸率は30〜60%にも及び、メツキ浴室
のPHを低下させることになり、これまたメツキ浴
の管理が困難になる。
On the other hand, various methods of using ion exchange membranes have been proposed for electroplating using insoluble anodes, and one example is the method described in Japanese Patent Publication No. 51-2900 (referred to as the prior art described in the publication). be. However, even if this method is adopted, the anion exchange membrane first prevents Ni 2+ and Zn 2+ from permeating and moving from the metal bath to the anode chamber, but the anion exchange membrane Due to the performance of the diaphragm,
Regarding Fe 2+ , there is actually a permeation movement to the anode chamber due to the concentration gradient, which poses a problem in bath management. Secondly, the H + generated in the anode chamber should not permeate and migrate to the plating bath through the anion exchange membrane diaphragm, but due to the performance of the diaphragm, the permeation of small ions such as H + can be ignored. Especially when a concentrated acid such as 1-3N H 2 SO 4 is circulated in the anode chamber, the transfer number of H + reaches 30-60%, which lowers the pH of the metal bath. This also makes it difficult to manage the plating bath.

本発明は前記問題点を解決すべく提案されたも
ので、可溶性陽極を用いるのであれば上述のよう
に基本的な問題があることに鑑み、不溶性陽極を
用いるものである。しかし、不溶性陽極を用いた
としても、上述のようにメツキ浴管理上避け得な
い難点があるため、陰イオン交換膜隔膜を併用す
るものである。そしてさらに、本発明は不溶性陽
極と陰イオン交換膜隔膜との併用に留まることな
く、現実的に陰イオン交換膜隔膜の透過性を考え
た場合、メツキ浴でのFe3+イオンの存在がメツ
キの特性等に大きく左右することに着目し、また
メツキの進行に伴つて陽極室液の酸濃度が増すた
め、その酸濃度を一定に保つためには、順次酸を
抜き出さなくてはならず、その際その酸を有効に
利用せんとするに当つて、そのまま酸をメツキ浴
室中に供給すると、Fe3+イオンが混入している
ので前記の通りメツキ特性を悪化させる原因とな
るから、メツキ金属を溶解する過程でFe2+に還
元した後メツキ浴室に補給するものである。しか
も、後に詳述するように、たとえば金属溶解に当
つて、金属板と酸とを接触させたとしても、金属
溶解量は微量であり金属イオンの補給としては十
分でないことに鑑み粒状または粉状の金属と接触
させ、かつ溶解塔内に充填することにより、メツ
キ浴室で必要とする金属イオンを円滑に補充しよ
うとするものである。
The present invention was proposed in order to solve the above-mentioned problems, and in view of the fact that using a soluble anode would have the basic problem as described above, an insoluble anode is used. However, even if an insoluble anode is used, there are unavoidable difficulties in managing the plating bath as described above, so an anion exchange membrane diaphragm is also used. Furthermore, the present invention is not limited to the combination of an insoluble anode and an anion exchange membrane diaphragm, but when considering the permeability of an anion exchange membrane diaphragm, the presence of Fe 3+ ions in the plating bath is In addition, as plating progresses, the acid concentration of the anode chamber solution increases, so in order to keep the acid concentration constant, it is necessary to gradually extract the acid. At that time, in order to effectively utilize the acid, if the acid is supplied as it is into the plating bath, Fe 3+ ions will be mixed in, which will cause deterioration of the plating properties as described above. In the process of melting metal, it is reduced to Fe 2+ and then supplied to the metal bath. Moreover, as will be explained in detail later, even if a metal plate is brought into contact with an acid during metal melting, the amount of metal dissolved is so small that it is not sufficient to replenish metal ions. The purpose is to smoothly replenish the metal ions needed in the plating bath by bringing the metal into contact with the metal and filling the melting tower.

