JPH0242912B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a plating processing apparatus for plating a predetermined portion of a ceramic package.

(Prior art) Conventionally, for plating ceramic packages such as pin grit type and dual in-line type, electrolytic plating or electroless plating has been applied to the entire exposed conductor parts such as the cavity part, shield ring part, and pins. By law, it was nickel-plated and gold-plated. As a result, plating is applied to parts that do not require plating, and as a result, the amount of precious metal electrodeposited per product increases, resulting in extremely high plating costs.

Therefore, it has been proposed to apply a partial plating method in which plating is applied only to necessary parts.

For example, in 1987, the applicant proposed
120765, as shown in Figure 5,
In order to plate at least the inside of the cavity of the pin grid package 12, a fixing pin 7 for positioning the package is attached to a support plate 1 having a plurality of plating liquid injection windows 2 for introducing plating liquid into the cavity of the package. , planted and established;
Furthermore, a plurality of movable pins 8 press each package 12 toward the fixed pin side to fix the package 12.
is provided facing the fixed pin 7, and the package 12 is connected by two fixed pins 7 and one movable pin 8.
The structure is such that it is supported at three points. Also, window hole 2
An elastic member 3 is provided around the window hole 2 to prevent the plating liquid from leaking, and a pressing plate 14 presses the package 12 through the elastic member 3 to the window hole 2 for spraying the plating liquid. .

The package 12 used for plating work is as follows:
The pin grid package disclosed by the applicant in Japanese Patent Laid-Open No. 62-214648, in which a common electrode is provided on the side surface, is suitable. That is, as an example is shown in FIG. 6, a pin grid package 12 is used in which a common electrode 12a provided on the entire side surface of the package 12 can commonly supply voltage to all of the electrode patterns 12b and also to all of the pins 12c. This allows electrolytic plating to be performed by supplying power to the movable pin 8 and fixed pin 7. Note that after the plating work is completed, the common electrode 12a is removed to obtain the pin grid package 12 as a final product.

(Problems to be Solved by the Invention) However, the movable pin 8 that elastically presses the package 12 toward the fixed pin side to fix the package 12 is not able to move the package 12 from the movable pin 8 due to contact with the common electrode 12a on the side surface of the package. Electrical conduction is enabled to all the electrode patterns 12b in the 12 cavities, and electroplating is performed between the plating liquid injection window hole and the cavity pattern 12b via the plating liquid present in the cavity. However, due to insufficient spring pressing pressure in the spring mechanism, contact failure with the common electrode 12a on the side of the package may cause electrical continuity failure, and the ceramic package fixed on the support plate may Individual plating thicknesses varied.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems and provide a plating apparatus capable of plating at least the inside of a cavity of a ceramic package.

(Means for Solving the Problems) The plating processing apparatus of the present invention comprises: a plating liquid spraying section for applying plating solution to a predetermined portion of a ceramic package; ,
a support plate having a window hole for spraying plating liquid;
A positioning part for fixing the ceramic package on the support plate; and a pressing part for electrically contacting a plurality of plug pins of the ceramic package and holding the support plate and the ceramic package airtight. It is characterized by

(Function) According to the present invention, the ceramic package is fixed in the horizontal direction by the positioning part with the cavity part of the ceramic package facing the window hole, and the fixed ceramic package is pressed against the support plate by the pressing part. The gap between the support plate and the ceramic package is made airtight, so that the plating liquid injected into a predetermined portion of the ceramic package, such as the cavity portion, through the window hole does not leak out. Almost at the same time as the pressing part presses the ceramic package, the pressing part comes into contact with a plurality of pins of the ceramic package, and since there are many contact points, the reliability of electrical continuity is improved, and the pressing part is pressed against the ceramic package. This ensures uniform and reliable electrical conduction. Also, since this pressing part is in extensive contact with the plurality of plug pins of the ceramic package, it provides a more uniform electrical potential throughout the ceramic package. Furthermore, since the pressing part presses the plurality of plug pins raised from the ceramic package and also presses the many plug pins almost perpendicularly with the flat surface of the pressing part, there is no possibility that the pins will bend.

(Example) Examples of the present invention will be described in detail below based on the drawings.

FIG. 1 is a front view showing the entire plating processing apparatus of the present invention. 11 is the plating liquid injection part, 12
1A and 2B respectively show a support frame to which a pressure rod and a power supply spring are attached. The support frame 12 is supported by a frame member 14 via a plurality of pneumatic cylinders 13 so as to be movable up and down. Note that 15 is a guide rod that assists the support frame 12 to move up and down.

