JPH0245224B2 - - Google Patents

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a method for creating a wiring pattern on a printed board, and in particular, the present invention relates to a method for creating a wiring pattern on a printed board, and in particular, to The present invention relates to a method of automatically wiring at least two wiring patterns between two wiring patterns.

[Conventional technology]

Generally, in order to automatically perform wiring on a printed board using a computer, standard grid lines with a grid point interval of 2.54 mm or 2.5 mm are provided on the printed board. Sub-grid lines divided into 1/2 or 1/4 (1/2 grit or 1/4
The wiring is placed on top of the grid (also called grid). The grid points are for connecting pins of integrated circuits (ICs).
An IC pin insertion electrode (hereinafter referred to as a land) is provided, and the diameter of this land is usually 1.3 mm to 1.5 mm. In order to wire a printed board to obtain a desired circuit, it is necessary to run two wires between adjacent lands, so-called two wires running between IC pins.

[Problems to be solved by the invention]

Sub-grid lines that divide the grid interval into 1/2 or 1/4 (1/2
IC (grid or 1/4 grid)
If an attempt is made to pass the two pins through, the wiring pattern W ₁ will come into contact with the land L ₁ as shown in FIG. 5a.

In order to avoid the wiring pattern coming into contact with the land, the wiring pattern W _1a should be
Since the wires and W _2a must run in areas other than the sub-grid lines, the wiring must be done without using the grid lines, which poses the problem of complicating the processing by the electronic computer. In addition, when running parts other than the sub-grid lines, please check the wiring pattern.
There is also the problem that there is a high possibility that W _1a and W _2a will come into contact with each other, resulting in a decrease in printed board manufacturing yield.

In addition, in FIG. 5a and FIG. 5b, X,
Y ₁ and Y ₂ are standard grid lines, and y ₁ , y ₂ , and y ₃ are sub-grid lines, which are 1/4 grid line, 1/2 grid line, and 1/4 grid line, respectively.
Shows grid lines. Further, L ₁ and L ₂ are adjacent lands.

[Means for solving problems]

An object of the present invention is to eliminate the above-mentioned problems, and for this purpose, the present invention provides at least two electrodes between two adjacent IC pin insertion electrodes arranged on a standard grid on a printed circuit board. In this method, when the wiring pattern is moved straight, the position where at least one wiring pattern contacts one of the IC pin insertion electrodes is recognized as a wiring pattern conversion device, and the wiring pattern conversion device Determine at which position on the electrode for inserting the IC pin the wiring pattern that is advanced straight comes into contact,
At least two wiring patterns are cut and removed by a length corresponding to at least the diameter of the IC pin insertion electrode with the wiring pattern conversion position as the center, and the pre-prepared bent insertion pattern is changed into the wiring pattern according to this determination. Wiring on a printed board that is inserted into the cut and removed part of the printed circuit board so that the wiring pattern can be routed between two adjacent IC pin insertion electrodes without contacting the IC pin insertion electrodes. A pattern creation method is provided.

Preferably, the length of the wiring pattern to be cut and removed is equal to the distance between two adjacent standard grids. Further, it is preferable that the width of the refractive insertion pattern is narrower than the width of each of the wiring patterns.

〔Example〕

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a flowchart showing a method for creating a wiring pattern on a printed board according to an embodiment of the present invention, FIGS. 2 a to d are refractive insertion patterns, and FIG. 3 a
-d are diagrams for explaining operations in each step in FIG.

In FIG. 1, in step 1, the converted position of the wiring pattern is recognized. That _{is ,} for example, as shown in _{FIG .} When the wiring patterns W _1X and W _2X go straight (hereinafter, this wiring pattern is referred to as a tentative wiring pattern), a lattice point that comes into contact with either land L ₁ or L ₂ is detected. In the example shown in Figure _3a , _{the tentative} wiring patterns W ₁
This is the grid point G ₁ at the intersection with y ₃ .