すなわち、本発明は、陰イオン交換膜隔膜によ
りメツキ浴室から分離した陽極室中に不溶性陽極
を設置して行うFe系の電気メツキであつて、陽
極室から回収したFe3+イオンを含む1N〜3Nの硫
酸に水を添加して硫酸濃度を調整後、一部を陽極
室に循環し、残部を溶解器内に充填した鉄または
鉄を含む金属粉あるいは金属粒と接触させて金属
を溶解させてFe3+イオンをFe2+イオンに還元し
た後、Fe2+イオンを含む溶解液をメツキ浴室に
供給することを特徴とするものである。
That is, the present invention is an Fe-based electroplating method that is carried out by installing an insoluble anode in an anode chamber separated from the plating bath by an anion exchange membrane diaphragm, and which is performed by installing an insoluble anode in an anode chamber separated from the plating bath by an anion exchange membrane diaphragm. After adjusting the sulfuric acid concentration by adding water to 3N sulfuric acid, a portion is circulated to the anode chamber, and the remaining portion is brought into contact with iron or iron-containing metal powder or metal particles filled in the melter to dissolve the metal. The method is characterized in that after reducing Fe 3+ ions to Fe 2+ ions, a solution containing Fe 2+ ions is supplied to the plating bath.

ところで、本発明は、Fe系メツキではFe3+
存在は極力避けなければならない点で、Feメツ
キ、Fe―Znメツキ、あるいはFe―Niメツキ等の
Fe系メツキの場合に特に有効である。
By the way, the present invention is applicable to Fe plating, Fe-Zn plating, Fe-Ni plating, etc., since the presence of Fe 3+ must be avoided as much as possible in Fe-based plating.
This is particularly effective in the case of Fe-based plating.

本発明によれば、第1に隔膜を用いているの
で、Fe2+は陽極室中に殆んど移行せず陽極での
発生O2ガスによるFe3+の生成が防止されるから
好適なメツキ性状が得られ、第2に実際には
Fe2+の一部は隔膜を通つて陽極室で酸化されて
Fe3+が生成されるが、これは金属の溶解過程で
Fe2+に還元できるから結局メツキ浴室中には
Fe3+が実質的に存在しない状態でメツキを行う
ことができる。第3に陽極室からの酸を回収して
メツキ補給液として有効利用でき、第4にこの陽
極室液中に水を添加し、一部を陽極室へ循環使用
するものであるから、硫酸濃度を常に最適に維持
し、もつてメツキ浴室のPHを一定にでき、金属の
溶解によつて補充すべき金属イオンを補給するの
で、高価なFeSO4やZnSO4の使用量を少くまたは
全く無くすることができ経済的となる。特にこの
点が顕著かつ特異な点であるのであるが、第5
に、金属の溶解により金属イオンを補充するとい
つてもその溶解量はかなり大きくする必要がある
ことに鑑み、単に金属板を酸液槽に浸漬するので
はなく、金属粒または金属粉を用い、しかも溶解
塔に充填させて酸液と接触させ溶解を図つている
ので、コンパクトの装置で高い溶解速度を得るこ
とができる。
According to the present invention, firstly, since a diaphragm is used, Fe 2+ hardly migrates into the anode chamber and the generation of Fe 3+ by O 2 gas generated at the anode is prevented, which is preferable. Second, it is actually
Some of the Fe 2+ is oxidized in the anode chamber through the diaphragm.
Fe 3+ is produced during the metal dissolution process.
Because it can be reduced to Fe 2+ , it ends up in the Metsuki bathroom.
Plating can be performed in the substantial absence of Fe 3+ . Thirdly, the acid from the anode chamber can be recovered and used effectively as a plating replenishment solution, and fourthly, water is added to this anode chamber solution and a portion is recycled to the anode chamber, so the sulfuric acid concentration can be reduced. The pH of the plating bath can be kept constant at all times, and the metal ions that should be replenished by dissolving the metal can be replenished, so the amount of expensive FeSO 4 and ZnSO 4 used can be reduced or completely eliminated. It can be economical. This point is especially remarkable and unique, but the fifth
In view of the fact that whenever metal ions are replenished by dissolving metal, the amount of dissolved metal must be considerably large, so instead of simply immersing a metal plate in an acid bath, metal particles or metal powder are used. Moreover, since the solution is packed in a dissolution tower and brought into contact with an acid solution for dissolution, a high dissolution rate can be obtained with a compact device.

次いで、第1図に示すFe―Znメツキの場合を
例に挙げて本発明をさらに詳述する。
Next, the present invention will be explained in further detail using the case of Fe--Zn plating shown in FIG. 1 as an example.