Although not shown, the plating liquid spraying section 11 is provided with a plating liquid spraying nozzle having an opening facing upward, and the plating liquid spraying unit 11 is provided with a plating liquid spraying nozzle having an opening facing upward, and the plating liquid is sprayed toward the plating surface of a ceramic package placed on a support plate, which will be described later. Spray liquid. In order to collect the plating liquid that returns from the plating surface, a liquid return chamber is provided surrounding the plating liquid spray nozzle.

The outline of the plating processing apparatus has been explained above, and next, the pressing section of the plating processing apparatus of the present invention will be explained below. FIG. 2 is an enlarged perspective view showing the pressing section of the device of the present invention and its aspect. A positioning part 23 having a plurality of steps for accommodating a ceramic package to be attached to the support plate 21, in this example a pin grid package 22, is provided, and a window hole for spraying a plating liquid is provided in the center of the bottom wall of the positioning part 23. 24, and an elastic seal member 25 made of rubber or other material is disposed around the window hole 24 to support the package 22 and to prevent plating liquid from adhering to parts other than the cavity portion. The sizes of the window hole 24 and the elastic seal member 25 are determined according to the area to be plated on the package. For example, if only the inside of the cavity of the package 22 is to be plated, the dimensions should be the same as the size of the cavity, and if it is desired to plate up to the seal ring on the outer periphery of the cavity, the dimensions should be approximately the same as the outer diameter of the seal ring. The dimensions shall be . In order to smoothly circulate the plating liquid sprayed toward the package, the window hole 24 for plating liquid injection is provided with:
For example, it is preferable to provide a taper (not shown) from the bottom surface of the support plate 21 on the plating liquid spray nozzle side. The material of this support plate 21 is, for example, an insulator such as FRP or ceramic.

On the other hand, the window hole 2 of the support plate 21
4, a press rod 26 is provided to protrude from the distal end surface of the support frame 12, and the press rod 2
Power supply springs 27 are disposed on both sides of 6. A bush 28 made of a material such as rubber is screwed onto the tip of the press rod 26, and a flange 29 is attached to the base of the push rod 26.
is provided, and the push rod 2 from the support frame 12 is
6 is prevented from slipping out. Furthermore, a coil spring 30 made of SUS material is inserted between the bottom wall of the support frame 12 and the bush 28, and the coil spring 30 and the bush 28 allow the ceramic to be moved elastically and with appropriate pressure. The package 22 can be pressed, and when pressed,
The elastic sealing member 25 and the bushing 28 work together to prevent the package 22 from shifting. The power supply springs 27 disposed on both sides of the press rod 26 are fixed to the support frame 12 via an insulating plate 31 and a bus bar 32, as shown in FIG. This power supply spring 27 has a flat surface 34 that uniformly and perpendicularly abuts the plug pins 33 raised from the package 22, so that electrical contact with a large number of plug pins is maintained. This flat surface 3
4 is in contact with the plug pin 33 perpendicularly and over a wide range when it comes into contact with the plug pin 33, and the material of the power supply spring 27 is made of a soft material.
Since SUS material is used, bending of the plug pin 33 can be effectively prevented. As the material for the power supply spring 27, it is desirable to use SUS material to ensure electrical continuity and corrosion resistance, but materials other than SUS may also be used with low electrical resistance and corrosion resistance.
Materials with excellent oxidation resistance, such as Cu or Be
A material made of copper with hard Au plating may also be used.

In the package 22, a common electrode is provided at the ends of all the electrode patterns in the cavity exposed on the outer peripheral side surface, and the independent electrode patterns are electrically connected to each other. This common electrode is plated out. Therefore, if the power supply spring comes into contact with at least one plug pin 33, electrical continuity can be established between the power supply spring and all the electrode patterns in the cavity via the common electrode part on the side surface of the package 22. It is becoming.

Furthermore, if a slit is suitably formed in the flat surface 34 of the power supply spring, the reliability of electrical continuity can be improved.