Next, in step 2, it is determined whether the temporary wiring pattern passing through the grid point _G1 , which is the wiring pattern conversion position, extends in the vertical direction or in the horizontal direction. In the example shown in FIG. 3a, the tentative wiring pattern W _2X passing through the lattice point G ₁ extends on the 1/4 sub-lattice line y ₃ and is therefore determined to be in the vertical direction. Instead of determining the direction of the temporary wiring pattern W _2X passing through the grid point G ₁ ,
A temporary wiring pattern (in Fig. 3 a) extending on the second sub-grid line (sub-grid line y ₂ in Fig. 3 a)
W _1X ) may be determined.

If it is determined in step 2 that the direction is vertical, the process proceeds to step 3, where it is determined whether the temporary wiring pattern passing through the wiring pattern conversion device is the left one or the right one of the two temporary wiring patterns passing between adjacent lands. Determine. That is, it is determined whether the tentative wiring pattern on the 1/4 sub-grid line is on the left or right side. In the example shown in FIG. 3b, the tentative wiring pattern W _2X passing through the case point G ₁ , which is the conversion position, is on the right side.

If the right side is determined in step 3, step 4
Then, the temporary wiring patterns X _1X and W _2X are cut and removed within a range of ±1/2 lattice above and below the standard lattice line X passing through the lattice point G ₁ which is the conversion position. In this way, Figure 3c
The cut wiring pattern shown in is formed.

Next, in step 5, a bending insertion pattern prepared in advance according to the determinations made in steps 2 and 3 is inserted into the portion cut and removed in step 4. In the example shown in FIG. 3d, a left parenthesis-shaped refraction insertion pattern A is placed on the left side as shown in FIG. The wiring pattern formed in this way
W ₁₀ and W ₂₀ do not touch lands L ₁ and L ₂ ,
It can be passed between lands L ₁ and L ₂ .

In step 3, if the tentative wiring pattern passing through the wiring pattern conversion position is determined to be the one on the left, the process proceeds to step 6, where the upper and lower ±1/2 grids of the quasi-grid line passing through the conversion position are cut, as in step 4. Then, in step 7, a right bracket-shaped refraction insertion pattern B as shown in FIG. 2b is inserted.

If it is determined in step 2 that the temporary wiring pattern passing through the wiring pattern conversion position extends in the horizontal direction, the process proceeds to step 8, where the temporary wiring pattern passing through the wiring pattern conversion position passes between adjacent lands. It is determined whether the two temporary wiring patterns are on the upper side or the lower side, that is, whether the temporary wiring pattern passing through the 1/4 sub-lattice line is on the upper side or the lower side.

If it is determined that it is on the upper side, the process proceeds to step 9, and the left and right sides of the vertical standard grid line passing through the grid point of the conversion position are
Cut and remove the temporary wiring pattern within the 1/2 grid area,
Next, in step 10, a pre-provided lower bracket-shaped bending insertion pattern C (FIG. 2c) is inserted into the cut and removed portion.

If it is determined in step 8 that it is the lower side, step 11
Then, in step 12, the wiring pattern is cut and removed in the same manner as in step 9 above, and then in step 12, the upper bracket-shaped bent insertion pattern D (FIG. 2d) prepared in advance is removed.
Insert into the cut and removed part.

Note that by making the line width of the refractive insertion pattern shown in FIGS. 2a to 2d narrower than the line width of a normal wiring pattern, the probability that the refraction insertion pattern contacts a land can be further reduced.

FIG. 4 is a plan view showing a part of the wiring pattern created according to the flowchart of FIG. 1.
In FIG. 4, standard grid lines X ₁ , X ₂ , X ₃ , X ₄ ,
Lands _{L 11} , _{L 13} , L ₁₅ , L ₂₁ , L ₂₃ , L ₂₄ , L _{25 , L 31 ,}
L ₃₂ , L ₃₃ , L ₃₄ , L ₃₅ , L ₄₁ , L ₄₃ and L ₄₅ are provided. The refraction insertion pattern between lands L ₁₁ and L ₂₁ , L ₁₃ and L ₂₃ , and L ₁₅ and L ₂₅ is pattern C shown in FIG. 2c. Furthermore, a pattern B shown in FIG. 2b is inserted between lands _L32 and _L33 . The line width LW ₁ of each refractive insertion pattern is narrower than the line width LW ₂ of the normal wiring pattern.