メツキ槽1は、陰イオン交換膜隔膜2によつて
メツキ浴室3と陽極室4とに分離されている。5
はPtやPb合金等からなる不溶性陽極、6は陰極
の被メツキ物たとえば鋼板で、これらの間に電源
7が接続され、メツキ電圧が印加される構成とな
つている。またメツキ浴室3には、たとえば、
ZnSO4・7H2O、FeSO4・7H2Oおよび
(NH42SO4からなるメツキ液が満されている。
このメツキ液は順次抜き出され、後述するメツキ
補給液とメツキ液循環槽8において合わされ、ポ
ンプ9によりメツキ浴室3に返送される。
The plating tank 1 is separated into a plating bath 3 and an anode chamber 4 by an anion exchange membrane diaphragm 2. 5
6 is an insoluble anode made of Pt or a Pb alloy, and 6 is an object to be plated as a cathode, such as a steel plate. A power source 7 is connected between these to apply a plating voltage. Also, in Metsuki Bathroom 3, for example,
It is filled with a plating liquid consisting of ZnSO 4 .7H 2 O, FeSO 4 .7H 2 O and (NH 4 ) 2 SO 4 .
This plating liquid is sequentially extracted, combined with a plating replenishing liquid to be described later in a plating liquid circulation tank 8, and returned to the plating bathroom 3 by a pump 9.

一方、陽極室液は陽極室4から順次抜き出さ
れ、陽極室液循環槽10において酸濃度が調整さ
れた後、ポンプ11により陽極室4に返送され
る。
On the other hand, the anode chamber liquid is sequentially extracted from the anode chamber 4 , the acid concentration is adjusted in the anode chamber liquid circulation tank 10 , and then returned to the anode chamber 4 by the pump 11 .

ここでもし、隔膜2を用いない場合について考
えてみると、不溶性陽極5では次記(1)および(2)式
の反応が起る。
If we consider the case where the diaphragm 2 is not used, the following reactions (1) and (2) occur at the insoluble anode 5.

2H2O→4H++O2↑+4e- ……(1) Fe2+Fe3++e- ……(2) すなわち、不溶性陽極では先ずアノード反応(2)
が生じ、Fe2+がFe3+に酸化されると共に水の電
解によりO2ガスが発生し、かつH+が生成する。
そしてこの発生したO2ガスによつて、Fe2+が酸
化されFe3+が生成する。こうなると、メツキ皮
膜の相変化、合金組織の変化、電流効率の低下お
よび皮膜の色ムラ等を生じ、所期のメツキ皮膜が
得られない。そこで、隔膜2を用いて、メツキ浴
室3中のFe2+の陽極室4への移行を防ぎ、Fe3+
の生成を防止し、もつて所期のメツキ皮膜を得る
ようにしてある。
2H 2 O→4H + +O 2 ↑+4e - ……(1) Fe 2+ Fe 3+ +e - ……(2) In other words, at the insoluble anode, first the anodic reaction (2)
occurs, Fe 2+ is oxidized to Fe 3+ , O 2 gas is generated by water electrolysis, and H + is generated.
The generated O 2 gas oxidizes Fe 2+ to generate Fe 3+ . If this happens, a phase change in the plating film, a change in the alloy structure, a decrease in current efficiency, uneven coloring of the film, etc. occur, and the desired plating film cannot be obtained. Therefore, the diaphragm 2 is used to prevent the transfer of Fe 2+ in the plating bath 3 to the anode chamber 4, and to prevent Fe 3+ from moving into the anode chamber 4.
This prevents the formation of oxides and allows the desired plating film to be obtained.

ところで、隔膜2をH+およびSO4 2-イオンは
自由に透過する。また陰極6において、Fe系メ
ツキでは電流効率がが悪く、60〜90%程度であ
り、したがつてFeおよびZnの析出に利用されな
かつた残りの電気量は、(3)式のように水の電解に
消費され、OH-イオンを生成させ、H2ガスを発
生させる。
By the way, H + and SO 4 2- ions freely permeate through the diaphragm 2. In addition, in the cathode 6, the current efficiency is poor with Fe-based plating, about 60 to 90%, and therefore the remaining electricity that is not used for the precipitation of Fe and Zn is is consumed in electrolysis, producing OH - ions and generating H 2 gas.