An embodiment in which the cavity portion of a pin grid package is actually plated using the plating processing apparatus constructed as described above will be described with reference to FIGS. 1, 2, and 3. First, the pin grid package 22 after pretreatment is fitted into the stepped positioning part 23 of the support plate 21 with the cavity part to be plated facing the window hole 24 for spraying plating liquid. Next, the positioning holes 3 of the support plate 21 are inserted into the positioning pins (not shown) that protrude upward from the upper end surface of the support base of the plating liquid injection unit 11.
5 to accurately set the support plate 21 on the plating liquid spraying section. In this state, the centers of the plurality of packages 22 placed on the support plate 21 and the openings of the plurality of plating liquid injection nozzles (not shown) inside the plating liquid injection section are arranged coaxially. . In order to hold down the plurality of packages 22 set in this way and to supply power, the upper pneumatic cylinder 13 is activated, the support frame 12 is lowered by the guide rod 15, and the presser rod 26 attached to the support frame 12 is lowered. The power supply spring 27 is brought into contact with the center part of the package 22, and then the power supply spring 27 is brought into contact with the plug pin 33 at the peripheral end of the package 22 by contraction of the presser rod 26. The lowering of the support frame 12 is stopped at a position where the press rod 26 presses the package 22 with a predetermined pressure. In this state, the negative electrode of the power supply spring 27 and the positive electrode of the plating liquid injection nozzle are energized,
On the other hand, gold plating liquid can be injected into the cavity from a nozzle through the plating liquid injection window hole 24 from below the support plate 21 to plate the conductive pattern in the cavity with gold.

The plating thickness when plating was performed using the plating processing apparatus of the present invention and when using the plating processing apparatus having the conventional plating jig shown in FIG.
When compared, the variation in plating thickness was significantly reduced in the present invention compared to the conventional example. Further, in the above-mentioned embodiment, there is no need to process a hole for positioning the package as in the conventional case, and there is an advantage that time and effort can be saved.

Furthermore, the conventional support plate shown in FIG. 5 can be used without being connected to a power source. Furthermore, as shown in FIG. 4, the support plate 21 is divided into a support plate main body and a piece having a window hole 24 for spraying plating liquid, and a window hole that matches the shape of the cavity part of the package is formed. It is also possible to use individually replaceable support plates for the pieces.

Furthermore, in the embodiment, the pressing part is made up of a separate member consisting of a pressing rod that fixes the ceramic package to the elastic sealing member and a power supply spring that supplies power to the plug pin, but it is also possible to use a pressing part that integrates both. do not have.

The present invention is not limited only to the embodiments described above, and numerous modifications and changes are possible.

(Effects of the Invention) As is clear from the above detailed explanation, according to the plating processing apparatus of the present invention, the pressing part is brought into uniform contact with the plug pin of the ceramic package fixed by the positioning part. The reliability of electrical continuity between the conductor pattern of the ceramic package and the power supply spring is improved, and predetermined portions of the ceramic package, such as the cavity portion, can be reliably plated. As a result, defects in plating due to insufficient plating thickness or protruding plating are significantly reduced, and quality and yield are improved.

[Brief explanation of drawings]

Fig. 1 is a front view showing the overall view of the plating processing device of the present invention, Fig. 2 is a partially enlarged view showing details of the plating processing device pressing section, positioning section, and support plate of the present invention, and Fig. 3 is a front view showing the overall view of the plating processing device of the present invention. AA′ sectional view of the support plate, FIG. 4 is a partial side view showing the electrode structure of the pressing part, FIG. 5 is a perspective view showing a conventional example, and FIG. 6 is a conventional pin grid with a common electrode provided on the side. FIG. 2 is a perspective view showing an example of a dossier cage. DESCRIPTION OF SYMBOLS 11... Plating bath liquid injection part, 12... Support frame, 13... Pneumatic cylinder, 14... Frame, 15... Guide rod, 21... Support plate, 22... Pin grid package, 23...
Positioning portion having a stepped portion, 24...window hole, 25...
...Elastic sealing member, 26...Press rod, 27...Power supply spring, 28...Button, 29...Flange,
30...Coil spring, 31...Insulating plate, 32...
Bus bar, 33...Plug pin, 34...Flat surface, 35...Positioning hole.

Claims (1)

[Scope of Claims] 1. A plating liquid spraying part for applying plating liquid to a predetermined portion of a ceramic package, and a support provided above the plating liquid spraying part and having a window hole for spraying the plating liquid. a plate; a positioning portion for fixing the ceramic package onto the support plate;
A plating processing apparatus comprising: a pressing part that electrically contacts a plurality of plug pins of the ceramic package and holds the support plate and the ceramic package airtight. 2. The plating processing apparatus according to claim 1, wherein the pressing portion comprises a pressing rod and a power supply spring. 3. The plating processing apparatus according to claim 1 or 2, wherein an elastic sealing member is disposed between the support plate and the ceramic package. 4. The plating processing apparatus according to any one of claims 1 to 3, wherein the positioning portion is a stepped portion provided around the window hole of the support plate.