In this way, by selecting an appropriate bending insertion pattern from among the pre-prepared bending insertion patterns and inserting it into the cutting/removal part of the wiring pattern, it is possible to avoid contact with the land and utilize the sub-grid lines to create a pattern between the IC pins. A main run can be executed.

The present invention is not limited to the embodiments described above, and various modifications are possible. For example, by replacing the sub-grid lines with 1/4 sub-grid lines and using 1/5 sub-grid lines or even thinner sub-grid lines, three or more lines can be passed between IC pins. Further, although the length of the portion of the wiring pattern to be cut and removed was set as a ±1/2 lattice, it is sufficient that the length is at least the diameter of the land.

〔Effect of the invention〕

As explained above, according to the present invention, a bending insertion pattern provided in advance is determined in accordance with the determination of the running direction of the wiring passing between adjacent lands and the determination of the wiring that will contact the land when the wiring runs straight. By inserting it into the wiring between lands, it is possible to easily connect two IC pins using an electronic computer without destroying the concept of grid lines, and the line width of the above-mentioned bent insertion pattern can be changed to the line width of the normal wiring pattern. By making it narrower than the width, the probability that the refractive insertion pattern comes into contact with the land can be reduced, and the printed board manufacturing yield can be improved.

[Brief explanation of drawings]

FIG. 1 is a flowchart showing a method for creating a wiring pattern on a printed board according to an embodiment of the present invention;
Figures 2 a to d are steps 5 and 5 of Figure 1, respectively.
7, 10, and 12, FIGS. 3a to 3d are diagrams for explaining the operations at each step in FIG. 1, and FIG. 4 is a flowchart of FIG. 1. FIG. 5 is a plan view showing a part of the wiring pattern created according to the method, and FIG. 5 is a diagram for explaining the problems of the prior art. L ₁ , L ₂ , L ₁₁ , L ₁₃ , ... L ₄₅ ... Land, X _1X ,
W _2X ... temporary wiring pattern, W ₁₀ , W ₂₀ ... wiring pattern, A, B, C, D ... bending insertion pattern,
X, X ₁ , X ₂ , X ₃ , X ₄ ...Standard grid lines, Y, Y ₁ ,
Y ₂ , Y ₃ , Y ₄ , Y ₅ ... Standard grid lines, y ₁ , y ₂ , y ₃ ...
... Sub-grid line, G ₁ ... Grid point, LW ₁ ... Line width of refraction insertion pattern, LW ₂ ... Line width of wiring pattern.

Claims (1)

[Claims] 1. IC arranged on a standard grid on a printed board
A method of passing at least two wiring patterns between two adjacent pin insertion electrodes, where at least one wiring pattern is passed in a straight line.
The position where the wiring pattern of the book contacts one of the IC pin insertion electrodes is recognized as the wiring pattern conversion position, and at the wiring pattern conversion position, the straightly advanced wiring pattern is connected to any one of the IC pin insertion electrodes. determining whether or not they make contact at the position, cutting and removing the at least two wiring patterns by a length corresponding to at least the diameter of the IC pin insertion electrode around the wiring pattern conversion position, and then, depending on the determination, A pre-prepared bending insertion pattern is inserted into the cut and removed portion of the wiring pattern, thereby allowing the wiring pattern to pass between two adjacent IC pin insertion electrodes without coming into contact with the IC pin insertion electrodes. A method for creating a wiring pattern on a printed board so that the wires can be routed through the board. 2. The wiring pattern creation method according to claim 1, wherein the length of the wiring pattern to be cut and removed is equal to the distance between two adjacent lines of the standard grid. 3. The wiring pattern creation method according to claim 1, wherein the width of the refraction insertion pattern is narrower than the width of each of the wiring patterns.