2H2O+2e→2OH-+H2↑ ……(3) そして、ある瞬時において、メツキ浴室3から
陽極室4へのSO4 2-イオン輸率に対して、残輸率
をもつて陽極室4からメツキ浴室3へH+イオン
が透過する。また陽極室4へ移行したSO4 2-は陽
極室4においてH2SO4を生成させ、陽極室の硫
酸濃度を高める。この硫酸濃度が変化すると、隔
膜2を介してのH+イオンおよびSO4 2-イオンの
輸率が変つてしまい、硫酸濃度の高まりによつて
H+イオンのメツキ浴室3への移行量が多くなる。
しかるに、メツキ浴室3にアルカリを添加しない
とすれば、かつ陰極6でのOH-イオン生成量は
経時的に一定とすれば、メツキ液の酸濃度が高ま
り、メツキ浴室3のPHが変化してしまう。特に
Fe系メツキでは皮膜の安定化を図るためにPHを
一定にすべきであるから、PHが変化することは極
力避けるべきである。もつとも、電流効率はPHの
変化によつて変わるので、OH-イオンの生成率
も変化するが、単にPHを一定にする課題の下で
は、通電量をその分上げればよいのであるけれど
も、電流効率を高くかつ一定にする最適の態様で
メツキせんとする下では、なんらかの手段を施さ
ない限り、メツキ浴室3でのPHの変化は避け得な
い。
2H 2 O+2e→2OH - +H 2 ↑ ...(3) Then, at a certain instant, for the SO 4 2- ion transference number from the metal bath 3 to the anode chamber 4, the SO 4 2- ion transference number from the anode chamber 4 is H + ions permeate into the bathroom 3. Further, the SO 4 2- transferred to the anode chamber 4 generates H 2 SO 4 in the anode chamber 4, increasing the sulfuric acid concentration in the anode chamber. When this sulfuric acid concentration changes, the transport numbers of H + ions and SO 4 2- ions through the diaphragm 2 change, and as the sulfuric acid concentration increases,
The amount of H + ions transferred to the bathroom 3 increases.
However, if no alkali is added to the plating bath 3 and the amount of OH - ions produced at the cathode 6 is constant over time, the acid concentration of the plating solution will increase and the PH of the plating bath 3 will change. Put it away. especially
In Fe-based plating, the pH should be kept constant to stabilize the film, so changes in the pH should be avoided as much as possible. Of course, the current efficiency changes with changes in PH, so the production rate of OH - ions also changes, but if the problem is simply to keep the PH constant, it would be sufficient to increase the amount of current by that amount, but the current efficiency When plating is to be done in an optimal manner to keep the pH high and constant, changes in the pH in the plating bathroom 3 are unavoidable unless some measure is taken.

そこで、上記例では、陽極室液循環系の一部を
なす循環槽10にPH計を設けるなどして、陽極室
中の硫酸濃度が一定になるように、陽極室液循環
槽10へのH2Oの添加と、そこからのH2SO4
の抜き出しを図つている。かくすることによつ
て、SO4 2-イオンおよびH+イオンの輸率を経時
的に一定させることができ、もつて電流効率も変
えることなしに、メツキ浴室3中のPHを一定にす
ることができる。
Therefore, in the above example, a PH meter is installed in the circulation tank 10 that forms part of the anode chamber liquid circulation system, so that H2O is supplied to the anode chamber liquid circulation tank 10 so that the sulfuric acid concentration in the anode chamber is constant. We are trying to add 2 O and extract H 2 SO 4 liquid from it. By doing this, the transference numbers of SO 4 2- ions and H + ions can be made constant over time, and the PH in the bathroom 3 can be made constant without changing the current efficiency. Can be done.

本発明においては、前述のように、H+の輸率
が30〜60%に及ぶ1N〜3Nの硫酸濃度の陽極室液
の酸濃度の調整を図ることでメツキ浴室のPH調整
を図つている。3Nを超えると、メツキ効率が低
下し、1N未満では電流密度が高くなり陰イオン
交換膜隔膜の寿命が短くなるからである。
In the present invention, as mentioned above, the PH of the metal bath is adjusted by adjusting the acid concentration of the anode chamber solution, which has a sulfuric acid concentration of 1N to 3N and has an H + transfer number of 30 to 60%. . This is because if it exceeds 3N, the plating efficiency will decrease, and if it is less than 1N, the current density will increase and the life of the anion exchange membrane membrane will be shortened.

循環槽10から抜き出したH2SO4を可能な限
り有効に使用するためには、これをメツキ浴室3
へ戻すことである。しかしながら、隔膜2は
Fe2+の透過を大部分阻止するが、微量は濃度勾
配によつて、陽極室4に移行し、前述のように陽
極5でのアノード反応(Fe2+→Fe3++e-)又は
水の電解によつて発生するO2ガスにより酸化さ
れFe3+となつて、循環槽10から抜き出した硫
酸液に混入する。したがつて、このFe3+を含む
硫酸液をそのままメツキ浴室3へ戻すことはでき
ない。Zn2+も硫酸液に混入するが、メツキ皮膜
に対してさしたる問題はないので、Feイオンに
着目すればよい。
In order to use the H 2 SO 4 extracted from the circulation tank 10 as effectively as possible, it must be used in the bathroom 3.
It is to return to However, the diaphragm 2
Most of the Fe 2+ permeation is blocked, but a small amount moves to the anode chamber 4 due to the concentration gradient, and as described above, the anode reaction at the anode 5 (Fe 2+ →Fe 3+ +e - ) or water It is oxidized by the O 2 gas generated by the electrolysis and becomes Fe 3+ , which is mixed into the sulfuric acid solution extracted from the circulation tank 10 . Therefore, this sulfuric acid solution containing Fe 3+ cannot be returned to the plating bath 3 as it is. Although Zn 2+ is also mixed into the sulfuric acid solution, it does not cause any major problems with the plating film, so focus should be placed on Fe ions.

この問題に対して、本例ではFe3+は金属の溶
解過程でFe2+に還元されることに着目して、抜
き出した硫酸を並列に設けたFe溶解器12およ
びZn溶解器13に導き、その内部に充填したFe
粉粒物およびZn粉粒物と接触させ、それらの溶
解を行い、Fe2+に還元した後、硫酸液を循環槽
8に補給している。14,15はそれぞれスラツ
ジ徐去装置である。
To solve this problem, in this example, focusing on the fact that Fe 3+ is reduced to Fe 2+ during the metal melting process, the extracted sulfuric acid is introduced into the Fe melter 12 and Zn melter 13, which are installed in parallel. , Fe filled inside
The sulfuric acid solution is supplied to the circulation tank 8 after being brought into contact with the powder and Zn powder to dissolve them and reduce them to Fe 2+ . 14 and 15 are sludge removal devices, respectively.

なお、第2図のように、溶解器12,13を直
列に設けてもよい。しかし、先にZnの溶解を行
い、後にFeの溶解を行うことは、Feの溶解性が
悪く濃い酸で溶解すべきこと及びFeが溶解する
表面でZnの析出が生じること等の点で望ましく
ない。
Note that, as shown in FIG. 2, the dissolvers 12 and 13 may be provided in series. However, dissolving Zn first and then dissolving Fe is not desirable because Fe has poor solubility and must be dissolved with a concentrated acid, and Zn will precipitate on the surface where Fe is dissolved. do not have.

本発明は、硫酸の有効利用およびFe3+の還元
のみに留ることなく、溶解した金属を、連続メツ
キにおいて、メツキによつて析出した金属に対し
てその補給源としようとするものである。先にも
触れたように、メツキ金属の補給には、Fe―Zn
合金メツキでは、FeSO4・7H2OおよびZnSO4
7H2Oの形で添加してやることもできるが、これ
らは高価であり、それより安価な金属粉粒物の溶
解によつて賄つた方が得策である。
The present invention aims not only to utilize sulfuric acid effectively and reduce Fe 3+ , but also to use dissolved metal as a replenishment source for metal precipitated by plating in continuous plating. . As mentioned earlier, Fe-Zn is used to supply the metal for plating.
For alloy plating, FeSO 4 7H 2 O and ZnSO 4
It can also be added in the form of 7H 2 O, but these are expensive and it is better to use cheaper metal powders to dissolve them.

ただ、メツキ金属の析出速度に追いつけるだけ
の金属イオンを供給するに当つて、たとえば硫酸
液中に金属板を浸漬することによつて行わんとし
ても、長大な溶解槽に多数の金属板を浸漬する場
合ならともかく、コンパクトな装置で高い溶解速
度を得ようとしても無理である。
However, in order to supply enough metal ions to keep up with the precipitation rate of plating metal, even if it is done by immersing metal plates in a sulfuric acid solution, for example, it is difficult to immerse a large number of metal plates in a long dissolution tank. However, it is impossible to obtain a high dissolution rate using a compact device.

この問題の解決法として、本発明者らは、第3
図のような溶解塔50を用い、その内部に金属粒
51(または粉)を充填させ、上部の回収硫酸供
給口52から硫酸を流し、金属粒51と接触させ
ればよいことを見出した。53は金属粒供給口、
54はフイルター、55はガス抜き口である。
As a solution to this problem, the inventors have developed the third
It has been found that it is sufficient to use a melting tower 50 as shown in the figure, fill the inside with metal particles 51 (or powder), and flow sulfuric acid from the recovered sulfuric acid supply port 52 at the top to bring it into contact with the metal particles 51. 53 is a metal grain supply port;
54 is a filter, and 55 is a gas vent.

また60は先に触れたスラツジ除去装置で、
Feの溶解であればセメンタイトFe3CおよびFeの
微粉を、Znの溶解であればZnの微粉を除去する
ものである。71はバイパス路、72は硫酸供給
量調整弁である。
Also, 60 is the sludge removal device mentioned earlier,
If dissolving Fe, cementite Fe 3 C and fine powder of Fe are removed, and if dissolving Zn, fine powder of Zn is removed. 71 is a bypass path, and 72 is a sulfuric acid supply amount regulating valve.

かかる溶解塔50を用いると、金属粒51の単
位体積当りの表面積がきわめて大となり、それだ
け単位体積当りの溶解速度が速くなる。しかも、
溶解に伴つて水素ガスが発生するため、硫酸の流
れを乱し、未使用の硫酸と金属粒表面との接触度
が高められ、かつ水素ガスによつて充填された各
金属粒あるいはそのベツドが流動化状態になるの
で、一層溶解速度が高められる。かつ金属粒間で
の硫酸の通過速度が速くなるので、この面でも高
い溶解性が期待できる。
When such a dissolving tower 50 is used, the surface area per unit volume of the metal particles 51 becomes extremely large, and the dissolution rate per unit volume increases accordingly. Moreover,
Hydrogen gas is generated during melting, which disturbs the flow of sulfuric acid, increases the degree of contact between unused sulfuric acid and the surface of metal particles, and causes each metal particle or its bed filled with hydrogen gas to Since it is in a fluidized state, the dissolution rate is further increased. In addition, since the passage speed of sulfuric acid between metal particles becomes faster, high solubility can be expected in this respect as well.

ところで、単に単位体積当りの表面積を大きく
するだけならば、粒子は小さければよいのである
が、本発明者らの知見によれば、0.1mm〜3mmが
望ましい。下限値について限定されるのは、粒子
近傍での硫酸は直に溶解に食われるが、それが新
しい硫酸に代わる拡散効果がないのではないかと
考えられる。
By the way, if the surface area per unit volume is simply increased, the particles need only be small, but according to the findings of the present inventors, it is desirable that the particles be 0.1 mm to 3 mm. The lower limit is thought to be due to the fact that sulfuric acid in the vicinity of particles is directly consumed by dissolution, but there is no diffusion effect to replace it with new sulfuric acid.

他方、Feの溶解に当つては、1N〜5N程度の硫
酸濃度で、Znの溶解に当つては0.1N以上の硫酸
濃度で行うのが望ましい。もし、1パスの硫酸接
触だけでは、所期の溶解量が得られないのであれ
ば、同一種の溶解塔を多段設けてもよいし、第2
図のように溶解液を戻し路16によりフイードバ
ツクさせてもよい。また、金属溶解とFeSO4およ
びZnSO4の添加との併用を図つてもよい。どのよ
うな方式を採るかは、経済性の面から決定され
る。さらに循環槽10から抜き出した硫酸の一部
は系外に取出すこともできる。
On the other hand, it is desirable to dissolve Fe at a sulfuric acid concentration of about 1N to 5N, and to dissolve Zn at a sulfuric acid concentration of 0.1N or higher. If the desired amount of dissolution cannot be obtained with just one pass of sulfuric acid contact, multiple dissolution towers of the same type may be installed, or a second dissolution tower may be installed.
The lysate may be fed back through a return path 16 as shown in the figure. Further, metal dissolution and addition of FeSO 4 and ZnSO 4 may be used together. The method to be adopted is determined from an economic standpoint. Furthermore, a part of the sulfuric acid extracted from the circulation tank 10 can also be taken out of the system.

次に実施例を示す。 Next, examples will be shown.

実施例 本例は第1図と同様なメツキ設備でFe―Zn合
金メツキを行つたもので、浴組成として、
ZnSO4・7H2O150g/,FeSO4・7H2O250g/
,(NH42SO4100g/,PH=2、浴温として
50℃を用い、陰イオン交換膜隔膜(徳山ソーダ製
Neosepta「AF―4T」)をへだてて、陽極室には
0.5mol/のH2SO4を満たし、Ptを陽極として、
30A/dm2で連続メツキを行つた。
Example In this example, Fe--Zn alloy plating was performed using the same plating equipment as shown in Fig. 1, and the bath composition was as follows:
ZnSO 4・7H 2 O150g/, FeSO 4・7H 2 O250g/
, (NH 4 ) 2 SO 4 100g/, PH=2, as bath temperature
Anion exchange membrane diaphragm (manufactured by Tokuyama Soda) was used at 50℃.
Neosepta "AF-4T") is separated and the anode chamber is
Filled with 0.5 mol/H 2 SO 4 and using Pt as an anode,
Continuous plating was performed at 30A/ dm2 .

なお、本例の陰イオン交換膜隔膜の特性とし
て、H+の輸率は25%であり、SO4 2-の輸率は75
%であつた。また、本例のFe―Zn合金メツキの
電流効率は70%であつた。
Note that the characteristics of the anion exchange membrane membrane in this example are that the transport number of H + is 25% and the transport number of SO 4 2- is 75.
It was %. Further, the current efficiency of the Fe--Zn alloy plating in this example was 70%.

その結果、陽極室4には通電電気量の75%に相
当するH2SO4が生成され、陽極室H2SO4濃度が
上昇するため、生成したH2SO4分を回収した。
また、メツキ浴室3のメツキ浴出口では、通電電
気量の5%に相当するOH-イオンが残存したた
め、PH=2.1と上昇した。
As a result, H 2 SO 4 equivalent to 75% of the amount of electricity supplied was generated in the anode chamber 4, and since the concentration of H 2 SO 4 in the anode chamber increased, 4 minutes of the generated H 2 SO 4 was collected.
Furthermore, at the exit of the plating bath in the plating bath 3, OH - ions equivalent to 5% of the amount of electricity that was supplied remained, so the pH increased to 2.1.

回収硫酸については、Fe溶解器12、Zn溶解
器13に導き、FeとZnを溶解させた。
The recovered sulfuric acid was led to an Fe dissolver 12 and a Zn dissolver 13 to dissolve Fe and Zn.

ここで、本例のFe―Znの合金組成がFe―20
%、Zn―80%であつたため、Fe―Znの溶解量は
その組成比に見合う供給金属イオンを溶解させる
ために、硫酸液量の配分をFe溶解器に19%、Zn
溶解器に56%を供給した。溶解器12,13で
は、ZnはFeに比較し、溶解しやすいため、供給
したH2SO4の全量がZnと反応した。また、Fe溶
解は通電電気量の5%に相当するH2SO4が未反
応H2SO4として残した。溶解器12,13を経
た溶解液は除去装置14,15にて未反応の金属
粒やスラツジ(Feの場合に多く、Fe3Cが主成分)
を除去後、メツキ浴循環槽8へ供給された。
Here, the alloy composition of Fe-Zn in this example is Fe-20
%, Zn-80%, the amount of Fe-Zn dissolved was 19%, Zn in the Fe dissolver, and the amount of sulfuric acid solution was changed to dissolve the supplied metal ions commensurate with the composition ratio.
Feed 56% to the dissolver. In the dissolvers 12 and 13, since Zn dissolves more easily than Fe, the entire amount of H 2 SO 4 supplied reacted with Zn. Further, Fe dissolution left H 2 SO 4 equivalent to 5% of the amount of electricity applied as unreacted H 2 SO 4 . The solution that has passed through the dissolvers 12 and 13 is removed by removal devices 14 and 15 to remove unreacted metal particles and sludge (often in the case of Fe, mainly Fe 3 C).
After removing it, it was supplied to the plating bath circulation tank 8.

ここで、メツキ浴供給液として供給した溶液中
には、通電電気量の5%のH+が存在していたが、
メツキ浴室3から回収されたメツキ浴中には
OH-が5%存在していたため、PHが2.0と一定に
保たれた。
Here, in the solution supplied as the plating bath supply solution, 5% of H + was present in the amount of electricity applied.
In the Metsuki bath recovered from Metsuki Bathroom 3,
Since 5% OH - was present, the pH was kept constant at 2.0.

金属イオンについて、常に安定したFe2+
Zn2+の濃度組成であり、かつFe3+イオンは数
10ppm以下に抑制することができた。
Regarding metal ions, Fe 2+ is always stable,
The concentration composition of Zn 2+ and the number of Fe 3+ ions
We were able to suppress it to 10ppm or less.

そのため、300hrの連続メツキによつても、常
に均一なFe―20%、Zn―80%の合金皮膜が得ら
れた。
Therefore, even after continuous plating for 300 hours, a uniform alloy film of 20% Fe and 80% Zn was always obtained.

【図面の簡単な説明】[Brief explanation of drawings]

第1図はFe―Zn合金メツキの構成例の概要図、
第2図は態様を異にする例の概要図、第3図は溶
解器の一例を示す概要図である。 2…陰イオン交換膜隔膜、3…メツキ浴室、4
…陽極室、5…不溶性陽極、6…被メツキ物、1
2…Fe溶解器、13…Zn溶解器、50…金属溶
解塔、51…金属粒。
Figure 1 is a schematic diagram of a configuration example of Fe-Zn alloy plating.
FIG. 2 is a schematic diagram of a different embodiment, and FIG. 3 is a schematic diagram showing an example of a dissolver. 2... Anion exchange membrane diaphragm, 3... Metsuki bathroom, 4
...anode chamber, 5...insoluble anode, 6... object to be plated, 1
2...Fe melter, 13...Zn melter, 50...metal melting tower, 51...metal particles.

Claims (1)

【特許請求の範囲】[Claims] 1 陰イオン交換膜隔膜によりメツキ浴室から分
離した陽極室中に不溶性陽極を設置して行うFe
系の電気メツキであつて、陽極室から回収した
Fe3+イオンを含む1N〜3Nの硫酸に水を添加して
硫酸濃度を調整後、一部を陽極室に循環し、残部
を溶解器内に充填した鉄または鉄を含む金属粉あ
るいは金属粒と接触させて金属を溶解させて
Fe3+イオンをFe2+イオンに還元した後、Fe2+
オンを含む溶解液をメツキ浴室に供給することを
特徴とする電気メツキにおける金属イオンの供給
方法。
1 Fe is carried out by installing an insoluble anode in an anode chamber separated from the metal bath by an anion exchange membrane diaphragm.
system electroplating, recovered from the anode chamber.
After adjusting the sulfuric acid concentration by adding water to 1N to 3N sulfuric acid containing Fe 3+ ions, part of it is circulated to the anode chamber and the rest is filled in the dissolver. Iron or metal powder or metal grains containing iron. melt the metal by contacting it with
A method for supplying metal ions in electroplating, which comprises reducing Fe 3+ ions to Fe 2+ ions and then supplying a solution containing Fe 2+ ions to a plating bath.
JP19261081A 1981-11-30 1981-11-30 Supplying method for metallic ion in electroplating Granted JPS5893888A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19261081A JPS5893888A (en) 1981-11-30 1981-11-30 Supplying method for metallic ion in electroplating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19261081A JPS5893888A (en) 1981-11-30 1981-11-30 Supplying method for metallic ion in electroplating

Publications (2)

Publication Number Publication Date
JPS5893888A JPS5893888A (en) 1983-06-03
JPH0242911B2 true JPH0242911B2 (en) 1990-09-26

Family

ID=16294118

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19261081A Granted JPS5893888A (en) 1981-11-30 1981-11-30 Supplying method for metallic ion in electroplating

Country Status (1)

Country Link
JP (1) JPS5893888A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0415615U (en) * 1990-05-29 1992-02-07

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58148068U (en) * 1982-03-31 1983-10-05 新日本製鐵株式会社 Adjustment device for iron-zinc alloy electroplating liquid
JP2013224467A (en) * 2012-04-20 2013-10-31 Nippon Steel & Sumikin Engineering Co Ltd Tin dissolving apparatus and tin dissolving method

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3909617A (en) * 1974-05-30 1975-09-30 Us Energy Radioisotopic heat source

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0415615U (en) * 1990-05-29 1992-02-07

Also Published As

Publication number Publication date
JPS5893888A (en) 1983-06-03

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